AU2003289360A1 - Lead-free glass, composition for electronic circuit substrate and electronic circuit substrate - Google Patents

Lead-free glass, composition for electronic circuit substrate and electronic circuit substrate

Info

Publication number
AU2003289360A1
AU2003289360A1 AU2003289360A AU2003289360A AU2003289360A1 AU 2003289360 A1 AU2003289360 A1 AU 2003289360A1 AU 2003289360 A AU2003289360 A AU 2003289360A AU 2003289360 A AU2003289360 A AU 2003289360A AU 2003289360 A1 AU2003289360 A1 AU 2003289360A1
Authority
AU
Australia
Prior art keywords
electronic circuit
circuit substrate
lead
composition
free glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003289360A
Inventor
Hitoshi Onoda
Hiroshi Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of AU2003289360A1 publication Critical patent/AU2003289360A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/20—Glass-ceramics matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Oxide Ceramics (AREA)
AU2003289360A 2003-02-14 2003-12-16 Lead-free glass, composition for electronic circuit substrate and electronic circuit substrate Abandoned AU2003289360A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003036639A JP2004244271A (en) 2003-02-14 2003-02-14 Lead-free glass, composition for electronic circuit board, and electronic circuit board
JP2003-36639 2003-02-14
PCT/JP2003/016105 WO2004071982A1 (en) 2003-02-14 2003-12-16 Lead-free glass, composition for electronic circuit substrate and electronic circuit substrate

Publications (1)

Publication Number Publication Date
AU2003289360A1 true AU2003289360A1 (en) 2004-09-06

Family

ID=32866336

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003289360A Abandoned AU2003289360A1 (en) 2003-02-14 2003-12-16 Lead-free glass, composition for electronic circuit substrate and electronic circuit substrate

Country Status (3)

Country Link
JP (1) JP2004244271A (en)
AU (1) AU2003289360A1 (en)
WO (1) WO2004071982A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4748701B2 (en) * 2003-04-28 2011-08-17 日本特殊陶業株式会社 Low-temperature fired porcelain composition and wiring board using the same
JP6691315B2 (en) * 2014-04-03 2020-04-28 日本電気硝子株式会社 Glass
WO2018051793A1 (en) * 2016-09-13 2018-03-22 旭硝子株式会社 Glass substrate for high frequency device and circuit board for high frequency device
CN111886209A (en) 2018-03-20 2020-11-03 Ａｇｃ株式会社 Glass substrate, liquid crystal antenna, and high-frequency device
DE102018112069A1 (en) * 2018-05-18 2019-11-21 Schott Ag Use of a flat glass in electronic components
WO2022054694A1 (en) * 2020-09-08 2022-03-17 日本電気硝子株式会社 Glass, and method for measuring dielectric properties using same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451345A (en) * 1987-08-18 1989-02-27 Nippon Sheet Glass Co Ltd Glass fiber composition having low dielectric constant
JP3240271B2 (en) * 1996-02-29 2001-12-17 ティーディーケイ株式会社 Ceramic substrate
JP2001348247A (en) * 2000-05-31 2001-12-18 Asahi Glass Co Ltd Alkaline-free glass
JP2002220256A (en) * 2001-01-22 2002-08-09 Asahi Glass Co Ltd Lead-free glass, electronic circuit board composition, and the electronic circuit board

Also Published As

Publication number Publication date
JP2004244271A (en) 2004-09-02
WO2004071982A1 (en) 2004-08-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase