ATE454718T1 - Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffs - Google Patents
Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffsInfo
- Publication number
- ATE454718T1 ATE454718T1 AT03810675T AT03810675T ATE454718T1 AT E454718 T1 ATE454718 T1 AT E454718T1 AT 03810675 T AT03810675 T AT 03810675T AT 03810675 T AT03810675 T AT 03810675T AT E454718 T1 ATE454718 T1 AT E454718T1
- Authority
- AT
- Austria
- Prior art keywords
- phosphor
- fluorescent
- coating member
- coating
- alkaline
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 10
- 239000011248 coating agent Substances 0.000 abstract 6
- 238000000576 coating method Methods 0.000 abstract 6
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 229910052761 rare earth metal Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000012808 vapor phase Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7735—Germanates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/7792—Aluminates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002326155A JP4529349B2 (ja) | 2002-11-08 | 2002-11-08 | 窒化物系蛍光体および発光装置 |
JP2003319668A JP4725008B2 (ja) | 2003-09-11 | 2003-09-11 | 発光装置、発光素子用蛍光体および発光素子用蛍光体の製造方法 |
PCT/JP2003/014233 WO2004042834A1 (ja) | 2002-11-08 | 2003-11-07 | 発光装置、蛍光体および蛍光体の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE454718T1 true ATE454718T1 (de) | 2010-01-15 |
Family
ID=32314072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03810675T ATE454718T1 (de) | 2002-11-08 | 2003-11-07 | Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffs |
Country Status (6)
Country | Link |
---|---|
US (1) | US7511411B2 (de) |
EP (1) | EP1560274B1 (de) |
AT (1) | ATE454718T1 (de) |
AU (1) | AU2003277627A1 (de) |
DE (1) | DE60330892D1 (de) |
WO (1) | WO2004042834A1 (de) |
Families Citing this family (60)
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WO2006059260A1 (en) * | 2004-12-03 | 2006-06-08 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a fluorescent material |
US7671529B2 (en) | 2004-12-10 | 2010-03-02 | Philips Lumileds Lighting Company, Llc | Phosphor converted light emitting device |
TWI249861B (en) * | 2005-01-12 | 2006-02-21 | Lighthouse Technology Co Ltd | Wavelength converting substance and light emitting device and encapsulating material comprising the same |
KR100678285B1 (ko) | 2005-01-20 | 2007-02-02 | 삼성전자주식회사 | 발광 다이오드용 양자점 형광체 및 그의 제조방법 |
CN101982891A (zh) * | 2005-02-28 | 2011-03-02 | 电气化学工业株式会社 | 荧光体及其制造方法及使用了该荧光体的发光元件 |
WO2006134982A1 (ja) * | 2005-06-14 | 2006-12-21 | Denki Kagaku Kogyo Kabushiki Kaisha | 蛍光体含有樹脂組成物およびシート、それらを用いた発光素子 |
JP2009506157A (ja) | 2005-08-24 | 2009-02-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光材料 |
DE102005041153A1 (de) | 2005-08-30 | 2007-03-01 | Leuchtstoffwerk Breitungen Gmbh | Nitridocarbid-Leuchtstoffe |
JP4529846B2 (ja) * | 2005-09-06 | 2010-08-25 | 日立電線株式会社 | Iii−v族窒化物系半導体基板及びその製造方法 |
DE102005059521A1 (de) * | 2005-12-13 | 2007-06-14 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Rot emittierender Leuchtstoff und Lichtquelle mit einem derartigen Leuchtstoff |
KR100735320B1 (ko) * | 2005-12-27 | 2007-07-04 | 삼성전기주식회사 | 형광체막 형성방법 및 이를 이용한 발광다이오드 패키지제조방법 |
EP1985683B1 (de) * | 2006-02-02 | 2013-08-28 | Mitsubishi Chemical Corporation | Komplexer oxynitrid-leuchtstoff, davon gebrauch machende lichtemittierende vorrichtung, bilddisplayvorrichtung, beleuchtungsvorrichtung, leuchtstoffhaltige zusammensetzung und komplexes oxynitrid |
US20070215837A1 (en) * | 2006-03-16 | 2007-09-20 | Shivkumar Chiruvolu | Highly crystalline nanoscale phosphor particles and composite materials incorporating the particles |
JP2009534490A (ja) * | 2006-04-19 | 2009-09-24 | チバ ホールディング インコーポレーテッド | 無機蛍光増白剤 |
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JP2007324475A (ja) * | 2006-06-02 | 2007-12-13 | Sharp Corp | 波長変換部材および発光装置 |
KR20090034897A (ko) * | 2006-06-22 | 2009-04-08 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 저압 가스 방전 램프, 백라이팅 시스템, 및 디스플레이 시스템 |
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DE102007053285A1 (de) * | 2007-11-08 | 2009-05-14 | Merck Patent Gmbh | Verfahren zur Herstellung von beschichteten Leuchtstoffen |
DE102007053770A1 (de) * | 2007-11-12 | 2009-05-14 | Merck Patent Gmbh | Beschichtete Leuchtstoffpartikel mit Brechungsindex-Anpassung |
JP5644112B2 (ja) * | 2008-01-21 | 2014-12-24 | 日亜化学工業株式会社 | 発光装置 |
WO2009099211A1 (ja) | 2008-02-07 | 2009-08-13 | Mitsubishi Chemical Corporation | 半導体発光装置、バックライト、カラー画像表示装置、及びそれらに用いる蛍光体 |
DE102008021662A1 (de) * | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | LED mit Mehrband-Leuchtstoffsystem |
US8287759B2 (en) | 2009-05-15 | 2012-10-16 | Cree, Inc. | Luminescent particles, methods and light emitting devices including the same |
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JP3829464B2 (ja) * | 1998-03-25 | 2006-10-04 | 双葉電子工業株式会社 | 蛍光体及び蛍光体の製造方法 |
US5985175A (en) * | 1998-08-19 | 1999-11-16 | Osram Sylvania Inc. | Boron oxide coated phosphor and method of making same |
US6458512B1 (en) | 1998-10-13 | 2002-10-01 | 3M Innovative Properties Company | Oxynitride encapsulated electroluminescent phosphor particles |
EP1104799A1 (de) * | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Rotstrahlendes lumineszentes Material |
JP2002033521A (ja) * | 2000-07-14 | 2002-01-31 | Showa Denko Kk | 白色発光素子およびその製造方法 |
JP2002076434A (ja) * | 2000-08-28 | 2002-03-15 | Toyoda Gosei Co Ltd | 発光装置 |
DE10051242A1 (de) * | 2000-10-17 | 2002-04-25 | Philips Corp Intellectual Pty | Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff |
JP2002173675A (ja) * | 2000-12-06 | 2002-06-21 | Sanken Electric Co Ltd | 被覆層を有する蛍光粒子及びその製法 |
JP3954304B2 (ja) | 2000-12-20 | 2007-08-08 | 株式会社東芝 | 発光装置 |
US6417019B1 (en) * | 2001-04-04 | 2002-07-09 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting diode |
US7001665B2 (en) * | 2001-04-06 | 2006-02-21 | Osram Sylvania Inc. | Electroluminescent phosphor with plural moisture resistant coatings thereon |
US6686676B2 (en) | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
US6734466B2 (en) | 2002-03-05 | 2004-05-11 | Agilent Technologies, Inc. | Coated phosphor filler and a method of forming the coated phosphor filler |
-
2003
- 2003-11-07 WO PCT/JP2003/014233 patent/WO2004042834A1/ja active Application Filing
- 2003-11-07 EP EP03810675A patent/EP1560274B1/de not_active Expired - Lifetime
- 2003-11-07 AT AT03810675T patent/ATE454718T1/de not_active IP Right Cessation
- 2003-11-07 US US10/533,688 patent/US7511411B2/en active Active
- 2003-11-07 AU AU2003277627A patent/AU2003277627A1/en not_active Abandoned
- 2003-11-07 DE DE60330892T patent/DE60330892D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7511411B2 (en) | 2009-03-31 |
WO2004042834A1 (ja) | 2004-05-21 |
EP1560274A1 (de) | 2005-08-03 |
US20060001352A1 (en) | 2006-01-05 |
AU2003277627A1 (en) | 2004-06-07 |
DE60330892D1 (de) | 2010-02-25 |
EP1560274A4 (de) | 2007-03-28 |
EP1560274B1 (de) | 2010-01-06 |
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