WO2008093669A1 - 感光性ガラスペーストおよび多層配線チップ部品 - Google Patents

感光性ガラスペーストおよび多層配線チップ部品 Download PDF

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Publication number
WO2008093669A1
WO2008093669A1 PCT/JP2008/051292 JP2008051292W WO2008093669A1 WO 2008093669 A1 WO2008093669 A1 WO 2008093669A1 JP 2008051292 W JP2008051292 W JP 2008051292W WO 2008093669 A1 WO2008093669 A1 WO 2008093669A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
sintering
main
chip part
ingredient
Prior art date
Application number
PCT/JP2008/051292
Other languages
English (en)
French (fr)
Inventor
Kosuke Nishino
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to CN200880003515XA priority Critical patent/CN101595071B/zh
Priority to JP2008556103A priority patent/JP5195432B2/ja
Publication of WO2008093669A1 publication Critical patent/WO2008093669A1/ja
Priority to US12/533,538 priority patent/US8525039B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)

Abstract

　低温短時間焼成が可能で、焼成工程を経て形成されるガラス層における、ボイドの発生と、Ａｇの拡散を抑制することが可能な感光性ガラスペースト、およびそれを用いて製造される、高特性の多層配線チップ部品を提供する。 　セラミック骨材、主成分ガラスとともに用いる焼結助剤ガラスとして、セラミック骨材に対する接触角が、主成分ガラスのセラミック骨材に対する接触角よりも小さいものを用い、かつ、その含有割合を、無機成分比率で５～１０体積％とする。 　また、焼結助剤ガラスとして、ＳｉＯ2と、Ｂ2Ｏ3と、ＣａＯと、Ｌｉ2Ｏと、ＺｎＯとを所定の割合で含むものを用いる。 　また、主成分ガラスとして、７０～９０重量％のＳｉＯ2と、１５～２０重量％のＢ2Ｏ3と、１～５重量％のＫ2Ｏとを含むものを用いる。
PCT/JP2008/051292 2007-01-30 2008-01-29 感光性ガラスペーストおよび多層配線チップ部品 WO2008093669A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880003515XA CN101595071B (zh) 2007-01-30 2008-01-29 感光性玻璃浆料和多层布线片部件
JP2008556103A JP5195432B2 (ja) 2007-01-30 2008-01-29 感光性ガラスペーストおよび多層配線チップ部品
US12/533,538 US8525039B2 (en) 2007-01-30 2009-07-31 Photosensitive glass paste and multilayer wiring chip component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-019560 2007-01-30
JP2007019560 2007-01-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/533,538 Continuation US8525039B2 (en) 2007-01-30 2009-07-31 Photosensitive glass paste and multilayer wiring chip component

Publications (1)

Publication Number Publication Date
WO2008093669A1 true WO2008093669A1 (ja) 2008-08-07

Family

ID=39673979

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051292 WO2008093669A1 (ja) 2007-01-30 2008-01-29 感光性ガラスペーストおよび多層配線チップ部品

Country Status (5)

Country Link
US (1) US8525039B2 (ja)
JP (1) JP5195432B2 (ja)
KR (1) KR101031742B1 (ja)
CN (1) CN101595071B (ja)
WO (1) WO2008093669A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013038671A1 (ja) * 2011-09-15 2013-03-21 パナソニック株式会社 コモンモードノイズフィルタおよびその製造方法
JP2013062460A (ja) * 2011-09-15 2013-04-04 Panasonic Corp コモンモードノイズフィルタおよびその製造方法
JP2013062459A (ja) * 2011-09-15 2013-04-04 Panasonic Corp コモンモードノイズフィルタおよびその製造方法
JP2014019585A (ja) * 2012-07-12 2014-02-03 Murata Mfg Co Ltd 感光性ガラスペーストの製造方法
JP2016054278A (ja) * 2014-09-02 2016-04-14 小林　博 表面に導電層と絶縁層とが形成されたセラミック基板が積層された部品の製造及び製造方法
WO2017056793A1 (ja) * 2015-09-28 2017-04-06 株式会社村田製作所 感光性ガラスペースト及び電子部品
WO2018037729A1 (ja) * 2016-08-26 2018-03-01 株式会社村田製作所 感光性ガラスペースト、電子部品、及び、電子部品の製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101228694B1 (ko) * 2010-12-03 2013-02-01 삼성전기주식회사 소결 조제용 나노 사이즈 글라스 분말 및 그 제조 방법
KR102052596B1 (ko) * 2014-06-25 2019-12-06 삼성전기주식회사 칩형 코일 부품 및 그 제조방법
JP6075481B2 (ja) * 2015-02-10 2017-02-08 Tdk株式会社 ガラスセラミックス組成物およびコイル電子部品
KR102163414B1 (ko) * 2015-12-30 2020-10-08 삼성전기주식회사 코일 전자부품
JP6738635B2 (ja) * 2016-03-31 2020-08-12 太陽誘電株式会社 コイル部品
CN107296985B (zh) * 2017-05-15 2020-09-22 广东工业大学 一种基于光固化成型三维打印生物陶瓷支架的方法和应用
JP6720945B2 (ja) * 2017-09-12 2020-07-08 株式会社村田製作所 コイル部品
WO2019066468A1 (ko) * 2017-09-27 2019-04-04 (주)이노시아 고정세 선폭을 가지는 칩인덕터 제조방법 및 이에 사용되는 감광성 물질
JP6879275B2 (ja) * 2017-11-29 2021-06-02 株式会社村田製作所 電子部品
US11881339B2 (en) * 2019-12-10 2024-01-23 Samsung Electro-Mechanics Co., Ltd. Coil component
JP7232280B2 (ja) 2021-03-25 2023-03-02 株式会社ノリタケカンパニーリミテド 電子部品製造用キットとその利用

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Publication number Priority date Publication date Assignee Title
JP2000275826A (ja) * 1999-03-25 2000-10-06 Murata Mfg Co Ltd ペースト組成物及びそれを用いた回路基板
JP2001114554A (ja) * 1999-10-12 2001-04-24 Murata Mfg Co Ltd 低温焼成セラミック組成物及びセラミック多層基板
JP2001210141A (ja) * 2000-01-31 2001-08-03 Murata Mfg Co Ltd 感光性ガラスペースト及びそれを用いた多層配線回路板の製造方法
JP2002037641A (ja) * 2000-05-16 2002-02-06 Nippon Electric Glass Co Ltd 半導体封入用ガラス、半導体封入用外套管及び半導体素子の封入方法
JP2003104755A (ja) * 2001-09-28 2003-04-09 Toray Ind Inc ペースト

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JPH0710567B2 (ja) 1989-11-08 1995-02-08 ユニッタ株式会社 両歯歯付ベルトの製造方法
JPH0818236A (ja) 1994-06-29 1996-01-19 Kyocera Corp 積層セラミック回路基板の製造方法
JP3645046B2 (ja) 1996-09-10 2005-05-11 Ｔｄｋ株式会社 非磁性セラミックおよびセラミック積層部品
JPH10289822A (ja) 1997-04-16 1998-10-27 Tdk Corp 電子部品及びウエハ
JPH11139846A (ja) * 1997-11-04 1999-05-25 Shipley Far East Kk 感光性ガラスペースト
JP3473891B2 (ja) 1998-01-07 2003-12-08 株式会社村田製作所 高周波インダクタの製造方法
JP2000284472A (ja) * 1999-01-27 2000-10-13 Murata Mfg Co Ltd 感光性絶縁体ペースト及び厚膜多層回路基板
US6183669B1 (en) * 1999-03-25 2001-02-06 Murata Manufacturing Co., Ltd. Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
US6534346B2 (en) * 2000-05-16 2003-03-18 Nippon Electric Glass Co., Ltd. Glass and glass tube for encapsulating semiconductors
TW526693B (en) * 2000-06-15 2003-04-01 Murata Manufacturing Co Multilayer circuit component and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000275826A (ja) * 1999-03-25 2000-10-06 Murata Mfg Co Ltd ペースト組成物及びそれを用いた回路基板
JP2001114554A (ja) * 1999-10-12 2001-04-24 Murata Mfg Co Ltd 低温焼成セラミック組成物及びセラミック多層基板
JP2001210141A (ja) * 2000-01-31 2001-08-03 Murata Mfg Co Ltd 感光性ガラスペースト及びそれを用いた多層配線回路板の製造方法
JP2002037641A (ja) * 2000-05-16 2002-02-06 Nippon Electric Glass Co Ltd 半導体封入用ガラス、半導体封入用外套管及び半導体素子の封入方法
JP2003104755A (ja) * 2001-09-28 2003-04-09 Toray Ind Inc ペースト

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013038671A1 (ja) * 2011-09-15 2013-03-21 パナソニック株式会社 コモンモードノイズフィルタおよびその製造方法
JP2013062460A (ja) * 2011-09-15 2013-04-04 Panasonic Corp コモンモードノイズフィルタおよびその製造方法
JP2013062459A (ja) * 2011-09-15 2013-04-04 Panasonic Corp コモンモードノイズフィルタおよびその製造方法
US9269487B2 (en) 2011-09-15 2016-02-23 Panasonic Intellectual Property Management Co., Ltd. Common mode noise filter and production method therefor
JP2014019585A (ja) * 2012-07-12 2014-02-03 Murata Mfg Co Ltd 感光性ガラスペーストの製造方法
JP2016054278A (ja) * 2014-09-02 2016-04-14 小林　博 表面に導電層と絶縁層とが形成されたセラミック基板が積層された部品の製造及び製造方法
WO2017056793A1 (ja) * 2015-09-28 2017-04-06 株式会社村田製作所 感光性ガラスペースト及び電子部品
JPWO2017056793A1 (ja) * 2015-09-28 2018-07-05 株式会社村田製作所 感光性ガラスペースト及び電子部品
US10390427B2 (en) 2015-09-28 2019-08-20 Murata Manufacturing Co., Ltd. Photosensitive glass paste and electronic component
WO2018037729A1 (ja) * 2016-08-26 2018-03-01 株式会社村田製作所 感光性ガラスペースト、電子部品、及び、電子部品の製造方法
JPWO2018037729A1 (ja) * 2016-08-26 2019-03-07 株式会社村田製作所 感光性ガラスペースト、電子部品、及び、電子部品の製造方法
US11136259B2 (en) 2016-08-26 2021-10-05 Murata Manufacturing Co., Ltd. Photosensitive glass paste, electronic component, and method for producing electronic component

Also Published As

Publication number Publication date
JPWO2008093669A1 (ja) 2010-05-20
CN101595071A (zh) 2009-12-02
KR101031742B1 (ko) 2011-04-29
KR20090094867A (ko) 2009-09-08
US20090283306A1 (en) 2009-11-19
JP5195432B2 (ja) 2013-05-08
CN101595071B (zh) 2012-07-04
US8525039B2 (en) 2013-09-03

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