ATE168306T1 - Vorrichtung zum chemisch-mechanischen polieren mit verbesserter verteilung der polierzusammensetzung - Google Patents

Vorrichtung zum chemisch-mechanischen polieren mit verbesserter verteilung der polierzusammensetzung

Info

Publication number
ATE168306T1
ATE168306T1 AT95301342T AT95301342T ATE168306T1 AT E168306 T1 ATE168306 T1 AT E168306T1 AT 95301342 T AT95301342 T AT 95301342T AT 95301342 T AT95301342 T AT 95301342T AT E168306 T1 ATE168306 T1 AT E168306T1
Authority
AT
Austria
Prior art keywords
polishing pad
polishing
chemical
improved distribution
mechanical polishing
Prior art date
Application number
AT95301342T
Other languages
English (en)
Inventor
Homayoun Talieh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE168306T1 publication Critical patent/ATE168306T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT95301342T 1994-03-02 1995-03-02 Vorrichtung zum chemisch-mechanischen polieren mit verbesserter verteilung der polierzusammensetzung ATE168306T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/205,278 US5650039A (en) 1994-03-02 1994-03-02 Chemical mechanical polishing apparatus with improved slurry distribution

Publications (1)

Publication Number Publication Date
ATE168306T1 true ATE168306T1 (de) 1998-08-15

Family

ID=22761558

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95301342T ATE168306T1 (de) 1994-03-02 1995-03-02 Vorrichtung zum chemisch-mechanischen polieren mit verbesserter verteilung der polierzusammensetzung

Country Status (6)

Country Link
US (1) US5650039A (de)
EP (1) EP0674972B1 (de)
JP (1) JPH0839423A (de)
KR (1) KR950031381A (de)
AT (1) ATE168306T1 (de)
DE (1) DE69503408T2 (de)

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US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
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BRPI0916466A2 (pt) 2008-12-09 2016-02-16 Du Pont método de remoção da cauda e dispositivo de remoção da cauda
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
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JP5620465B2 (ja) * 2012-12-28 2014-11-05 東洋ゴム工業株式会社 円形状研磨パッド
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
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Also Published As

Publication number Publication date
US5650039A (en) 1997-07-22
DE69503408T2 (de) 1999-02-11
DE69503408D1 (de) 1998-08-20
KR950031381A (ko) 1995-12-18
JPH0839423A (ja) 1996-02-13
EP0674972B1 (de) 1998-07-15
EP0674972A1 (de) 1995-10-04

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