ATE180920T1 - Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht - Google Patents

Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht

Info

Publication number
ATE180920T1
ATE180920T1 AT94200542T AT94200542T ATE180920T1 AT E180920 T1 ATE180920 T1 AT E180920T1 AT 94200542 T AT94200542 T AT 94200542T AT 94200542 T AT94200542 T AT 94200542T AT E180920 T1 ATE180920 T1 AT E180920T1
Authority
AT
Austria
Prior art keywords
layer
polymer layer
conductive
metal
metal layer
Prior art date
Application number
AT94200542T
Other languages
German (de)
English (en)
Inventor
Leeuw Dagobertt Michel De
Cornelius Marcus Joha Mutsaers
Maurice Maria Johannes Simenon
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE180920T1 publication Critical patent/ATE180920T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C08G61/126Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/127Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/128Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0329Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT94200542T 1993-03-09 1994-03-03 Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht ATE180920T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP93200665 1993-03-09
EP93202602 1993-09-07

Publications (1)

Publication Number Publication Date
ATE180920T1 true ATE180920T1 (de) 1999-06-15

Family

ID=26133690

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94200542T ATE180920T1 (de) 1993-03-09 1994-03-03 Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht

Country Status (5)

Country Link
US (2) US5427841A (enExample)
JP (1) JPH06350221A (enExample)
AT (1) ATE180920T1 (enExample)
DE (1) DE69418746T2 (enExample)
TW (1) TW292989B (enExample)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532025A (en) * 1993-07-23 1996-07-02 Kinlen; Patrick J. Corrosion inhibiting compositions
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
DE19536844C1 (de) * 1995-10-02 1997-04-10 Bayer Ag Verfahren zur elektrostatischen Lackierung von nicht leitfähigen Oberflächen
EP0968537B1 (en) 1997-08-22 2012-05-02 Creator Technology B.V. A method of manufacturing a field-effect transistor substantially consisting of organic materials
US5980723A (en) * 1997-08-27 1999-11-09 Jude Runge-Marchese Electrochemical deposition of a composite polymer metal oxide
RU2210834C2 (ru) 1998-01-28 2003-08-20 Тин Филм Электроникс Аса Способ формирования электропроводящих и/или полупроводниковых трехмерных структур, способ уничтожения этих структур и генератор/модулятор электрического поля для использования в способе формирования
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten
EP1013413B1 (en) * 1998-12-21 2004-11-17 Chi Mei Optoelectronics Corporation Electroconductive glass laminate
EP1085319B1 (en) * 1999-09-13 2005-06-01 Interuniversitair Micro-Elektronica Centrum Vzw A device for detecting an analyte in a sample based on organic materials
US7357965B1 (en) * 1999-10-15 2008-04-15 Agfa-Gevaert, N.V. Liquid crystal alignment layer
US20040043162A1 (en) * 1999-10-15 2004-03-04 Agfa-Gevaert Use of a polythiophene for aligning liquid crystals
EP1096674B1 (en) * 1999-10-29 2013-03-27 Kyocera Corporation Circuit substrate
JP3456461B2 (ja) * 2000-02-21 2003-10-14 Tdk株式会社 パターニング方法、薄膜デバイスの製造方法及び薄膜磁気ヘッドの製造方法
US6730857B2 (en) * 2001-03-13 2004-05-04 International Business Machines Corporation Structure having laser ablated features and method of fabricating
US6623903B2 (en) 2001-06-22 2003-09-23 Agfa-Gevaert Material and method for making an electroconductive pattern
DE60216460T2 (de) * 2001-06-22 2007-09-27 Agfa-Gevaert Material und verfahren zur herstellung einer elektroleitfähigen struktur
US6649327B2 (en) * 2001-10-25 2003-11-18 The United States Of America As Represented By The Secretary Of The Navy Method of patterning electrically conductive polymers
WO2004017439A2 (de) * 2002-07-29 2004-02-26 Siemens Aktiengesellschaft Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu
US20060035423A1 (en) * 2002-11-19 2006-02-16 Walter Fix Organic electronic component comprising the same organic material for at least two functional layers
MXPA05010361A (es) * 2003-04-02 2005-11-17 Starck H C Gmbh Agentes de oxidacion especificos para producir polimeros conductores.
US7063762B2 (en) * 2003-08-20 2006-06-20 Endicott Interconnect Technologies, Inc. Circuitized substrate and method of making same
US7320813B2 (en) * 2003-12-15 2008-01-22 The United States Of America As Represented By The Secretary Of The Navy Synthesis of highly conducting and transparent thin polymer films
US7449758B2 (en) * 2004-08-17 2008-11-11 California Institute Of Technology Polymeric piezoresistive sensors
US7279268B2 (en) * 2004-09-09 2007-10-09 Intel Corporation Conductive lithographic polymer and method of making devices using same
US8350238B2 (en) * 2004-12-30 2013-01-08 E.I. Du Pont De Nemours And Company Device patterning using irradiation
CN101297415A (zh) * 2005-08-01 2008-10-29 普莱克斯托尼克斯公司 导电聚合物的潜在掺杂
WO2007021980A2 (en) 2005-08-12 2007-02-22 Isotron Corporation Compositionally modulated composite materials and methods for making the same
US7932520B2 (en) * 2006-04-07 2011-04-26 Chimei Innolux Corporation Organic light emitting device and method of fabricating the same
TWI303535B (en) * 2006-04-07 2008-11-21 Chi Mei El Corp Organic light emitting device and method of fabricating the same
KR101502978B1 (ko) * 2007-12-07 2015-03-18 아그파-게바에르트 엔.브이. 태양광 노출에 대한 안정성이 개선된 층 구성체
KR101683026B1 (ko) * 2008-04-11 2016-12-07 닛산 가가쿠 고교 가부시키 가이샤 도핑된 공액 중합체, 소자, 및 소자의 제조 방법
IT1392069B1 (it) * 2008-11-27 2012-02-09 St Microelectronics Srl Metodo per realizzare un dispositivo elettronico organico a film sottile e corrispondente dispositivo
CN105839157B (zh) 2009-06-08 2019-06-14 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
KR100969172B1 (ko) * 2009-06-22 2010-07-14 한국기계연구원 마스크 템플릿을 이용한 미세패턴 형성방법
EP2453471A3 (de) * 2010-11-15 2013-05-15 Dyconex AG Verfahren zur galvanischen Abscheidung einer Elektrode auf einem dielektrischen Substrat
TWI462244B (zh) * 2011-10-17 2014-11-21 財團法人工業技術研究院 異方向性導電膜片及其製作方法
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
BR112015022192A8 (pt) * 2013-03-15 2019-11-26 Modumetal Inc artigo e seu método de preparação
JP6171609B2 (ja) * 2013-06-19 2017-08-02 東ソー株式会社 透明導電膜用塗工液及びこれを用いた透明導電膜
CN106795645B (zh) 2014-09-18 2020-03-27 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CA2961507C (en) 2014-09-18 2024-04-09 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
KR102312314B1 (ko) * 2015-01-28 2021-10-13 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
KR102320639B1 (ko) * 2015-02-04 2021-11-02 삼성디스플레이 주식회사 터치 스크린 패널 및 이의 제조 방법
KR102322084B1 (ko) * 2015-04-30 2021-11-04 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
KR20180089486A (ko) * 2015-12-03 2018-08-08 마이크로닉 아베 중합체 층을 이용하여 공작물을 제조하기 위한 방법 및 시스템
KR102629580B1 (ko) * 2016-01-08 2024-01-26 삼성디스플레이 주식회사 플렉서블 터치 스크린 패널 및 플렉서블 터치 스크린 패널의 제조 방법
EP3510185A1 (en) 2016-09-08 2019-07-17 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
WO2018053158A1 (en) 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
WO2018175975A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
CN111831156A (zh) * 2018-01-24 2020-10-27 祥达光学(厦门)有限公司 触控面板与触控传感器卷带
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793106A (en) * 1969-12-31 1974-02-19 Macdermid Inc Process for forming plastic parts having surfaces receptive to adherent coatings
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US5264108A (en) * 1992-09-08 1993-11-23 The United States Of America As Represented By The United States Department Of Energy Laser patterning of laminated structures for electroplating

Also Published As

Publication number Publication date
US5620800A (en) 1997-04-15
DE69418746D1 (de) 1999-07-08
US5427841A (en) 1995-06-27
JPH06350221A (ja) 1994-12-22
TW292989B (enExample) 1996-12-11
DE69418746T2 (de) 1999-12-02

Similar Documents

Publication Publication Date Title
DE69418746D1 (de) Methode zur Herstellung eines Verbundstoffes mit einer Metallschicht auf einer leitfähigen Polymerschicht
US4339303A (en) Radiation stress relieving of sulfone polymer articles
ATE171560T1 (de) Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen musters
US4424095A (en) Radiation stress relieving of polymer articles
US4770900A (en) Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
ATE317633T1 (de) Verfahren zur herstellung einer gedruckten schaltung und mit dieser gedruckten schaltung hergestellte planarantenne
DE68923904D1 (de) Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Schaltungsplatten.
MX9204898A (es) Capas resistivas metalicas y metodo para su preparacion
KR950007618A (ko) 구리부착적층판 및 프린트배선판
DE4202337A1 (de) Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
MY128039A (en) Printed circuit boards and method of producing the same
WO1989002212A2 (en) Improved circuit board material and electroplating bath for the production thereof
KR960016662A (ko) 2층 및 다층 인쇄 회로 기판의 쓰루-홀 도금 방법
ATE303712T1 (de) Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte
ATE111294T1 (de) Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.
DE59007653D1 (de) Verfahren zur herstellung einer durchkontaktierten leiterplatte.
US3691007A (en) Printed circuit board fabrication by electroplating a surface through a porous membrane
ATE196710T1 (de) Strukturierte leiterplatten und folienleiterplatten und verfahren zu deren herstellung
DE69620273D1 (de) Verfahren zur Herstellung von Abstandshaltern auf einer elektrischen Leiterplatte
KR830008634A (ko) 후막파인패턴(thick film fine pattern) 도전체(導電體)의 제조방법
CA1263763A (en) Printed circuit with chromium adhesion layer
DE3577030D1 (de) Verfahren zur herstellung von metallmustern auf isolierenden traegern sowie isolierende traeger mit metallmuster, insbesondere gedruckte schaltungen.
US4824381A (en) Circuit board containing a metal net
DE69220588D1 (de) Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Leiterplatten
EP0615257B1 (en) Method of manufactoring a laminated structure of a metal layer on a conductive polymer layer

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee