DE60043913D1 - Polierkissen zum chemisch-mechanischen Polieren von Substraten in Gegenwart von Schleifpartikeln enthaltende Aufschlämmung - Google Patents

Polierkissen zum chemisch-mechanischen Polieren von Substraten in Gegenwart von Schleifpartikeln enthaltende Aufschlämmung

Info

Publication number
DE60043913D1
DE60043913D1 DE60043913T DE60043913T DE60043913D1 DE 60043913 D1 DE60043913 D1 DE 60043913D1 DE 60043913 T DE60043913 T DE 60043913T DE 60043913 T DE60043913 T DE 60043913T DE 60043913 D1 DE60043913 D1 DE 60043913D1
Authority
DE
Germany
Prior art keywords
layer
polishing
backing
abrasive particles
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60043913T
Other languages
English (en)
Inventor
Oscar K Hsu
Jean K Vangsness
Scott C Billings
David S Gilbride
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innopad Inc
Original Assignee
Innopad Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad Inc filed Critical Innopad Inc
Application granted granted Critical
Publication of DE60043913D1 publication Critical patent/DE60043913D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE60043913T 1999-04-13 2000-04-12 Polierkissen zum chemisch-mechanischen Polieren von Substraten in Gegenwart von Schleifpartikeln enthaltende Aufschlämmung Expired - Lifetime DE60043913D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12904899P 1999-04-13 1999-04-13
US09/545,982 US6656018B1 (en) 1999-04-13 2000-04-10 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Publications (1)

Publication Number Publication Date
DE60043913D1 true DE60043913D1 (de) 2010-04-15

Family

ID=26827184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60043913T Expired - Lifetime DE60043913D1 (de) 1999-04-13 2000-04-12 Polierkissen zum chemisch-mechanischen Polieren von Substraten in Gegenwart von Schleifpartikeln enthaltende Aufschlämmung

Country Status (8)

Country Link
US (2) US6656018B1 (de)
EP (2) EP2266757B1 (de)
JP (1) JP2001047357A (de)
AT (1) ATE459453T1 (de)
CA (1) CA2305106C (de)
DE (1) DE60043913D1 (de)
SG (1) SG87892A1 (de)
TW (1) TW440495B (de)

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JP2002190460A (ja) * 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法
EP1211024A3 (de) 2000-11-30 2004-01-02 JSR Corporation Polierverfahren
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
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KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
US6488767B1 (en) 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
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US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4266579B2 (ja) * 2002-06-28 2009-05-20 株式会社ノリタケカンパニーリミテド 研磨体およびその製造方法
EP1542831A1 (de) * 2002-09-25 2005-06-22 PPG Industries Ohio, Inc. Polierkissen zur planarisierung
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US6641632B1 (en) * 2002-11-18 2003-11-04 International Business Machines Corporation Polishing compositions and use thereof
JP4659338B2 (ja) * 2003-02-12 2011-03-30 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US20050042976A1 (en) * 2003-08-22 2005-02-24 International Business Machines Corporation Low friction planarizing/polishing pads and use thereof
US7101275B2 (en) 2003-09-26 2006-09-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Resilient polishing pad for chemical mechanical polishing
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7232364B2 (en) * 2005-02-04 2007-06-19 3M Innovative Properties Company Abrasive cleaning article and method of making
WO2007016498A2 (en) * 2005-08-02 2007-02-08 Raytech Composites, Inc. Nonwoven polishing pads for chemical mechanical polishing
US8192257B2 (en) * 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads
JP2008000831A (ja) * 2006-06-20 2008-01-10 Saitama Univ 研磨パッドの製造方法
TWI409136B (zh) 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
US20080274674A1 (en) * 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
EP2227350A4 (de) 2007-11-30 2011-01-12 Innopad Inc Kissen mit endpunkterfassungsfenster für chemisch-mechanisches polieren
EP2242615A4 (de) * 2007-12-31 2013-10-30 Innopad Inc Chemisch-mechanisches planarisierungskissen
EP2271463A4 (de) * 2008-04-01 2013-11-27 Innopad Inc Polierkissen mit gesteuerter hohlraumbildung
JP2011517111A (ja) * 2008-04-11 2011-05-26 イノパッド，インコーポレイテッド ボイドネットワークを有する化学機械的平坦化パッド
US8177603B2 (en) * 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
US8546260B2 (en) * 2008-09-04 2013-10-01 Innopad, Inc. Fabric containing non-crimped fibers and methods of manufacture
TW201016391A (en) * 2008-10-20 2010-05-01 Bestac Advanced Material Co Ltd Polishing pad having abrasive grains and method for making the same
JP2012517715A (ja) * 2009-02-12 2012-08-02 イノパッド，インコーポレイテッド Ｃｍｐパッドにおける３次元ネットワーク
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
WO2012082395A2 (en) 2010-12-14 2012-06-21 3M Innovative Properties Company Self-contained fibrous buffing article
US9108299B2 (en) 2011-06-14 2015-08-18 3M Innovative Properties Company Self-contained fibrous buffing article
DE102012206708A1 (de) 2012-04-24 2013-10-24 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102013201663B4 (de) 2012-12-04 2020-04-23 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102013205448A1 (de) 2013-03-27 2014-10-16 Siltronic Ag Verfahren zum Polieren eines Substrates aus Halbleitermaterial
TWI590918B (zh) * 2013-08-16 2017-07-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
CN105729297B (zh) * 2016-04-19 2017-08-25 南京航空航天大学 研抛一体化冰粒型固结磨料抛光垫及其制备方法
CN106002663B (zh) * 2016-05-26 2018-03-27 南京航空航天大学 一种分层冷冻固结磨料抛光垫及制备方法
EP3441185A4 (de) * 2016-06-01 2020-04-01 Fujibo Holdings, Inc. Polierkissen und verfahren zur herstellung davon sowie verfahren zur herstellung eines schleifmittels
JP6829037B2 (ja) * 2016-09-30 2021-02-10 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN114310652A (zh) * 2021-12-30 2022-04-12 金陵科技学院 一种软脆材料柔性研磨装置

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US5916011A (en) * 1996-12-26 1999-06-29 Motorola, Inc. Process for polishing a semiconductor device substrate
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Also Published As

Publication number Publication date
US6656018B1 (en) 2003-12-02
EP2266757B1 (de) 2013-10-02
US6890244B2 (en) 2005-05-10
TW440495B (en) 2001-06-16
US20040072507A1 (en) 2004-04-15
CA2305106A1 (en) 2000-10-13
ATE459453T1 (de) 2010-03-15
SG87892A1 (en) 2002-04-16
CA2305106C (en) 2008-07-08
EP2266757A1 (de) 2010-12-29
JP2001047357A (ja) 2001-02-20
EP1046466A3 (de) 2003-10-08
EP1046466B1 (de) 2010-03-03
EP1046466A2 (de) 2000-10-25

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Legal Events

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8364 No opposition during term of opposition