KR950031381A - 슬러리의 보급이 개선된 기판처리용의 화학적 및 기계적 연마기와 기판의 연마방법 - Google Patents

슬러리의 보급이 개선된 기판처리용의 화학적 및 기계적 연마기와 기판의 연마방법 Download PDF

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Publication number
KR950031381A
KR950031381A KR1019950004239A KR19950004239A KR950031381A KR 950031381 A KR950031381 A KR 950031381A KR 1019950004239 A KR1019950004239 A KR 1019950004239A KR 19950004239 A KR19950004239 A KR 19950004239A KR 950031381 A KR950031381 A KR 950031381A
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South Korea
Prior art keywords
polishing pad
polishing
substrate
flaw
pad
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KR1019950004239A
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English (en)
Inventor
텔리 호메이욘
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제임스 조셉 드롱
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 제임스 조셉 드롱, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 제임스 조셉 드롱
Publication of KR950031381A publication Critical patent/KR950031381A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

본 발명의 화학적 및 기계적 연마기는 화학작용하거나 물리적 연마제인 슬러리의 바로 앞에서 회전하는 연마패드상의 기판을 연마한다. 연마패드와 체결되어 있는 기관의 표면에 슬러리가 접근할 수 있도록 연마패드의 표면에 적어도 하나의 흠이 제공되어 있다. 이 흠은 적어도 부분적으로 방사방향으로 뻗어있다. 그밖에, 연마패드를 연속적으로 조절하기 위해서 기판이 연마될 때 회전하는 연마패드상에 패드조절기가 설치될 수 있다.

Description

슬러리의 보급이 개선된 기판처리용의 화학적 및 기계적 연마기와 기판의 연마방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 화학적 및 기계적 연마기의 한 실시예를 개략적으로 도시한 사시도, 제6도는 제1도의 화학적 연마기패드의 부분단면도, 제7도는 제1도에 도시된 연마기 패드 조절장치의 확대사시도.

Claims (20)

  1. 기판 처리용의 화학적 및 기계적 연마기로서, 적어도 하나의 흠이 형성되어 있는 상부 연마 표면을 가진 회전가능한 연마패드로서, 상기 적어도 하나의 흠이 상기 연마패드의 상기 상부 연마표면에 적어도 부분적으로 방사형으로 뻗어있는 회전가능한 연마패드와, 상기 연마패드에 접해서 기판을 위치시키기 위한 위치지정 부재를 포함하고 있는 연마기.
  2. 제1항에 있어서, 상기 위치지정 부재가 상기 연마패드의 상기 연마표면상의 상기 기관의 주위를 선회하는 연마기.
  3. 제1항에 있어서, 상기 적어도 하나의 흠이 나선형으로 형성되어 있는 연마기.
  4. 제3항에 있어서, 상기 적어도 하나의 흠이 상기 연마패드의 상기 상부 연마표면으로부터 방사상의 외부로 뻗어 있는 연마기.
  5. 제3항에 있어서, 상기 흠이 1인치 이하의 피치를 가지고 있는 연마기.
  6. 제1항에 있어서, 상기 흠이 방사형의 흠인 연마기.
  7. 제6항에 있어서, 상기 흠이 활모양의 요소를 포함하고 있는 연마기.
  8. 제1항에 있어서, 상기 흠이 원형으로 형성되어 있고, 상기 흠을 형성하는 호의 중심이 상기 연마패드의 상기 상부 연마표면의 중심으로부터 옵셋되어 있는 연마기.
  9. 제1항에 있어서, 상기 흠이 상기 연마패드의 하부표면내로 절단되어 있는 연마기.
  10. 제1항에 있어서, 상기 흠이 연마패드상에서 처리되는 상기 기판의 전체표면의 밑으로 방사상으로 뻗기에 충분한 거리로 상기 연마패드의 상기 상부연마표면을 따라서 방사상으로 뻗어있는 연마기.
  11. 제1항에 있어서, 상기 흠이 적어도 2개의 상호교차하는 흠을 포함하고 있는 연마기.
  12. 기판의 연마방법으로서, 연마패드의 상부표면을 따라서 적어도 부분적으로 방사방향으로 뻗어있는 흠을 가진 연마패드를 제공하는 단계와, 상기 연마패드상에 슬러리를 공급하는 단계와 상기 연마패드를 회전시키는 단계와, 그리고 상기 연미패드상에 기판을 설치하고 상기 흠이 상기 기판과 상기 연마패드의 접촉면에 슬러리를 보급할 때 상기 기판을 연마하는 단계를 포함하고 있는 방법.
  13. 제12항에 있어서, 상기 흠이 나선형으로 형성되어 있는 방법.
  14. 제12항에 있어서, 상기 흠이 직선의 경로를 따라 형성되어 있는 방법.
  15. 제12항에 있어서, 상기 흠이 원형이고, 상기 흠을 형성하는 원의 중심이 상기 연마패드의 회전축으로부터 옵셋되어 있는 방법.
  16. 제12항에 있어서, 상기 흠이 상기 연마패드내에서 활모양으로 뻗어 있는 방법.
  17. 제12항에 있어서, 상기 기판이 상기 연마패드상에서 연마될 때 상기 연마패드를 조절하는 단계를 더 포함하고 있는 방법.
  18. 제12항에 있어서, 상기 흠이 적어도 2개의 상호교차하는 홈을 포함하고 있는 방법.
  19. 기판연마기로서, 회전가능한 연마패드와, 기판이 상기 연마패드와 접촉하여 위치하도록 상기 연마패드에 인접하게 배열된 기판의 캐리어 및, 상기 연마패드와 접촉하여 배열된 패드조절기로서, 상기 연마패드와 체결되어 배열된 종방향의 조절비를 포함하고 있고, 상기 종방향의 조절비는 상기 연마패드상에 수용된 기판의 폭과 동일한 폭을 가진 상기 연마패드의 고리형의 구역을 동시에 연마하기에 충분한 방사상의 거리로 상기 연마패드로 가로질러서 뻗어있는 패드조절기를 포함하고 있는 기판연마기.
  20. 제19항에 있어서, 상기 조절바는 조절그리트를 포함하고 있고 상기 조절 그리트는 상기 연마 패드의 표면과 체결가능한 기판 연마기.
    ※ 참고사항：최초출원 내용에 의하여 공개하는 것임.
KR1019950004239A 1994-03-02 1995-03-02 슬러리의 보급이 개선된 기판처리용의 화학적 및 기계적 연마기와 기판의 연마방법 KR950031381A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/205,278 US5650039A (en) 1994-03-02 1994-03-02 Chemical mechanical polishing apparatus with improved slurry distribution
US08/205,278 1994-03-02

Publications (1)

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KR950031381A true KR950031381A (ko) 1995-12-18

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Country Status (6)

Country Link
US (1) US5650039A (ko)
EP (1) EP0674972B1 (ko)
JP (1) JPH0839423A (ko)
KR (1) KR950031381A (ko)
AT (1) ATE168306T1 (ko)
DE (1) DE69503408T2 (ko)

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ATE168306T1 (de) 1998-08-15
US5650039A (en) 1997-07-22
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