BR0214724A - Composição de resina curável termicamente - Google Patents

Composição de resina curável termicamente

Info

Publication number
BR0214724A
BR0214724A BR0214724-6A BR0214724A BR0214724A BR 0214724 A BR0214724 A BR 0214724A BR 0214724 A BR0214724 A BR 0214724A BR 0214724 A BR0214724 A BR 0214724A
Authority
BR
Brazil
Prior art keywords
resin composition
curable resin
thermally curable
patterns
compositions
Prior art date
Application number
BR0214724-6A
Other languages
English (en)
Other versions
BR0214724B1 (pt
Inventor
Roger Pierr-Elie Salvin
Martin Roth
Masato Hoshino
Yasuharu Nojima
Original Assignee
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag filed Critical Vantico Ag
Publication of BR0214724A publication Critical patent/BR0214724A/pt
Publication of BR0214724B1 publication Critical patent/BR0214724B1/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04Polymers provided for in subclasses C08C or C08F
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/02Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C08L51/085Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L19/00Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
    • C08L19/006Rubber characterised by functional groups, e.g. telechelic diene polymers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)

Abstract

"COMPOSIçãO DE RESINA CURáVEL TERMICAMENTE". A presente invenção refere-se a uma composição de resina compreendendo um pré-polímero pelo menos bifuncional (A), curável pela ação de calor, um elastómero telequélico e um material particulado tendo um núcleo elastomérico e uma casca termoplástica. Camadas e padrões que são produzidos usando a formulação de acordo com a invenção possuem excelentes propriedades de adesão, estabilidade química, boas propriedades elétricas e alta resistência a rápidas alterações de temperatura. As composições são adequadas, em particular, como resists de solda na produção de placas de circuito.
BRPI0214724-6A 2001-12-06 2002-11-21 composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem. BR0214724B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH22292001 2001-12-06
PCT/EP2002/013047 WO2003048235A1 (en) 2001-12-06 2002-11-21 Heat-curable resin composition

Publications (2)

Publication Number Publication Date
BR0214724A true BR0214724A (pt) 2004-08-31
BR0214724B1 BR0214724B1 (pt) 2012-09-04

Family

ID=4568114

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0214724-6A BR0214724B1 (pt) 2001-12-06 2002-11-21 composições de resina e seu uso, circuito impresso, processo para produção de uma camada e unidade de embalagem.

Country Status (11)

Country Link
US (1) US7387812B2 (pt)
EP (1) EP1458794B1 (pt)
JP (1) JP4509561B2 (pt)
KR (1) KR100902339B1 (pt)
CN (1) CN1267478C (pt)
AT (1) ATE302231T1 (pt)
AU (1) AU2002352080A1 (pt)
BR (1) BR0214724B1 (pt)
CA (1) CA2466611C (pt)
DE (1) DE60205664T2 (pt)
WO (1) WO2003048235A1 (pt)

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US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
EP2017307A4 (en) * 2006-04-28 2010-07-07 Showa Denko Kk HEAT-RESISTANT RESIN COMPOSITION AND ITS USE
TWI419949B (zh) * 2006-09-28 2013-12-21 Jsr Corp 黏著劑組成物及撓性印刷電路板用基板
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
WO2009051067A1 (ja) * 2007-10-18 2009-04-23 Hitachi Chemical Company, Ltd. 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
JP2009192632A (ja) * 2008-02-12 2009-08-27 Fujifilm Corp 絶縁材料用樹脂組成物、感光性フィルム、及び感光性積層体
JP5239446B2 (ja) * 2008-03-26 2013-07-17 日立化成株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
DE102008023076A1 (de) 2008-05-09 2009-11-12 Henkel Ag & Co. Kgaa Polymerisierbare Zusammensetzung
JP5270994B2 (ja) * 2008-07-25 2013-08-21 パナソニック株式会社 ミクロフィブリル化セルロース/エラストマー/樹脂複合材の製造方法および成形品の製造方法
EP2451872A1 (en) * 2009-07-10 2012-05-16 Dow Global Technologies LLC Core/shell rubbers for use in electrical laminate compositions
TW201213433A (en) * 2010-09-28 2012-04-01 Dow Global Technologies Llc Epoxy composition with crystallization inhibition
DE102012200855A1 (de) * 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
US9880467B2 (en) 2012-08-01 2018-01-30 Lg Chem, Ltd. Photo-curable and thermo-curable resin composition and dry film solder resist
JP6075763B2 (ja) * 2013-03-22 2017-02-08 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用着色スペーサー及び/またはブラックマトリックス
JP2015031849A (ja) * 2013-08-02 2015-02-16 日立化成株式会社 感光性樹脂組成物
JP5700166B1 (ja) * 2014-08-01 2015-04-15 東洋インキScホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
JP6764874B2 (ja) * 2015-11-06 2020-10-07 株式会社カネカ 黒色樹脂組成物、黒色樹脂硬化膜付きポリイミドとその製造方法および黒色樹脂硬化膜を用いたフレキシブルプリント配線基板
JP6456313B2 (ja) * 2016-01-26 2019-01-23 株式会社タムラ製作所 感光性樹脂組成物
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
CN113176705A (zh) * 2020-01-27 2021-07-27 株式会社田村制作所 感光性树脂组合物
JP6944073B2 (ja) * 2020-01-27 2021-10-06 株式会社タムラ製作所 感光性樹脂組成物
JP7229304B2 (ja) * 2020-08-06 2023-02-27 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板

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Also Published As

Publication number Publication date
US20050032935A1 (en) 2005-02-10
WO2003048235A1 (en) 2003-06-12
KR20040068192A (ko) 2004-07-30
EP1458794A1 (en) 2004-09-22
CN1267478C (zh) 2006-08-02
AU2002352080A1 (en) 2003-06-17
JP2005512117A (ja) 2005-04-28
CN1599770A (zh) 2005-03-23
US7387812B2 (en) 2008-06-17
ATE302231T1 (de) 2005-09-15
CA2466611C (en) 2011-09-27
EP1458794B1 (en) 2005-08-17
DE60205664T2 (de) 2006-03-02
BR0214724B1 (pt) 2012-09-04
DE60205664D1 (de) 2005-09-22
JP4509561B2 (ja) 2010-07-21
KR100902339B1 (ko) 2009-06-12
CA2466611A1 (en) 2003-06-12

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 21/11/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2281 DE 23-09-2014 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.