TWI319776B - Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate - Google Patents

Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate

Info

Publication number
TWI319776B
TWI319776B TW093121925A TW93121925A TWI319776B TW I319776 B TWI319776 B TW I319776B TW 093121925 A TW093121925 A TW 093121925A TW 93121925 A TW93121925 A TW 93121925A TW I319776 B TWI319776 B TW I319776B
Authority
TW
Taiwan
Prior art keywords
circuit substrate
electronic device
alloy material
silver alloy
manufacturing
Prior art date
Application number
TW093121925A
Other languages
Chinese (zh)
Other versions
TW200505310A (en
Inventor
Yuhichi Saitoh
Akiyoshi Fujii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004185228A external-priority patent/JP4421394B2/en
Priority claimed from JP2004185264A external-priority patent/JP4498835B2/en
Application filed filed Critical
Publication of TW200505310A publication Critical patent/TW200505310A/en
Application granted granted Critical
Publication of TWI319776B publication Critical patent/TWI319776B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW093121925A 2003-07-23 2004-07-22 Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate TWI319776B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003200806 2003-07-23
JP2003200815 2003-07-23
JP2004185228A JP4421394B2 (en) 2003-07-23 2004-06-23 Silver alloy material, circuit board, electronic device, and method of manufacturing circuit board
JP2004185264A JP4498835B2 (en) 2003-07-23 2004-06-23 Circuit board, manufacturing method thereof, and electronic device

Publications (2)

Publication Number Publication Date
TW200505310A TW200505310A (en) 2005-02-01
TWI319776B true TWI319776B (en) 2010-01-21

Family

ID=34084641

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121925A TWI319776B (en) 2003-07-23 2004-07-22 Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate

Country Status (4)

Country Link
US (1) US20050019203A1 (en)
KR (2) KR100677805B1 (en)
CN (1) CN100339914C (en)
TW (1) TWI319776B (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8553517B2 (en) 2002-10-14 2013-10-08 Samsung Electronics Co., Ltd. Magnetic medium using spin-polarized electrons and apparatus and method of recording data on the magnetic medium
KR20070019458A (en) * 2005-08-12 2007-02-15 삼성전자주식회사 Interconnection metal, method for fabricating the same, thin film transistor plate and method for fabricating the same
US7872022B2 (en) * 2006-04-03 2011-01-18 Hoffmann-La Roche Inc. Serotonin transporter (SERT) inhibitors for the treatment of depression and anxiety
JP5257965B2 (en) * 2006-04-25 2013-08-07 独立行政法人物質・材料研究機構 Method for producing alloy fine particle colloid
JP2011514432A (en) * 2007-09-07 2011-05-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Multi-element alloy powder containing silver and at least two non-silver containing elements
JP4636128B2 (en) * 2008-06-24 2011-02-23 ソニー株式会社 Input device and display device with input function
JP2010225572A (en) * 2008-11-10 2010-10-07 Kobe Steel Ltd Reflective anode and wiring film for organic el display device
EP2325848B1 (en) 2009-11-11 2017-07-19 Samsung Electronics Co., Ltd. Conductive paste and solar cell
KR101741683B1 (en) 2010-08-05 2017-05-31 삼성전자주식회사 Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8987586B2 (en) 2010-08-13 2015-03-24 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8668847B2 (en) 2010-08-13 2014-03-11 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8974703B2 (en) 2010-10-27 2015-03-10 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the same
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US9105370B2 (en) 2011-01-12 2015-08-11 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
US8940195B2 (en) 2011-01-13 2015-01-27 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
SE536911C2 (en) * 2011-02-09 2014-10-28 Impact Coatings Ab Material for providing an electrically conductive contact layer, a contact element with such layer, method for providing the contact element, and use of the material
EP2800145B1 (en) * 2013-05-03 2018-11-21 Saint-Gobain Glass France Back contact substrate for a photovoltaic cell or module
EP2800146A1 (en) * 2013-05-03 2014-11-05 Saint-Gobain Glass France Back contact substrate for a photovoltaic cell or module
CN104419844A (en) * 2013-08-23 2015-03-18 光洋应用材料科技股份有限公司 Silver alloy material
US9773989B2 (en) * 2013-12-03 2017-09-26 National University Corporation Yamagata University Method for producing metal thin film and conductive structure
JP5850077B2 (en) * 2014-04-09 2016-02-03 三菱マテリアル株式会社 Ag alloy film and sputtering target for forming Ag alloy film
EP3168325B1 (en) 2015-11-10 2022-01-05 Materion Advanced Materials Germany GmbH Silver alloy based sputter target
US10504999B2 (en) * 2018-03-15 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Forming semiconductor structures with semimetal features
JP7062528B2 (en) 2018-06-14 2022-05-06 株式会社ジャパンディスプレイ Semiconductor device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1847941A (en) * 1926-01-22 1932-03-01 Oneida Community Ltd Metal alloys and process of producing the same
JPH04311543A (en) * 1991-04-09 1992-11-04 Chugai Electric Ind Co Ltd Ag-sno-ino electrical contact material and production thereof
JP2506281B2 (en) * 1991-08-05 1996-06-12 ニッコー株式会社 Low temperature sintering multilayer substrate
AUPM365594A0 (en) * 1994-02-02 1994-02-24 Australian National University, The Method and apparatus for coating a substrate
JPH0856075A (en) * 1994-08-17 1996-02-27 Matsushita Electric Ind Co Ltd Checking method for junction state of electronic part with solder bump and substrate
JPH10282907A (en) * 1997-04-10 1998-10-23 Toppan Printing Co Ltd Electrode substrate
JPH1138428A (en) * 1997-07-22 1999-02-12 Toppan Printing Co Ltd Electrode substrate and its production
JPH1144887A (en) * 1997-07-28 1999-02-16 Toppan Printing Co Ltd Reflection electrode substrate for display device
JP4003273B2 (en) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 Pattern forming method and substrate manufacturing apparatus
JPH11243273A (en) * 1998-02-26 1999-09-07 Hitachi Ltd Forming method of metal wiring
JP2001035814A (en) * 1999-07-22 2001-02-09 Vacuum Metallurgical Co Ltd Method of forming silver wiring pattern
JP2001237279A (en) * 2000-02-23 2001-08-31 Hitachi Ltd Semiconductor device and electronic apparatus comprising it
JP2002111001A (en) * 2000-09-29 2002-04-12 Toshiba Corp Circuit board and its manufacturing method
JP4646415B2 (en) * 2001-02-08 2011-03-09 株式会社倉元製作所 Ag-based thin film
DE60230728D1 (en) * 2001-03-16 2009-02-26 Ishifuku Metal Ind Optical disc medium, reflective STN liquid crystal display and organic EL display
JP3900248B2 (en) * 2001-03-30 2007-04-04 ハリマ化成株式会社 Multilayer wiring board and method for forming the same
KR100750922B1 (en) * 2001-04-13 2007-08-22 삼성전자주식회사 A wiring and a method for manufacturing the wiring, and a thin film transistor array panel including the wiring and method for manufacturing the same
JP2003080694A (en) * 2001-06-26 2003-03-19 Seiko Epson Corp Method for forming membrane pattern, apparatus for forming membrane pattern, electrically conductive membrane wiring, electrooptic apparatus, electronic instrument and non-contact type card medium
KR100825102B1 (en) * 2002-01-08 2008-04-25 삼성전자주식회사 A thin film transistor substrate and a method of manufacturing the same

Also Published As

Publication number Publication date
KR20060041198A (en) 2006-05-11
CN1577637A (en) 2005-02-09
KR100960181B1 (en) 2010-05-26
TW200505310A (en) 2005-02-01
US20050019203A1 (en) 2005-01-27
KR100677805B1 (en) 2007-02-02
CN100339914C (en) 2007-09-26
KR20050012154A (en) 2005-01-31

Similar Documents

Publication Publication Date Title
TWI319776B (en) Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
EP1650808A4 (en) Electronic element, integrated circuit and process for fabricating the same
TWI351097B (en) Circuit module and manufacturing method thereof
EP1544905A4 (en) Electric circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor
EP1620894A4 (en) Substrate, manufacturing method therefor, and semiconductor device
AU2003266560A1 (en) Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device
EP1363325A4 (en) Member for electronic circuit, method for manufacturing the member, and electronic part
AU2003219354A1 (en) Carrier, method of manufacturing a carrier and an electronic device
IL172852A0 (en) Substrate processing method and substrate processing device
SG111122A1 (en) Substrate holder and device manufacturing method
EP1860691A4 (en) Electronic circuit and method for manufacturing same
GB2401479B (en) Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method
AU2003296081A1 (en) Pattern forming method, electronic device manufacturing method, electronic device, and photomask
EP1594146A4 (en) Electronic parts and method for manufacture thereof
EP1619718A4 (en) Electronic device and its manufacturing method
EP1675446A4 (en) Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same
EP1581032A4 (en) Electronic part and manufacturing method thereof
AU2003207156A1 (en) Organic electronic device and its manufacturing method
AU2003277560A1 (en) Electronic device and its manufacturing method
IL181708A0 (en) Integrated circuit and method for manufacturing
PT1559068E (en) Electronic module comprising an element exposed on one surface and method for making same
AU2003214524A1 (en) Method of manufacturing an electronic device
SG111128A1 (en) Integrated circuit package and manufacturing method therefor
SG113002A1 (en) Semiconductor device, electronic circuit array substrate provided with the same and method of manufacturing the electronic circuit array substrate
AU2003211879A1 (en) Electronic circuit device and porduction method therefor

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees