201016391 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種拋光墊及其製造方法，詳言之，係關 於一種具有研磨粒之拋光墊及其製造方法。 【先前技術】 習知抛光方法係採用一抛光液搭配一抛光塾之模式。該 拋光液具有複數個研磨粒，該等研磨粒係用以拋光一被抛 光工件之表面。該拋光塾具有複數個孔洞，該等孔洞相互 連通’使該拋光液平均分佈於該拋光墊之表面，以提升拋 光能力。 該習知拋光方法之缺點如下。拋光時，該拋光液流通於 該等孔洞時，該拋光液之該等研磨粒易堵塞該等孔洞，導 致拋光能力下降。而後則需以一修整器修整被堵塞之該等 孔洞，以回復該拋光墊之拋光能力。然而在原有製程添加 此一手續，會提高成本且降低效率。 另一種習知拋光方法，係使用一具有研磨粒之拋光墊。 參考圖1，顯示中華民國專利公告第1233384號所揭示之習 知具有研磨粒之拋光墊之示意圖。該具有研磨粒之拋光墊 1包括一底層11及一拋光層12»該拋光層12位於該底層11 上，該拋光層12具有一樹脂121及複數個研磨粒122。該樹 脂121包覆該等研磨粒122，該樹脂121具有一拋光面 1211。部分該等研磨粒122顯露於該樹脂121之拋光面 1211。 該習知具有研磨粒之拋光墊1之缺點如下。該具有研磨 130536.doc -6- 201016391 粒之拋光墊1係利用該樹脂121固定住該等研磨粒122，因 此拋光時該等研磨粒122係固定於同一位置，以相同應力 於相同方向研磨’而容易在被拋光工件上造成刮傷 (Scratch)。同時’該樹脂121逐漸被磨去，而使固定於該 樹脂121内之該等研磨粒122顯露於該拋光面12 11之面積越 來越大，導致刮傷的情況更加嚴重。 因此，有必要提供一種創新且具進步性的具有研磨粒之 拋光墊及其製造方法，以解決上述問題。 【發明内容】 本發明提供一種具有研磨粒之拋光塾，其包括複數絛纖 維、複數個研磨粒及一高分子體。該等纖維係交錯排列成 一纖維基材。該等研磨粒附著於該等纖維上。該高分子艘 包覆該等纖維及該等研磨粒。 本發明另提供一種具有研磨粒之拋光墊之製造方法，包 括以下步驟：（a)提供一纖維基材，該纖維基材具有複數條 纖維及複數個研磨粒’該等纖維係交錯排列，該等研磨粒 係附著於該等纖維上；（b)將該纖維基材含浸於一高分子溶 液中；及（c)進行一固化步驟，使得該纖維基材被一高分子 體所包覆。 藉此’該等纖維之柔韌性使該等研磨粒不易刮傷被拋光 工件之表面，且該拋光墊只需以一不具有研磨粒之酸性、 驗14抛光液或具有電解質的電解液溶液之輔助，便有相當 好的抛光能力，可避免習知技術中拋光液之研磨粒堵塞拋 光墊之孔洞的情況。此外，利用該拋光墊拋光後，該被拋 130536.doc 201016391 光工件之表面只殘留少數研磨粒，僅需簡單的清洗程序便 可完成，且也容易作廢水處理。 【實施方式】 參考圖2’顯示本發明具有研磨粒之搬光墊之第一實施 例之示意圖。該具有研磨粒之拋光墊2包括複數條纖維 21、複數個研磨粒22及一高分子體23。在其他應用中，該 拋光墊2更包括一底層，該底層可為背膠層或為另一複合 層。 該等研磨粒22附著於該等纖維21上，且該等纖維21係交 錯排列成一纖維基材24。在本實施例中，該等纖維21係為 實心且該等研磨粒22位於該等纖維21之表面（如圖3所示）。 在其他應用中，該等纖維21係可為空心且該等研磨粒22位 於該等纖維21之表面（如圖4所示）。 較佳地，該等纖維21之尺寸係為o.ooi丹尼（Denier)至6 丹尼》較佳地’該等纖維21之材質係選自由聚醯胺樹脂 (Polyamide Resin)、聚乙烯對苯二甲酸酯（P〇1yethylene Terephthalate，PET)、聚酯樹脂（p〇iyester> Resin)、尼龍 (Nylon)、聚丙烯（Polypr〇ylene，pp)、丙烯酸樹脂（Acrylic Resin)及聚丙稀腈樹脂（p〇lyacryi〇nitriie Resin)所組成之 群。在本實施例中，該纖維基材24係為一不織布。較佳 地，該纖維基材24係利用化學黏合法、熱熔黏合法、機械 絡合法、乾式梳棉法、直接成網法或濕式成網法形成。在 本實施例中，該等研磨粒22之平均直徑係為〇.〇 1微米（ m)至100微米’且其材質係選自由二氧化矽（si〇2)、二氧化 130536.doc 201016391 筛（Ce02)、氧化鋁（Al2〇3)、過渡金屬之氧化物及π A族金 屬之氧化物所組成之群。 該高分子體23包覆該等纖維21及該等研磨粒22,該高分 子體23具有一第一表面231及一第二表面232。較佳地，部 分該等纖維21及部分該等研磨粒22係顯露於該第一表面 231。該第一表面231係為拋光面。在其他應用中，該高分 子體23係完全包覆該等纖維21及該等研磨粒22，待開始拋 光一段時間後，該第一表面23 1(拋光面）之高分子體23被移 除一部分後，部分該等纖維21及部分該等研磨粒22即會顯 露於該第一表面231»或者，在拋光之前，事先移除（例如 修整或研磨）部分該第一表面231之高分子體23，以使部分 該等纖維21及部分該等研磨粒22係顯露於該第一表面 231，再進行拋光。在本實施例中，該高分子體23係為一 連通多孔性高分子彈性體樹脂。較佳地，該高分子體23之 材質係選自由聚酿胺類樹醋（Polyamide Resin)、聚碳酸醋 (Polycarbonate)、聚甲基丙稀酸樹脂、環氧樹脂（Ep〇xy Resin)、酚樹脂（Phenol Resin)、聚胺醋樹脂（Po 丨 yurethane Resin)、乙烯苯樹脂（Vinylbenzene Resin)及丙烯酸樹脂 (Acrylic Resin)所組成之群。在其他應用中，該高分子體 23之第二表面232係位於該底層上。 參考圖5，顯示本發明具有研磨粒之拋光墊之第一實施 例之製造方法之流程圖。配合參考圖2，首先，參考步称 S51，提供一纖維原料（圖令未示），且進行一抽絲 (Spinning)步驟’使該纖維原料形成複數條纖維21。較佳 130536.doc •9· 201016391 地，該抽絲（Spinning)步驟係為熔融法（Melt Spinning)、乾 式法（Dry Spinning)或濕式法（Wet Spinning)。在本實施例 中，該等纖維21係為實心（如圖3所示）。在其他應用中，該 等纖維21係可為空心（如圖4所示）。較佳地，該等纖維21之 尺寸係為0.001丹尼（Denier)至6丹尼。較佳地，該等纖維 21之材質係選自由聚酿胺樹脂（Polyamide Resin)、聚乙埽 對苯二甲酸 S旨（Polyethylene Terephthalate，PET)、聚 S旨樹 脂（Polyester Resin)、尼龍（Nylon)、聚丙稀（Polyproylene， PP)、丙稀酸樹脂（Acrylic Resin)及聚丙婦腈樹脂 (Polyacrylonitrile Resin)所組成之群。 接著，參考步驟S52’提供複數個研磨粒22，且將該等 研磨粒22附著於該等纖維21之表面（如圖3及圖4所示）》在 其他應用中，每一該等研磨粒22係顯露於該等纖維21之表 面’意即每一該等研磨粒22係部分位於該等纖維21内，且 部分裸露於該等纖維21外，或者’部分該等研磨粒22位於 ❿ 該等纖維21之内部，且部分該等研磨粒22顯露於該等纖維 21之表面（如圖7及圖8所示）。較佳地，該等研磨粒22之材 質係選自由二氧化矽（Si〇2)、二氧化鈽（Ce〇2)、氧化鋁 (八丨2〇3)、過渡金屬之氧化物及n A族金屬之氧化物所組成 之群。 接著，參考步驟S53，進行一製棉步驟，使該等纖維21 形成一纖維基材24 ^在本實施例中，該纖維基材24係為一 不織布。較佳地，該纖維基材24係利用化學黏合法熱熔 黏合法、機械絡合法、乾式梳棉法、直接成網法或濕式成 130536.doc •10· 201016391 網法形成。接著，參考步驟S54,將該纖維基材24含浸於 一高分子溶液（圖中未示）中。 最後，參考步驟S55,進行一固化步驟’使得該纖維基 材24被一高分子體23所包覆，該高分子體23包括一第一表 面231及一第二表面232。較佳地，部分該等纖維21及部分 5亥專研磨粒22係顯露於該高分子體23之第一表面231。在 其他應用中，該步驟S55中該高分子體23完全包覆該纖維 基材24。或者，該步驟S55中該高分子體23完全包覆該纖 維基材24，且該步驟S55更包括一移除（例如修整或研磨） 部分該高分子體23之步驟，以使部分該等纖維21及部分該 等研磨粒22係顯露於該高分子體23之第一表面231。較佳 地’該步驟S55之後更包括一形成一底層於該高分子體23 之第二表面232之步驟，其中該底層係為一背膠層。 參考圖6，顯示本發明具有研磨粒之拋光墊之第二實施 例之示意圖。本實施例之拋光墊3與該第一實施例之拋光 墊2(圖2)大致相同。本實施例與該第一實施例之不同處在 於該等研磨粒32係位於該等纖維31内。在本實施例中，該 等纖維3 1係為實心，且該等研磨粒32位於該等纖維3 1之内 部’其中部分該等研磨粒32係顯露於該等纖維31之表面 (如圖7所示）。然而，在其他應用中，該等纖維31係可為空 心（如圖8所示）》 參考圖9’顯示本發明具有研磨粒之拋光塾之第二實施 例之製造方法之流程圖。配合參考圖6，首先’參考步驟 S91 ’提供一纖維原料（圖中未示）及複數個研磨粒32，且 130536.doc -11- 201016391 將該等研磨粒32添加至該纖維原料中。較佳地，該等研磨 粒32之材質係選自由二氧化矽（Si02)、二氧化鈽（Ce02)、 氧化IS (Alz〇3)、過渡金屬之氧化物及n a族金屬之氧化物 所組成之群。 接著，參考步驟S92，進行一抽絲（Spinning)步驟，使該 纖維原料形成複數條纖維3 1，其中部分該等研磨粒32位於 該等纖維31之内部，且部分該等研磨粒32顯露於該等纖維 31之表面（如圖7及圖8所示較佳地，該抽絲（Spinning)步 驟係為溶融法（Melt Spinning)、乾式法（Dry Spinning)或濕 式法（Wet Spinning)。在本實施例中，該等纖維3丨係為實 心（如圖7所示）。在其他應用中，該等纖維3丨係可為空心 (如圖8所示）。較佳地’該等纖維31之尺寸係為〇 〇〇1丹尼 (Denier)至6丹尼。較佳地，該等纖維31之材質係選自由聚 醯胺樹脂（Polyamide Resin)、聚乙烯對苯二甲酸酯 (Polyethylene Terephthalate，PET)、聚醋樹脂（p〇iyester Resin)、尼龍（Nylon)、聚丙烯（P〇lypr〇ylene，pp)、丙烯酸 樹脂（Acrylic Resin)及聚丙烯腈樹脂 Resin)所組成之群。 接著，參考步驟S93，進行一製棉步驟，使該等纖維31 形成一纖維基材34 〇在本實施例中，該纖維基材34係為一 不織布。較佳地，該纖維基材34係利用化學黏合法、熱熔 黏合法、機械絡合法、乾式梳棉法、直接成網法或濕式成 網法形成。接著，參考步驟S94,將該纖維基材34含浸於 一局分子溶液（圖中未示）中。 130536.doc -12- 201016391 最後’參考步驟S95 ’進行-固化步驟’使得該織維基 材34被一高分子體33所包覆，該高分子體33包括一第一表 面331及一第二表面332。較佳地，部分該等纖維31及部分 該等研磨粒32係顯露於該高分子體33之第一表面331。在 其他應用中，該步驟S95中該高分子體33完全包覆該纖維 基材34°或者’該步驟S95中該高分子體33完全包覆該纖 維基材34，且該步驟S95更包括一移除（例如修整或研磨） 部分該高分子體33之步驟，以使部分該等纖維31及部分該 等研磨粒32係顯露於該局分子體33之第一表面331。該第 一表面331係為拋光面。 本發明之優點如下，在拋光過程中，由於該等纖維 21，31本身之柔韌性’使得顯露於該第一表面231331之該 等纖維21，31會隨著研磨液之流動或拋光墊2,3與被拋光工 件間之應力作用而擺動’導致附著於其上之研磨粒22,32 也隨之移動，而不會一直固定在同一位置，藉此該等研磨 粒22，32不易到傷該被拋光工件之表面。再者，該拋光墊 2,3只需以一不具有研磨粒之酸性、鹼性拋光液或具有電 解質的電解液溶液之辅助，便有相當好的拋光能力，可避 免習知技術中抛光液之研磨粒堵塞拋光墊之孔洞的情況。 此外’利用該拋光墊2,3拋光後，該被拋光工件之表面只 殘留少數研磨粒22,32，僅需簡單的清洗程序便可完成， 且也容易作廢水處理。 兹以下列實例予以詳細說明本發明，唯並不意味本發明 僅侷限於此等實例所揭示之内容。 130536.doc • 13· 201016391 實例： 本實例之製造方法係對應上述第二實施例之製造方法。 參考圖6，首先，提供一纖維原料及複數個研磨粒32，且 將該等研磨粒32添加至該纖維原料中’其中該纖維原料包 括重量百分比75 %之聚乙烯對苯二甲酸酯（Polyethylene Terephthalate，PET)及重量百分比40%之聚乙稀（PE) ’該等 研磨粒32係為重量百分比3%之二氧化矽（Si〇2)。 接著，進行一抽絲（Spinning)步驟，使該纖維原料形成 ❹ 複數條纖維3 1。該等纖維3 1係為實心’且部分該等研磨粒 32位於該等纖維31之内部，且部分該等研磨粒32顯露於該 等纖維31之表面（如圖7所示）。該抽絲（Spinning)步驟係為 溶融法（Melt Spinning)，首先，使該纖維原料經一押出機 以288°C之溫度熔融，於喷絲板喷出，再經22°C之溫度冷 卻，紡絲捲取速度為55Om/min，即可得原絲，最後再切斷 為短纖，可得該等纖維3 1。 0 接著，進行一製棉步驟，使該等纖維31形成一纖維基材 34，且該纖維基材34係為一不織布。接著，將該纖維基材 34含浸於一高分子溶液（圖中未示）中，該高分子溶液之材 質係選自由聚酿胺類樹酯（Polyamide Resin)、聚碳酸酯 (Polycarbonate)、聚甲基丙稀酸樹脂、環氧樹脂（Epoxy Resin)、紛樹脂（Phenol Resin)、聚胺醋樹脂（Polyurethane Resin)、乙稀苯樹脂（Vinylbenzene Resin)及丙稀酸樹脂 (Acrylic Resin)所組成之群。 最後，進行一固化步驟。首先將含浸於該高分子溶液之 130536.doc 201016391 纖維基材34置入22%二甲基曱醯胺（Dmf)之凝固槽凝固， 再置入水洗槽洗出二甲基甲醯胺（DMF)，最後以150。(：之 溫度供乾’以得到該具有研磨粒32之拋光墊3。藉此，該 纖維基材34被一高分子體33所包覆，該高分子體33包括一 第一表面331及一第二表面332 ’其中部分該等纖維31及部 分該等研磨粒32係顯露於該高分子體33之第一表面Mi。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此’習於此技術之人士對上述實施例進 行修改及變化仍不脫本發明之精神。本發明之權利範圍應 如後述之申請專利範圍所列。 【圖式簡單說明】 圖1顯示習知具有研磨粒之拋光墊之示意圖； 圖2顯示本發明具有研磨粒之拋光墊之第一實施例之示 意圖； 圖3顯示本發明具有研磨粒之拋光墊之第一實施例之纖 維之剖面示意圖，其中該等纖維係為實心； 圖4顯示本發明具有研磨粒之拋光墊之第一實施例之纖 維之剖面示意圖’其中該等纖維係為空心； 圓5顯示本發明具有研磨粒之拋光墊之第一實施例之製 造方法之流程圖； 囷6顯示本發明具有研磨粒之拋光墊之第二實施例之示 意圖； 圖7顯示本發明具有研磨粒之拋光墊之第二實施例之纖 維之剖面示意圖’其中該等纖維係為實心； 130536.doc •15- 201016391 圖8顯示本發明具有研磨粒之拋光藝之第二實施例之纖 維之剖面示意圖，其中該等纖維係為空心；及 圖9顯示本發明具有研磨粒之拋光墊之第二實施例之製 造方法之流程圖。 【主要元件符號說明】 1 習知具有研磨粒之拋光墊 2 本發明具有研磨粒之拋光墊之第一實施例 3 本發明具有研磨粒之拋光墊之第二實施例201016391 IX. Description of the Invention: The present invention relates to a polishing pad and a method of manufacturing the same, and more particularly to a polishing pad having abrasive particles and a method of manufacturing the same. [Prior Art] A conventional polishing method employs a polishing liquid in combination with a polishing enamel mode. The polishing slurry has a plurality of abrasive particles for polishing the surface of a polished workpiece. The polishing crucible has a plurality of holes which are interconnected to cause the polishing liquid to be evenly distributed on the surface of the polishing pad to enhance the polishing ability. The disadvantages of this conventional polishing method are as follows. When the polishing liquid flows through the holes during polishing, the abrasive grains of the polishing liquid tend to block the holes, resulting in a decrease in polishing ability. Then, the holes that are blocked are trimmed with a dresser to restore the polishing ability of the polishing pad. However, adding this procedure to the original process will increase costs and reduce efficiency. Another conventional polishing method uses a polishing pad having abrasive particles. Referring to Fig. 1, there is shown a schematic view of a polishing pad having abrasive grains disclosed in the Republic of China Patent Publication No. 1233384. The polishing pad 1 having abrasive particles includes a bottom layer 11 and a polishing layer 12. The polishing layer 12 is disposed on the bottom layer 11. The polishing layer 12 has a resin 121 and a plurality of abrasive grains 122. The resin 121 covers the abrasive particles 122 having a polished surface 1211. A portion of the abrasive particles 122 are exposed to the polishing surface 1211 of the resin 121. The disadvantages of the conventional polishing pad 1 having abrasive grains are as follows. The polishing pad 1 having the abrasive 130536.doc -6-201016391 particles is used to fix the abrasive particles 122 by the resin 121, so that the polishing particles 122 are fixed at the same position during polishing, and are ground in the same direction with the same stress. It is easy to cause scratches on the workpiece to be polished. At the same time, the resin 121 is gradually removed, and the area of the abrasive grains 122 fixed in the resin 121 exposed to the polishing surface 12 11 is increased, resulting in a more serious scratch. Therefore, it is necessary to provide an innovative and progressive polishing pad having abrasive grains and a method of manufacturing the same to solve the above problems. SUMMARY OF THE INVENTION The present invention provides a polishing crucible having abrasive particles comprising a plurality of fine fibers, a plurality of abrasive particles, and a polymer. The fibers are staggered to form a fibrous substrate. The abrasive particles are attached to the fibers. The polymer ship coats the fibers and the abrasive particles. The invention further provides a method for manufacturing a polishing pad having abrasive particles, comprising the steps of: (a) providing a fibrous substrate having a plurality of fibers and a plurality of abrasive particles, wherein the fibers are staggered. The abrasive particles are attached to the fibers; (b) the fibrous substrate is impregnated into a polymer solution; and (c) a curing step is performed such that the fibrous substrate is coated with a polymer. Thereby, the flexibility of the fibers makes the abrasive grains less likely to scratch the surface of the workpiece to be polished, and the polishing pad only needs to have an acid solution without abrasive particles, a polishing solution or an electrolyte solution having an electrolyte. Auxiliary, there is a relatively good polishing ability, which can avoid the situation that the abrasive grains of the polishing liquid block the pores of the polishing pad in the prior art. In addition, after polishing with the polishing pad, the surface of the thrown 130536.doc 201016391 light workpiece has only a few abrasive grains remaining, which can be completed by a simple cleaning process, and is also easy to be used for wastewater treatment. [Embodiment] A schematic view of a first embodiment of a polishing pad having abrasive grains of the present invention is shown with reference to Fig. 2'. The polishing pad 2 having abrasive grains includes a plurality of fibers 21, a plurality of abrasive grains 22, and a polymer body 23. In other applications, the polishing pad 2 further includes a backing layer which may be a backing layer or another composite layer. The abrasive grains 22 are attached to the fibers 21, and the fibers 21 are alternately arranged into a fibrous base material 24. In the present embodiment, the fibers 21 are solid and the abrasive particles 22 are located on the surface of the fibers 21 (as shown in Figure 3). In other applications, the fibers 21 can be hollow and the abrasive particles 22 can be on the surface of the fibers 21 (as shown in Figure 4). Preferably, the fibers 21 are of the size of o.ooi to 6 Danny. Preferably, the fibers 21 are selected from the group consisting of polyamide resin (Polyamide Resin) and polyethylene. Phthalate terephthalate (PET), polyester resin (p〇iyester> Resin), nylon (Nylon), polypropylene (Polypr〇ylene, pp), acrylic resin (Acrylic Resin) and polyacrylonitrile A group of resins (p〇lyacryi〇nitriie Resin). In this embodiment, the fibrous substrate 24 is a non-woven fabric. Preferably, the fibrous substrate 24 is formed by chemical bonding, hot melt bonding, mechanical processing, dry carding, direct forming or wet forming. In the present embodiment, the abrasive grains 22 have an average diameter of 〇.1 micrometer (m) to 100 micrometers and are made of a material selected from the group consisting of cerium oxide (si〇2) and oxidizing 130536.doc 201016391. (Ce02), a group of alumina (Al2〇3), an oxide of a transition metal, and an oxide of a π-Group metal. The polymer body 23 covers the fibers 21 and the abrasive grains 22, and the polymer body 23 has a first surface 231 and a second surface 232. Preferably, a portion of the fibers 21 and a portion of the abrasive particles 22 are exposed to the first surface 231. The first surface 231 is a polished surface. In other applications, the polymer 23 completely coats the fibers 21 and the abrasive particles 22, and the polymer 23 of the first surface 23 1 (polished surface) is removed after a period of polishing is started. After a portion, a portion of the fibers 21 and a portion of the abrasive particles 22 may be exposed on the first surface 231» or, prior to polishing, a portion of the first surface 231 may be removed (eg, trimmed or ground). 23, such that a portion of the fibers 21 and a portion of the abrasive particles 22 are exposed on the first surface 231 and then polished. In the present embodiment, the polymer body 23 is a continuous porous polymer elastomer resin. Preferably, the material of the polymer body 23 is selected from the group consisting of Polyamide Resin, Polycarbonate, Polymethyl methacrylate resin, Ep〇xy Resin, A group consisting of Phenol Resin, Po 丨yurethane Resin, Vinylbenzene Resin, and Acrylic Resin. In other applications, the second surface 232 of the polymer body 23 is located on the bottom layer. Referring to Figure 5, there is shown a flow chart of a method of manufacturing a first embodiment of a polishing pad having abrasive particles of the present invention. Referring to Fig. 2, first, referring to step S51, a fiber raw material (not shown) is provided, and a spinning step is performed to form the fiber raw material into a plurality of fibers 21. Preferably, the spinning step is a Melt Spinning, a Dry Spinning or a Wet Spinning. In this embodiment, the fibers 21 are solid (as shown in Figure 3). In other applications, the fibers 21 can be hollow (as shown in Figure 4). Preferably, the fibers 21 are sized from 0.001 Denier to 6 denier. Preferably, the fibers 21 are selected from the group consisting of Polyamide Resin, Polyethylene Terephthalate (PET), Polyester Resin, and Nylon. ), a group of polyproylene (PP), acrylic resin (Acrylic Resin) and polyacrylonitrile resin (Polyacrylonitrile Resin). Next, a plurality of abrasive particles 22 are provided with reference to step S52', and the abrasive particles 22 are attached to the surface of the fibers 21 (as shown in FIGS. 3 and 4). In other applications, each of the abrasive particles 22 is exposed on the surface of the fibers 21, meaning that each of the abrasive particles 22 is partially within the fibers 21 and partially exposed outside the fibers 21, or 'part of the abrasive particles 22 are located at the The interior of the fibers 21, and a portion of the abrasive particles 22 are exposed on the surface of the fibers 21 (as shown in Figures 7 and 8). Preferably, the materials of the abrasive grains 22 are selected from the group consisting of cerium oxide (Si〇2), cerium oxide (Ce〇2), aluminum oxide (barium oxide), oxides of transition metals, and n A a group of oxides of a group of metals. Next, referring to step S53, a cotton making step is performed to form the fibers 21 into a fibrous substrate 24. In the present embodiment, the fibrous substrate 24 is a nonwoven fabric. Preferably, the fibrous substrate 24 is formed by chemical bonding hot melt bonding, mechanical complexing, dry carding, direct forming or wet forming. Next, referring to step S54, the fibrous substrate 24 is impregnated into a polymer solution (not shown). Finally, referring to step S55, a curing step is performed to cause the fibrous substrate 24 to be covered by a polymer body 23 comprising a first surface 231 and a second surface 232. Preferably, a portion of the fibers 21 and a portion of the abrasive particles 22 are exposed on the first surface 231 of the polymer body 23. In other applications, the polymer body 23 completely covers the fibrous substrate 24 in the step S55. Alternatively, in step S55, the polymer body 23 completely covers the fiber substrate 24, and the step S55 further includes a step of removing (for example, trimming or grinding) a portion of the polymer body 23 to make a portion of the fibers. 21 and a portion of the abrasive grains 22 are exposed on the first surface 231 of the polymer body 23. Preferably, the step S55 further comprises the step of forming a second surface 232 on the bottom surface of the polymer body 23, wherein the bottom layer is a backing layer. Referring to Figure 6, there is shown a schematic view of a second embodiment of a polishing pad having abrasive particles of the present invention. The polishing pad 3 of this embodiment is substantially the same as the polishing pad 2 (Fig. 2) of the first embodiment. This embodiment differs from the first embodiment in that the abrasive particles 32 are located within the fibers 31. In this embodiment, the fibers 31 are solid, and the abrasive particles 32 are located inside the fibers 31. A portion of the abrasive particles 32 are exposed on the surface of the fibers 31 (see FIG. 7). Shown). However, in other applications, the fibers 31 may be hollow (as shown in Figure 8). Referring to Figure 9', there is shown a flow chart of a method of manufacturing a second embodiment of the polishing crucible having abrasive particles of the present invention. Referring to Fig. 6, first, a fiber raw material (not shown) and a plurality of abrasive grains 32 are supplied with reference to step S91, and 130536.doc -11-201016391 is added to the fiber raw material. Preferably, the materials of the abrasive grains 32 are selected from the group consisting of cerium oxide (SiO 2 ), cerium oxide (CeO 2 ), oxidized IS (Alz 〇 3 ), an oxide of a transition metal, and an oxide of a na group metal. Group. Next, referring to step S92, a spinning step is performed to form the fiber material into a plurality of fibers 31, wherein a portion of the abrasive grains 32 are located inside the fibers 31, and a portion of the abrasive particles 32 are exposed. Preferably, the spinning step is a Melt Spinning, a Dry Spinning or a Wet Spinning as shown in FIGS. 7 and 8. In this embodiment, the fibers 3 are solid (as shown in Figure 7). In other applications, the fibers 3 can be hollow (as shown in Figure 8). Preferably, The fibers 31 are sized from Denier to 6 Danny. Preferably, the fibers 31 are selected from the group consisting of Polyamide Resin and polyethylene terephthalate. (Polyethylene Terephthalate, PET), p〇iyester Resin, Nylon, P〇lypr〇ylene (pp), Acrylic Resin and Resin group. Next, referring to step S93, a cotton making step is performed to form the fibers 31 into a fibrous substrate 34. In the present embodiment, the fibrous substrate 34 is a nonwoven fabric. Preferably, the fibrous substrate 34 is formed by chemical bonding, hot melt bonding, mechanical complexing, dry carding, direct forming or wet forming. Next, referring to step S94, the fibrous substrate 34 is impregnated into a localized molecular solution (not shown). 130536.doc -12- 201016391 Finally, the reference step S95 'peer-curing step' causes the woven substrate 34 to be covered by a polymer body 33 comprising a first surface 331 and a second surface 332. Preferably, a portion of the fibers 31 and a portion of the abrasive particles 32 are exposed on the first surface 331 of the polymer body 33. In other applications, the polymer 33 completely covers the fiber substrate 34° in the step S95 or the polymer 33 completely covers the fiber substrate 34 in the step S95, and the step S95 further includes a A portion of the polymer body 33 is removed (e.g., trimmed or ground) such that a portion of the fibers 31 and a portion of the abrasive particles 32 are exposed to the first surface 331 of the localized molecular body 33. The first surface 331 is a polished surface. The advantages of the present invention are as follows: during the polishing process, due to the flexibility of the fibers 21, 31 themselves, the fibers 21, 31 exposed on the first surface 231331 will follow the flow of the slurry or the polishing pad 2, 3, the vibration between the workpiece and the workpiece being oscillated, causing the abrasive particles 22, 32 attached thereto to move, and not always fixed at the same position, whereby the abrasive particles 22, 32 are not easily damaged. The surface of the workpiece being polished. Moreover, the polishing pad 2, 3 only needs to be assisted by an acidic, alkaline polishing liquid or an electrolyte solution having an electrolyte without abrasive particles, and has a relatively good polishing ability, thereby avoiding the polishing liquid in the prior art. The abrasive particles block the pores of the polishing pad. Further, after polishing with the polishing pad 2, 3, only a small amount of abrasive grains 22, 32 remain on the surface of the workpiece to be polished, which can be completed by a simple cleaning process, and is also easy to be used for wastewater treatment. The invention is illustrated by the following examples, which are not intended to be construed as limiting the invention. 130536.doc • 13· 201016391 Example: The manufacturing method of the present example corresponds to the manufacturing method of the second embodiment described above. Referring to Figure 6, first, a fiber raw material and a plurality of abrasive particles 32 are provided, and the abrasive particles 32 are added to the fiber raw material, wherein the fiber raw material comprises 75% by weight of polyethylene terephthalate ( Polyethylene Terephthalate (PET) and 40% by weight of polyethylene (PE) 'The abrasive particles 32 are 3% by weight of cerium oxide (Si〇2). Next, a spinning step is performed to form the fiber raw material into a plurality of fibers 31. The fibers 31 are solid and some of the abrasive particles 32 are located inside the fibers 31, and a portion of the abrasive particles 32 are exposed on the surface of the fibers 31 (as shown in Figure 7). The spinning step is Melt Spinning. First, the fiber raw material is melted at a temperature of 288 ° C through an extruder, sprayed on a spinneret, and cooled at a temperature of 22 ° C. The spinning take-up speed is 55Om/min, and the raw yarn can be obtained, and finally cut into short fibers, and the fibers 31 can be obtained. 0 Next, a cotton making step is performed to form the fibers 31 into a fibrous substrate 34, and the fibrous substrate 34 is a nonwoven fabric. Next, the fiber base material 34 is impregnated into a polymer solution (not shown), and the material of the polymer solution is selected from the group consisting of polyamide resin (Polyamide Resin), polycarbonate (Polycarbonate), and poly Epoxy Resin, Phenol Resin, Polyurethane Resin, Vinylbenzene Resin and Acrylic Resin Group. Finally, a curing step is performed. First, 130536.doc 201016391 fibrous substrate 34 impregnated with the polymer solution was placed in a coagulation tank of 22% dimethyl decylamine (Dmf) to be solidified, and then placed in a washing tank to wash out dimethylformamide (DMF). ), and finally to 150. (The temperature is supplied to dryness to obtain the polishing pad 3 having the abrasive grains 32. Thereby, the fiber substrate 34 is covered with a polymer body 33 including a first surface 331 and a A portion of the fibers 31 and a portion of the abrasive particles 32 are exposed on the first surface Mi of the polymer body 33. However, the above embodiments are merely illustrative of the principles and effects of the present invention, rather than The invention is not limited by the spirit of the invention, and the scope of the invention should be as set forth in the appended claims. 1 is a schematic view showing a polishing pad having abrasive grains; FIG. 2 is a view showing a first embodiment of a polishing pad having abrasive grains of the present invention; and FIG. 3 is a view showing a first embodiment of the polishing pad having abrasive grains of the present invention. A schematic cross-sectional view of a fiber in which the fibers are solid; FIG. 4 is a schematic cross-sectional view showing the fiber of the first embodiment of the polishing pad having abrasive grains of the present invention, wherein the fibers are hollow; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7 is a schematic view showing a second embodiment of a polishing pad having abrasive grains according to the present invention; FIG. 7 is a view showing a polishing pad having abrasive grains according to the present invention; A schematic cross-sectional view of a fiber of a second embodiment in which the fibers are solid; 130536.doc • 15 - 201016391 Figure 8 is a schematic cross-sectional view showing a fiber of a second embodiment of the polishing art of abrasive grains of the present invention, wherein The fiber system is hollow; and Fig. 9 is a flow chart showing the manufacturing method of the second embodiment of the polishing pad having abrasive grains of the present invention. [Main component symbol description] 1 Conventional polishing pad having abrasive grains 2 The present invention has abrasive grains First Embodiment 3 of Polishing Pad A second embodiment of a polishing pad having abrasive grains of the present invention
11 底層 12 拋光層 21 纖維 22 研磨粒 23 高分子體 24 纖維基材 31 纖維 32 研磨粒 33 高分子體 34 纖維基材 121 樹脂 122 研磨粒 231 第一表面 232 第二表面 331 第一表面 332 第二表面 1211 拋光面 130536.doc • 16 -11 bottom layer 12 polishing layer 21 fiber 22 abrasive grain 23 polymer body 24 fiber substrate 31 fiber 32 abrasive grain 33 polymer body 34 fiber substrate 121 resin 122 abrasive grain 231 first surface 232 second surface 331 first surface 332 Two surface 1211 polished surface 130536.doc • 16 -