ATE180920T1 - Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht - Google Patents

Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht

Info

Publication number
ATE180920T1
ATE180920T1 AT94200542T AT94200542T ATE180920T1 AT E180920 T1 ATE180920 T1 AT E180920T1 AT 94200542 T AT94200542 T AT 94200542T AT 94200542 T AT94200542 T AT 94200542T AT E180920 T1 ATE180920 T1 AT E180920T1
Authority
AT
Austria
Prior art keywords
layer
polymer layer
conductive
metal
metal layer
Prior art date
Application number
AT94200542T
Other languages
English (en)
Inventor
Leeuw Dagobertt Michel De
Cornelius Marcus Joha Mutsaers
Maurice Maria Johannes Simenon
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE180920T1 publication Critical patent/ATE180920T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C08G61/126Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/127Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/128Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0329Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
AT94200542T 1993-03-09 1994-03-03 Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht ATE180920T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP93200665 1993-03-09
EP93202602 1993-09-07

Publications (1)

Publication Number Publication Date
ATE180920T1 true ATE180920T1 (de) 1999-06-15

Family

ID=26133690

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94200542T ATE180920T1 (de) 1993-03-09 1994-03-03 Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht

Country Status (5)

Country Link
US (2) US5427841A (de)
JP (1) JPH06350221A (de)
AT (1) ATE180920T1 (de)
DE (1) DE69418746T2 (de)
TW (1) TW292989B (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532025A (en) * 1993-07-23 1996-07-02 Kinlen; Patrick J. Corrosion inhibiting compositions
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
DE19536844C1 (de) * 1995-10-02 1997-04-10 Bayer Ag Verfahren zur elektrostatischen Lackierung von nicht leitfähigen Oberflächen
EP0968537B1 (de) 1997-08-22 2012-05-02 Creator Technology B.V. Feld-effekt-transistor, der im wesentlichen aus organischen materialien besteht
US5980723A (en) * 1997-08-27 1999-11-09 Jude Runge-Marchese Electrochemical deposition of a composite polymer metal oxide
CN1171301C (zh) 1998-01-28 2004-10-13 薄膜电子有限公司 产生和擦除导电和半导电结构的方法及电场发生器调制器
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten
DE69827649T2 (de) * 1998-12-21 2005-12-01 Chi Mei Optoelectronics Corp. Elektrisch leitfähiges Verbundglas
EP1085319B1 (de) * 1999-09-13 2005-06-01 Interuniversitair Micro-Elektronica Centrum Vzw Vorrichtung auf Basis von organischem Material zur Erfassung eines Probenanalyts
US20040043162A1 (en) * 1999-10-15 2004-03-04 Agfa-Gevaert Use of a polythiophene for aligning liquid crystals
US7357965B1 (en) * 1999-10-15 2008-04-15 Agfa-Gevaert, N.V. Liquid crystal alignment layer
EP1096674B1 (de) * 1999-10-29 2013-03-27 Kyocera Corporation Schaltungssubstrat
JP3456461B2 (ja) * 2000-02-21 2003-10-14 Tdk株式会社 パターニング方法、薄膜デバイスの製造方法及び薄膜磁気ヘッドの製造方法
US6730857B2 (en) * 2001-03-13 2004-05-04 International Business Machines Corporation Structure having laser ablated features and method of fabricating
US6623903B2 (en) 2001-06-22 2003-09-23 Agfa-Gevaert Material and method for making an electroconductive pattern
JP4077405B2 (ja) * 2001-06-22 2008-04-16 アグフア−ゲヴエルト,ナームローゼ・フエンノートシヤツプ 導電性パターンの形成のための材料及び方法
US6649327B2 (en) * 2001-10-25 2003-11-18 The United States Of America As Represented By The Secretary Of The Navy Method of patterning electrically conductive polymers
WO2004017439A2 (de) * 2002-07-29 2004-02-26 Siemens Aktiengesellschaft Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu
WO2004047194A2 (de) * 2002-11-19 2004-06-03 Polyic Gmbh & Co.Kg Organisches elektronisches bauelement mit gleichem organischem material für zumindest zwei funktionsschichten
US7972534B2 (en) * 2003-04-02 2011-07-05 H. C. Starck Gmbh Retarding oxidants for preparing conductive polymers
US7063762B2 (en) * 2003-08-20 2006-06-20 Endicott Interconnect Technologies, Inc. Circuitized substrate and method of making same
US7320813B2 (en) * 2003-12-15 2008-01-22 The United States Of America As Represented By The Secretary Of The Navy Synthesis of highly conducting and transparent thin polymer films
US7449758B2 (en) * 2004-08-17 2008-11-11 California Institute Of Technology Polymeric piezoresistive sensors
US7279268B2 (en) * 2004-09-09 2007-10-09 Intel Corporation Conductive lithographic polymer and method of making devices using same
JP2008532206A (ja) * 2004-12-30 2008-08-14 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 照射を使用するデバイスのパターニング
WO2007016403A2 (en) * 2005-08-01 2007-02-08 Plextronics, Inc. Latent doping of conducting polymers
JP5301993B2 (ja) 2005-08-12 2013-09-25 モジュメタル エルエルシー 組成変調複合材料及びその形成方法
US7932520B2 (en) * 2006-04-07 2011-04-26 Chimei Innolux Corporation Organic light emitting device and method of fabricating the same
TWI303535B (en) * 2006-04-07 2008-11-21 Chi Mei El Corp Organic light emitting device and method of fabricating the same
EP2222755B1 (de) * 2007-12-07 2016-10-05 Agfa-Gevaert N.V. Schichtaufbau mit verbesserter stabilität gegenüber der einwirkung von sonnenlicht
US8865025B2 (en) * 2008-04-11 2014-10-21 Solvay Usa, Inc. Doped conjugated polymers, devices, and methods of making devices
IT1392069B1 (it) * 2008-11-27 2012-02-09 St Microelectronics Srl Metodo per realizzare un dispositivo elettronico organico a film sottile e corrispondente dispositivo
CN102639758B (zh) 2009-06-08 2016-05-18 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
KR100969172B1 (ko) * 2009-06-22 2010-07-14 한국기계연구원 마스크 템플릿을 이용한 미세패턴 형성방법
EP2453471A3 (de) * 2010-11-15 2013-05-15 Dyconex AG Verfahren zur galvanischen Abscheidung einer Elektrode auf einem dielektrischen Substrat
TWI462244B (zh) * 2011-10-17 2014-11-21 Ind Tech Res Inst 異方向性導電膜片及其製作方法
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
WO2014145771A1 (en) * 2013-03-15 2014-09-18 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
EP2971266A4 (de) 2013-03-15 2017-03-01 Modumetal, Inc. Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen
JP6171609B2 (ja) * 2013-06-19 2017-08-02 東ソー株式会社 透明導電膜用塗工液及びこれを用いた透明導電膜
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN106794673B (zh) 2014-09-18 2021-01-22 莫杜美拓有限公司 通过电沉积和添加制造工艺制备制品的方法
KR102312314B1 (ko) * 2015-01-28 2021-10-13 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
KR102320639B1 (ko) * 2015-02-04 2021-11-02 삼성디스플레이 주식회사 터치 스크린 패널 및 이의 제조 방법
KR102322084B1 (ko) * 2015-04-30 2021-11-04 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
WO2017092923A1 (en) * 2015-12-03 2017-06-08 Mycronic AB Method and system for manufacturing a workpiece using a polymer layer
KR102629580B1 (ko) * 2016-01-08 2024-01-26 삼성디스플레이 주식회사 플렉서블 터치 스크린 패널 및 플렉서블 터치 스크린 패널의 제조 방법
AR109584A1 (es) 2016-09-08 2018-12-26 Modumetal Inc Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos
CN110637107B (zh) 2017-03-24 2022-08-19 莫杜美拓有限公司 具有电镀层的升降柱塞以及用于生产其的系统和方法
WO2018195516A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
US11519093B2 (en) 2018-04-27 2022-12-06 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3793106A (en) * 1969-12-31 1974-02-19 Macdermid Inc Process for forming plastic parts having surfaces receptive to adherent coatings
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US5264108A (en) * 1992-09-08 1993-11-23 The United States Of America As Represented By The United States Department Of Energy Laser patterning of laminated structures for electroplating

Also Published As

Publication number Publication date
DE69418746T2 (de) 1999-12-02
DE69418746D1 (de) 1999-07-08
US5620800A (en) 1997-04-15
JPH06350221A (ja) 1994-12-22
TW292989B (de) 1996-12-11
US5427841A (en) 1995-06-27

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