ATE275812T1 - Strahldruckvorrichtung und verfahren zur herstellung von leiterplatten - Google Patents
Strahldruckvorrichtung und verfahren zur herstellung von leiterplattenInfo
- Publication number
- ATE275812T1 ATE275812T1 AT01947758T AT01947758T ATE275812T1 AT E275812 T1 ATE275812 T1 AT E275812T1 AT 01947758 T AT01947758 T AT 01947758T AT 01947758 T AT01947758 T AT 01947758T AT E275812 T1 ATE275812 T1 AT E275812T1
- Authority
- AT
- Austria
- Prior art keywords
- pcb
- printing
- jet
- dispensing
- utilized
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ink Jet (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/606,288 US6754551B1 (en) | 2000-06-29 | 2000-06-29 | Jet print apparatus and method for printed circuit board manufacturing |
PCT/IL2001/000596 WO2002001929A2 (en) | 2000-06-29 | 2001-06-28 | Jet print apparatus and method for printed circuit board manufacturing |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE275812T1 true ATE275812T1 (de) | 2004-09-15 |
Family
ID=24427356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01947758T ATE275812T1 (de) | 2000-06-29 | 2001-06-28 | Strahldruckvorrichtung und verfahren zur herstellung von leiterplatten |
Country Status (9)
Country | Link |
---|---|
US (1) | US6754551B1 (de) |
EP (1) | EP1300059B1 (de) |
JP (1) | JP2004509780A (de) |
AT (1) | ATE275812T1 (de) |
AU (1) | AU2001269397A1 (de) |
DE (1) | DE60105431T2 (de) |
ES (1) | ES2228902T3 (de) |
IL (1) | IL153581A0 (de) |
WO (1) | WO2002001929A2 (de) |
Families Citing this family (98)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6754551B1 (en) * | 2000-06-29 | 2004-06-22 | Printar Ltd. | Jet print apparatus and method for printed circuit board manufacturing |
US8178188B2 (en) * | 2001-04-20 | 2012-05-15 | Panasonic Corporation | Base layer for manufacturing an electronic component by an etching process |
US7451699B2 (en) | 2002-03-04 | 2008-11-18 | Printar Ltd. | Digital application of protective soldermask to printed circuit boards |
CN1294167C (zh) | 2002-03-28 | 2007-01-10 | 亨斯迈先进材料(瑞士)有限公司 | 可聚合的组合物 |
ATE539888T1 (de) * | 2002-11-27 | 2012-01-15 | Ulvac Inc | Industrielles mikroauftragesystem mit auftrageverteilung zur verminderung der auswirkung von tröpfchenausrichtungstoleranzen und -fehlern sowie tröpfchenvolumentoleranzen und fehlern |
JP4198514B2 (ja) * | 2003-04-23 | 2008-12-17 | 新光電気工業株式会社 | 無電解めっき方法 |
US20050042852A1 (en) * | 2003-08-19 | 2005-02-24 | Unitech Printed Circuit Board Corp. | Method for applying solder mask onto pad spacings of a printed circuit board |
KR100577406B1 (ko) * | 2003-09-17 | 2006-05-10 | 박재상 | Pcb 방식을 이용한 히터 제조방법 및 히터 |
JP4875834B2 (ja) * | 2003-12-24 | 2012-02-15 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | マスク |
US20050175941A1 (en) * | 2004-02-06 | 2005-08-11 | Rohm And Hass Electronic Materials, L.L.C. | Imaging composition and method |
US7977026B2 (en) * | 2004-02-06 | 2011-07-12 | Rohm And Haas Electronic Materials Llc | Imaging methods |
KR101125678B1 (ko) * | 2004-02-06 | 2012-03-28 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 개선된 이미지화 조성물 및 방법 |
US7270932B2 (en) * | 2004-02-06 | 2007-09-18 | Rohm And Haas Electronic Materials Llc | Imaging composition and method |
US7144676B2 (en) * | 2004-02-06 | 2006-12-05 | Rohm And Haas Electronic Materials Llc | Imaging compositions and methods |
US7185799B2 (en) * | 2004-03-29 | 2007-03-06 | Intel Corporation | Method of creating solder bar connections on electronic packages |
US20050270755A1 (en) * | 2004-06-04 | 2005-12-08 | Inventec Corporation | Method for preventing pins of semiconductor package from short circuit during soldering |
CA2588566A1 (en) * | 2004-12-17 | 2006-06-22 | Bionovo, Inc. | Estrogenic extracts of morus alba and uses thereof |
US20060176350A1 (en) * | 2005-01-14 | 2006-08-10 | Howarth James J | Replacement of passive electrical components |
US20060275590A1 (en) * | 2005-06-03 | 2006-12-07 | Lorenz Daniel W | Method of printing a durable UV cured ink design on a substrate |
US7611216B2 (en) * | 2005-07-22 | 2009-11-03 | Pitney Bowes Inc. | Method and system for correcting print image distortion due to irregular print image space topography |
US20070068898A1 (en) * | 2005-09-29 | 2007-03-29 | Lorenz Glen D | Multi-level etching method and product |
US20070117042A1 (en) * | 2005-11-23 | 2007-05-24 | Rohm And Haas Electronic Materials Llc | Imaging methods |
US20070119911A1 (en) * | 2005-11-28 | 2007-05-31 | Chan Su L | Method of forming a composite standoff on a circuit board |
TWI287828B (en) * | 2005-12-30 | 2007-10-01 | Ind Tech Res Inst | Method for printing a pattern and data processing method thereof |
US7402341B2 (en) * | 2006-05-23 | 2008-07-22 | Printar Ltd. | Methods and compositions for printable surface pre-treatment |
WO2008102266A2 (en) * | 2007-02-23 | 2008-08-28 | Infermata Systems Ltd. | Method and apparatus for rapid fabrication of functional printed circuit board |
US20090002422A1 (en) * | 2007-06-29 | 2009-01-01 | Stephenson Iii Stanley W | Structure for monolithic thermal inkjet array |
US8534787B2 (en) * | 2007-10-11 | 2013-09-17 | Camtek Ltd. | Method and system for printing on a printed circuit board |
US20090095176A1 (en) * | 2007-10-11 | 2009-04-16 | Printar Ltd. | Method and apparatus for PCB finishing processes |
US20090199141A1 (en) * | 2008-02-06 | 2009-08-06 | Anritsu Company | Systems and methods for prototyping and testing electrical circuits in near real-time |
EP2105247B1 (de) * | 2008-03-25 | 2017-11-29 | Mycronic AB | Positionierungssystem |
US8062693B2 (en) * | 2008-09-22 | 2011-11-22 | Sunpower Corporation | Generation of contact masks for inkjet printing on solar cell substrates |
KR101057462B1 (ko) | 2008-10-23 | 2011-08-17 | 에센하이텍(주) | 자동 인쇄회로기판 생산시스템 |
US20100156998A1 (en) * | 2008-12-19 | 2010-06-24 | Nobuo Matsumoto | Method and apparatus for printing |
US8229719B2 (en) * | 2009-03-26 | 2012-07-24 | Seiko Epson Corporation | Finite element algorithm for solving a fourth order nonlinear lubrication equation for droplet evaporation |
US8014986B2 (en) * | 2009-06-02 | 2011-09-06 | Seiko Epson Corporation | Finite difference algorithm for solving lubrication equations with solute diffusion |
WO2011004365A1 (en) * | 2009-07-06 | 2011-01-13 | Camtek Ltd. | A system and a method for solder mask inspection |
US9661755B2 (en) * | 2009-07-06 | 2017-05-23 | Camtek Ltd. | System and a method for solder mask inspection |
US8198547B2 (en) | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed pass-through components for printed circuit boards |
US8735734B2 (en) * | 2009-07-23 | 2014-05-27 | Lexmark International, Inc. | Z-directed delay line components for printed circuit boards |
JP5018840B2 (ja) * | 2009-07-27 | 2012-09-05 | 富士通株式会社 | クーポン基板 |
JP5535561B2 (ja) * | 2009-09-15 | 2014-07-02 | 日本発條株式会社 | 接着剤塗布装置 |
US20110080476A1 (en) * | 2009-10-02 | 2011-04-07 | Lasx Industries, Inc. | High Performance Vision System for Part Registration |
US8285530B2 (en) * | 2009-10-15 | 2012-10-09 | Seiko Epson Corporation | Upwind algorithm for solving lubrication equations |
US9245765B2 (en) | 2009-10-16 | 2016-01-26 | Empire Technology Development Llc | Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer |
US8255194B2 (en) * | 2009-12-02 | 2012-08-28 | Seiko Epson Corporation | Judiciously retreated finite element method for solving lubrication equation |
US8285526B2 (en) * | 2009-12-02 | 2012-10-09 | Seiko Epson Corporation | Finite difference algorithm for solving slender droplet evaporation with moving contact lines |
FR2953617B1 (fr) * | 2009-12-03 | 2012-01-20 | Herve Mongin | Machine de personnalisation electrique et graphique d'objets electroniques portatifs |
US20110196657A1 (en) * | 2010-02-11 | 2011-08-11 | Jie Zhang | Solving a Solute Lubrication Equation for 3D Droplet Evaporation on a Complicated OLED Bank Structure |
US8271238B2 (en) * | 2010-03-23 | 2012-09-18 | Seiko Epson Corporation | Finite difference scheme for solving droplet evaporation lubrication equations on a time-dependent varying domain |
US8678534B2 (en) * | 2010-12-22 | 2014-03-25 | Camtek Ltd. | Multiple iteration substrate printing |
US20120171356A1 (en) * | 2010-12-27 | 2012-07-05 | Camtek Ltd. | System for digital deposition of pad / interconnects coatings |
US8677929B2 (en) * | 2010-12-29 | 2014-03-25 | Intevac, Inc. | Method and apparatus for masking solar cell substrates for deposition |
US20120194622A1 (en) * | 2011-01-31 | 2012-08-02 | Camtek Ltd. | Ultra violet light emitting diode curing of uv reactive ink |
US20120196039A1 (en) * | 2011-01-31 | 2012-08-02 | Camtek Ltd. | Method for enhancing metallization in selective deposition processes |
CN102991164B (zh) * | 2011-07-28 | 2016-12-21 | 卡姆特有限公司 | 用于焊接掩模检验的系统和方法 |
EP2556962A1 (de) * | 2011-08-12 | 2013-02-13 | hülsta-werke Hüls GmbH & Co. KG | Verfahren zum Digitaldruck eines Druckbildes auf ein flächiges Bauteil |
US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US8658245B2 (en) | 2011-08-31 | 2014-02-25 | Lexmark International, Inc. | Spin coat process for manufacturing a Z-directed component for a printed circuit board |
US8752280B2 (en) | 2011-09-30 | 2014-06-17 | Lexmark International, Inc. | Extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8790520B2 (en) * | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US9078374B2 (en) | 2011-08-31 | 2015-07-07 | Lexmark International, Inc. | Screening process for manufacturing a Z-directed component for a printed circuit board |
US8943684B2 (en) * | 2011-08-31 | 2015-02-03 | Lexmark International, Inc. | Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board |
US20140010952A1 (en) * | 2012-01-02 | 2014-01-09 | Noam ROSENSTEIN | Pcb repair of defective interconnects by deposition of conductive ink |
US9060437B2 (en) | 2012-02-01 | 2015-06-16 | Illinois Tool Works Inc. | System and method for operating a stencil printer |
US8830692B2 (en) | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
CN102682166B (zh) * | 2012-05-09 | 2014-01-15 | 上海望友信息科技有限公司 | Smt设备快速制程系统及方法 |
EP2852498A1 (de) * | 2012-05-23 | 2015-04-01 | OCE-Technologies B.V. | Druckverfahren zum drucken eines funktionalen musters und druckvorrichtung |
US8995022B1 (en) | 2013-12-12 | 2015-03-31 | Kateeva, Inc. | Ink-based layer fabrication using halftoning to control thickness |
KR20190123811A (ko) | 2012-12-27 | 2019-11-01 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법 |
US11141752B2 (en) | 2012-12-27 | 2021-10-12 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9352561B2 (en) | 2012-12-27 | 2016-05-31 | Kateeva, Inc. | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
US9700908B2 (en) | 2012-12-27 | 2017-07-11 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9832428B2 (en) | 2012-12-27 | 2017-11-28 | Kateeva, Inc. | Fast measurement of droplet parameters in industrial printing system |
ES2768283T3 (es) * | 2013-10-09 | 2020-06-22 | Hinterkopf Gmbh | Equipo de impresión, máquina de impresión y procedimiento para el funcionamiento de un equipo de impresión |
GB2538522B (en) | 2015-05-19 | 2019-03-06 | Dst Innovations Ltd | Electronic circuit and component construction |
CN106696475B (zh) * | 2015-11-13 | 2019-06-18 | 富泰华工业(深圳)有限公司 | 打印机及利用打印机打印电路板的方法 |
US10980131B2 (en) * | 2017-01-26 | 2021-04-13 | Nano Dimension Technologies, Ltd. | Chip embedded printed circuit boards and methods of fabrication |
KR102261254B1 (ko) * | 2017-04-14 | 2021-06-04 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 유체 다이 |
WO2019172912A1 (en) * | 2018-03-08 | 2019-09-12 | Hewlett-Packard Development Company, L.P. | Printing utilizing quality data for printed target areas |
CN108633184A (zh) * | 2018-07-16 | 2018-10-09 | 湖北荣宝电子科技有限公司 | 一种用于印刷电路板塞孔的垫板装置 |
CN109109471A (zh) * | 2018-09-21 | 2019-01-01 | 深圳市微印科技有限公司 | 一种双工位喷印设备 |
CN109068563B (zh) * | 2018-09-21 | 2024-03-26 | 北京梦之墨科技有限公司 | 一种液态金属打印机 |
US10939600B2 (en) | 2018-11-28 | 2021-03-02 | International Business Machines Corporation | Flux residue detection |
KR102428051B1 (ko) | 2019-02-14 | 2022-08-01 | 오르보테크 엘티디. | 고밀도 도체를 갖는 pcb 제품을 제조하기 위한 방법 및 장치 |
US11682600B2 (en) | 2019-08-07 | 2023-06-20 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Protection layer for panel handling systems |
US11452199B2 (en) | 2019-09-12 | 2022-09-20 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic module with single or multiple components partially surrounded by a thermal decoupling gap |
US20230199970A1 (en) * | 2020-04-24 | 2023-06-22 | Fuji Corporation | Circuit forming method and circuit forming device |
TWI819237B (zh) * | 2020-09-08 | 2023-10-21 | 健鼎科技股份有限公司 | 印刷電路板製程方法 |
US11571896B2 (en) | 2021-02-01 | 2023-02-07 | Funai Electric Co., Ltd. | Customization of multichannel printhead |
DE102021116019A1 (de) * | 2021-06-21 | 2022-12-22 | Notion Systems GmbH | Verfahren zum Bedrucken eines Substrats |
CN115257192B (zh) * | 2021-06-25 | 2023-11-17 | 深圳达捷科技有限公司 | 一种柔性电路板用喷印平台 |
CN113993295B (zh) * | 2021-10-13 | 2023-04-25 | 苏州康尼格电子科技股份有限公司 | 一种pcba板封装设备 |
CN114959602B (zh) * | 2022-06-13 | 2023-08-15 | 江西福昌发电路科技有限公司 | 一种基于金面镀铜表面混合的阶梯线路板表面镀膜装置及工艺 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4824010A (en) * | 1980-12-26 | 1989-04-25 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for soldering printed circuit boards |
US4503606A (en) * | 1980-12-26 | 1985-03-12 | Citizen Watch Company Limited | Automatic assembling machine |
US4668533A (en) | 1985-05-10 | 1987-05-26 | E. I. Du Pont De Nemours And Company | Ink jet printing of printed circuit boards |
US4767489A (en) | 1987-03-25 | 1988-08-30 | Pc Proto, Inc. | Computer aided printer-etcher |
US4748453A (en) | 1987-07-21 | 1988-05-31 | Xerox Corporation | Spot deposition for liquid ink printing |
US4963882B1 (en) | 1988-12-27 | 1996-10-29 | Hewlett Packard Co | Printing of pixel locations by an ink jet printer using multiple nozzles for each pixel or pixel row |
US4999646A (en) | 1989-11-29 | 1991-03-12 | Hewlett-Packard Company | Method for enhancing the uniformity and consistency of dot formation produced by color ink jet printing |
US5239312A (en) | 1990-02-02 | 1993-08-24 | Dataproducts Corporation | Interlaced ink jet printing |
JP3293638B2 (ja) * | 1991-03-15 | 2002-06-17 | 日本トムソン株式会社 | Xy駆動装置 |
US5270368A (en) | 1992-07-15 | 1993-12-14 | Videojet Systems International, Inc. | Etch-resistant jet ink and process |
US5356658A (en) * | 1993-07-19 | 1994-10-18 | Motorola, Inc. | Flexible high speed liquid dispenser |
JPH07212005A (ja) * | 1994-01-21 | 1995-08-11 | Pioneer Electron Corp | Pcb作成装置 |
US5790150A (en) | 1994-02-17 | 1998-08-04 | Colorspan Corporation | Method for controlling an ink jet printer in a multipass printing mode |
JPH07263856A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半田付け装置 |
US5640183A (en) * | 1994-07-20 | 1997-06-17 | Hewlett-Packard Company | Redundant nozzle dot matrix printheads and method of use |
US5587730A (en) | 1994-09-30 | 1996-12-24 | Xerox Corporation | Redundant full width array thermal ink jet printing for improved reliability |
JP2865578B2 (ja) | 1994-10-25 | 1999-03-08 | 富士通株式会社 | レジストパターンの作成方法、その方法により得られるプリント配線板及びその作成装置 |
US6030072A (en) * | 1995-04-12 | 2000-02-29 | Eastman Kodak Company | Fault tolerance in high volume printing presses |
US5793392A (en) | 1995-06-13 | 1998-08-11 | Tschida; Mark J. | Printing apparatus and method |
JP3756580B2 (ja) * | 1995-11-07 | 2006-03-15 | セイコープレシジョン株式会社 | 多層基板の製造方法及びその製造装置 |
JP3359211B2 (ja) * | 1995-12-28 | 2002-12-24 | キヤノン株式会社 | 記録方法および記録装置 |
JP3037158B2 (ja) * | 1996-10-07 | 2000-04-24 | ユーエイチティー株式会社 | プリント配線体の製造方法並びにその製造装置 |
JPH1148464A (ja) * | 1997-08-01 | 1999-02-23 | Canon Inc | テストプリント方法およびインクジェット記録装置 |
US5984455A (en) | 1997-11-04 | 1999-11-16 | Lexmark International, Inc. | Ink jet printing apparatus having primary and secondary nozzles |
US6076910A (en) * | 1997-11-04 | 2000-06-20 | Lexmark International, Inc. | Ink jet printing apparatus having redundant nozzles |
JP4741045B2 (ja) * | 1998-03-25 | 2011-08-03 | セイコーエプソン株式会社 | 電気回路、その製造方法および電気回路製造装置 |
DE19842379A1 (de) | 1998-09-16 | 2000-05-11 | Tron Elektronik Gmbh F | Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen |
US6439681B1 (en) * | 2000-01-27 | 2002-08-27 | Hewlett-Packard Company | Method and apparatus for improving print quality on failure of a thermal ink jet nozzle |
US6754551B1 (en) * | 2000-06-29 | 2004-06-22 | Printar Ltd. | Jet print apparatus and method for printed circuit board manufacturing |
-
2000
- 2000-06-29 US US09/606,288 patent/US6754551B1/en not_active Expired - Lifetime
-
2001
- 2001-06-28 AU AU2001269397A patent/AU2001269397A1/en not_active Abandoned
- 2001-06-28 WO PCT/IL2001/000596 patent/WO2002001929A2/en active IP Right Grant
- 2001-06-28 ES ES01947758T patent/ES2228902T3/es not_active Expired - Lifetime
- 2001-06-28 AT AT01947758T patent/ATE275812T1/de not_active IP Right Cessation
- 2001-06-28 JP JP2002505567A patent/JP2004509780A/ja active Pending
- 2001-06-28 DE DE60105431T patent/DE60105431T2/de not_active Expired - Fee Related
- 2001-06-28 EP EP01947758A patent/EP1300059B1/de not_active Expired - Lifetime
- 2001-06-28 IL IL15358101A patent/IL153581A0/xx active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1300059A2 (de) | 2003-04-09 |
WO2002001929A3 (en) | 2002-04-25 |
WO2002001929A2 (en) | 2002-01-03 |
EP1300059B1 (de) | 2004-09-08 |
JP2004509780A (ja) | 2004-04-02 |
IL153581A0 (en) | 2003-07-06 |
US6754551B1 (en) | 2004-06-22 |
DE60105431T2 (de) | 2005-09-22 |
AU2001269397A1 (en) | 2002-01-08 |
ES2228902T3 (es) | 2005-04-16 |
DE60105431D1 (de) | 2004-10-14 |
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