ATE540430T1 - Lichtemittierende halbleitervorrichtung mit elektrode für eine n-polare ingaain-fläche - Google Patents
Lichtemittierende halbleitervorrichtung mit elektrode für eine n-polare ingaain-flächeInfo
- Publication number
- ATE540430T1 ATE540430T1 AT06805075T AT06805075T ATE540430T1 AT E540430 T1 ATE540430 T1 AT E540430T1 AT 06805075 T AT06805075 T AT 06805075T AT 06805075 T AT06805075 T AT 06805075T AT E540430 T1 ATE540430 T1 AT E540430T1
- Authority
- AT
- Austria
- Prior art keywords
- ohmic
- layer
- ingaain
- polar
- electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
Landscapes
- Led Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100308742A CN100375303C (zh) | 2005-10-27 | 2005-10-27 | 含有金锗镍的欧姆电极、铟镓铝氮半导体发光元件及制造方法 |
| PCT/CN2006/002870 WO2007048345A1 (en) | 2005-10-27 | 2006-10-26 | SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH ELECTRODE FOR N-POLAR InGaAlN SURFACE |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE540430T1 true ATE540430T1 (de) | 2012-01-15 |
Family
ID=36805821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06805075T ATE540430T1 (de) | 2005-10-27 | 2006-10-26 | Lichtemittierende halbleitervorrichtung mit elektrode für eine n-polare ingaain-fläche |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7919784B2 (de) |
| EP (1) | EP1941555B1 (de) |
| JP (1) | JP2009514197A (de) |
| KR (1) | KR20080060222A (de) |
| CN (1) | CN100375303C (de) |
| AT (1) | ATE540430T1 (de) |
| WO (1) | WO2007048345A1 (de) |
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| JP4680065B2 (ja) * | 2003-12-22 | 2011-05-11 | パナソニック株式会社 | 面発光レーザおよびレーザ投射装置 |
| US8878245B2 (en) | 2006-11-30 | 2014-11-04 | Cree, Inc. | Transistors and method for making ohmic contact to transistors |
| US8021904B2 (en) * | 2007-02-01 | 2011-09-20 | Cree, Inc. | Ohmic contacts to nitrogen polarity GaN |
| WO2008120432A1 (ja) * | 2007-03-28 | 2008-10-09 | Panasonic Corporation | オーミック電極構造体および半導体素子 |
| TWI338387B (en) * | 2007-05-28 | 2011-03-01 | Delta Electronics Inc | Current spreading layer with micro/nano structure, light-emitting diode apparatus and its manufacturing method |
| TWI353068B (en) * | 2007-07-19 | 2011-11-21 | Lite On Technology Corp | Semiconductor light-emitting element and process f |
| US8044381B2 (en) * | 2007-07-30 | 2011-10-25 | Hewlett-Packard Development Company, L.P. | Light emitting diode (LED) |
| KR100882112B1 (ko) * | 2007-09-28 | 2009-02-06 | 삼성전기주식회사 | 반도체 발광소자 및 그의 제조방법 |
| US9634191B2 (en) | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
| CN102017192B (zh) * | 2008-03-26 | 2013-01-23 | 晶能光电(江西)有限公司 | 在发光器件内制造高反射欧姆接触的方法 |
| US20090242929A1 (en) * | 2008-03-31 | 2009-10-01 | Chao-Kun Lin | Light emitting diodes with patterned current blocking metal contact |
| KR101459770B1 (ko) | 2008-05-02 | 2014-11-12 | 엘지이노텍 주식회사 | 그룹 3족 질화물계 반도체 소자 |
| US9059338B2 (en) * | 2008-05-02 | 2015-06-16 | Lg Innotek Co., Ltd. | Light emitting element and a production method therefor |
| KR100942713B1 (ko) | 2008-05-07 | 2010-02-16 | 주식회사 세미콘라이트 | 질화물계 발광소자 및 그 제조방법 |
| JP2010056313A (ja) * | 2008-08-28 | 2010-03-11 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| US8188496B2 (en) | 2008-11-06 | 2012-05-29 | Samsung Led Co., Ltd. | Semiconductor light emitting device including substrate having protection layers and method for manufacturing the same |
| KR101004858B1 (ko) * | 2008-11-06 | 2010-12-28 | 삼성엘이디 주식회사 | 화합물 반도체 발광 소자 및 그 제조방법 |
| KR101007113B1 (ko) * | 2008-11-25 | 2011-01-10 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| JP2010186829A (ja) * | 2009-02-10 | 2010-08-26 | Toshiba Corp | 発光素子の製造方法 |
| JP5350833B2 (ja) * | 2009-02-20 | 2013-11-27 | 株式会社東芝 | 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法 |
| KR101231457B1 (ko) * | 2009-03-24 | 2013-02-07 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| KR101585102B1 (ko) * | 2009-04-16 | 2016-01-13 | 삼성전자 주식회사 | 발광 소자 및 그 제조 방법 |
| KR100986560B1 (ko) * | 2010-02-11 | 2010-10-07 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| US9287452B2 (en) | 2010-08-09 | 2016-03-15 | Micron Technology, Inc. | Solid state lighting devices with dielectric insulation and methods of manufacturing |
| US8502244B2 (en) * | 2010-08-31 | 2013-08-06 | Micron Technology, Inc. | Solid state lighting devices with current routing and associated methods of manufacturing |
| US10170668B2 (en) | 2011-06-21 | 2019-01-01 | Micron Technology, Inc. | Solid state lighting devices with improved current spreading and light extraction and associated methods |
| US20130001510A1 (en) * | 2011-06-29 | 2013-01-03 | SemiLEDs Optoelectronics Co., Ltd. | Optoelectronic device having current blocking insulation layer for uniform temperature distribution and method of fabrication |
| US9847372B2 (en) * | 2011-12-01 | 2017-12-19 | Micron Technology, Inc. | Solid state transducer devices with separately controlled regions, and associated systems and methods |
| DE102012220050A1 (de) * | 2012-11-02 | 2014-05-08 | Osram Opto Semiconductors Gmbh | Organisches optoelektronisches Bauelement und Verfahren zum Betrieb des organischen optoelektronischen Bauelements |
| DE102012220020A1 (de) | 2012-11-02 | 2014-05-08 | Osram Opto Semiconductors Gmbh | Organisches optoelektronisches bauelement und verfahren zum betrieb des organischen optoelektronischen bauelements |
| DE102012220056A1 (de) | 2012-11-02 | 2014-02-13 | Osram Opto Semiconductors Gmbh | Organisches optoelektronisches bauelement und verfahren zum betrieb des organischen optoelektronischen bauelements |
| JP6185786B2 (ja) * | 2012-11-29 | 2017-08-23 | スタンレー電気株式会社 | 発光素子 |
| CN104393126A (zh) * | 2014-11-14 | 2015-03-04 | 无锡科思电子科技有限公司 | 一种红色led芯片制程工艺中的n面蒸镀方法 |
| CN105489726B (zh) * | 2015-11-24 | 2017-10-24 | 厦门市三安光电科技有限公司 | 发光二极管及其制作方法 |
| US10784398B2 (en) * | 2015-12-24 | 2020-09-22 | Vuereal Inc. | Vertical solid state devices |
| CN110709989B (zh) | 2017-03-30 | 2023-12-01 | 维耶尔公司 | 垂直固态装置 |
| US11721784B2 (en) | 2017-03-30 | 2023-08-08 | Vuereal Inc. | High efficient micro devices |
| US11600743B2 (en) | 2017-03-30 | 2023-03-07 | Vuereal Inc. | High efficient microdevices |
| CN110808319B (zh) * | 2019-11-11 | 2021-08-17 | 中国科学院半导体研究所 | 反极性垂直发光二极管及其制备方法 |
| CN113410312B (zh) * | 2021-06-11 | 2023-03-21 | 西安电子科技大学 | 一种氮极性面氮化镓共振隧穿二极管及其制作方法 |
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| JPH06151354A (ja) * | 1992-10-30 | 1994-05-31 | Sanyo Electric Co Ltd | 半導体素子の電極形成方法 |
| US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
| JPH08222797A (ja) * | 1995-01-17 | 1996-08-30 | Hewlett Packard Co <Hp> | 半導体装置およびその製造方法 |
| JP3462720B2 (ja) * | 1997-07-16 | 2003-11-05 | 三洋電機株式会社 | n型窒化物半導体の電極及び前記電極を有する半導体素子並びにその製造方法 |
| JPH11135834A (ja) * | 1997-10-27 | 1999-05-21 | Matsushita Electric Ind Co Ltd | 発光ダイオード装置及びその製造方法 |
| EP0989643B1 (de) * | 1998-09-25 | 2006-08-09 | Mitsubishi Chemical Corporation | Halbleiterlichtstrahler und dessen Herstellungsverfahren |
| JP2001085741A (ja) * | 1999-09-17 | 2001-03-30 | Toshiba Corp | 半導体素子および発光半導体素子 |
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| US6657237B2 (en) * | 2000-12-18 | 2003-12-02 | Samsung Electro-Mechanics Co., Ltd. | GaN based group III-V nitride semiconductor light-emitting diode and method for fabricating the same |
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| DE20320291U1 (de) * | 2003-06-30 | 2004-07-29 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes Bauelement |
| TWI230473B (en) * | 2003-03-10 | 2005-04-01 | Sanken Electric Co Ltd | Semiconductor light emitting device and manufacturing method thereof |
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| TWM255514U (en) * | 2003-10-16 | 2005-01-11 | Arima Optoelectronics Corp | Structure improvement of Gallium Indium Nitride light-emitting diode |
| KR100586948B1 (ko) | 2004-01-19 | 2006-06-07 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| JP2005277372A (ja) * | 2004-02-25 | 2005-10-06 | Sanken Electric Co Ltd | 半導体発光素子及びその製造方法 |
| US20050218414A1 (en) * | 2004-03-30 | 2005-10-06 | Tetsuzo Ueda | 4H-polytype gallium nitride-based semiconductor device on a 4H-polytype substrate |
| CN100372137C (zh) | 2005-05-27 | 2008-02-27 | 晶能光电(江西)有限公司 | 具有上下电极结构的铟镓铝氮发光器件及其制造方法 |
| KR101041843B1 (ko) * | 2005-07-30 | 2011-06-17 | 삼성엘이디 주식회사 | 질화물계 화합물 반도체 발광소자 및 그 제조방법 |
| JP2007208048A (ja) * | 2006-02-02 | 2007-08-16 | Fujikura Ltd | 発光素子およびその製造方法 |
| JP5019755B2 (ja) * | 2006-02-08 | 2012-09-05 | 昭和電工株式会社 | 発光ダイオード及びその製造方法 |
| JP5034275B2 (ja) * | 2006-03-08 | 2012-09-26 | ソニー株式会社 | 半導体レーザ装置 |
| JP2007273764A (ja) * | 2006-03-31 | 2007-10-18 | Sony Corp | 半導体発光装置およびその製造方法 |
-
2005
- 2005-10-27 CN CNB2005100308742A patent/CN100375303C/zh not_active Expired - Fee Related
-
2006
- 2006-09-29 US US12/063,978 patent/US7919784B2/en active Active
- 2006-10-26 JP JP2008536912A patent/JP2009514197A/ja active Pending
- 2006-10-26 US US12/063,974 patent/US7705348B2/en not_active Expired - Fee Related
- 2006-10-26 EP EP06805075A patent/EP1941555B1/de not_active Not-in-force
- 2006-10-26 AT AT06805075T patent/ATE540430T1/de active
- 2006-10-26 WO PCT/CN2006/002870 patent/WO2007048345A1/en not_active Ceased
- 2006-10-26 KR KR1020087005773A patent/KR20080060222A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP1941555A1 (de) | 2008-07-09 |
| US20080230799A1 (en) | 2008-09-25 |
| WO2007048345A1 (en) | 2007-05-03 |
| EP1941555B1 (de) | 2012-01-04 |
| US20080230792A1 (en) | 2008-09-25 |
| EP1941555A4 (de) | 2009-06-17 |
| US7919784B2 (en) | 2011-04-05 |
| CN1794477A (zh) | 2006-06-28 |
| KR20080060222A (ko) | 2008-07-01 |
| CN100375303C (zh) | 2008-03-12 |
| US7705348B2 (en) | 2010-04-27 |
| JP2009514197A (ja) | 2009-04-02 |
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