SG87892A1 - Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles - Google Patents

Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Info

Publication number
SG87892A1
SG87892A1 SG200002133A SG200002133A SG87892A1 SG 87892 A1 SG87892 A1 SG 87892A1 SG 200002133 A SG200002133 A SG 200002133A SG 200002133 A SG200002133 A SG 200002133A SG 87892 A1 SG87892 A1 SG 87892A1
Authority
SG
Singapore
Prior art keywords
polishing
layer
abrasive particles
backing
substrates
Prior art date
Application number
SG200002133A
Other languages
English (en)
Inventor
K Hsu Oscar
K Vangsness Jean
C Billings Scott
S Gilbride David
Original Assignee
Freudenberg Nonwovens Ltd Part
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freudenberg Nonwovens Ltd Part filed Critical Freudenberg Nonwovens Ltd Part
Publication of SG87892A1 publication Critical patent/SG87892A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
SG200002133A 1999-04-13 2000-04-13 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles SG87892A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12904899P 1999-04-13 1999-04-13
US09/545,982 US6656018B1 (en) 1999-04-13 2000-04-10 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Publications (1)

Publication Number Publication Date
SG87892A1 true SG87892A1 (en) 2002-04-16

Family

ID=26827184

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002133A SG87892A1 (en) 1999-04-13 2000-04-13 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Country Status (8)

Country Link
US (2) US6656018B1 (de)
EP (2) EP2266757B1 (de)
JP (1) JP2001047357A (de)
AT (1) ATE459453T1 (de)
CA (1) CA2305106C (de)
DE (1) DE60043913D1 (de)
SG (1) SG87892A1 (de)
TW (1) TW440495B (de)

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US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6652764B1 (en) * 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
JP2002190460A (ja) * 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法
EP1211024A3 (de) 2000-11-30 2004-01-02 JSR Corporation Polierverfahren
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
KR100421704B1 (ko) * 2001-04-20 2004-03-10 고려연마공업 주식회사 유연성 기능을 갖는 연마포용 직물기재
KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
US6488767B1 (en) 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
CN1312740C (zh) * 2001-09-28 2007-04-25 信越半导体株式会社 用于研磨的工件保持盘及工件研磨装置及研磨方法
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4266579B2 (ja) * 2002-06-28 2009-05-20 株式会社ノリタケカンパニーリミテド 研磨体およびその製造方法
EP1542831A1 (de) * 2002-09-25 2005-06-22 PPG Industries Ohio, Inc. Polierkissen zur planarisierung
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US6641632B1 (en) * 2002-11-18 2003-11-04 International Business Machines Corporation Polishing compositions and use thereof
JP4659338B2 (ja) * 2003-02-12 2011-03-30 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US20050042976A1 (en) * 2003-08-22 2005-02-24 International Business Machines Corporation Low friction planarizing/polishing pads and use thereof
US7101275B2 (en) 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7232364B2 (en) * 2005-02-04 2007-06-19 3M Innovative Properties Company Abrasive cleaning article and method of making
WO2007016498A2 (en) * 2005-08-02 2007-02-08 Raytech Composites, Inc. Nonwoven polishing pads for chemical mechanical polishing
US8192257B2 (en) * 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads
JP2008000831A (ja) * 2006-06-20 2008-01-10 Saitama Univ 研磨パッドの製造方法
TWI409136B (zh) 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
US20080274674A1 (en) * 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
EP2227350A4 (de) 2007-11-30 2011-01-12 Innopad Inc Kissen mit endpunkterfassungsfenster für chemisch-mechanisches polieren
EP2242615A4 (de) * 2007-12-31 2013-10-30 Innopad Inc Chemisch-mechanisches planarisierungskissen
EP2271463A4 (de) * 2008-04-01 2013-11-27 Innopad Inc Polierkissen mit gesteuerter hohlraumbildung
JP2011517111A (ja) * 2008-04-11 2011-05-26 イノパッド，インコーポレイテッド ボイドネットワークを有する化学機械的平坦化パッド
US8177603B2 (en) * 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
US8546260B2 (en) * 2008-09-04 2013-10-01 Innopad, Inc. Fabric containing non-crimped fibers and methods of manufacture
TW201016391A (en) * 2008-10-20 2010-05-01 Bestac Advanced Material Co Ltd Polishing pad having abrasive grains and method for making the same
JP2012517715A (ja) * 2009-02-12 2012-08-02 イノパッド，インコーポレイテッド Ｃｍｐパッドにおける３次元ネットワーク
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
WO2012082395A2 (en) 2010-12-14 2012-06-21 3M Innovative Properties Company Self-contained fibrous buffing article
US9108299B2 (en) 2011-06-14 2015-08-18 3M Innovative Properties Company Self-contained fibrous buffing article
DE102012206708A1 (de) 2012-04-24 2013-10-24 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102013201663B4 (de) 2012-12-04 2020-04-23 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102013205448A1 (de) 2013-03-27 2014-10-16 Siltronic Ag Verfahren zum Polieren eines Substrates aus Halbleitermaterial
TWI590918B (zh) * 2013-08-16 2017-07-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
CN105729297B (zh) * 2016-04-19 2017-08-25 南京航空航天大学 研抛一体化冰粒型固结磨料抛光垫及其制备方法
CN106002663B (zh) * 2016-05-26 2018-03-27 南京航空航天大学 一种分层冷冻固结磨料抛光垫及制备方法
EP3441185A4 (de) * 2016-06-01 2020-04-01 Fujibo Holdings, Inc. Polierkissen und verfahren zur herstellung davon sowie verfahren zur herstellung eines schleifmittels
JP6829037B2 (ja) * 2016-09-30 2021-02-10 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN114310652A (zh) * 2021-12-30 2022-04-12 金陵科技学院 一种软脆材料柔性研磨装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288165A (ja) * 1988-09-21 1990-03-28 Speedfam Co Ltd ポリッシングパッド及びその製造方法
EP0845328A2 (de) * 1996-11-29 1998-06-03 Sumitomo Metal Industries, Ltd. Polierkissen und Vorrichtung zum Polieren einer Halbleiterscheibe
JPH10225864A (ja) * 1997-02-17 1998-08-25 Sony Corp 研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法

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US5725417A (en) 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US5916011A (en) * 1996-12-26 1999-06-29 Motorola, Inc. Process for polishing a semiconductor device substrate
US5910471A (en) * 1997-03-07 1999-06-08 Minnesota Mining And Manufacturing Company Abrasive article for providing a clear surface finish on glass
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0288165A (ja) * 1988-09-21 1990-03-28 Speedfam Co Ltd ポリッシングパッド及びその製造方法
EP0845328A2 (de) * 1996-11-29 1998-06-03 Sumitomo Metal Industries, Ltd. Polierkissen und Vorrichtung zum Polieren einer Halbleiterscheibe
JPH10225864A (ja) * 1997-02-17 1998-08-25 Sony Corp 研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法

Also Published As

Publication number Publication date
US6656018B1 (en) 2003-12-02
EP2266757B1 (de) 2013-10-02
US6890244B2 (en) 2005-05-10
TW440495B (en) 2001-06-16
DE60043913D1 (de) 2010-04-15
US20040072507A1 (en) 2004-04-15
CA2305106A1 (en) 2000-10-13
ATE459453T1 (de) 2010-03-15
CA2305106C (en) 2008-07-08
EP2266757A1 (de) 2010-12-29
JP2001047357A (ja) 2001-02-20
EP1046466A3 (de) 2003-10-08
EP1046466B1 (de) 2010-03-03
EP1046466A2 (de) 2000-10-25

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