DE69418746D1 - Methode zur Herstellung eines Verbundstoffes mit einer Metallschicht auf einer leitfähigen Polymerschicht - Google Patents

Methode zur Herstellung eines Verbundstoffes mit einer Metallschicht auf einer leitfähigen Polymerschicht

Info

Publication number
DE69418746D1
DE69418746D1 DE69418746T DE69418746T DE69418746D1 DE 69418746 D1 DE69418746 D1 DE 69418746D1 DE 69418746 T DE69418746 T DE 69418746T DE 69418746 T DE69418746 T DE 69418746T DE 69418746 D1 DE69418746 D1 DE 69418746D1
Authority
DE
Germany
Prior art keywords
layer
polymer layer
conductive
metal
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69418746T
Other languages
English (en)
Other versions
DE69418746T2 (de
Inventor
Leeuw Dagobertt Michel De
Cornelius Marcus Joha Mutsaers
Maurice Maria Johannes Simenon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69418746D1 publication Critical patent/DE69418746D1/de
Application granted granted Critical
Publication of DE69418746T2 publication Critical patent/DE69418746T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69418746T 1993-03-09 1994-03-03 Methode zur Herstellung eines Verbundstoffes mit einer Metallschicht auf einer leitfähigen Polymerschicht Expired - Fee Related DE69418746T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP93200665 1993-03-09
EP93202602 1993-09-07

Publications (2)

Publication Number Publication Date
DE69418746D1 true DE69418746D1 (de) 1999-07-08
DE69418746T2 DE69418746T2 (de) 1999-12-02

Family

ID=26133690

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69418746T Expired - Fee Related DE69418746T2 (de) 1993-03-09 1994-03-03 Methode zur Herstellung eines Verbundstoffes mit einer Metallschicht auf einer leitfähigen Polymerschicht

Country Status (5)

Country Link
US (2) US5427841A (de)
JP (1) JPH06350221A (de)
AT (1) ATE180920T1 (de)
DE (1) DE69418746T2 (de)
TW (1) TW292989B (de)

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DE19536844C1 (de) * 1995-10-02 1997-04-10 Bayer Ag Verfahren zur elektrostatischen Lackierung von nicht leitfähigen Oberflächen
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US5980723A (en) * 1997-08-27 1999-11-09 Jude Runge-Marchese Electrochemical deposition of a composite polymer metal oxide
CN1171301C (zh) 1998-01-28 2004-10-13 薄膜电子有限公司 产生和擦除导电和半导电结构的方法及电场发生器调制器
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten
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US20040043162A1 (en) * 1999-10-15 2004-03-04 Agfa-Gevaert Use of a polythiophene for aligning liquid crystals
US7357965B1 (en) * 1999-10-15 2008-04-15 Agfa-Gevaert, N.V. Liquid crystal alignment layer
EP1096674B1 (de) * 1999-10-29 2013-03-27 Kyocera Corporation Schaltungssubstrat
JP3456461B2 (ja) * 2000-02-21 2003-10-14 Ｔｄｋ株式会社 パターニング方法、薄膜デバイスの製造方法及び薄膜磁気ヘッドの製造方法
US6730857B2 (en) * 2001-03-13 2004-05-04 International Business Machines Corporation Structure having laser ablated features and method of fabricating
EP1402543B1 (de) 2001-06-22 2006-11-29 Agfa-Gevaert Material und verfahren zur herstellung einer elektroleitfähigen struktur
US6623903B2 (en) 2001-06-22 2003-09-23 Agfa-Gevaert Material and method for making an electroconductive pattern
US6649327B2 (en) * 2001-10-25 2003-11-18 The United States Of America As Represented By The Secretary Of The Navy Method of patterning electrically conductive polymers
US8044517B2 (en) * 2002-07-29 2011-10-25 Polyic Gmbh & Co. Kg Electronic component comprising predominantly organic functional materials and a method for the production thereof
US20060035423A1 (en) * 2002-11-19 2006-02-16 Walter Fix Organic electronic component comprising the same organic material for at least two functional layers
WO2004088672A1 (de) * 2003-04-02 2004-10-14 H. C. Starck Gmbh Spezielle oxidationsmittel zur herstellung leitfähiger polymere
US7063762B2 (en) * 2003-08-20 2006-06-20 Endicott Interconnect Technologies, Inc. Circuitized substrate and method of making same
US7320813B2 (en) * 2003-12-15 2008-01-22 The United States Of America As Represented By The Secretary Of The Navy Synthesis of highly conducting and transparent thin polymer films
US7449758B2 (en) * 2004-08-17 2008-11-11 California Institute Of Technology Polymeric piezoresistive sensors
US7279268B2 (en) * 2004-09-09 2007-10-09 Intel Corporation Conductive lithographic polymer and method of making devices using same
JP2008532206A (ja) * 2004-12-30 2008-08-14 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 照射を使用するデバイスのパターニング
US7888427B2 (en) * 2005-08-01 2011-02-15 Plextronics, Inc. Latent doping of conducting polymers
EP2381015B1 (de) 2005-08-12 2019-01-16 Modumetal, Inc. Kompositionell modulierte Verbundmaterialien
TWI303535B (en) * 2006-04-07 2008-11-21 Chi Mei El Corp Organic light emitting device and method of fabricating the same
US7932520B2 (en) * 2006-04-07 2011-04-26 Chimei Innolux Corporation Organic light emitting device and method of fabricating the same
CN101883811B (zh) * 2007-12-07 2013-04-24 爱克发-格法特公司 对日光暴露的稳定性得到改进的层配置
WO2009126918A1 (en) * 2008-04-11 2009-10-15 Plextronics, Inc. Doped conjugated polymers, devices, and methods of making devices
IT1392069B1 (it) * 2008-11-27 2012-02-09 St Microelectronics Srl Metodo per realizzare un dispositivo elettronico organico a film sottile e corrispondente dispositivo
CA2764887C (en) 2009-06-08 2018-09-11 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
KR100969172B1 (ko) * 2009-06-22 2010-07-14 한국기계연구원 마스크 템플릿을 이용한 미세패턴 형성방법
EP2453471A3 (de) * 2010-11-15 2013-05-15 Dyconex AG Verfahren zur galvanischen Abscheidung einer Elektrode auf einem dielektrischen Substrat
TWI462244B (zh) * 2011-10-17 2014-11-21 Ind Tech Res Inst 異方向性導電膜片及其製作方法
CN105283587B (zh) 2013-03-15 2019-05-10 莫杜美拓有限公司 纳米叠层涂层
CN105189828B (zh) 2013-03-15 2018-05-15 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
CA2905536C (en) 2013-03-15 2023-03-07 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
WO2014146117A2 (en) 2013-03-15 2014-09-18 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
JP6171609B2 (ja) * 2013-06-19 2017-08-02 東ソー株式会社 透明導電膜用塗工液及びこれを用いた透明導電膜
EP3194642A4 (de) 2014-09-18 2018-07-04 Modumetal, Inc. Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
KR102312314B1 (ko) * 2015-01-28 2021-10-13 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
KR102320639B1 (ko) * 2015-02-04 2021-11-02 삼성디스플레이 주식회사 터치 스크린 패널 및 이의 제조 방법
KR102322084B1 (ko) * 2015-04-30 2021-11-04 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
JP2018537857A (ja) * 2015-12-03 2018-12-20 マイクロニック アクティエボラーグ ポリマー層を用いてワークピースを製造する方法及びシステム
KR102629580B1 (ko) * 2016-01-08 2024-01-26 삼성디스플레이 주식회사 플렉서블 터치 스크린 패널 및 플렉서블 터치 스크린 패널의 제조 방법
AR109584A1 (es) 2016-09-08 2018-12-26 Modumetal Inc Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
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CN112272717B (zh) 2018-04-27 2024-01-05 莫杜美拓有限公司 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法

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Also Published As

Publication number Publication date
JPH06350221A (ja) 1994-12-22
ATE180920T1 (de) 1999-06-15
DE69418746T2 (de) 1999-12-02
US5427841A (en) 1995-06-27
TW292989B (de) 1996-12-11
US5620800A (en) 1997-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: VOLMER, G., DIPL.-ING., PAT.-ANW., 52066 AACHEN

8339 Ceased/non-payment of the annual fee