AU1388497A - Three-dimensional etching process - Google Patents
Three-dimensional etching processInfo
- Publication number
- AU1388497A AU1388497A AU13884/97A AU1388497A AU1388497A AU 1388497 A AU1388497 A AU 1388497A AU 13884/97 A AU13884/97 A AU 13884/97A AU 1388497 A AU1388497 A AU 1388497A AU 1388497 A AU1388497 A AU 1388497A
- Authority
- AU
- Australia
- Prior art keywords
- substrate
- mask
- etching process
- etch
- dimensional etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/001—Phase modulating patterns, e.g. refractive index patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0041—Photosensitive materials providing an etching agent upon exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
- H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
- H10P50/692—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Saccharide Compounds (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9600469.2A GB9600469D0 (en) | 1996-01-10 | 1996-01-10 | Three dimensional etching process |
| GB9600469 | 1996-01-10 | ||
| PCT/GB1997/000043 WO1997025653A1 (en) | 1996-01-10 | 1997-01-09 | Three-dimensional etching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU1388497A true AU1388497A (en) | 1997-08-01 |
Family
ID=10786847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU13884/97A Abandoned AU1388497A (en) | 1996-01-10 | 1997-01-09 | Three-dimensional etching process |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6682657B2 (enExample) |
| EP (1) | EP0873542B1 (enExample) |
| JP (1) | JP3965213B2 (enExample) |
| KR (1) | KR19990077120A (enExample) |
| CN (1) | CN1135438C (enExample) |
| AT (1) | ATE507496T1 (enExample) |
| AU (1) | AU1388497A (enExample) |
| CA (1) | CA2242634C (enExample) |
| DE (1) | DE69740180D1 (enExample) |
| GB (2) | GB9600469D0 (enExample) |
| PL (1) | PL194893B1 (enExample) |
| WO (1) | WO1997025653A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19904307C2 (de) * | 1999-01-28 | 2001-09-20 | Bosch Gmbh Robert | Verfahren zur Herstellung von dreidimensionalen Strukturen mittels eines Ätzprozesses |
| DE10135872A1 (de) * | 2001-07-24 | 2003-02-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Linse |
| JP4012156B2 (ja) * | 2004-02-02 | 2007-11-21 | 独立行政法人科学技術振興機構 | 圧電素子の製造方法 |
| TW200625699A (en) * | 2004-11-24 | 2006-07-16 | Sumitomo Chemical Co | Semiconductor substrate, method for manufacture thereof, and light emitting element |
| TWI415288B (zh) * | 2005-03-22 | 2013-11-11 | 住友化學股份有限公司 | 獨立基板、其製造方法,以及半導體發光元件 |
| JP2007019318A (ja) * | 2005-07-08 | 2007-01-25 | Sumitomo Chemical Co Ltd | 半導体発光素子、半導体発光素子用基板の製造方法及び半導体発光素子の製造方法 |
| US8691674B2 (en) * | 2005-09-29 | 2014-04-08 | Sumitomo Chemical Company, Limited | Method for producing group 3-5 nitride semiconductor and method for producing light-emitting device |
| KR100998017B1 (ko) * | 2009-02-23 | 2010-12-03 | 삼성엘이디 주식회사 | 발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지 |
| JP5650388B2 (ja) * | 2009-10-05 | 2015-01-07 | 三菱電機株式会社 | 有機elパネル、パネル接合型発光装置、有機elパネルの製造方法 |
| JP2019121750A (ja) * | 2018-01-11 | 2019-07-22 | 東京エレクトロン株式会社 | エッチング方法およびエッチング装置 |
| CN110824590A (zh) | 2019-11-25 | 2020-02-21 | 京东方科技集团股份有限公司 | 微透镜阵列的制备方法、显示装置的制备方法及显示装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4357704A (en) * | 1980-09-15 | 1982-11-02 | Science Applications, Inc. | Disc or slab laser apparatus employing compound parabolic concentrator |
| US4514252A (en) | 1982-11-18 | 1985-04-30 | Hewlett-Packard Company | Technique of producing tapered features in integrated circuits |
| CA1237824A (en) * | 1984-04-17 | 1988-06-07 | Takashi Mimura | Resonant tunneling semiconductor device |
| JPS6144627A (ja) | 1984-08-09 | 1986-03-04 | Pioneer Electronic Corp | マイクロフレネルレンズの製造方法 |
| EP0199497B1 (en) * | 1985-04-10 | 1992-01-02 | Fujitsu Limited | Process for fabricating a self-aligned bipolar transistor |
| WO1987002179A1 (en) | 1985-09-27 | 1987-04-09 | Burroughs Corporation | Method of fabricating a tapered via hole in polyimide |
| FR2590409B1 (fr) * | 1985-11-15 | 1987-12-11 | Commissariat Energie Atomique | Procede de fabrication d'un transistor en couches minces a grille auto-alignee par rapport au drain et a la source de celui-ci et transistor obtenu par le procede |
| US4698128A (en) * | 1986-11-17 | 1987-10-06 | Motorola, Inc. | Sloped contact etch process |
| GB8715211D0 (en) | 1987-06-29 | 1987-08-05 | Secr Defence | Lensed photo detector |
| US5161059A (en) | 1987-09-21 | 1992-11-03 | Massachusetts Institute Of Technology | High-efficiency, multilevel, diffractive optical elements |
| US4902377A (en) * | 1989-05-23 | 1990-02-20 | Motorola, Inc. | Sloped contact etch process |
| US5227915A (en) | 1990-02-13 | 1993-07-13 | Holo-Or Ltd. | Diffractive optical element |
| US5073007A (en) | 1990-06-11 | 1991-12-17 | Holo-Or Ltd. | Diffractive optical element |
| US5316640A (en) * | 1991-06-19 | 1994-05-31 | Matsushita Electric Industrial Co., Ltd. | Fabricating method of micro lens |
| US5286338A (en) * | 1993-03-01 | 1994-02-15 | At&T Bell Laboratories | Methods for making microlens arrays |
| JP2795126B2 (ja) * | 1993-04-16 | 1998-09-10 | 株式会社デンソー | 曲面加工方法及びその装置 |
| US5853960A (en) * | 1998-03-18 | 1998-12-29 | Trw Inc. | Method for producing a micro optical semiconductor lens |
-
1996
- 1996-01-10 GB GBGB9600469.2A patent/GB9600469D0/en active Pending
-
1997
- 1997-01-09 AU AU13884/97A patent/AU1388497A/en not_active Abandoned
- 1997-01-09 KR KR1019980705256A patent/KR19990077120A/ko active Granted
- 1997-01-09 CN CNB971927529A patent/CN1135438C/zh not_active Expired - Fee Related
- 1997-01-09 JP JP52497697A patent/JP3965213B2/ja not_active Expired - Fee Related
- 1997-01-09 CA CA002242634A patent/CA2242634C/en not_active Expired - Fee Related
- 1997-01-09 PL PL327667A patent/PL194893B1/pl not_active IP Right Cessation
- 1997-01-09 US US09/101,306 patent/US6682657B2/en not_active Expired - Fee Related
- 1997-01-09 DE DE69740180T patent/DE69740180D1/de not_active Expired - Lifetime
- 1997-01-09 EP EP97900295A patent/EP0873542B1/en not_active Expired - Lifetime
- 1997-01-09 AT AT97900295T patent/ATE507496T1/de not_active IP Right Cessation
- 1997-01-09 GB GB9813813A patent/GB2322833B/en not_active Expired - Fee Related
- 1997-01-09 WO PCT/GB1997/000043 patent/WO1997025653A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US6682657B2 (en) | 2004-01-27 |
| KR100859673B1 (enExample) | 2009-01-12 |
| PL327667A1 (en) | 1998-12-21 |
| KR19990077120A (ko) | 1999-10-25 |
| CA2242634C (en) | 2006-08-15 |
| CN1212768A (zh) | 1999-03-31 |
| JP2000503136A (ja) | 2000-03-14 |
| JP3965213B2 (ja) | 2007-08-29 |
| CA2242634A1 (en) | 1997-07-17 |
| US20030057177A1 (en) | 2003-03-27 |
| GB9813813D0 (en) | 1998-08-26 |
| CN1135438C (zh) | 2004-01-21 |
| PL194893B1 (pl) | 2007-07-31 |
| GB2322833B (en) | 1999-10-20 |
| DE69740180D1 (de) | 2011-06-09 |
| EP0873542B1 (en) | 2011-04-27 |
| WO1997025653A1 (en) | 1997-07-17 |
| GB2322833A (en) | 1998-09-09 |
| ATE507496T1 (de) | 2011-05-15 |
| GB9600469D0 (en) | 1996-03-13 |
| EP0873542A1 (en) | 1998-10-28 |
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