ATE419558T1 - Verfahren zur herstellung von strukturen im nanometerbereich zur anwendung im bereich der maskenreparatur - Google Patents

Verfahren zur herstellung von strukturen im nanometerbereich zur anwendung im bereich der maskenreparatur

Info

Publication number
ATE419558T1
ATE419558T1 AT03783067T AT03783067T ATE419558T1 AT E419558 T1 ATE419558 T1 AT E419558T1 AT 03783067 T AT03783067 T AT 03783067T AT 03783067 T AT03783067 T AT 03783067T AT E419558 T1 ATE419558 T1 AT E419558T1
Authority
AT
Austria
Prior art keywords
nanostructures
repaired
holes
application
field
Prior art date
Application number
AT03783067T
Other languages
German (de)
English (en)
Inventor
Crocker Percy Van
Sylvain Cruchon-Dupeyrat
Linette Demers
Robert Elghanian
Sandeep Disawal
Nabil Amro
Hua Zhang
Original Assignee
Nanoink Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanoink Inc filed Critical Nanoink Inc
Application granted granted Critical
Publication of ATE419558T1 publication Critical patent/ATE419558T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1254—Sol or sol-gel processing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/855—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure
    • Y10S977/857—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure including coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/863—Atomic force probe

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Surface Treatment Of Glass (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AT03783067T 2002-10-21 2003-10-21 Verfahren zur herstellung von strukturen im nanometerbereich zur anwendung im bereich der maskenreparatur ATE419558T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41978102P 2002-10-21 2002-10-21

Publications (1)

Publication Number Publication Date
ATE419558T1 true ATE419558T1 (de) 2009-01-15

Family

ID=32176479

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03783067T ATE419558T1 (de) 2002-10-21 2003-10-21 Verfahren zur herstellung von strukturen im nanometerbereich zur anwendung im bereich der maskenreparatur

Country Status (9)

Country Link
US (1) US7691541B2 (enExample)
EP (1) EP1556737B1 (enExample)
JP (1) JP2006504136A (enExample)
KR (1) KR101101698B1 (enExample)
CN (1) CN1726431A (enExample)
AT (1) ATE419558T1 (enExample)
AU (1) AU2003290531A1 (enExample)
DE (1) DE60325629D1 (enExample)
WO (1) WO2004038504A2 (enExample)

Families Citing this family (146)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751683A (en) 1995-07-24 1998-05-12 General Nanotechnology, L.L.C. Nanometer scale data storage device and associated positioning system
US6337479B1 (en) * 1994-07-28 2002-01-08 Victor B. Kley Object inspection and/or modification system and method
US6339217B1 (en) 1995-07-28 2002-01-15 General Nanotechnology Llc Scanning probe microscope assembly and method for making spectrophotometric, near-field, and scanning probe measurements
US8071168B2 (en) * 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US7491422B2 (en) * 2002-10-21 2009-02-17 Nanoink, Inc. Direct-write nanolithography method of transporting ink with an elastomeric polymer coated nanoscopic tip to form a structure having internal hollows on a substrate
US7217396B2 (en) * 2003-05-05 2007-05-15 The Board Of Trustees Of The University Of Illinois Microfabricated micro fluid channels
US20040228962A1 (en) * 2003-05-16 2004-11-18 Chang Liu Scanning probe microscopy probe and method for scanning probe contact printing
US7153615B2 (en) * 2003-08-20 2006-12-26 Intel Corporation Extreme ultraviolet pellicle using a thin film and supportive mesh
TWI261726B (en) * 2004-04-09 2006-09-11 Allied Integrated Patterning C Acceptable defect positioning and manufacturing method for large-scaled photomask blanks
US8235302B2 (en) * 2004-04-20 2012-08-07 Nanolnk, Inc. Identification features
JP4652725B2 (ja) * 2004-06-09 2011-03-16 エスアイアイ・ナノテクノロジー株式会社 フォトマスク欠陥修正方法
US7034290B2 (en) * 2004-09-24 2006-04-25 Agilent Technologies, Inc. Target support with pattern recognition sites
US8261662B1 (en) 2004-11-08 2012-09-11 Nanolnk, Inc. Active pen nanolithography
US7171841B2 (en) * 2004-12-01 2007-02-06 Uchicago Argonne, Llc Ultrafast and ultrasensitive hydrogen sensors based on self-assembly monolayer promoted 2-dimensional palladium nanoclusters
CN1300635C (zh) * 2004-12-09 2007-02-14 上海交通大学 真空负压纳米压印方法
US20100297027A1 (en) * 2004-12-20 2010-11-25 Nanolnk, Inc. Overt authentication features for compositions and objects and methods of fabrication and verification thereof
US20100294147A1 (en) * 2004-12-20 2010-11-25 Nanoink, Inc. Apparatus and methods for preparing identification features including pharmaceutical applications
US20060138079A1 (en) * 2004-12-27 2006-06-29 Potyrailo Radislav A Fabrication process of microfluidic devices
EP1854160B1 (en) 2005-02-10 2017-06-21 Yeda Research And Development Co., Ltd. Redox-active structures and devices utilizing the same
US8461628B2 (en) * 2005-03-18 2013-06-11 Kovio, Inc. MOS transistor with laser-patterned metal gate, and method for making the same
WO2006127736A2 (en) * 2005-05-23 2006-11-30 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon Silicon substrates with thermal oxide windows for transmission electron microscopy
US8212225B2 (en) * 2005-05-13 2012-07-03 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon TEM grids for determination of structure-property relationships in nanotechnology
US7833904B2 (en) * 2005-06-16 2010-11-16 The Trustees Of Columbia University In The City Of New York Methods for fabricating nanoscale electrodes and uses thereof
WO2007008507A2 (en) * 2005-07-06 2007-01-18 Mirkin Chad A Phase separation in patterned structures
US8846195B2 (en) 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US8557351B2 (en) * 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US7759407B2 (en) 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
US8808808B2 (en) * 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
JP4607705B2 (ja) * 2005-08-24 2011-01-05 株式会社東芝 マスク欠陥修正方法及び半導体装置の製造方法
US20100294927A1 (en) * 2005-09-12 2010-11-25 Nanolnk, Inc. High throughput inspecting
US7281419B2 (en) * 2005-09-21 2007-10-16 The Board Of Trustees Of The University Of Illinois Multifunctional probe array system
US7473912B2 (en) * 2005-11-09 2009-01-06 Yang Xiao Charles Method and apparatus for patterning micro and nano structures using a mask-less process
US20070172745A1 (en) * 2006-01-26 2007-07-26 Smith Bruce W Evanescent wave assist features for microlithography
US8192794B2 (en) * 2006-04-19 2012-06-05 Northwestern University Massively parallel lithography with two-dimensional pen arrays
EP2013662B1 (en) 2006-04-19 2013-08-14 Northwestern University Article for parallel lithography with two-dimensional pen arrays
KR100866499B1 (ko) * 2006-05-18 2008-11-03 주식회사 파이컴 폴리머 마스크의 수리 방법
CA2654973A1 (en) * 2006-06-28 2008-07-31 Northwestern University Etching and hole arrays
US8278216B1 (en) 2006-08-18 2012-10-02 Novellus Systems, Inc. Selective capping of copper
JP5003094B2 (ja) * 2006-10-20 2012-08-15 凸版印刷株式会社 ハーフトーン型位相シフトマスクの製造方法
DE102007055540A1 (de) * 2006-11-29 2008-06-19 Sii Nano Technology Inc. Verfahren zum Korrigieren von Photomaskendefekten
US9181098B2 (en) 2006-12-15 2015-11-10 Los Alamos National Security, Llc Preparation of array of long carbon nanotubes and fibers therefrom
KR20090101943A (ko) * 2006-12-18 2009-09-29 노쓰웨스턴유니버시티 에칭 레지스트를 이용한 미세구조 및 나노구조의 제조
US7767985B2 (en) * 2006-12-26 2010-08-03 Globalfoundries Inc. EUV pellicle and method for fabricating semiconductor dies using same
CN101610980A (zh) * 2007-02-08 2009-12-23 丰塔纳技术公司 粒子去除方法及化合物
US7680553B2 (en) 2007-03-08 2010-03-16 Smp Logic Systems Llc Methods of interfacing nanomaterials for the monitoring and execution of pharmaceutical manufacturing processes
KR20100015321A (ko) * 2007-03-13 2010-02-12 나노잉크, 인크. 검시창을 사용하는 나노리소그래피
US20080264441A1 (en) * 2007-04-30 2008-10-30 Yoji Takagi Method for removing residuals from photomask
CA2681443A1 (en) * 2007-05-09 2008-11-20 Nanoink, Inc. Compact nanofabrication apparatus
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
JP2010531977A (ja) * 2007-06-20 2010-09-30 ノースウエスタン ユニバーシティ 脂質を含む組成物を用いたパターニング
US20090004231A1 (en) 2007-06-30 2009-01-01 Popp Shane M Pharmaceutical dosage forms fabricated with nanomaterials for quality monitoring
US8039379B1 (en) * 2007-07-02 2011-10-18 Novellus Systems, Inc. Nanoparticle cap layer
US7994640B1 (en) 2007-07-02 2011-08-09 Novellus Systems, Inc. Nanoparticle cap layer
EP2185975A1 (en) * 2007-08-08 2010-05-19 Northwestern University Independently-addressable, self-correcting inking for cantilever arrays
US8540922B2 (en) * 2007-08-27 2013-09-24 Hewlett-Packard Development Company, L.P. Laser patterning of a carbon nanotube layer
US20090061161A1 (en) * 2007-08-27 2009-03-05 Lynn Sheehan Laser patterning of a cross-linked polymer
US20090061184A1 (en) 2007-08-31 2009-03-05 United Technologies Corporation Processes for Applying a Conversion Coating with Conductive Additive(S) and the Resultant Coated Articles
KR20100068278A (ko) * 2007-10-15 2010-06-22 나노잉크, 인크. 나노입자-계 잉크의 리소그래피
US8205268B2 (en) * 2007-11-26 2012-06-19 Nanoink, Inc. Cantilever with pivoting actuation
KR100873154B1 (ko) * 2008-01-30 2008-12-10 한국표준과학연구원 포토 마스크의 수리장치 및 이를 이용한 수리방법
US8256018B2 (en) * 2008-02-05 2012-08-28 Nanoink, Inc. Array and cantilever array leveling
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US8068328B2 (en) * 2008-03-12 2011-11-29 Intel Corporation Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same
WO2009140442A2 (en) * 2008-05-13 2009-11-19 Hanoink, Inc. Heated cantilever
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
KR20100013577A (ko) * 2008-07-31 2010-02-10 서울대학교산학협력단 나노패터닝에 있어서 벌지효과의 제거
CN101344717B (zh) * 2008-08-15 2011-05-18 深圳市路维电子有限公司 光罩修补液
WO2010032243A1 (en) * 2008-09-16 2010-03-25 Ramot At Tel Aviv University Ltd. A system and a method for nano imprinting
US9104948B2 (en) 2008-09-16 2015-08-11 Ramot At Tel-Aviv University Ltd. System and a method for nano imprinting
KR101053450B1 (ko) * 2008-09-26 2011-08-03 참엔지니어링(주) 마스크 리페어 장치 및 방법
CN101726633B (zh) * 2008-10-16 2011-12-07 京元电子股份有限公司 具修补层的测试载板
US8361546B2 (en) * 2008-10-30 2013-01-29 Molecular Imprints, Inc. Facilitating adhesion between substrate and patterned layer
CN101738514B (zh) * 2008-11-11 2013-03-20 京元电子股份有限公司 具有修补层金属垫的测试载板制造方法
JP5168100B2 (ja) * 2008-11-17 2013-03-21 大日本印刷株式会社 フォトマスク等の欠陥修正方法
EP2412007B1 (en) 2009-03-27 2020-07-22 Ishihara Chemical Co., Ltd. Buffer layer to enhance photo and/or laser sintering
WO2010120809A1 (en) * 2009-04-14 2010-10-21 Nanoink, Inc. Conducting lines, nanoparticles, inks, and patterning
KR101129025B1 (ko) * 2009-06-25 2012-03-23 주식회사 하이닉스반도체 위상반전마스크의 위상차 에러 보정방법
WO2011002806A1 (en) 2009-06-30 2011-01-06 Nanoink, Inc. Advanced photomask repair
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
GB0915251D0 (en) * 2009-09-02 2009-10-07 Univ Bangor Low temperature platinisation for dye-sensitised solar cells
WO2011066450A2 (en) * 2009-11-24 2011-06-03 Molecular Imprints, Inc. Adhesion layers in nanoimprint lithography
US20110203656A1 (en) * 2010-02-24 2011-08-25 Iowa State University Research Foundation, Inc. Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same
TW201200877A (en) * 2010-04-27 2012-01-01 Nanoink Inc Ball-spacer method for planar object leveling
US9436080B2 (en) * 2010-12-17 2016-09-06 Carl Zeiss Sms Gmbh Method and apparatus for correcting errors on a wafer processed by a photolithographic mask
US8630479B2 (en) * 2011-01-07 2014-01-14 Kla-Tencor Corporation Methods and systems for improved localized feature quantification in surface metrology tools
DE102011004214A1 (de) 2011-02-16 2012-08-16 Carl Zeiss Sms Gmbh Vorrichtung und Verfahren zum Analysieren und Verändern einer Probenoberfläche
US8458810B2 (en) * 2011-04-07 2013-06-04 Michael E. MCCONNEY Scanning thermal twisting atomic force microscopy
RO128117B1 (ro) * 2011-06-16 2019-04-30 Institutul Naţional De Cercetare-Dezvoltare Pentru Microtehnologie Procedeu de nanolitografie 2d şi 3d de tip fountain pen asistat optic
TWI438436B (zh) * 2011-07-12 2014-05-21 Univ Nat Cheng Kung 熱探針
WO2013059670A2 (en) 2011-10-21 2013-04-25 Nanoink, Inc. Octahedral and pyramid-on-post tips for microscopy and lithography
CN102736405B (zh) * 2012-06-15 2014-07-16 深圳市华星光电技术有限公司 一种光罩及其修正方法
EP2870644A2 (en) 2012-07-09 2015-05-13 Yeda Research and Development Co. Ltd. Logic circuits with plug and play solid-state molecular chips
US9598776B2 (en) 2012-07-09 2017-03-21 Pen Inc. Photosintering of micron-sized copper particles
US8748063B2 (en) 2012-08-01 2014-06-10 International Business Machines Corporation Extreme ultraviolet (EUV) multilayer defect compensation and EUV masks
WO2014125494A1 (en) * 2013-02-17 2014-08-21 Carl Zeiss Sms Ltd Surface defect repair by irradiation
US9494854B2 (en) * 2013-03-14 2016-11-15 Kla-Tencor Corporation Technique for repairing an EUV photo-mask
US9038269B2 (en) * 2013-04-02 2015-05-26 Xerox Corporation Printhead with nanotips for nanoscale printing and manufacturing
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
US9086639B2 (en) 2013-09-12 2015-07-21 International Business Machines Corporation Fabrication of on-product aberration monitors with nanomachining
IL229525A0 (en) 2013-11-20 2014-01-30 Yeda Res & Dev Metal complexes of tris-bipyridyl and their uses in electrochromic applications
JP6495025B2 (ja) * 2014-01-31 2019-04-03 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 真空統合ハードマスク処理および装置
WO2015133090A1 (ja) * 2014-03-07 2015-09-11 株式会社Ｊｏｌｅｄ バンクの補修方法、有機ｅｌ表示装置およびその製造方法
US9899234B2 (en) 2014-06-30 2018-02-20 Lam Research Corporation Liner and barrier applications for subtractive metal integration
US10252463B2 (en) * 2014-07-22 2019-04-09 Nabil A. Amro Compact instrument with exchangeable modules for multiple microfabrication and/or nanofabrication methods
KR102352740B1 (ko) * 2015-04-30 2022-01-18 삼성디스플레이 주식회사 마스크의 제조 방법 및 표시 장치의 제조 방법
CN105182684A (zh) * 2015-10-20 2015-12-23 京东方科技集团股份有限公司 一种掩模板的检修方法
US9996004B2 (en) 2015-11-20 2018-06-12 Lam Research Corporation EUV photopatterning of vapor-deposited metal oxide-containing hardmasks
US10751933B2 (en) 2015-12-16 2020-08-25 The Regents Of The University Of California Technique for three-dimensional nanoprinting
GB201604818D0 (en) * 2016-03-22 2016-05-04 Xtpl Sp Z O O Method for forming structures upon a substrate
RU2702960C2 (ru) * 2016-03-24 2019-10-14 Федеральное государственное бюджетное учреждение науки Институт систем обработки изображений Российской академии наук (ИСОИ РАН) Способ изготовления фазовых дифракционных решеток, микроструктур и контактных масок
DE102016205941B4 (de) * 2016-04-08 2020-11-05 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Analysieren eines Defekts einer fotolithographischen Maske oder eines Wafers
RU2659103C1 (ru) * 2017-04-07 2018-06-28 Федеральное государственное бюджетное образовательное учреждение высшего образования "Владимирский Государственный Университет имени Александра Григорьевича и Николая Григорьевича Столетовых" (ВлГУ) Способ формирования планарных структур методом атомно-силовой литографии
CN107015029B (zh) * 2017-05-11 2019-12-13 四川理工学院 原子力显微镜接触模式表征用碳素材料样本的制做方法
US10796912B2 (en) 2017-05-16 2020-10-06 Lam Research Corporation Eliminating yield impact of stochastics in lithography
US10510937B2 (en) * 2017-11-22 2019-12-17 X-Celeprint Limited Interconnection by lateral transfer printing
JP6983633B2 (ja) 2017-11-24 2021-12-17 浜松ホトニクス株式会社 ウェハの検査方法、及びウェハ
CA3085459A1 (en) * 2018-01-04 2019-07-11 Magic Leap, Inc. Optical elements based on polymeric structures incorporating inorganic materials
US10679110B2 (en) 2018-04-01 2020-06-09 Ramot At Tel-Aviv University Ltd. Nanotags for authentication
KR102955829B1 (ko) 2018-11-14 2026-04-23 램 리써치 코포레이션 차세대 리소그래피에서 유용한 하드 마스크들을 제조하기 위한 방법들
CN120762258A (zh) 2018-12-20 2025-10-10 朗姆研究公司 抗蚀剂的干式显影
JP7361622B2 (ja) * 2019-03-05 2023-10-16 Hoya株式会社 フォトマスクの修正方法、フォトマスクの修正装置、ペリクル付きフォトマスクの製造方法および表示装置の製造方法
US12125711B2 (en) 2019-03-18 2024-10-22 Lam Research Corporation Reducing roughness of extreme ultraviolet lithography resists
US11459232B2 (en) * 2019-04-08 2022-10-04 Donna C. Mauro Additive manufacturing methods for modification and improvement of the surfaces of micro-scale geometric features
WO2020223011A1 (en) 2019-04-30 2020-11-05 Lam Research Corporation Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
TWI910974B (zh) 2019-06-26 2026-01-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
TWI849159B (zh) 2019-06-28 2024-07-21 美商蘭姆研究公司 光阻膜的乾式腔室清潔
US12601974B2 (en) 2019-06-28 2026-04-14 Lam Research Corporation Bake strategies to enhance lithographic performance of metal-containing resist
KR20250160237A (ko) 2019-06-28 2025-11-11 램 리써치 코포레이션 복수의 패터닝 복사-흡수 엘리먼트들 및/또는 수직 조성 경사를 갖는 포토레지스트
CN110627376A (zh) * 2019-09-24 2019-12-31 上海电机学院 一种纳米SiO2超疏水涂层及制备工艺和用途
KR20260017509A (ko) 2019-11-25 2026-02-05 램 리써치 코포레이션 금속 상호 접속 구조체들의 도핑 프로세스들
CN111063610B (zh) * 2019-12-30 2024-02-02 上海集成电路研发中心有限公司 光刻缺陷修复方法
CN114200776A (zh) 2020-01-15 2022-03-18 朗姆研究公司 用于光刻胶粘附和剂量减少的底层
CN115244664A (zh) 2020-02-28 2022-10-25 朗姆研究公司 用于减少euv图案化缺陷的多层硬掩模
CN115362414A (zh) 2020-04-03 2022-11-18 朗姆研究公司 用于增强euv光刻性能的暴露前光致抗蚀剂固化
JP2023530299A (ja) 2020-06-22 2023-07-14 ラム リサーチ コーポレーション 金属含有フォトレジスト堆積のための表面改質
DE102020208185B4 (de) 2020-06-30 2025-01-30 Carl Zeiss Smt Gmbh Verfahren und Vorrichtungen zum Einstellen eines Seitenwandwinkels eines Pattern-Elements und zum Untersuchen eines Defekts einer fotolithographischen Maske
KR102601038B1 (ko) 2020-07-07 2023-11-09 램 리써치 코포레이션 방사선 포토레지스트 패터닝을 패터닝하기 위한 통합된 건식 프로세스
KR102673863B1 (ko) 2020-11-13 2024-06-11 램 리써치 코포레이션 포토레지스트의 건식 제거를 위한 프로세스 툴
KR20250142946A (ko) 2020-12-08 2025-09-30 램 리써치 코포레이션 유기 증기를 사용한 포토레지스트 현상
US20230005870A1 (en) * 2021-07-01 2023-01-05 Macom Technology Solutions Holdings, Inc. 3d printed interconnects and resonators for semiconductor devices
CN114014262B (zh) * 2021-10-13 2023-07-21 电子科技大学 一种石墨烯量子点阵列的微纳复合制备方法
US12416589B2 (en) 2022-06-24 2025-09-16 SanDisk Technologies, Inc. Systems and methods for non-destructive inspection of semiconductor devices using reflective X-ray microscope tomographic imaging
KR102861030B1 (ko) * 2022-12-08 2025-09-16 한국외국어대학교 연구산학협력단 제품의 표면에 미세 패턴을 형성하는 방법 및 이를 적용하여 형성한 미세 패턴을 포함하는 제품
WO2026072534A1 (en) * 2024-09-24 2026-04-02 Nani Lithography Inc. Lithography mask methods and composition
CN120033092B (zh) * 2025-01-21 2025-10-03 广东工业大学 一种打印纳米铜辅助混合键合工艺的方法

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160049A (en) 1977-11-07 1979-07-03 Harold Narcus Bright electroless plating process producing two-layer nickel coatings on dielectric substrates
US4200668A (en) 1978-09-05 1980-04-29 Western Electric Company, Inc. Method of repairing a defective photomask
ATE80955T1 (de) 1984-06-20 1992-10-15 Gould Inc Laserverfahren zur photomaskenreparatur.
US4968390A (en) * 1988-11-03 1990-11-06 Board Of Regents, The University Of Texas System High resolution deposition and etching in polymer films
US5126574A (en) 1989-10-10 1992-06-30 The United States Of America As Represented By The Secretary Of Commerce Microtip-controlled nanostructure fabrication and multi-tipped field-emission tool for parallel-process nanostructure fabrication
US5015323A (en) 1989-10-10 1991-05-14 The United States Of America As Represented By The Secretary Of Commerce Multi-tipped field-emission tool for nanostructure fabrication
US5104684A (en) 1990-05-25 1992-04-14 Massachusetts Institute Of Technology Ion beam induced deposition of metals
US5879860A (en) 1993-12-08 1999-03-09 Leica Microsystems Lithography Limited Method of writing a pattern by an electron beam
US6000947A (en) 1994-04-12 1999-12-14 The Board Of Trustees Of The Leland Stanford, Jr. Method of fabricating transistor or other electronic device using scanning probe microscope
US5751683A (en) 1995-07-24 1998-05-12 General Nanotechnology, L.L.C. Nanometer scale data storage device and associated positioning system
US5756997A (en) 1996-03-04 1998-05-26 General Nanotechnology, L.L.C. Scanning probe/optical microscope with modular objective/probe and drive/detector units
WO1998034092A2 (en) 1997-01-21 1998-08-06 Rave, L.L.C. Object inspection and/or modification system and method
US6353219B1 (en) 1994-07-28 2002-03-05 Victor B. Kley Object inspection and/or modification system and method
AU3152795A (en) 1994-07-28 1996-02-22 Victor B. Kley Scanning probe microscope assembly
US6337479B1 (en) * 1994-07-28 2002-01-08 Victor B. Kley Object inspection and/or modification system and method
US5441386A (en) 1994-07-29 1995-08-15 Hsieh; Hsin M. Lubricating system for cooling fans
US5674409A (en) 1995-03-16 1997-10-07 International Business Machines Corporation Nanolithographic method of forming fine lines
DE19630705A1 (de) 1995-08-30 1997-03-20 Deutsche Telekom Ag Verfahren zur Herstellung von 3-dimensional strukturierten Polymerschichten für die integrierte Optik
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US5747120A (en) 1996-03-29 1998-05-05 Regents Of The University Of California Laser ablated hard coating for microtools
KR100189741B1 (ko) * 1996-07-19 1999-06-01 구본준 위상반전마스크 및 그의 제조방법
WO1998029770A1 (en) * 1996-12-30 1998-07-09 D-Star Technologies, Inc. Near-ultraviolet formation of refractive-index grating using phase mask
US6165649A (en) 1997-01-21 2000-12-26 International Business Machines Corporation Methods for repair of photomasks
US6396966B1 (en) 1997-02-09 2002-05-28 Nanoptics, Inc. Glass structures for nanodelivery and nanosensing
US5854487A (en) 1997-02-28 1998-12-29 Park Scientific Instruments Scanning probe microscope providing unobstructed top down and bottom up views
JPH10282130A (ja) 1997-04-01 1998-10-23 Canon Inc プローブとそれを用いた走査型プローブ顕微鏡
US5948470A (en) 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US5865978A (en) * 1997-05-09 1999-02-02 Cohen; Adam E. Near-field photolithographic masks and photolithography; nanoscale patterning techniques; apparatus and method therefor
US5798193A (en) 1997-05-16 1998-08-25 Micron Technology, Inc. Method and apparatus to accurately correlate defect coordinates between photomask inspection and repair systems
US6292382B1 (en) 1997-06-01 2001-09-18 Nanoptics, Inc. Nanometric writing and erasure combined with supersensitive reading without erasure
US5980998A (en) 1997-09-16 1999-11-09 Sri International Deposition of substances on a surface
US6005247A (en) 1997-10-01 1999-12-21 Intevac, Inc. Electron beam microscope using electron beam patterns
US6426499B1 (en) 1998-01-30 2002-07-30 Deutsche Telekom Ag Multi-probe test head and process using same
KR100269329B1 (ko) 1998-06-29 2000-12-01 윤종용 포토마스크의 결함 수리 방법
US6271130B1 (en) 1998-11-25 2001-08-07 The University Of Chicago Semiconductor assisted metal deposition for nanolithography applications
US6146227A (en) * 1998-09-28 2000-11-14 Xidex Corporation Method for manufacturing carbon nanotubes as functional elements of MEMS devices
US6600856B1 (en) 1998-12-06 2003-07-29 Nanoptics, Ltd. Lensed optical fibers and unique micropipettes with subwavelength apertures
US6114073A (en) 1998-12-28 2000-09-05 Micron Technology, Inc. Method for repairing phase shifting masks
US6096459A (en) 1998-12-28 2000-08-01 Micron Technology, Inc. Method for repairing alternating phase shifting masks
US20020122873A1 (en) 2000-01-05 2002-09-05 Mirkin Chad A. Nanolithography methods and products therefor and produced thereby
US6827979B2 (en) 1999-01-07 2004-12-07 Northwestern University Methods utilizing scanning probe microscope tips and products therefor or produced thereby
US6635311B1 (en) 1999-01-07 2003-10-21 Northwestern University Methods utilizing scanning probe microscope tips and products therefor or products thereby
US6197455B1 (en) 1999-01-14 2001-03-06 Advanced Micro Devices, Inc. Lithographic mask repair using a scanning tunneling microscope
US6270946B1 (en) 1999-03-18 2001-08-07 Luna Innovations, Inc. Non-lithographic process for producing nanoscale features on a substrate
US6452171B1 (en) 1999-07-23 2002-09-17 Piezomax Technologies, Inc. Method for sharpening nanotube bundles
US6253015B1 (en) * 2000-02-08 2001-06-26 Corning Incorporated Planar waveguides with high refractive index
KR100455279B1 (ko) 2000-05-06 2004-11-06 삼성전자주식회사 Ｓｅｔ 소자 제작 방법
US6322938B1 (en) 2000-05-22 2001-11-27 The United States Of America As Represented By The Secretary Of The Air Force Nanolithography for multi-passband grating filters
US6455175B1 (en) 2000-07-06 2002-09-24 Honeywell International Inc. Electroless rhodium plating
JP2002040627A (ja) 2000-07-24 2002-02-06 Nec Corp レーザパターン修正方法並びに修正装置
WO2002045215A2 (en) 2000-10-20 2002-06-06 Northwestern University Nanolithography methods and products therefor and produced thereby
JP3914386B2 (ja) * 2000-12-28 2007-05-16 株式会社ルネサステクノロジ フォトマスク、その製造方法、パターン形成方法および半導体装置の製造方法
US6451375B1 (en) 2001-01-05 2002-09-17 International Business Machines Corporation Process for depositing a film on a nanometer structure
JP4149676B2 (ja) 2001-02-05 2008-09-10 株式会社東芝 フォトマスクの修正方法
US6573592B2 (en) 2001-08-21 2003-06-03 Micron Technology, Inc. Semiconductor die packages with standard ball grid array footprint and method for assembling the same
IL145136A0 (en) 2001-08-27 2002-06-30 Multiple plate tip or sample scanning reconfigurable scanning probe microscope with transparent interfacing of far-field optical microscopes
IL145191A0 (en) 2001-08-30 2002-06-30 Aaron Lewis Optically amplifying near-field optical signals
US6740474B2 (en) 2001-11-06 2004-05-25 Eastman Kodak Company Technique for making deep microstructures in photoresist
CN100345059C (zh) * 2001-12-17 2007-10-24 西北大学 采用直写纳米刻蚀印刷的固态部件的图案化
US7994450B2 (en) 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
US7998528B2 (en) 2002-02-14 2011-08-16 Massachusetts Institute Of Technology Method for direct fabrication of nanostructures
US7098056B2 (en) 2002-08-09 2006-08-29 Nanoink, Inc. Apparatus, materials, and methods for fabrication and catalysis
US8071168B2 (en) 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US7005378B2 (en) 2002-08-26 2006-02-28 Nanoink, Inc. Processes for fabricating conductive patterns using nanolithography as a patterning tool
WO2004027791A1 (en) * 2002-09-17 2004-04-01 Northwestern University Patterning magnetic nanostructures
US7491422B2 (en) * 2002-10-21 2009-02-17 Nanoink, Inc. Direct-write nanolithography method of transporting ink with an elastomeric polymer coated nanoscopic tip to form a structure having internal hollows on a substrate

Also Published As

Publication number Publication date
EP1556737B1 (en) 2008-12-31
CN1726431A (zh) 2006-01-25
US7691541B2 (en) 2010-04-06
US20040175631A1 (en) 2004-09-09
DE60325629D1 (de) 2009-02-12
KR20050071599A (ko) 2005-07-07
WO2004038504A2 (en) 2004-05-06
AU2003290531A1 (en) 2004-05-13
EP1556737A2 (en) 2005-07-27
WO2004038504A3 (en) 2004-11-04
AU2003290531A8 (en) 2004-05-13
JP2006504136A (ja) 2006-02-02
KR101101698B1 (ko) 2011-12-30

Similar Documents

Publication Publication Date Title
DE60325629D1 (de) Verfahren zur herstellung von strukturen im nanometerbereich zur anwendung im bereich der maskenreparatur
Yu et al. Laser interference lithography as a new and efficient technique for micropatterning of biopolymer surface
Jonušauskas et al. Optical 3D printing: bridging the gaps in the mesoscale
Watt et al. Proton beam writing
Yiannakou et al. Cell patterning via laser micro/nano structured silicon surfaces
Yin et al. Near-field two-photon nanolithography using an apertureless optical probe
DE102019121028A1 (de) Vorrichtung und Verfahren zur Verwendung von Diamant-Nanokristallen mit NV-Farbzentren in CMOS-Schaltkreisen
Park et al. Adding colors to polydimethylsiloxane by embedding vertical silicon nanowires
EP1080883A3 (de) Siliconkautschuk und Eisenoxide enthaltendes Aufzeichnungsmaterial zur Herstellung von Reliefdruckplatten mittels Lasergravur
Liu et al. High-uniformity submicron gratings with tunable periods fabricated through femtosecond laser-assisted molding technology for deformation detection
Pisera et al. Insights into the structure and morphogenesis of the giant basal spicule of the glass sponge Monorhaphis chuni
Wang et al. Micropatterning and defect engineering of colloidal photonic crystals via laser direct writing
Liu et al. Single-pixel-adjustable structural color fabricated using a spatially modulated femtosecond laser
Jiang et al. 3D nanoprinting of multifunctional MgO transparent ceramics
Jha et al. Micro-patterning in anodic oxide film on aluminium by laser irradiation
Liu et al. Fabrication of microlens arrays by localized hydrolysis in water droplet microreactors
JP5223095B2 (ja) Ｓｉ−Ｏ−Ｓｉ結合を含む化合物を用いた硬質超撥水性材料の作製法及び硬質超撥水性素子
Sun et al. Direct laser writing defects in holographic lithography-created photonic lattices
Seet et al. Three-dimensional circular spiral photonic crystal structures recorded by femtosecond pulses
Ovsianikov et al. Two-photon polymerization–high resolution 3d laser technology and its applications
Chen et al. Refined grating fabrication using displacement Talbot lithography
Gritsch et al. Nanostructured biocomposites for tissue engineering scaffolds
JP4017330B2 (ja) 光学複合体膜とその製造方法ならびにその光学複合体膜を備えた光素子
DE102006035806A1 (de) Farbeffekt-Schichtsystem und Beschichtungen auf Basis photonischer Kristalle, ein Verfahren zu deren Herstellung und deren Verwendung
Klein-Wiele et al. Sub-wavelength pattern generation by laser direct writing via repeated irradiation

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties