ATE264886T1 - Epoxyharzzusammensetzung sowie elektronisches teil - Google Patents
Epoxyharzzusammensetzung sowie elektronisches teilInfo
- Publication number
- ATE264886T1 ATE264886T1 AT01900660T AT01900660T ATE264886T1 AT E264886 T1 ATE264886 T1 AT E264886T1 AT 01900660 T AT01900660 T AT 01900660T AT 01900660 T AT01900660 T AT 01900660T AT E264886 T1 ATE264886 T1 AT E264886T1
- Authority
- AT
- Austria
- Prior art keywords
- epoxy resin
- electronic part
- resin composition
- amount
- free
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
- C08L85/02—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers containing phosphorus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
- Fireproofing Substances (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000006658 | 2000-01-14 | ||
JP2000310562A JP3489025B2 (ja) | 2000-01-14 | 2000-10-11 | エポキシ樹脂組成物及びそれを用いた電子部品 |
PCT/JP2001/000083 WO2001051562A1 (en) | 2000-01-14 | 2001-01-11 | Epoxy resin composition and electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE264886T1 true ATE264886T1 (de) | 2004-05-15 |
Family
ID=26583560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01900660T ATE264886T1 (de) | 2000-01-14 | 2001-01-11 | Epoxyharzzusammensetzung sowie elektronisches teil |
Country Status (9)
Country | Link |
---|---|
US (1) | US6905768B2 (de) |
EP (1) | EP1270668B1 (de) |
JP (1) | JP3489025B2 (de) |
KR (1) | KR100675267B1 (de) |
AT (1) | ATE264886T1 (de) |
DE (1) | DE60102912T2 (de) |
ES (1) | ES2219496T3 (de) |
TW (1) | TW553971B (de) |
WO (1) | WO2001051562A1 (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001316565A (ja) * | 2000-05-10 | 2001-11-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP4765150B2 (ja) * | 2000-05-29 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP3889206B2 (ja) * | 2000-07-24 | 2007-03-07 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
JP4765151B2 (ja) * | 2000-08-23 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
EP1287071A1 (de) * | 2001-04-23 | 2003-03-05 | Sumitomo Bakelite Co., Ltd. | Epoxydharzzusammensetzung und halbleiteranordnung |
JP4880841B2 (ja) * | 2001-09-19 | 2012-02-22 | 太陽ホールディングス株式会社 | 粗化面形成用樹脂組成物を用いた多層プリント配線板 |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
KR100584069B1 (ko) * | 2002-10-10 | 2006-05-29 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 밀봉용 난연성 에폭시 수지 조성물 및 반도체 장치 |
FR2848016B1 (fr) * | 2002-11-29 | 2005-01-28 | Nexans | Cable ignifuge |
AU2003252667A1 (en) * | 2003-07-22 | 2005-02-04 | Matsushita Electric Works, Ltd. | Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same |
JP2005120228A (ja) * | 2003-10-16 | 2005-05-12 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
KR100553758B1 (ko) * | 2004-02-02 | 2006-02-20 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 |
KR100577463B1 (ko) * | 2004-09-24 | 2006-05-04 | 김의연 | 내산성 및 난연성 에폭시 수지 |
US7741388B2 (en) * | 2004-11-02 | 2010-06-22 | Sumitomo Bakelite Company, Ltd. | Epoxy resin composition and semiconductor device |
JP5103607B2 (ja) * | 2005-11-04 | 2012-12-19 | 国立大学法人東京農工大学 | 剥離層除去方法 |
JP2007234800A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
JP5194423B2 (ja) * | 2006-10-17 | 2013-05-08 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグ、積層板、及び半導体装置 |
WO2008059856A1 (en) | 2006-11-15 | 2008-05-22 | Hitachi Chemical Co., Ltd. | Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
JP5138267B2 (ja) * | 2007-04-18 | 2013-02-06 | 日立化成工業株式会社 | プリプレグ、それを用いた多層基配線板及び電子部品 |
JP4901687B2 (ja) * | 2007-10-17 | 2012-03-21 | 日東電工株式会社 | 感光性樹脂組成物およびそれを用いて得られるカバー絶縁層を有するフレキシブルプリント配線回路基板 |
EP2123712A1 (de) * | 2008-05-19 | 2009-11-25 | Evonik Degussa GmbH | Epoxydharzzusammensetzung und elektronisches Teil |
JP5086945B2 (ja) * | 2008-09-05 | 2012-11-28 | 株式会社東芝 | 半導体装置の製造方法 |
JP5182512B2 (ja) * | 2008-12-15 | 2013-04-17 | 日亜化学工業株式会社 | 熱硬化性エポキシ樹脂組成物及び半導体装置 |
DE102009007392A1 (de) * | 2009-01-29 | 2010-08-05 | Siemens Aktiengesellschaft | Tränkharzsystem für Isolierstoffe in Schaltanlagen |
EP2414444B1 (de) * | 2009-04-02 | 2013-04-17 | Huntsman Advanced Materials (Switzerland) GmbH | Direkte umgiessung |
JP5443827B2 (ja) * | 2009-05-20 | 2014-03-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4934166B2 (ja) * | 2009-05-25 | 2012-05-16 | 住友電気工業株式会社 | 電極の接着剤接続構造、電子機器およびその組立方法 |
US8618415B2 (en) | 2010-10-22 | 2013-12-31 | Blackberry Limited | Portable electronic device and method of manufacturing parts thereof |
US20120128499A1 (en) | 2010-11-19 | 2012-05-24 | Desai Umesh C | Structural adhesive compositions |
JP6240560B2 (ja) * | 2013-06-26 | 2017-11-29 | 本田技研工業株式会社 | マトリックス材 |
CN104527177B (zh) * | 2014-12-16 | 2018-03-23 | 艾达索高新材料芜湖有限公司 | 一种用于印刷电路板的可回收半固化片、固化片、覆铜板及其制备、回收方法 |
CA3033410A1 (en) * | 2016-08-11 | 2018-02-15 | Jetson I.P. Pty Ltd | Smart ball, locator system and method therefor |
JP7098881B2 (ja) * | 2017-03-31 | 2022-07-12 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
DE212020000366U1 (de) * | 2019-11-25 | 2021-02-23 | Murata Manufacturing Co., Ltd. | RFIC-Modul und RFID-Transponder |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4094856A (en) * | 1976-06-15 | 1978-06-13 | E. I. Du Pont De Nemours And Company | Flame retardant polymeric compositions |
JPS63349A (ja) * | 1986-06-19 | 1988-01-05 | Fujitsu Ltd | 半導体封止用エポキシ樹脂組成物 |
JP3092009B2 (ja) * | 1990-05-01 | 2000-09-25 | 東都化成株式会社 | 難燃剤及び該難燃剤を含有した熱硬化性難燃性樹脂組成物 |
JPH08151427A (ja) * | 1994-09-27 | 1996-06-11 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH08100108A (ja) * | 1994-09-28 | 1996-04-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JP3343704B2 (ja) * | 1994-11-29 | 2002-11-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
JPH08188638A (ja) * | 1995-01-11 | 1996-07-23 | Hitachi Ltd | 樹脂封止型半導体装置並びにその製造方法 |
JP3783312B2 (ja) * | 1997-01-17 | 2006-06-07 | 日立化成工業株式会社 | 電子部品封止用エポキシ樹脂成形材料及び電子部品 |
JPH11181429A (ja) * | 1997-02-14 | 1999-07-06 | Otsuka Chem Co Ltd | 難燃剤、難燃性樹脂組成物及び難燃性樹脂成形体 |
ID22006A (id) | 1997-10-15 | 1999-08-19 | Otsuka Chemical Co Ltd | Senyawa fenoksifosfazena taut-silang, penghambat nyala, komposisi resin penghambat nyala, dan pencetakan resin penghambat nyala |
TW445276B (en) * | 1998-08-13 | 2001-07-11 | Otsuka Chemical Co Ltd | Crosslinked phenoxyphosphazene compounds, process for the preparation thereof, flame retardants, flame-retardant resin compositions, and moldings of flame-retardant resins |
JP3364679B2 (ja) * | 1998-08-26 | 2003-01-08 | 大塚化学株式会社 | 粉末状難燃剤 |
JP3852221B2 (ja) * | 1998-09-30 | 2006-11-29 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP4614214B2 (ja) * | 1999-12-02 | 2011-01-19 | 信越化学工業株式会社 | 半導体装置素子用中空パッケージ |
-
2000
- 2000-10-11 JP JP2000310562A patent/JP3489025B2/ja not_active Expired - Fee Related
-
2001
- 2001-01-11 ES ES01900660T patent/ES2219496T3/es not_active Expired - Lifetime
- 2001-01-11 TW TW90100639A patent/TW553971B/zh active
- 2001-01-11 KR KR1020027009041A patent/KR100675267B1/ko not_active IP Right Cessation
- 2001-01-11 WO PCT/JP2001/000083 patent/WO2001051562A1/ja active IP Right Grant
- 2001-01-11 US US10/169,104 patent/US6905768B2/en not_active Expired - Fee Related
- 2001-01-11 DE DE2001602912 patent/DE60102912T2/de not_active Expired - Fee Related
- 2001-01-11 EP EP20010900660 patent/EP1270668B1/de not_active Expired - Lifetime
- 2001-01-11 AT AT01900660T patent/ATE264886T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60102912T2 (de) | 2005-04-07 |
KR20020068400A (ko) | 2002-08-27 |
EP1270668A1 (de) | 2003-01-02 |
JP2001261792A (ja) | 2001-09-26 |
US6905768B2 (en) | 2005-06-14 |
DE60102912D1 (de) | 2004-05-27 |
EP1270668A4 (de) | 2003-04-16 |
KR100675267B1 (ko) | 2007-01-26 |
US20030153650A1 (en) | 2003-08-14 |
TW553971B (en) | 2003-09-21 |
JP3489025B2 (ja) | 2004-01-19 |
ES2219496T3 (es) | 2004-12-01 |
EP1270668B1 (de) | 2004-04-21 |
WO2001051562A1 (en) | 2001-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE264886T1 (de) | Epoxyharzzusammensetzung sowie elektronisches teil | |
BR9913002B1 (pt) | composto de fenoxifosfazeno reticulado, seu processo de preparação, retardante de chama compreendendo o referido composto, composições de resina retardante de chama e artigos moldados de resina retardante de chama. | |
TW200602374A (en) | Encapsulation epoxy resin material and electronic component | |
EP1273608A4 (de) | Flammhemmende epoxyharzzusammensetzung, daraus geformter gegenstand sowie elektrisches teil | |
DE60023752D1 (de) | Feuerhemmende phosporenthaltende epoxidharzzusammensetzung | |
MY142518A (en) | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin | |
TW200736291A (en) | Epoxy resin composition for encapsulation and electronic component device | |
DE60115673T2 (de) | Halogenfreie flammhemmende zusammensetzung und flammhemmende polyamid-zusammensetzung | |
TW200736317A (en) | Non-halogen flame-retardant resin compositions | |
BR0311575A (pt) | Composições de resinas termoplásticas resistentes à ignição isentas de halogênios e produtos obtidos destas | |
ATE266689T1 (de) | Flammhemmende epoxyharze, die mit phosphor und silizium modifiziert sind | |
AU2003293202A1 (en) | Flame-retardant molding compositions | |
BR0214724A (pt) | Composição de resina curável termicamente | |
MY141944A (en) | Epoxy resin composition and semiconductor device | |
DE69934716D1 (de) | Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung | |
BRPI0406966A (pt) | Composições de resina termoplástica, resistentes à ignição livres de halogênio | |
DE68924521D1 (de) | Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen. | |
ATE248894T1 (de) | Polyetherimid-polyestermischungen mit verbesserten eigenschaften | |
EP0382015A3 (de) | Poly(arylensulfid)-Harzzusammensetzung | |
TWI266790B (en) | Resin composition for printed wiring board, prepreg, and laminate using the same | |
MY142389A (en) | Biphenylaralkyl epoxy and phenolic resins | |
TR200102241T2 (tr) | Alevden korunmalı kalıp kütleleri. | |
KR970705609A (ko) | 에폭시 수지조성물(epoxy resin composition) | |
WO2001070867A3 (en) | Flame retardant epoxy molding compositions | |
EP0400785A3 (de) | UV-härtbare Phenyl- und Acrylamidgruppen enthaltende Siliconzusammensetzungen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |