MY132791A - Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles - Google Patents

Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Info

Publication number
MY132791A
MY132791A MYPI20001569A MYPI20001569A MY132791A MY 132791 A MY132791 A MY 132791A MY PI20001569 A MYPI20001569 A MY PI20001569A MY PI20001569 A MYPI20001569 A MY PI20001569A MY 132791 A MY132791 A MY 132791A
Authority
MY
Malaysia
Prior art keywords
polishing
abrasive particles
fibrous
substrates
chemical mechanical
Prior art date
Application number
MYPI20001569A
Inventor
K Hsu Oscar
K Vangsness Jean
C Billings Scott
S Gilbride David
Original Assignee
Innopad Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad Inc filed Critical Innopad Inc
Publication of MY132791A publication Critical patent/MY132791A/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A POLISHING PAD FOR POLISHING SEMICONDUCTORS AND OTHER PLANAR SUBSTRATES IN THE PRESENCE OF A SLURRY COMPRISING ABRASIVE PARTICLES AND A DISPERSIVE AGENT IS DISCLOSED. THE POLISHING PAD INCLUDES A SOLUBLE COMPONENT, PREFERABLY FIBROUS, WITHIN A POLYMER MATRIX COMPONENT. THE FIBROUS COMPONENT INCLUDES FIBERS SOLUBLE IN THE SLURRY SUFFICIENTLY TO PROVIDE A VOID STRUCTURE IN THE POLISHING SURFACE OF THE PAD. THE VOID STRUCTURE ENHANCES THE POLISHING RATE AND UNIFORMITY BY INCRESING THE MOBILITY OF THE ABRASIVE PARTICLES WHILE REDUCING SCRATCHING OF THE POLISHED SURFACE. ADDITIVES THAT FURTHER ENHANCE POLISHING AND/OR ASSIST IN THE REMOVAL OR RESIDUES GENERATED DURING POLISHING, SUCH AS SURFACTANTS AND REMOVERS, ARE OPTIONALLY INCORPORATED IN THE FIBROUS SUBSTANCE OR TOPOGRAPHICALLY COATED ON THE FIBROUS SUBSTANCE.
MYPI20001569A 1999-04-13 2000-04-13 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles MY132791A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12904899P 1999-04-13 1999-04-13
US54598200P 2000-04-10 2000-04-10

Publications (1)

Publication Number Publication Date
MY132791A true MY132791A (en) 2007-10-31

Family

ID=78397463

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20001569A MY132791A (en) 1999-04-13 2000-04-13 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Country Status (1)

Country Link
MY (1) MY132791A (en)

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