MY132791A - Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
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Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
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Application filed by Innopad IncfiledCriticalInnopad Inc
Publication of MY132791ApublicationCriticalpatent/MY132791A/en
A POLISHING PAD FOR POLISHING SEMICONDUCTORS AND OTHER PLANAR SUBSTRATES IN THE PRESENCE OF A SLURRY COMPRISING ABRASIVE PARTICLES AND A DISPERSIVE AGENT IS DISCLOSED. THE POLISHING PAD INCLUDES A SOLUBLE COMPONENT, PREFERABLY FIBROUS, WITHIN A POLYMER MATRIX COMPONENT. THE FIBROUS COMPONENT INCLUDES FIBERS SOLUBLE IN THE SLURRY SUFFICIENTLY TO PROVIDE A VOID STRUCTURE IN THE POLISHING SURFACE OF THE PAD. THE VOID STRUCTURE ENHANCES THE POLISHING RATE AND UNIFORMITY BY INCRESING THE MOBILITY OF THE ABRASIVE PARTICLES WHILE REDUCING SCRATCHING OF THE POLISHED SURFACE. ADDITIVES THAT FURTHER ENHANCE POLISHING AND/OR ASSIST IN THE REMOVAL OR RESIDUES GENERATED DURING POLISHING, SUCH AS SURFACTANTS AND REMOVERS, ARE OPTIONALLY INCORPORATED IN THE FIBROUS SUBSTANCE OR TOPOGRAPHICALLY COATED ON THE FIBROUS SUBSTANCE.
MYPI20001569A1999-04-132000-04-13Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
MY132791A
(en)
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing