ATE525490T1 - Nickel-rhenium-legierungspulver und das nickel- rhenium-legierungspulver enthaltende leiterpaste - Google Patents

Nickel-rhenium-legierungspulver und das nickel- rhenium-legierungspulver enthaltende leiterpaste

Info

Publication number
ATE525490T1
ATE525490T1 AT07828337T AT07828337T ATE525490T1 AT E525490 T1 ATE525490 T1 AT E525490T1 AT 07828337 T AT07828337 T AT 07828337T AT 07828337 T AT07828337 T AT 07828337T AT E525490 T1 ATE525490 T1 AT E525490T1
Authority
AT
Austria
Prior art keywords
nickel
alloy powder
rhenium alloy
rhenium
powder
Prior art date
Application number
AT07828337T
Other languages
English (en)
Inventor
Yuji Akimoto
Kazuro Nagashima
Tetsuya Kimura
Yasuhiro Kamahori
Original Assignee
Shoei Chemical Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co
Application granted granted Critical
Publication of ATE525490T1 publication Critical patent/ATE525490T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
AT07828337T 2006-10-02 2007-09-25 Nickel-rhenium-legierungspulver und das nickel- rhenium-legierungspulver enthaltende leiterpaste ATE525490T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006270672 2006-10-02
PCT/JP2007/068520 WO2008041541A1 (fr) 2006-10-02 2007-09-25 alliage de nickel-rhÉnium en poudre et pÂte conductrice contenant ledit alliage de nickel-rhÉnium en poudre

Publications (1)

Publication Number Publication Date
ATE525490T1 true ATE525490T1 (de) 2011-10-15

Family

ID=39268403

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07828337T ATE525490T1 (de) 2006-10-02 2007-09-25 Nickel-rhenium-legierungspulver und das nickel- rhenium-legierungspulver enthaltende leiterpaste

Country Status (10)

Country Link
US (1) US7744779B2 (de)
EP (1) EP2078762B1 (de)
JP (1) JP5327442B2 (de)
KR (1) KR101355329B1 (de)
CN (1) CN101522928B (de)
AT (1) ATE525490T1 (de)
CA (1) CA2663572C (de)
MY (1) MY145770A (de)
TW (1) TWI419980B (de)
WO (1) WO2008041541A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101412950B1 (ko) * 2012-11-07 2014-06-26 삼성전기주식회사 적층 세라믹 커패시터
US9099215B2 (en) * 2013-01-21 2015-08-04 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode
US9093675B2 (en) * 2013-01-21 2015-07-28 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode
CN103192070B (zh) * 2013-04-17 2015-07-08 苏州格林泰克科技有限公司 一种银/氯化银电极材料及其制备方法和电极
JP6512844B2 (ja) * 2015-01-30 2019-05-15 太陽誘電株式会社 積層コンデンサ及び積層コンデンサの製造方法
JP7251068B2 (ja) * 2018-07-31 2023-04-04 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体

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US431385A (en) * 1890-07-01 Berth for vessels
US5584663A (en) * 1994-08-15 1996-12-17 General Electric Company Environmentally-resistant turbine blade tip
JP3640511B2 (ja) 1997-09-05 2005-04-20 Ｊｆｅミネラル株式会社 ニッケル超微粉
JPH1180816A (ja) * 1997-09-10 1999-03-26 Sumitomo Metal Mining Co Ltd 導電ペースト用ニッケル粉末とその製造方法
JP2992270B2 (ja) 1998-05-29 1999-12-20 三井金属鉱業株式会社 複合ニッケル微粉末及びその製造方法
FR2780982B1 (fr) 1998-07-07 2000-09-08 Onera (Off Nat Aerospatiale) Superalliage monocristallin a base de nickel a haut solvus
JP3984712B2 (ja) 1998-07-27 2007-10-03 東邦チタニウム株式会社 導電ペースト用ニッケル粉末
JP4016232B2 (ja) * 1998-12-04 2007-12-05 住友金属鉱山株式会社 ニッケル粉末の製造方法
WO2000075398A1 (en) * 1999-06-02 2000-12-14 Abb Research Ltd. Coating composition for high temperature protection
JP3812359B2 (ja) 2000-05-02 2006-08-23 昭栄化学工業株式会社 金属粉末の製造方法
JP2002060877A (ja) 2000-08-16 2002-02-28 Kawatetsu Mining Co Ltd 導電ペースト用Ｎｉ合金粉
JP4098329B2 (ja) 2003-02-05 2008-06-11 Ｔｄｋ株式会社 電子部品およびその製造方法
JP4182009B2 (ja) 2003-03-31 2008-11-19 Ｔｄｋ株式会社 導電性粒子、導電性ペースト、電子部品、積層セラミックコンデンサおよびその製造方法
JP2005347288A (ja) * 2004-05-31 2005-12-15 Tdk Corp 積層セラミックコンデンサの製造方法
JP2005352925A (ja) 2004-06-11 2005-12-22 P A:Kk ネットワークを利用した求人・求職情報およびそれに関連した情報の提供におけるマッチングシステム
CN1260384C (zh) * 2004-07-20 2006-06-21 兰州理工大学 用于两相流工件喷熔的NiCrWRE合金粉末及其制备方法
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JP4218067B2 (ja) * 2005-10-19 2009-02-04 昭栄化学工業株式会社 レニウム含有合金粉末の製造方法
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US9520498B2 (en) * 2014-03-17 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. FinFET structure and method for fabricating the same

Also Published As

Publication number Publication date
CN101522928A (zh) 2009-09-02
JPWO2008041541A1 (ja) 2010-02-04
KR101355329B1 (ko) 2014-01-23
TW200829701A (en) 2008-07-16
EP2078762A1 (de) 2009-07-15
US7744779B2 (en) 2010-06-29
JP5327442B2 (ja) 2013-10-30
TWI419980B (zh) 2013-12-21
WO2008041541A1 (fr) 2008-04-10
US20100021735A1 (en) 2010-01-28
KR20090069302A (ko) 2009-06-30
EP2078762A4 (de) 2010-09-01
CA2663572A1 (en) 2008-04-10
MY145770A (en) 2012-04-13
CA2663572C (en) 2013-07-30
CN101522928B (zh) 2010-09-29
EP2078762B1 (de) 2011-09-21

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