ATE391576T1 - Fokussierung eines optischen strahles auf zwei fokusse - Google Patents

Fokussierung eines optischen strahles auf zwei fokusse

Info

Publication number
ATE391576T1
ATE391576T1 AT04739406T AT04739406T ATE391576T1 AT E391576 T1 ATE391576 T1 AT E391576T1 AT 04739406 T AT04739406 T AT 04739406T AT 04739406 T AT04739406 T AT 04739406T AT E391576 T1 ATE391576 T1 AT E391576T1
Authority
AT
Austria
Prior art keywords
laser beam
focuses
focusing
optical beam
focussed
Prior art date
Application number
AT04739406T
Other languages
English (en)
Inventor
Venkatakrishnan Krishnan
Tan Bo
Original Assignee
Xsil Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xsil Technology Ltd filed Critical Xsil Technology Ltd
Application granted granted Critical
Publication of ATE391576T1 publication Critical patent/ATE391576T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Optical Head (AREA)
  • Laser Surgery Devices (AREA)
  • Optical Communication System (AREA)
AT04739406T 2003-05-30 2004-05-27 Fokussierung eines optischen strahles auf zwei fokusse ATE391576T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0312469A GB2402230B (en) 2003-05-30 2003-05-30 Focusing an optical beam to two foci

Publications (1)

Publication Number Publication Date
ATE391576T1 true ATE391576T1 (de) 2008-04-15

Family

ID=9959064

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04739406T ATE391576T1 (de) 2003-05-30 2004-05-27 Fokussierung eines optischen strahles auf zwei fokusse

Country Status (11)

Country Link
US (1) US7858901B2 (de)
EP (1) EP1631415B1 (de)
JP (1) JP4751319B2 (de)
KR (1) KR101167140B1 (de)
CN (1) CN1826206B (de)
AT (1) ATE391576T1 (de)
DE (1) DE602004012999T2 (de)
GB (1) GB2402230B (de)
MY (1) MY149114A (de)
TW (1) TWI260843B (de)
WO (1) WO2004105995A1 (de)

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JP2006525874A (ja) 2006-11-16
US20060261050A1 (en) 2006-11-23
CN1826206B (zh) 2010-10-27
KR20060009019A (ko) 2006-01-27
TW200428729A (en) 2004-12-16
EP1631415A1 (de) 2006-03-08
DE602004012999D1 (en) 2008-05-21
GB2402230B (en) 2006-05-03
KR101167140B1 (ko) 2012-07-20
GB2402230A (en) 2004-12-01
CN1826206A (zh) 2006-08-30
JP4751319B2 (ja) 2011-08-17
WO2004105995A1 (en) 2004-12-09
US7858901B2 (en) 2010-12-28
EP1631415B1 (de) 2008-04-09
DE602004012999T2 (de) 2009-05-28
GB0312469D0 (en) 2003-07-09
TWI260843B (en) 2006-08-21

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