ATE302231T1 - Wärmehärtbare harzzusammensetzung - Google Patents

Wärmehärtbare harzzusammensetzung

Info

Publication number
ATE302231T1
ATE302231T1 AT02787752T AT02787752T ATE302231T1 AT E302231 T1 ATE302231 T1 AT E302231T1 AT 02787752 T AT02787752 T AT 02787752T AT 02787752 T AT02787752 T AT 02787752T AT E302231 T1 ATE302231 T1 AT E302231T1
Authority
AT
Austria
Prior art keywords
resin composition
heat current
current resin
heat
patterns
Prior art date
Application number
AT02787752T
Other languages
English (en)
Inventor
Roger Pierre-Elie Salvin
Martin Roth
Masato Hoshino
Yasuharu Nojima
Original Assignee
Huntsman Adv Mat Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Switzerland filed Critical Huntsman Adv Mat Switzerland
Application granted granted Critical
Publication of ATE302231T1 publication Critical patent/ATE302231T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/02—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L19/00—Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
    • C08L19/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
AT02787752T 2001-12-06 2002-11-21 Wärmehärtbare harzzusammensetzung ATE302231T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH22292001 2001-12-06
PCT/EP2002/013047 WO2003048235A1 (en) 2001-12-06 2002-11-21 Heat-curable resin composition

Publications (1)

Publication Number Publication Date
ATE302231T1 true ATE302231T1 (de) 2005-09-15

Family

ID=4568114

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02787752T ATE302231T1 (de) 2001-12-06 2002-11-21 Wärmehärtbare harzzusammensetzung

Country Status (11)

Country Link
US (1) US7387812B2 (de)
EP (1) EP1458794B1 (de)
JP (1) JP4509561B2 (de)
KR (1) KR100902339B1 (de)
CN (1) CN1267478C (de)
AT (1) ATE302231T1 (de)
AU (1) AU2002352080A1 (de)
BR (1) BR0214724B1 (de)
CA (1) CA2466611C (de)
DE (1) DE60205664T2 (de)
WO (1) WO2003048235A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8524838B2 (en) * 2004-09-21 2013-09-03 Showa Denko K.K. Heat-curable urethane resin composition
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
US20090065244A1 (en) * 2006-04-28 2009-03-12 Showa Denko K.K. Thermosetting resin compositions and uses thereof
TWI419949B (zh) * 2006-09-28 2013-12-21 Jsr Corp 黏著劑組成物及撓性印刷電路板用基板
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
WO2009051067A1 (ja) * 2007-10-18 2009-04-23 Hitachi Chemical Company, Ltd. 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
JP2009192632A (ja) * 2008-02-12 2009-08-27 Fujifilm Corp 絶縁材料用樹脂組成物、感光性フィルム、及び感光性積層体
JP5239446B2 (ja) * 2008-03-26 2013-07-17 日立化成株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
DE102008023076A1 (de) 2008-05-09 2009-11-12 Henkel Ag & Co. Kgaa Polymerisierbare Zusammensetzung
JP5270994B2 (ja) * 2008-07-25 2013-08-21 パナソニック株式会社 ミクロフィブリル化セルロース／エラストマー／樹脂複合材の製造方法および成形品の製造方法
JP2012532963A (ja) * 2009-07-10 2012-12-20 ダウ グローバル テクノロジーズ エルエルシー 電気用積層板組成物における使用のためのコア／シェルゴム
TW201213433A (en) * 2010-09-28 2012-04-01 Dow Global Technologies Llc Epoxy composition with crystallization inhibition
DE102012200855A1 (de) * 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
CN104704426A (zh) 2012-08-01 2015-06-10 株式会社Lg化学 具有光固化性能和热固化性能的树脂组合物及阻焊干膜
JP6075763B2 (ja) * 2013-03-22 2017-02-08 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用着色スペーサー及び／またはブラックマトリックス
JP2015031849A (ja) * 2013-08-02 2015-02-16 日立化成株式会社 感光性樹脂組成物
JP5700166B1 (ja) * 2014-08-01 2015-04-15 東洋インキＳｃホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
JP6764874B2 (ja) * 2015-11-06 2020-10-07 株式会社カネカ 黒色樹脂組成物、黒色樹脂硬化膜付きポリイミドとその製造方法および黒色樹脂硬化膜を用いたフレキシブルプリント配線基板
JP6456313B2 (ja) * 2016-01-26 2019-01-23 株式会社タムラ製作所 感光性樹脂組成物
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
JP6944073B2 (ja) * 2020-01-27 2021-10-06 株式会社タムラ製作所 感光性樹脂組成物
CN113176705A (zh) * 2020-01-27 2021-07-27 株式会社田村制作所 感光性树脂组合物
JP7229304B2 (ja) * 2020-08-06 2023-02-27 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134123A1 (de) * 1981-08-28 1983-03-17 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
JPS6162511A (ja) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
US5051469A (en) 1985-12-13 1991-09-24 Monsanto Company Rubber modified reaction molded nylon-6 block copolymers
US5360836A (en) 1986-10-02 1994-11-01 Societe Nationale Des Poudres Et Explosifs Process for the production of coatings by radiation cross-linking
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
US4801680A (en) * 1987-12-30 1989-01-31 Ppg Industries, Inc. Hydroxyalkylamide powder coating curing system
US4894315A (en) * 1988-08-30 1990-01-16 E. I. Du Pont De Nemours And Company Process for making flexographic printing plates with increased flexibility
US4977220A (en) * 1988-11-21 1990-12-11 Hughes Aircraft Company Epoxy end-capped diolefin derivatives, polymers thereof, and processes for forming same
EP0565425B1 (de) * 1992-04-07 1999-10-27 Alcatel Polyurethanacrylat-Polymermaterial für die Beschichtung von optischen Fasern oder für Bandkabel aus optischen Fasern
BE1006097A3 (nl) * 1992-07-29 1994-05-10 Dsm Nv Poederverf op basis van een polymeer met vrije carbonzuurgroepen als bindmiddel en een beta-hydroxyalkylamidegroepen bevattende verbinding als crosslinker.
JP3329877B2 (ja) * 1993-03-02 2002-09-30 互応化学工業株式会社 プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板
JPH07314603A (ja) * 1993-12-28 1995-12-05 Nippon Denkai Kk 銅張積層体、多層プリント回路板及びそれらの処理方法
EP0662501A1 (de) * 1994-01-07 1995-07-12 Gencorp Inc. Polymerisatzusammensetzungen, ihre Herstellung und Anwendung
JP3580445B2 (ja) 1994-09-13 2004-10-20 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
US5576388A (en) * 1994-10-11 1996-11-19 Shell Oil Company Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems
DE19631170A1 (de) * 1996-08-01 1998-02-05 Basf Ag Schlagzähe thermoplastische Formmassen
US6127094A (en) * 1997-10-02 2000-10-03 Napp Systems Inc. Acrylate copolymer-containing water-developable photosensitive resins and printing plates prepared therefrom
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
EP0938026B1 (de) * 1998-02-18 2009-05-27 DSM IP Assets B.V. Fotohärtbare flüssige Harzzusammensetzung
JP2000072986A (ja) * 1998-08-31 2000-03-07 Sumitomo Durez Co Ltd エポキシ樹脂粉体塗料
JP4081217B2 (ja) * 1999-03-17 2008-04-23 互応化学工業株式会社 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板
JP2001168536A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 多層プリント配線板
JP2001188340A (ja) * 2000-01-04 2001-07-10 Toagosei Co Ltd 硬化性組成物およびソルダーレジスト
FR2809741B1 (fr) * 2000-05-31 2002-08-16 Atofina Materiaux thermodurs a tenue au choc amelioree
AU2002356681A1 (en) * 2001-12-06 2003-06-17 Vantico Ag Resin composition
US20030198824A1 (en) * 2002-04-19 2003-10-23 Fong John W. Photocurable compositions containing reactive polysiloxane particles

Also Published As

Publication number Publication date
BR0214724B1 (pt) 2012-09-04
EP1458794B1 (de) 2005-08-17
WO2003048235A1 (en) 2003-06-12
DE60205664D1 (de) 2005-09-22
KR20040068192A (ko) 2004-07-30
CN1267478C (zh) 2006-08-02
US20050032935A1 (en) 2005-02-10
JP2005512117A (ja) 2005-04-28
EP1458794A1 (de) 2004-09-22
CA2466611C (en) 2011-09-27
AU2002352080A1 (en) 2003-06-17
KR100902339B1 (ko) 2009-06-12
DE60205664T2 (de) 2006-03-02
CA2466611A1 (en) 2003-06-12
BR0214724A (pt) 2004-08-31
JP4509561B2 (ja) 2010-07-21
CN1599770A (zh) 2005-03-23
US7387812B2 (en) 2008-06-17

Similar Documents

Publication Publication Date Title
ATE302231T1 (de) Wärmehärtbare harzzusammensetzung
ATE470939T1 (de) Leitfähige thermoplastische zusammensetzungen und herstellungsverfahren
DE69233595D1 (de) Elektrisch leitfähige zusammensetzungen und verfahren zur herstellung derselben und anwendungen
TWI320575B (de)
ATE386330T1 (de) Elektrische vorrichtungen und herstellungsverfahren
ATE370991T1 (de) Polyphenylenoxid-harze, prepregs, schichtplatten, gedruckte leiterplatten und gedruckte multilayer- leiterplatten
EP1207726A3 (de) Leitfähige Tintenzusammensetzung
DE602004013544D1 (de) Leitfähige kleberzusammensetzungen mit elektrischer stabilität und guter schlagzähigkeit und deren verwendung in elektronischen geräten
MY129757A (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
TW200631040A (en) Circuit connecting adhesive
ATE266689T1 (de) Flammhemmende epoxyharze, die mit phosphor und silizium modifiziert sind
EP1300444A4 (de) Epoxyharzzusammensetzung sowie damit hergestellter gehärteter gegenstand
EP1950246A4 (de) Leitfähige harzzusammensetzung, leitfähige folie damit und widerstandsfolienschalter damit
WO2001076322A3 (en) Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions
EP1753277A3 (de) Leiterplatte
TW200600542A (en) Compositions with polymers for advanced materials
ATE398656T1 (de) Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat
SE9802157L (sv) Elektrisk komponent
DE60321040D1 (de) Bauelement aus leitendem polymer und verfahren zu seiner herstellung
TW200514105A (en) PTC thermister, and circuit protection method
TW200516126A (en) Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
EP0921158A3 (de) Wärmehärtbaren Zusammensetzungen von Poly(phenylenether)
TW200617087A (en) Conductive composition exhibiting ptc behavior and over-current protection device using the same
GB2439264A (en) Circuit materials circuits and methods of manufacture thereof
DE50205819D1 (de) Steckverbinder mit Isolations- und Dichtungselement

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties