AU3272200A - Device and method for applying adhesive material onto planar components and the use thereof - Google Patents

Device and method for applying adhesive material onto planar components and the use thereof

Info

Publication number
AU3272200A
AU3272200A AU32722/00A AU3272200A AU3272200A AU 3272200 A AU3272200 A AU 3272200A AU 32722/00 A AU32722/00 A AU 32722/00A AU 3272200 A AU3272200 A AU 3272200A AU 3272200 A AU3272200 A AU 3272200A
Authority
AU
Australia
Prior art keywords
sieve element
adhesive material
adhesive
planar components
material onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU32722/00A
Inventor
Hubert Knor
Marcus Reiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU3272200A publication Critical patent/AU3272200A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • B05C9/022—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means to obtain ornamental coatings
    • B05C9/025—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means to obtain ornamental coatings using silk screens or stencils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to a device and a method for applying adhesive material onto planar components such as substrates, semiconductor chips or the like. The invention is characterised in that a sieve element (3) is arranged in the area of the adhesive bed surface. The openings of said sieve element (3) allow the adhesive material to pass through. The adhesive bed (2) and the sieve element are configured or co-operate in such a way that only a limited amount of adhesive passes the sieve element before, during or after the component is placed in order to moisten the supporting surface thereof. The invention also relates to methods for applying adhesive material onto planar components. When a component is placed, the sieve element is dug into the adhesive bed in such a way that the adhesive material is transported through the openings of the sieve element (3) and that the supporting surface (7) of the placed component is moistened or that the sieve element is arranged in the adhesive bed in such a way that adhesive material is transported onto the surface of the sieve element. Said adhesive material moistens the supporting surfaces of the components which are situated on the surface of the sieve element (3) or are to be placed onto said sieve element (3).
AU32722/00A 1999-02-27 2000-02-25 Device and method for applying adhesive material onto planar components and the use thereof Abandoned AU3272200A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19908625A DE19908625A1 (en) 1999-02-27 1999-02-27 Device and method for applying adhesive material to flat components and its use
DE19908625 1999-02-27
PCT/DE2000/000550 WO2000051748A1 (en) 1999-02-27 2000-02-25 Device and method for applying adhesive material onto planar components and the use thereof

Publications (1)

Publication Number Publication Date
AU3272200A true AU3272200A (en) 2000-09-21

Family

ID=7899139

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32722/00A Abandoned AU3272200A (en) 1999-02-27 2000-02-25 Device and method for applying adhesive material onto planar components and the use thereof

Country Status (5)

Country Link
EP (1) EP1156884B1 (en)
AT (1) ATE253413T1 (en)
AU (1) AU3272200A (en)
DE (2) DE19908625A1 (en)
WO (1) WO2000051748A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376942B2 (en) * 1999-03-08 2003-02-17 株式会社村田製作所 Method and apparatus for applying sealing material to parts
WO2002022278A2 (en) * 2000-09-15 2002-03-21 Häcker Automation Method and device for applying fluid substances
AT412761B (en) * 2001-05-15 2005-07-25 Datacon Semiconductor Equip DEVICE FOR USING A SURFACE
DE10145826C1 (en) * 2001-09-13 2003-01-23 Siemens Ag Method, for connecting component to substrate, involves applying underfill material by immersing at least part of component into tank of underfill material before placing component onto substrate
DE102005012396B3 (en) * 2005-03-17 2006-06-14 Datacon Technology Ag Semiconductor chip e.g. flip-chip, mounting method for use on substrate, involves taking chips from sprinkler station and feeding to mounting station, where chips are again taken from initialization station and placed in sprinkler station
PL422395A1 (en) * 2017-07-31 2019-02-11 Zachodniopomorski Uniwersytet Technologiczny W Szczecinie Method for carrying lightweight low-energy dehesive materials and the handle for carrying lightweight low-energy dehesive materials
CN113771527B (en) * 2021-08-19 2022-07-05 嘉兴华善文具制造股份有限公司 A treatment facility for sticky note
CN113649233B (en) * 2021-08-19 2022-05-31 嘉兴华善文具制造股份有限公司 Convenient-to-paste glue coating device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1493809A (en) * 1921-09-09 1924-05-13 Craddy Edward Gluing-out slab
US3003461A (en) * 1959-08-03 1961-10-10 Speedry Chemical Products Inc Marking fluid container
BE794795A (en) * 1972-02-09 1973-05-16 Hercules Inc PAINT BOWL
DE2435036A1 (en) * 1974-07-20 1976-01-29 Bosch Gmbh Robert DEVICE FOR APPLYING ADHESIVE
US4346124A (en) * 1981-05-04 1982-08-24 Laurier Associates, Inc. Method of applying an adhesive to a circuit chip
DE3931496A1 (en) * 1989-09-21 1991-04-04 Heidelberger Druckmasch Ag METHOD AND DEVICE FOR MANUALLY APPLYING SCREW LOCKING ADHESIVE TO THREAD GEAR OF A SCREW
JPH07169658A (en) * 1993-07-02 1995-07-04 Electro Scient Ind Inc Device to attach terminating paste to electronic device
JPH08252987A (en) * 1995-03-16 1996-10-01 Futaba Corp Screen mask

Also Published As

Publication number Publication date
DE50004322D1 (en) 2003-12-11
EP1156884A1 (en) 2001-11-28
DE19908625A1 (en) 2000-08-31
EP1156884B1 (en) 2003-11-05
ATE253413T1 (en) 2003-11-15
WO2000051748A1 (en) 2000-09-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase