ATE459453T1 - Polierkissen zum chemisch-mechanischen polieren von substraten in gegenwart von schleifpartikeln enthaltende aufschlämmung - Google Patents

Polierkissen zum chemisch-mechanischen polieren von substraten in gegenwart von schleifpartikeln enthaltende aufschlämmung

Info

Publication number
ATE459453T1
ATE459453T1 AT00850065T AT00850065T ATE459453T1 AT E459453 T1 ATE459453 T1 AT E459453T1 AT 00850065 T AT00850065 T AT 00850065T AT 00850065 T AT00850065 T AT 00850065T AT E459453 T1 ATE459453 T1 AT E459453T1
Authority
AT
Austria
Prior art keywords
layer
polishing
backing
abrasive particles
substrates
Prior art date
Application number
AT00850065T
Other languages
English (en)
Inventor
Oscar K Hsu
Jean K Vangsness
Scott C Billings
David S Gilbride
Original Assignee
Innopad Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad Inc filed Critical Innopad Inc
Application granted granted Critical
Publication of ATE459453T1 publication Critical patent/ATE459453T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT00850065T 1999-04-13 2000-04-12 Polierkissen zum chemisch-mechanischen polieren von substraten in gegenwart von schleifpartikeln enthaltende aufschlämmung ATE459453T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12904899P 1999-04-13 1999-04-13
US09/545,982 US6656018B1 (en) 1999-04-13 2000-04-10 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Publications (1)

Publication Number Publication Date
ATE459453T1 true ATE459453T1 (de) 2010-03-15

Family

ID=26827184

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00850065T ATE459453T1 (de) 1999-04-13 2000-04-12 Polierkissen zum chemisch-mechanischen polieren von substraten in gegenwart von schleifpartikeln enthaltende aufschlämmung

Country Status (8)

Country Link
US (2) US6656018B1 (de)
EP (2) EP2266757B1 (de)
JP (1) JP2001047357A (de)
AT (1) ATE459453T1 (de)
CA (1) CA2305106C (de)
DE (1) DE60043913D1 (de)
SG (1) SG87892A1 (de)
TW (1) TW440495B (de)

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US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
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US20080274674A1 (en) * 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
WO2009070352A1 (en) 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
KR101570732B1 (ko) * 2007-12-31 2015-11-20 에프엔에스테크 주식회사 화학-기계적 평탄화 패드
KR101563204B1 (ko) * 2008-04-01 2015-10-26 에프엔에스테크 주식회사 제어된 공동 형성을 가지는 연마 패드
JP2011517111A (ja) * 2008-04-11 2011-05-26 イノパッド，インコーポレイテッド ボイドネットワークを有する化学機械的平坦化パッド
KR101618273B1 (ko) * 2008-04-29 2016-05-04 세미퀘스트, 인코포레이티드 연마 패드 조성물, 및 이의 제조 방법 및 용도
CN102143826A (zh) * 2008-09-04 2011-08-03 因诺派德公司 含有非卷曲纤维的织物及其制造方法
TW201016391A (en) * 2008-10-20 2010-05-01 Bestac Advanced Material Co Ltd Polishing pad having abrasive grains and method for making the same
JP2012517715A (ja) * 2009-02-12 2012-08-02 イノパッド，インコーポレイテッド Ｃｍｐパッドにおける３次元ネットワーク
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
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DE102013201663B4 (de) 2012-12-04 2020-04-23 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102013205448A1 (de) 2013-03-27 2014-10-16 Siltronic Ag Verfahren zum Polieren eines Substrates aus Halbleitermaterial
TWI590918B (zh) * 2013-08-16 2017-07-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
CN105729297B (zh) * 2016-04-19 2017-08-25 南京航空航天大学 研抛一体化冰粒型固结磨料抛光垫及其制备方法
CN106002663B (zh) * 2016-05-26 2018-03-27 南京航空航天大学 一种分层冷冻固结磨料抛光垫及制备方法
RU2736460C2 (ru) * 2016-06-01 2020-11-17 Фудзибо Холдингс, Инк. Полировальная подушка и способ ее получения, а также способ получения полированного изделия
JP6829037B2 (ja) * 2016-09-30 2021-02-10 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP4383691B1 (de) 2021-11-10 2026-01-21 Samsung Electronics Co., Ltd. Elektronische vorrichtung mit haftelement
CN114310652A (zh) * 2021-12-30 2022-04-12 金陵科技学院 一种软脆材料柔性研磨装置

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Also Published As

Publication number Publication date
EP1046466A3 (de) 2003-10-08
CA2305106C (en) 2008-07-08
US6890244B2 (en) 2005-05-10
DE60043913D1 (de) 2010-04-15
TW440495B (en) 2001-06-16
CA2305106A1 (en) 2000-10-13
JP2001047357A (ja) 2001-02-20
EP2266757A1 (de) 2010-12-29
EP2266757B1 (de) 2013-10-02
US6656018B1 (en) 2003-12-02
US20040072507A1 (en) 2004-04-15
SG87892A1 (en) 2002-04-16
EP1046466A2 (de) 2000-10-25
EP1046466B1 (de) 2010-03-03

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