WO2008117710A1 - 感光性誘電体ペーストおよびそれを用いた電子部品 - Google Patents

感光性誘電体ペーストおよびそれを用いた電子部品 Download PDF

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Publication number
WO2008117710A1
WO2008117710A1 PCT/JP2008/055062 JP2008055062W WO2008117710A1 WO 2008117710 A1 WO2008117710 A1 WO 2008117710A1 JP 2008055062 W JP2008055062 W JP 2008055062W WO 2008117710 A1 WO2008117710 A1 WO 2008117710A1
Authority
WO
WIPO (PCT)
Prior art keywords
amount
glass powder
sintering
paste
vol
Prior art date
Application number
PCT/JP2008/055062
Other languages
English (en)
French (fr)
Inventor
Reiko Muraki
Shuichi Towata
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009506297A priority Critical patent/JP5104852B2/ja
Priority to CN2008800098568A priority patent/CN101641749B/zh
Publication of WO2008117710A1 publication Critical patent/WO2008117710A1/ja
Priority to US12/565,035 priority patent/US7923132B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C12/00—Powdered glass; Bead compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　低温短時間焼成が可能で、焼結性や誘電率の温度特性などの特性の良好な誘電体膜（絶縁体膜）を形成することが可能な感光性誘電体ペーストおよびそれを用いて形成された誘電体膜を備えた高特性の電子部品を提供する。 　(ａ)Ｂａ－Ｎｄ－Ｔｉ系複合酸化物粉末を含む誘電体粉末１０～３０体積％と、支持ガラス粉末５０～８０体積％と、ＢｉをＢｉ2Ｏ3換算で５０～９０重量％含む焼結助剤ガラス粉末１～２０体積％とを含む無機成分と、(ｂ)感光性有機成分とを含有し、焼成時にＢａ－Ｎｄ－Ｔｉ系複合酸化物粉末と焼結助剤ガラス粉末とが反応することにより、Ｂｉ－Ｎｄ－Ｔｉ系複合酸化物を生成するような構成とする。 　支持ガラス粉末として、ＳｉをＳｉＯ2換算で７０～９０重量％の割合で含有するものを用いる。
PCT/JP2008/055062 2007-03-26 2008-03-19 感光性誘電体ペーストおよびそれを用いた電子部品 WO2008117710A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009506297A JP5104852B2 (ja) 2007-03-26 2008-03-19 感光性誘電体ペーストおよびそれを用いた電子部品
CN2008800098568A CN101641749B (zh) 2007-03-26 2008-03-19 感光性电介质糊剂及使用其的电子部件
US12/565,035 US7923132B2 (en) 2007-03-26 2009-09-23 Photosensitive dielectric paste and electronic part made with the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-078641 2007-03-26
JP2007078641 2007-03-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/565,035 Continuation US7923132B2 (en) 2007-03-26 2009-09-23 Photosensitive dielectric paste and electronic part made with the same

Publications (1)

Publication Number Publication Date
WO2008117710A1 true WO2008117710A1 (ja) 2008-10-02

Family

ID=39788446

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055062 WO2008117710A1 (ja) 2007-03-26 2008-03-19 感光性誘電体ペーストおよびそれを用いた電子部品

Country Status (4)

Country Link
US (1) US7923132B2 (ja)
JP (1) JP5104852B2 (ja)
CN (1) CN101641749B (ja)
WO (1) WO2008117710A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010136385A1 (en) * 2009-05-25 2010-12-02 Basf Se Crosslinkable dielectrics and methods of preparation and use thereof
WO2013161968A1 (ja) * 2012-04-26 2013-10-31 三菱化学株式会社 感光性樹脂組成物、硬化物、層間絶縁膜、ｔｆｔアクティブマトリックス基板及び液晶表示装置
JP2014019585A (ja) * 2012-07-12 2014-02-03 Murata Mfg Co Ltd 感光性ガラスペーストの製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101940981B1 (ko) 2014-05-05 2019-01-23 3디 글래스 솔루션즈 인코포레이티드 2d 및 3d 인덕터 안테나 및 변압기 제작 광 활성 기판
JP6508349B2 (ja) * 2015-09-28 2019-05-08 株式会社村田製作所 感光性ガラスペースト及び電子部品
JP6742877B2 (ja) * 2016-09-28 2020-08-19 株式会社ノリタケカンパニーリミテド 導電性ペースト
EP3649733A1 (en) * 2017-07-07 2020-05-13 3D Glass Solutions, Inc. 2d and 3d rf lumped element devices for rf system in a package photoactive glass substrates
KR102419713B1 (ko) 2017-12-15 2022-07-13 3디 글래스 솔루션즈 인코포레이티드 결합 전송 라인 공진 rf 필터
CA3172853A1 (en) 2019-04-05 2020-10-08 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
KR20220164800A (ko) 2020-04-17 2022-12-13 3디 글래스 솔루션즈 인코포레이티드 광대역 인덕터
CN111952075A (zh) * 2020-09-16 2020-11-17 大连达利凯普科技股份公司 一种抑制玻璃成分析出并改善镀层结合力的烧结工艺
WO2023200624A1 (en) * 2022-04-11 2023-10-19 3D Glass Solutions, Inc. 2d and 3d rf lumped element devices for rf system in a package photoactive glass substrates

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01275466A (ja) * 1988-04-26 1989-11-06 Mitsubishi Mining & Cement Co Ltd 誘電体磁器組成物
JPH06251621A (ja) * 1993-02-26 1994-09-09 Toray Ind Inc 感光性誘電ペースト
JPH0959063A (ja) * 1995-08-21 1997-03-04 Ferro Corp Ｘ７ｒ型低火度改良誘電性組成物とそのコンデンサー
JPH10130050A (ja) * 1996-10-25 1998-05-19 Fuji Elelctrochem Co Ltd 低温焼結用誘電体材料の調製方法
JP2000030534A (ja) * 1998-07-08 2000-01-28 Asahi Chem Res Lab Ltd 感光性高誘電体ペーストおよびそれを用いるコンデンサーの製造方法
JP2000222940A (ja) * 2000-01-01 2000-08-11 Toray Ind Inc 感光性誘電ペ―スト

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2197331C (en) * 1995-06-12 2007-02-27 Yuichiro Iguchi A photosensitive paste, a plasma display, and a method for the production thereof
JP3651298B2 (ja) * 1999-02-17 2005-05-25 株式会社村田製作所 感光性絶縁体ペースト及び厚膜多層回路基板
US6183669B1 (en) * 1999-03-25 2001-02-06 Murata Manufacturing Co., Ltd. Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
GB2348205B (en) * 1999-03-25 2001-06-27 Murata Manufacturing Co Paste composition green sheet and multilayer substrate
GB2360292B (en) * 2000-03-15 2002-04-03 Murata Manufacturing Co Photosensitive thick film composition and electronic device using the same
JP2002082449A (ja) * 2000-06-30 2002-03-22 Murata Mfg Co Ltd 厚膜パターンの形成方法及びそれに用いられる感光性ペースト
JP3674501B2 (ja) * 2000-11-30 2005-07-20 株式会社村田製作所 感光性銅ペースト、銅パターンの形成方法、及びセラミック多層基板の製造方法
JP3757886B2 (ja) * 2002-01-25 2006-03-22 株式会社村田製作所 光反応性樹脂組成物、それを用いた回路基板およびセラミック多層基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01275466A (ja) * 1988-04-26 1989-11-06 Mitsubishi Mining & Cement Co Ltd 誘電体磁器組成物
JPH06251621A (ja) * 1993-02-26 1994-09-09 Toray Ind Inc 感光性誘電ペースト
JPH0959063A (ja) * 1995-08-21 1997-03-04 Ferro Corp Ｘ７ｒ型低火度改良誘電性組成物とそのコンデンサー
JPH10130050A (ja) * 1996-10-25 1998-05-19 Fuji Elelctrochem Co Ltd 低温焼結用誘電体材料の調製方法
JP2000030534A (ja) * 1998-07-08 2000-01-28 Asahi Chem Res Lab Ltd 感光性高誘電体ペーストおよびそれを用いるコンデンサーの製造方法
JP2000222940A (ja) * 2000-01-01 2000-08-11 Toray Ind Inc 感光性誘電ペ―スト

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010136385A1 (en) * 2009-05-25 2010-12-02 Basf Se Crosslinkable dielectrics and methods of preparation and use thereof
US8853820B2 (en) 2009-05-25 2014-10-07 Basf Se Crosslinkable dielectrics and methods of preparation and use thereof
WO2013161968A1 (ja) * 2012-04-26 2013-10-31 三菱化学株式会社 感光性樹脂組成物、硬化物、層間絶縁膜、ｔｆｔアクティブマトリックス基板及び液晶表示装置
CN104246609A (zh) * 2012-04-26 2014-12-24 三菱化学株式会社 感光性树脂组合物、固化物、层间绝缘膜、tft 有源阵列基板及液晶显示装置
JPWO2013161968A1 (ja) * 2012-04-26 2015-12-24 三菱化学株式会社 感光性樹脂組成物、硬化物、層間絶縁膜、ｔｆｔアクティブマトリックス基板及び液晶表示装置
JP2014019585A (ja) * 2012-07-12 2014-02-03 Murata Mfg Co Ltd 感光性ガラスペーストの製造方法

Also Published As

Publication number Publication date
US7923132B2 (en) 2011-04-12
JPWO2008117710A1 (ja) 2010-07-15
US20100009838A1 (en) 2010-01-14
JP5104852B2 (ja) 2012-12-19
CN101641749A (zh) 2010-02-03
CN101641749B (zh) 2011-05-04

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