BR0214724A - Composição de resina curável termicamente - Google Patents
Composição de resina curável termicamenteInfo
- Publication number
- BR0214724A BR0214724A BR0214724-6A BR0214724A BR0214724A BR 0214724 A BR0214724 A BR 0214724A BR 0214724 A BR0214724 A BR 0214724A BR 0214724 A BR0214724 A BR 0214724A
- Authority
- BR
- Brazil
- Prior art keywords
- resin composition
- curable resin
- thermally curable
- patterns
- compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
- C08F291/02—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
- C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
- C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L19/00—Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
- C08L19/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Graft Or Block Polymers (AREA)
- Polymerisation Methods In General (AREA)
- Laminated Bodies (AREA)
Abstract
"COMPOSIçãO DE RESINA CURáVEL TERMICAMENTE". A presente invenção refere-se a uma composição de resina compreendendo um pré-polímero pelo menos bifuncional (A), curável pela ação de calor, um elastómero telequélico e um material particulado tendo um núcleo elastomérico e uma casca termoplástica. Camadas e padrões que são produzidos usando a formulação de acordo com a invenção possuem excelentes propriedades de adesão, estabilidade química, boas propriedades elétricas e alta resistência a rápidas alterações de temperatura. As composições são adequadas, em particular, como resists de solda na produção de placas de circuito.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH22292001 | 2001-12-06 | ||
PCT/EP2002/013047 WO2003048235A1 (en) | 2001-12-06 | 2002-11-21 | Heat-curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
BR0214724A true BR0214724A (pt) | 2004-08-31 |
BR0214724B1 BR0214724B1 (pt) | 2012-09-04 |
Family
ID=4568114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0214724-6A BR0214724B1 (pt) | 2001-12-06 | 2002-11-21 | composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem. |
Country Status (11)
Country | Link |
---|---|
US (1) | US7387812B2 (pt) |
EP (1) | EP1458794B1 (pt) |
JP (1) | JP4509561B2 (pt) |
KR (1) | KR100902339B1 (pt) |
CN (1) | CN1267478C (pt) |
AT (1) | ATE302231T1 (pt) |
AU (1) | AU2002352080A1 (pt) |
BR (1) | BR0214724B1 (pt) |
CA (1) | CA2466611C (pt) |
DE (1) | DE60205664T2 (pt) |
WO (1) | WO2003048235A1 (pt) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1802674A1 (en) * | 2004-09-21 | 2007-07-04 | Showa Denko K.K. | Heat-curable urethane resin composition |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
EP2017307A4 (en) * | 2006-04-28 | 2010-07-07 | Showa Denko Kk | HEAT-RESISTANT RESIN COMPOSITION AND ITS USE |
TWI419949B (zh) * | 2006-09-28 | 2013-12-21 | Jsr Corp | 黏著劑組成物及撓性印刷電路板用基板 |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
WO2009051067A1 (ja) * | 2007-10-18 | 2009-04-23 | Hitachi Chemical Company, Ltd. | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2009192632A (ja) * | 2008-02-12 | 2009-08-27 | Fujifilm Corp | 絶縁材料用樹脂組成物、感光性フィルム、及び感光性積層体 |
JP5239446B2 (ja) * | 2008-03-26 | 2013-07-17 | 日立化成株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品 |
DE102008023076A1 (de) | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
JP5270994B2 (ja) * | 2008-07-25 | 2013-08-21 | パナソニック株式会社 | ミクロフィブリル化セルロース/エラストマー/樹脂複合材の製造方法および成形品の製造方法 |
EP2451872A1 (en) * | 2009-07-10 | 2012-05-16 | Dow Global Technologies LLC | Core/shell rubbers for use in electrical laminate compositions |
TW201213433A (en) * | 2010-09-28 | 2012-04-01 | Dow Global Technologies Llc | Epoxy composition with crystallization inhibition |
DE102012200855A1 (de) * | 2012-01-20 | 2013-07-25 | Tesa Se | Vernetzer-Beschleuniger-System für Polyacrylate |
US9880467B2 (en) | 2012-08-01 | 2018-01-30 | Lg Chem, Ltd. | Photo-curable and thermo-curable resin composition and dry film solder resist |
JP6075763B2 (ja) * | 2013-03-22 | 2017-02-08 | 日本化薬株式会社 | 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用着色スペーサー及び/またはブラックマトリックス |
JP2015031849A (ja) * | 2013-08-02 | 2015-02-16 | 日立化成株式会社 | 感光性樹脂組成物 |
JP5700166B1 (ja) * | 2014-08-01 | 2015-04-15 | 東洋インキScホールディングス株式会社 | 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス |
JP6764874B2 (ja) * | 2015-11-06 | 2020-10-07 | 株式会社カネカ | 黒色樹脂組成物、黒色樹脂硬化膜付きポリイミドとその製造方法および黒色樹脂硬化膜を用いたフレキシブルプリント配線基板 |
JP6456313B2 (ja) * | 2016-01-26 | 2019-01-23 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
KR102040225B1 (ko) * | 2016-11-11 | 2019-11-06 | 주식회사 엘지화학 | 절연층 제조방법 및 다층인쇄회로기판 제조방법 |
CN113176705A (zh) * | 2020-01-27 | 2021-07-27 | 株式会社田村制作所 | 感光性树脂组合物 |
JP6944073B2 (ja) * | 2020-01-27 | 2021-10-06 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
JP7229304B2 (ja) * | 2020-08-06 | 2023-02-27 | 株式会社タムラ製作所 | 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板 |
Family Cites Families (26)
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DE3134123A1 (de) * | 1981-08-28 | 1983-03-17 | Hoechst Ag, 6000 Frankfurt | Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial |
JPS6162511A (ja) * | 1984-09-05 | 1986-03-31 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
US5051469A (en) | 1985-12-13 | 1991-09-24 | Monsanto Company | Rubber modified reaction molded nylon-6 block copolymers |
US5360836A (en) * | 1986-10-02 | 1994-11-01 | Societe Nationale Des Poudres Et Explosifs | Process for the production of coatings by radiation cross-linking |
JPS63258975A (ja) * | 1986-12-26 | 1988-10-26 | Toshiba Corp | ソルダーレジストインキ組成物 |
US4801680A (en) * | 1987-12-30 | 1989-01-31 | Ppg Industries, Inc. | Hydroxyalkylamide powder coating curing system |
US4894315A (en) * | 1988-08-30 | 1990-01-16 | E. I. Du Pont De Nemours And Company | Process for making flexographic printing plates with increased flexibility |
US4977220A (en) | 1988-11-21 | 1990-12-11 | Hughes Aircraft Company | Epoxy end-capped diolefin derivatives, polymers thereof, and processes for forming same |
DE69326853T2 (de) * | 1992-04-07 | 2000-06-15 | Alcatel, Paris | Polyurethanacrylat-Polymermaterial für die Beschichtung von optischen Fasern oder für Bandkabel aus optischen Fasern |
BE1006097A3 (nl) * | 1992-07-29 | 1994-05-10 | Dsm Nv | Poederverf op basis van een polymeer met vrije carbonzuurgroepen als bindmiddel en een beta-hydroxyalkylamidegroepen bevattende verbinding als crosslinker. |
JP3329877B2 (ja) * | 1993-03-02 | 2002-09-30 | 互応化学工業株式会社 | プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板 |
JPH07314603A (ja) * | 1993-12-28 | 1995-12-05 | Nippon Denkai Kk | 銅張積層体、多層プリント回路板及びそれらの処理方法 |
EP0662501A1 (en) * | 1994-01-07 | 1995-07-12 | Gencorp Inc. | Polymeric compositions, their preparation and use |
JP3580445B2 (ja) | 1994-09-13 | 2004-10-20 | 日本化薬株式会社 | フレキシブルプリント配線板用レジストインキ組成物及びその硬化物 |
US5576388A (en) * | 1994-10-11 | 1996-11-19 | Shell Oil Company | Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems |
DE19631170A1 (de) * | 1996-08-01 | 1998-02-05 | Basf Ag | Schlagzähe thermoplastische Formmassen |
US6127094A (en) * | 1997-10-02 | 2000-10-03 | Napp Systems Inc. | Acrylate copolymer-containing water-developable photosensitive resins and printing plates prepared therefrom |
US6583198B2 (en) * | 1997-11-28 | 2003-06-24 | Hitachi Chemical Company, Ltd. | Photo curable resin composition and photosensitive element |
EP0938026B1 (en) * | 1998-02-18 | 2009-05-27 | DSM IP Assets B.V. | Photocurable liquid resin composition |
JP2000072986A (ja) * | 1998-08-31 | 2000-03-07 | Sumitomo Durez Co Ltd | エポキシ樹脂粉体塗料 |
JP4081217B2 (ja) * | 1999-03-17 | 2008-04-23 | 互応化学工業株式会社 | 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板 |
JP2001168536A (ja) * | 1999-12-06 | 2001-06-22 | Idemitsu Petrochem Co Ltd | 多層プリント配線板 |
JP2001188340A (ja) * | 2000-01-04 | 2001-07-10 | Toagosei Co Ltd | 硬化性組成物およびソルダーレジスト |
FR2809741B1 (fr) * | 2000-05-31 | 2002-08-16 | Atofina | Materiaux thermodurs a tenue au choc amelioree |
US20050032946A1 (en) * | 2001-12-06 | 2005-02-10 | Huntsman Advanced Materials Americas, Inc. | Resin composition |
US20030198824A1 (en) * | 2002-04-19 | 2003-10-23 | Fong John W. | Photocurable compositions containing reactive polysiloxane particles |
-
2002
- 2002-11-21 AU AU2002352080A patent/AU2002352080A1/en not_active Abandoned
- 2002-11-21 AT AT02787752T patent/ATE302231T1/de not_active IP Right Cessation
- 2002-11-21 WO PCT/EP2002/013047 patent/WO2003048235A1/en active IP Right Grant
- 2002-11-21 CN CNB028244397A patent/CN1267478C/zh not_active Expired - Lifetime
- 2002-11-21 US US10/498,036 patent/US7387812B2/en not_active Expired - Fee Related
- 2002-11-21 BR BRPI0214724-6A patent/BR0214724B1/pt not_active IP Right Cessation
- 2002-11-21 DE DE60205664T patent/DE60205664T2/de not_active Expired - Lifetime
- 2002-11-21 CA CA2466611A patent/CA2466611C/en not_active Expired - Fee Related
- 2002-11-21 KR KR1020047008660A patent/KR100902339B1/ko active IP Right Grant
- 2002-11-21 EP EP02787752A patent/EP1458794B1/en not_active Expired - Lifetime
- 2002-11-21 JP JP2003549420A patent/JP4509561B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20050032935A1 (en) | 2005-02-10 |
WO2003048235A1 (en) | 2003-06-12 |
KR20040068192A (ko) | 2004-07-30 |
EP1458794A1 (en) | 2004-09-22 |
CN1267478C (zh) | 2006-08-02 |
AU2002352080A1 (en) | 2003-06-17 |
JP2005512117A (ja) | 2005-04-28 |
CN1599770A (zh) | 2005-03-23 |
US7387812B2 (en) | 2008-06-17 |
ATE302231T1 (de) | 2005-09-15 |
CA2466611C (en) | 2011-09-27 |
EP1458794B1 (en) | 2005-08-17 |
DE60205664T2 (de) | 2006-03-02 |
BR0214724B1 (pt) | 2012-09-04 |
DE60205664D1 (de) | 2005-09-22 |
JP4509561B2 (ja) | 2010-07-21 |
KR100902339B1 (ko) | 2009-06-12 |
CA2466611A1 (en) | 2003-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 21/11/2002, OBSERVADAS AS CONDICOES LEGAIS. |
|
B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 12A ANUIDADE. |
|
B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2281 DE 23-09-2014 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |