CN106045508A - 一种可低温烧结的低介电常数微波介电陶瓷Al2Mo3O12 - Google Patents

一种可低温烧结的低介电常数微波介电陶瓷Al2Mo3O12 Download PDF

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CN106045508A
CN106045508A CN201610393595.0A CN201610393595A CN106045508A CN 106045508 A CN106045508 A CN 106045508A CN 201610393595 A CN201610393595 A CN 201610393595A CN 106045508 A CN106045508 A CN 106045508A
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dielectric
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al2mo3o12
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李纯纯
相怀成
方维双
杨光杰
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Guilin University of Technology
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Abstract

本发明公开了一种钼基复合氧化物Al2Mo3O12作为可低温烧结的低介电常数微波介电陶瓷的应用及其制备方法。（1）将纯度为99.9%（重量百分比）以上的Al2O3和MoO3的原始粉末按Al2Mo3O12的组成称量配料；（2）将步骤（1）原料湿式球磨混合8小时，球磨介质为无水乙醇，烘干后在550℃大气气氛中预烧12小时；（3）在步骤（2）制得的粉末中添加粘结剂并造粒后，再压制成型，最后在600~680℃大气气氛中烧结4小时；所述的粘结剂采用质量浓度为5%的聚乙烯醇溶液，聚乙烯醇的添加量占粉末总质量的3%。本发明制备的陶瓷烧结良好，介电常数达到12.3～14.7，其品质因数Q×f值高达34,000‑55,000GHz，谐振频率温度系数小，在工业上有着极大的应用价值。

Description

一种可低温烧结的低介电常数微波介电陶瓷Al2Mo3O12
技术领域
本发明涉及介电陶瓷材料，特别是涉及用于制造微波频率使用的陶瓷基板、谐振器与滤波器等微波元器件的介电陶瓷材料及其制备方法。
背景技术
微波介电陶瓷是指应用于微波频段（主要是UHF和SHF频段）电路中作为介质材料并完成一种或多种功能的陶瓷，在现代通讯中被广泛用作谐振器、滤波器、介质基片和介质导波回路等元器件，是现代通信技术的关键基础材料，已在便携式移动电话、汽车电话、无绳电话、电视卫星接受器和军事雷达等方面有着十分重要的应用，在现代通讯工具的小型化、集成化过程中正发挥着越来越大的作用。
应用于微波频段的介电陶瓷，应满足如下介电特性的要求：（1）系列化介电常数ε r 以适应不同频率及不同应用场合的要求;（2）高的品质因数Q 值或低的介质损耗tanδ 以降低噪音，一般要求Q ×f ≥ 3000 GHz;（3）谐振频率的温度系数τ ƒ 尽可能小以保证器件具有好的热稳定性，一般要求-10 ppm/℃ ≤ τƒ ≤ +10 ppm/℃。由于微波介电陶瓷的三个性能指标（ε r 与Q ×f和τƒ）之间是相互制约的关系（见文献：微波介质陶瓷材料介电性能间的制约关系，朱建华，梁 飞，汪小红，吕文中，电子元件与材料，2005年3月第3期），满足三个性能要求且可低温烧结的单相微波介质陶瓷非常少，主要是它们的谐振频率温度系数通常过大或者品质因数偏低而无法实际应用要求。目前对微波介质陶瓷的研究大部分是通过大量实验而得出的经验总结，却没有完整的理论来阐述微观结构与介电性能的关系。因此，在理论上还无法从化合物的组成与结构上预测其谐振频率温度系数和品质因数等微波介电性能。探索与开发同时具有近零谐振频率温度系数（-10 ppm/℃ ≤ τƒ ≤ +10 ppm/℃）与较高品质因数的微波介电陶瓷是本领域技术人员一直渴望解决但始终难以获得成功的难题。
近年来，随着信息技术的高速发展，电子线路日益向高频化、微型化和高集成化方向发展，这就对电子遇见提出了尺寸小、高频、高可靠性和高集成度的要求。低温共烧陶瓷技术（Low Temperature Co-fired Ceramics, LTCC）采用厚膜材料，根据预先设计的结构，将电极材料、基板、电子器件等一次性烧成独石结构，是一种可以实现高集成度和高性能的电子封装技术。作为LTCC基板材料，为了实现与高电导率金属电极（Ag，Cu等）的共烧，微波介电陶瓷的烧结温度应低于960℃。近期，国内外的研究人员对一些低烧体系材料进行了广泛的探索和研究，主要是采用微晶玻璃或玻璃-陶瓷复合材料体系，因低熔点玻璃相具有相对较高的介质损耗，玻璃相的存在大大提高了材料的介质损耗。因此研制无玻璃相的低烧微波介质陶瓷材料是当前研究的重点。
在探索与开发新型可低烧微波介电陶瓷材料的过程中，固有烧结温度低的Li基化合物、Bi基化合物、钨酸盐体系化合物、钼酸盐和碲酸盐体系化合物等材料体系得到了广泛关注与研究。我们对组成为Al2Mo 3 O12、Y2Mo 3 O12、La2Mo 3 O12的系列化合物进行了合成探索和微波介电性能的研究，发现Al2Mo 3 O12的合成容易，而且烧结温度低于700℃，而且具有好的综合微波介电性能，可作为低烧的微波介电陶瓷。Y2Mo 3 O12和La2Mo 3 O12的合成困难。
发明内容
本发明的目的是提供一种具有良好热稳定性与低损耗的低介电常数微波介电陶瓷材料及其制备方法。
本发明的微波介电陶瓷材料的化学组成为Al2Mo 3 O12。
本微波介电陶瓷材料的制备方法步骤为：
（1）将纯度为99.9%（重量百分比）以上的Al2O3和MoO3的原始粉末按Al2Mo3O12的组成称量配料；
（2）将步骤（1）原料湿式球磨混合8小时，球磨介质为无水乙醇，烘干后在550℃大气气氛中预烧12小时；
（3）在步骤（2）制得的粉末中添加粘结剂并造粒后，再压制成型，最后在600~680℃大气气氛中烧结4小时；所述的粘结剂采用质量浓度为5%的聚乙烯醇溶液，聚乙烯醇的添加量占粉末总质量的3%。
本发明的优点：Al2Mo 3 O12陶瓷的陶瓷烧结温度低，原料成本低；介电常数达到12.3～14.7，其品质因数Q ×f值高达34,000-55,000GHz，谐振频率温度系数小，可广泛用于各种介质基板、谐振器和滤波器等微波器件的制造，在工业上有着极大的应用价值。
具体实施方式
实施例：
表1示出了构成本发明的不同烧结温度的4个具体实施例及其微波介电性能。其制备方法如上所述，用圆柱介质谐振器法进行微波介电性能的评价。
本陶瓷可广泛用于各种介质基板、谐振器和滤波器等微波器件的制造，可满足移动通信和卫星通信等系统的技术需要。
表1：

Claims (1)

1.一种作为可低温烧结的低介电常数微波介电陶瓷应用的复合氧化物，其特征在于所述复合氧化物的化学组成为：Al2Mo3O12；
所述复合氧化物的制备方法步骤为：
（1）将纯度为99.9%（重量百分比）以上的Al2O3和MoO3的原始粉末按Al2Mo3O12的组成称量配料；
（2）将步骤（1）原料湿式球磨混合8小时，球磨介质为无水乙醇，烘干后在550℃大气气氛中预烧12小时；
（3）在步骤（2）制得的粉末中添加粘结剂并造粒后，再压制成型，最后在600~680℃大气气氛中烧结4小时；所述的粘结剂采用质量浓度为5%的聚乙烯醇溶液，聚乙烯醇的添加量占粉末总质量的3%。
CN201610393595.0A 2016-06-06 2016-06-06 一种可低温烧结的低介电常数微波介电陶瓷Al2Mo3O12 Pending CN106045508A (zh)

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CN103113104A (zh) * 2013-03-24 2013-05-22 桂林理工大学 可低温烧结微波介电陶瓷Li2W4O13及其制备方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108727023A (zh) * 2018-07-11 2018-11-02 北京邮电大学 一种钼酸铝基微波介质复合陶瓷及其制备方法

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Application publication date: 20161026