ATE348392T1 - Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzung - Google Patents

Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzung

Info

Publication number
ATE348392T1
ATE348392T1 AT02769392T AT02769392T ATE348392T1 AT E348392 T1 ATE348392 T1 AT E348392T1 AT 02769392 T AT02769392 T AT 02769392T AT 02769392 T AT02769392 T AT 02769392T AT E348392 T1 ATE348392 T1 AT E348392T1
Authority
AT
Austria
Prior art keywords
production
methods
interface materials
silver
aluminum
Prior art date
Application number
AT02769392T
Other languages
German (de)
English (en)
Inventor
My Nguyen
Road Columbia
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of ATE348392T1 publication Critical patent/ATE348392T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24074—Strand or strand-portions
    • Y10T428/24116—Oblique to direction of web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Conductive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
AT02769392T 2001-05-07 2002-05-07 Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzung ATE348392T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/851,103 US6706219B2 (en) 1999-09-17 2001-05-07 Interface materials and methods of production and use thereof

Publications (1)

Publication Number Publication Date
ATE348392T1 true ATE348392T1 (de) 2007-01-15

Family

ID=25309990

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02769392T ATE348392T1 (de) 2001-05-07 2002-05-07 Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzung

Country Status (10)

Country Link
US (3) US6706219B2 (https=)
EP (2) EP1386327B1 (https=)
JP (1) JP2004533705A (https=)
KR (1) KR20040030561A (https=)
CN (2) CN101088697A (https=)
AT (1) ATE348392T1 (https=)
CA (1) CA2442034A1 (https=)
DE (1) DE60216749T2 (https=)
TW (1) TWI276116B (https=)
WO (1) WO2002091395A1 (https=)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7608324B2 (en) * 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7436058B2 (en) * 2002-05-09 2008-10-14 Intel Corporation Reactive solder material
US7147367B2 (en) * 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US6791839B2 (en) 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US7416922B2 (en) 2003-03-31 2008-08-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US20070164424A1 (en) * 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
US7014093B2 (en) * 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US7527090B2 (en) 2003-06-30 2009-05-05 Intel Corporation Heat dissipating device with preselected designed interface for thermal interface materials
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US7109520B2 (en) * 2003-10-10 2006-09-19 E. I. Du Pont De Nemours And Company Heat sinks
US20050228097A1 (en) * 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
JP2007005670A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd 電子部品パッケージおよび接合組立体
JP4634891B2 (ja) * 2005-08-18 2011-02-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物およびその硬化物
EP1839469A2 (en) * 2005-11-01 2007-10-03 Techfilm, LLC Thermal interface material with multiple size distribution thermally conductive fillers
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
US20070166875A1 (en) * 2005-12-29 2007-07-19 Intel Corporation Method of forming a microelectronic package and microelectronic package formed according to the method
US20070284730A1 (en) * 2006-06-12 2007-12-13 Wei Shi Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packages
WO2008001740A1 (en) * 2006-06-30 2008-01-03 Asahi Kasei Emd Corporation Conductive filler
US20080023665A1 (en) * 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
JP5093766B2 (ja) * 2007-01-31 2012-12-12 株式会社タムラ製作所 導電性ボール等搭載半導体パッケージ基板の製造方法
US8475709B2 (en) 2007-03-21 2013-07-02 Hoganas Ab (Publ) Powder metal polymer composites
US9279178B2 (en) 2007-04-27 2016-03-08 Honeywell International Inc. Manufacturing design and processing methods and apparatus for sputtering targets
US20080291634A1 (en) * 2007-05-22 2008-11-27 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
EP2188836A2 (en) * 2007-09-11 2010-05-26 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
US20090111925A1 (en) * 2007-10-31 2009-04-30 Burnham Kikue S Thermal interface materials, methods of production and uses thereof
US8124548B2 (en) * 2007-12-21 2012-02-28 Honeywell International Inc. Low weight and high durability soft body armor composite using silicone-based topical treatments
US20110038124A1 (en) * 2008-04-21 2011-02-17 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US20100112360A1 (en) * 2008-10-31 2010-05-06 Delano Andrew D Layered thermal interface systems methods of production and uses thereof
CN101807531A (zh) * 2010-03-30 2010-08-18 上海凯虹电子有限公司 一种超薄芯片的封装方法以及封装体
US9748043B2 (en) 2010-05-26 2017-08-29 Kemet Electronics Corporation Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
US8896986B2 (en) * 2010-05-26 2014-11-25 Kemet Electronics Corporation Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
CN101869982A (zh) * 2010-06-26 2010-10-27 上海交通大学 核壳型铝锡铋无铅焊料及其制备方法
CN102554486A (zh) * 2010-12-28 2012-07-11 上海杰远环保科技有限公司 一种高导热焊接材料及其制造方法
TWI477594B (zh) * 2011-09-22 2015-03-21 Univ Nat Yunlin Sci & Tech Composites with high thermal conductivity
US9228086B2 (en) * 2013-02-05 2016-01-05 Medarray, Inc. Siloxane based hollow fibers
CN103289650B (zh) * 2013-06-09 2014-01-08 北京依米康科技发展有限公司 一种低熔点金属导热膏
US9693481B2 (en) 2013-06-25 2017-06-27 Henkel IP & Holding GmbH Thermally conductive dielectric interface
CN103394820A (zh) * 2013-07-02 2013-11-20 天津市天联滨海复合材料有限公司 一种锡铋银系无铅焊料合金及其制备方法
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
EP3105300B1 (en) 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
WO2016004565A1 (en) 2014-07-07 2016-01-14 Honeywell International Inc. Thermal interface material with ion scavenger
HUE054751T2 (hu) * 2014-08-29 2021-09-28 Furukawa Electric Co Ltd Vezetõképes tapadó film
US9536851B2 (en) * 2014-09-05 2017-01-03 Infineon Technologies Ag Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
DE102015103118A1 (de) * 2014-10-06 2016-04-07 Siltectra Gmbh Splitting-Verfahren und Verwendung eines Materials in einem Splitting-Verfahren
JP6542891B2 (ja) 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
CN104577704A (zh) * 2015-01-29 2015-04-29 山东浪潮华光光电子股份有限公司 纤维网增强高纯铟复合焊料及其应用方法
CN104668808A (zh) * 2015-01-29 2015-06-03 山东浪潮华光光电子股份有限公司 一种高纯铟纤维复合增强焊料及其制备方法
CN104708224A (zh) * 2015-01-29 2015-06-17 山东浪潮华光光电子股份有限公司 短纤维丝增强高纯铟复合焊料及其制备方法
WO2017044712A1 (en) 2015-09-11 2017-03-16 Laird Technologies, Inc. Devices for absorbing energy from electronic components
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US20180323130A1 (en) * 2015-12-22 2018-11-08 Intel Corporation Adhesive polymer thermal interface material with sintered fillers for thermal conductivity in micro-electronic packaging
US10720261B2 (en) * 2016-02-02 2020-07-21 Carnegie Mellon University, A Pennsylvania Non-Profit Corporation Polymer composite with liquid phase metal inclusions
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
WO2017160349A1 (en) 2016-03-14 2017-09-21 Dow Corning Corporation Siloxane composition
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
CN106964919A (zh) * 2017-06-04 2017-07-21 曾双 一种无卤助焊剂制备方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
TW202543812A (zh) * 2019-10-25 2025-11-16 德商漢高股份有限及兩合公司 可三維圖案化之熱介面
TWI856288B (zh) * 2022-02-18 2024-09-21 華碩電腦股份有限公司 導熱膏的製造方法
JP2025039021A (ja) * 2023-09-08 2025-03-21 信越化学工業株式会社 熱伝導性シリコーン組成物

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065197A (en) * 1974-06-17 1977-12-27 Chomerics, Inc. Isolated paths connector
JPS5713427A (en) * 1980-06-26 1982-01-23 Canon Inc Image display device
US4842911A (en) * 1983-09-02 1989-06-27 The Bergquist Company Interfacing for heat sinks
JPS6293810A (ja) * 1985-10-19 1987-04-30 東芝シリコ−ン株式会社 感圧導電性シ−トの製造法
US4790968A (en) * 1985-10-19 1988-12-13 Toshiba Silicone Co., Ltd. Process for producing pressure-sensitive electroconductive sheet
US5109771A (en) * 1988-08-19 1992-05-05 Presstek, Inc. Spark-discharge lithography plates containing image-support pigments
US4931479B1 (en) * 1988-11-07 2000-10-10 Parker Intangibles Inc Foam in place conductive polyurethane foam
JPH04503825A (ja) * 1989-03-01 1992-07-09 レイケム・コーポレイション オルガノポリシロキサン組成物の硬化法およびそれからなる物品
JPH0484444A (ja) 1990-07-27 1992-03-17 Toshiba Chem Corp 導電性ペースト
EP0476224A1 (en) 1990-08-21 1992-03-25 Ricon Resins, Inc. Adhesive rubber compositions
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5227093A (en) * 1991-11-29 1993-07-13 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
US5380770A (en) * 1992-04-09 1995-01-10 General Electric Company Heat cured silicone rubber compositions containing a potassium aluminosilicate filler which provides resistance to hydrocarbon oils and adjustable shrinkage
DE4320527A1 (de) * 1992-06-22 1993-12-23 Whitaker Corp Elektrisch leitfähiges Gel
JPH06151480A (ja) * 1992-11-13 1994-05-31 Hitachi Chem Co Ltd 導電性樹脂ペーストおよび半導体装置
JPH07207160A (ja) * 1994-01-11 1995-08-08 Toshiba Silicone Co Ltd シリコーン組成物およびその製造方法
US5466302A (en) * 1994-05-09 1995-11-14 Regents Of The University Of California Solar cell array interconnects
US5879794A (en) * 1994-08-25 1999-03-09 W. L. Gore & Associates, Inc. Adhesive-filler film composite
US5665473A (en) * 1994-09-16 1997-09-09 Tokuyama Corporation Package for mounting a semiconductor device
US5492863A (en) * 1994-10-19 1996-02-20 Motorola, Inc. Method for forming conductive bumps on a semiconductor device
JP3384472B2 (ja) * 1994-12-26 2003-03-10 住友ベークライト株式会社 導電性樹脂ペースト
US5837119A (en) * 1995-03-31 1998-11-17 International Business Machines Corporation Methods of fabricating dendritic powder materials for high conductivity paste applications
US5859105A (en) 1997-02-11 1999-01-12 Johnson Matthey, Inc. Organosilicon-containing compositions capable of rapid curing at low temperature
JPH0912892A (ja) * 1995-07-04 1997-01-14 Toray Dow Corning Silicone Co Ltd 現場成形ガスケット用シリコーンゴム組成物
JP3403274B2 (ja) * 1995-08-31 2003-05-06 住友ベークライト株式会社 導電性樹脂ペースト
US5890915A (en) * 1996-05-17 1999-04-06 Minnesota Mining And Manufacturing Company Electrical and thermal conducting structure with resilient conducting paths
DE69734431T2 (de) * 1996-06-11 2006-05-24 Sumitomo Osaka Cement Co., Ltd. Transparante leitfolie, schwach reflektierende transparante leitfolie, und anzeige
US5695847A (en) * 1996-07-10 1997-12-09 Browne; James M. Thermally conductive joining film
DE19640192A1 (de) * 1996-09-30 1998-04-02 Bosch Gmbh Robert Verfahren zur Flip-Chip-Montage
KR20000064867A (ko) * 1997-02-07 2000-11-06 아이. 데이비드 크로산 전도성，수지-기재 조성물
US5852092A (en) * 1997-02-11 1998-12-22 Johnson Matthey, Inc. Organosilicon-containing compositions having enhanced adhesive properties
JPH1140224A (ja) 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート
JPH1135904A (ja) * 1997-07-17 1999-02-09 Alps Electric Co Ltd 導電性組成物およびそれを用いた電子機器
GB9816377D0 (en) 1998-07-29 1998-09-23 Dow Corning Sa Foam control agents
US6057402A (en) * 1998-08-12 2000-05-02 Johnson Matthey, Inc. Long and short-chain cycloaliphatic epoxy resins with cyanate ester
US6271299B1 (en) 1999-02-02 2001-08-07 Dow Corning Corporation Fire resistant sealant composition
US5989459A (en) 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials
US6238596B1 (en) * 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US6605238B2 (en) 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
JP4897149B2 (ja) * 2001-04-10 2012-03-14 ダウ コーニング コーポレーション シリコーン組成物およびそれから製造されるシリコーン接着剤
JP2003262519A (ja) * 2002-03-07 2003-09-19 Sakamoto Electric Mfg Co Ltd 水準器

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US6706219B2 (en) 2004-03-16
DE60216749D1 (de) 2007-01-25
DE60216749T2 (de) 2007-10-04
EP1386327B1 (en) 2006-12-13
KR20040030561A (ko) 2004-04-09
JP2004533705A (ja) 2004-11-04
CN1552078A (zh) 2004-12-01
CN101088697A (zh) 2007-12-19
CN100338690C (zh) 2007-09-19
EP1386327A4 (en) 2005-02-02
US20080044670A1 (en) 2008-02-21
US20010038093A1 (en) 2001-11-08
US20040185273A1 (en) 2004-09-23
TWI276116B (en) 2007-03-11
US7172711B2 (en) 2007-02-06

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