ATE525338T1 - Leiterpaste für ein keramisches substrat und elektrischer schaltkreis - Google Patents

Leiterpaste für ein keramisches substrat und elektrischer schaltkreis

Info

Publication number
ATE525338T1
ATE525338T1 AT08796035T AT08796035T ATE525338T1 AT E525338 T1 ATE525338 T1 AT E525338T1 AT 08796035 T AT08796035 T AT 08796035T AT 08796035 T AT08796035 T AT 08796035T AT E525338 T1 ATE525338 T1 AT E525338T1
Authority
AT
Austria
Prior art keywords
powder
ceramic substrate
conductor paste
electrical circuit
glass powder
Prior art date
Application number
AT08796035T
Other languages
German (de)
English (en)
Inventor
Akira Inaba
Naoto Nakajima
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39764755&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE525338(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of ATE525338T1 publication Critical patent/ATE525338T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5116—Ag or Au
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H10W70/666—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H10W72/5363—
    • H10W74/15—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT08796035T 2007-06-29 2008-06-27 Leiterpaste für ein keramisches substrat und elektrischer schaltkreis ATE525338T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/824,194 US7704416B2 (en) 2007-06-29 2007-06-29 Conductor paste for ceramic substrate and electric circuit
PCT/US2008/068459 WO2009006242A1 (en) 2007-06-29 2008-06-27 Conductor paste for ceramic substrate and electric circuit

Publications (1)

Publication Number Publication Date
ATE525338T1 true ATE525338T1 (de) 2011-10-15

Family

ID=39764755

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08796035T ATE525338T1 (de) 2007-06-29 2008-06-27 Leiterpaste für ein keramisches substrat und elektrischer schaltkreis

Country Status (8)

Country Link
US (3) US7704416B2 (enExample)
EP (1) EP2164822B1 (enExample)
JP (1) JP5303552B2 (enExample)
KR (1) KR20100029142A (enExample)
CN (1) CN101720311A (enExample)
AT (1) ATE525338T1 (enExample)
TW (1) TW200919492A (enExample)
WO (1) WO2009006242A1 (enExample)

Families Citing this family (48)

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US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
US20090211626A1 (en) * 2008-02-26 2009-08-27 Hideki Akimoto Conductive paste and grid electrode for silicon solar cells
FR2942516B1 (fr) * 2009-02-24 2015-07-03 Saint Gobain Ct Recherches Assemblage affleurant.
FR2942471A1 (fr) 2009-02-24 2010-08-27 Saint Gobain Ct Recherches Piece ceramique revetue.
JP5532512B2 (ja) * 2009-02-24 2014-06-25 日本電気硝子株式会社 電極形成用ガラス組成物および電極形成材料
FR2942517B1 (fr) * 2009-02-24 2015-07-03 Saint Gobain Ct Recherches Materiau compliant.
FR2942515B1 (fr) * 2009-02-24 2015-07-03 Saint Gobain Ct Recherches Dispositif d'assemblage.
US20130284256A1 (en) * 2009-04-09 2013-10-31 E I Du Pont De Nemours And Company Lead-free conductive paste composition and semiconductor devices made therewith
CN102123961A (zh) * 2009-08-07 2011-07-13 Lg化学株式会社 制备硅太阳能电池的无铅玻璃料粉末、其制备方法、包含其的金属膏组合物和硅太阳能电池
BR112012011551A2 (pt) * 2009-11-16 2016-06-28 Heraeus Precious Metals North America Conshohocken Llc composição em pasta eletrocondutora
US20110195541A1 (en) * 2010-02-05 2011-08-11 Hitachi Chemical Company, Ltd. Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell
US20110212564A1 (en) * 2010-02-05 2011-09-01 Hitachi Chemical Company, Ltd. Method for producing photovoltaic cell
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CN102214497B (zh) * 2010-04-07 2013-05-01 太阳控股株式会社 导电糊剂及导电图案
CN102270513B (zh) * 2010-06-03 2013-05-08 西安宏星电子浆料科技有限责任公司 氧化铝基板使用的厚膜导体浆料及其制备方法
US20130161569A1 (en) * 2010-08-17 2013-06-27 Kentaro Ishihara Glass for use in forming electrodes, and electrode-forming material using same
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CN103165217B (zh) * 2011-12-14 2016-04-06 上海宝银电子材料有限公司 一种云母片电容器用导电银浆及其制备方法
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CN103165213B (zh) * 2011-12-15 2016-01-06 上海宝银电子材料有限公司 一种客车前挡玻璃用导电银浆及其制备方法
US9039942B2 (en) 2011-12-21 2015-05-26 E I Du Pont De Nemours And Company Lead-free conductive paste composition and semiconductor devices made therewith
TWI425894B (zh) * 2011-12-26 2014-02-01 Vin Cen Shi 陶瓷基板漸縮凹陷區域之導電層附著加工方法及導電膠組成物
CN103187490B (zh) * 2011-12-31 2016-04-20 谢文圣 陶瓷基板凹陷区域的导电层附着加工方法及导电胶组成物
US9355986B2 (en) * 2012-02-14 2016-05-31 Mitsubishi Materials Corporation Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
AT512525B1 (de) 2012-05-04 2013-09-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat
US9615452B1 (en) 2012-05-10 2017-04-04 Cree Fayetteville, Inc. Silver filled trench substrate for high power and/or high temperature electronics
US9245663B2 (en) * 2012-10-10 2016-01-26 E I Du Pont De Nemours And Company Thick film silver paste and its use in the manufacture of semiconductor devices
DE102014209106A1 (de) * 2013-06-05 2014-12-11 Ceramtec Gmbh Metallisierung auf keramischen Substraten
CN103366858B (zh) * 2013-07-08 2015-10-14 广东羚光新材料股份有限公司 一种led灯氧化铝基座用银浆及其应用
CN105492548A (zh) * 2013-09-16 2016-04-13 贺利氏贵金属北美康舍霍肯有限责任公司 具有促粘玻璃的导电浆料
CN103996430A (zh) * 2014-04-24 2014-08-20 安徽为民磁力科技有限公司 一种高导电性pcb电路板银浆及其制备方法
CN104078099A (zh) * 2014-06-04 2014-10-01 乐凯特科技铜陵有限公司 一种环保pcb电路板导电银浆及其制备方法
CN104078096A (zh) * 2014-06-04 2014-10-01 乐凯特科技铜陵有限公司 一种低成本印刷电路板银浆及其制备方法
KR101682939B1 (ko) * 2014-10-08 2016-12-06 김강 저온 소결 가능한 도전성 접착제
US10784383B2 (en) 2015-08-07 2020-09-22 E I Du Pont De Nemours And Company Conductive paste composition and semiconductor devices made therewith
TWI585055B (zh) * 2016-03-29 2017-06-01 中國製釉股份有限公司 玻璃材料、螢光複合材料、與發光裝置
CN106082671B (zh) * 2016-06-22 2019-01-29 丽水学院 龙泉青瓷青釉、龙泉青瓷及其制备方法
US11228080B2 (en) 2018-11-07 2022-01-18 Dupont Electronics, Inc. Dielectric filter and method for manufacturing the same
CN110400651B (zh) * 2019-06-28 2021-07-30 云南大学 一种导电银浆料及其制备方法
CN110942840A (zh) * 2019-12-13 2020-03-31 新昌中国计量大学企业创新研究院有限公司 用于氮化铝衬底的无铅铜导体浆料
CN111863312B (zh) * 2020-09-04 2022-03-29 西安宏星电子浆料科技股份有限公司 一种5g陶瓷介质滤波器用喷涂型银浆及其制备方法
CN114049982B (zh) * 2021-11-23 2024-06-07 无锡帝科电子材料股份有限公司 一种陶瓷滤波器用导电银浆及其制备方法
CN114590999B (zh) * 2022-01-20 2023-05-05 广西科技大学 一种低熔点无铅玻璃粉及其制备方法
CN115804477A (zh) * 2022-12-07 2023-03-17 深圳市卓尔悦电子科技有限公司 发热件、雾化芯、气溶胶发生装置及发热件制备方法
CN115886354A (zh) * 2022-12-08 2023-04-04 李雪春 一种用于电子烟的功能材料及其制备方法
TW202437276A (zh) 2023-02-09 2024-09-16 德商陶瓷技術公司 用於陶瓷基板的金屬糊料
CN115838303B (zh) * 2023-02-22 2023-04-28 西安石油大学 一种氮化铝陶瓷用银浆
CN116525173B (zh) * 2023-05-09 2024-07-16 湖南特发新材料有限公司 一种不锈钢基板大功率厚膜银铂钨电阻浆料、烧制方法和应用

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Also Published As

Publication number Publication date
WO2009006242A1 (en) 2009-01-08
US8043536B2 (en) 2011-10-25
US20110114898A1 (en) 2011-05-19
JP5303552B2 (ja) 2013-10-02
US20100155117A1 (en) 2010-06-24
US20090004369A1 (en) 2009-01-01
US7897066B2 (en) 2011-03-01
EP2164822B1 (en) 2011-09-21
EP2164822A1 (en) 2010-03-24
US7704416B2 (en) 2010-04-27
JP2010532586A (ja) 2010-10-07
CN101720311A (zh) 2010-06-02
KR20100029142A (ko) 2010-03-15
TW200919492A (en) 2009-05-01

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