ATE180920T1 - Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht - Google Patents
Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschichtInfo
- Publication number
- ATE180920T1 ATE180920T1 AT94200542T AT94200542T ATE180920T1 AT E180920 T1 ATE180920 T1 AT E180920T1 AT 94200542 T AT94200542 T AT 94200542T AT 94200542 T AT94200542 T AT 94200542T AT E180920 T1 ATE180920 T1 AT E180920T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- polymer layer
- conductive
- metal
- metal layer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP93200665 | 1993-03-09 | ||
EP93202602 | 1993-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE180920T1 true ATE180920T1 (de) | 1999-06-15 |
Family
ID=26133690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT94200542T ATE180920T1 (de) | 1993-03-09 | 1994-03-03 | Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht |
Country Status (5)
Country | Link |
---|---|
US (2) | US5427841A (de) |
JP (1) | JPH06350221A (de) |
AT (1) | ATE180920T1 (de) |
DE (1) | DE69418746T2 (de) |
TW (1) | TW292989B (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532025A (en) * | 1993-07-23 | 1996-07-02 | Kinlen; Patrick J. | Corrosion inhibiting compositions |
US5415762A (en) * | 1993-08-18 | 1995-05-16 | Shipley Company Inc. | Electroplating process and composition |
DE19536844C1 (de) * | 1995-10-02 | 1997-04-10 | Bayer Ag | Verfahren zur elektrostatischen Lackierung von nicht leitfähigen Oberflächen |
EP0968537B1 (de) | 1997-08-22 | 2012-05-02 | Creator Technology B.V. | Feld-effekt-transistor, der im wesentlichen aus organischen materialien besteht |
US5980723A (en) * | 1997-08-27 | 1999-11-09 | Jude Runge-Marchese | Electrochemical deposition of a composite polymer metal oxide |
CN1171301C (zh) | 1998-01-28 | 2004-10-13 | 薄膜电子有限公司 | 产生和擦除导电和半导电结构的方法及电场发生器调制器 |
DE19822075C2 (de) * | 1998-05-16 | 2002-03-21 | Enthone Gmbh | Verfahren zur metallischen Beschichtung von Substraten |
DE69827649T2 (de) * | 1998-12-21 | 2005-12-01 | Chi Mei Optoelectronics Corp. | Elektrisch leitfähiges Verbundglas |
EP1085319B1 (de) * | 1999-09-13 | 2005-06-01 | Interuniversitair Micro-Elektronica Centrum Vzw | Vorrichtung auf Basis von organischem Material zur Erfassung eines Probenanalyts |
US20040043162A1 (en) * | 1999-10-15 | 2004-03-04 | Agfa-Gevaert | Use of a polythiophene for aligning liquid crystals |
US7357965B1 (en) * | 1999-10-15 | 2008-04-15 | Agfa-Gevaert, N.V. | Liquid crystal alignment layer |
EP1096674B1 (de) * | 1999-10-29 | 2013-03-27 | Kyocera Corporation | Schaltungssubstrat |
JP3456461B2 (ja) * | 2000-02-21 | 2003-10-14 | Tdk株式会社 | パターニング方法、薄膜デバイスの製造方法及び薄膜磁気ヘッドの製造方法 |
US6730857B2 (en) * | 2001-03-13 | 2004-05-04 | International Business Machines Corporation | Structure having laser ablated features and method of fabricating |
US6623903B2 (en) | 2001-06-22 | 2003-09-23 | Agfa-Gevaert | Material and method for making an electroconductive pattern |
JP4077405B2 (ja) * | 2001-06-22 | 2008-04-16 | アグフア−ゲヴエルト,ナームローゼ・フエンノートシヤツプ | 導電性パターンの形成のための材料及び方法 |
US6649327B2 (en) * | 2001-10-25 | 2003-11-18 | The United States Of America As Represented By The Secretary Of The Navy | Method of patterning electrically conductive polymers |
WO2004017439A2 (de) * | 2002-07-29 | 2004-02-26 | Siemens Aktiengesellschaft | Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu |
WO2004047194A2 (de) * | 2002-11-19 | 2004-06-03 | Polyic Gmbh & Co.Kg | Organisches elektronisches bauelement mit gleichem organischem material für zumindest zwei funktionsschichten |
US7972534B2 (en) * | 2003-04-02 | 2011-07-05 | H. C. Starck Gmbh | Retarding oxidants for preparing conductive polymers |
US7063762B2 (en) * | 2003-08-20 | 2006-06-20 | Endicott Interconnect Technologies, Inc. | Circuitized substrate and method of making same |
US7320813B2 (en) * | 2003-12-15 | 2008-01-22 | The United States Of America As Represented By The Secretary Of The Navy | Synthesis of highly conducting and transparent thin polymer films |
US7449758B2 (en) * | 2004-08-17 | 2008-11-11 | California Institute Of Technology | Polymeric piezoresistive sensors |
US7279268B2 (en) * | 2004-09-09 | 2007-10-09 | Intel Corporation | Conductive lithographic polymer and method of making devices using same |
JP2008532206A (ja) * | 2004-12-30 | 2008-08-14 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 照射を使用するデバイスのパターニング |
WO2007016403A2 (en) * | 2005-08-01 | 2007-02-08 | Plextronics, Inc. | Latent doping of conducting polymers |
JP5301993B2 (ja) | 2005-08-12 | 2013-09-25 | モジュメタル エルエルシー | 組成変調複合材料及びその形成方法 |
US7932520B2 (en) * | 2006-04-07 | 2011-04-26 | Chimei Innolux Corporation | Organic light emitting device and method of fabricating the same |
TWI303535B (en) * | 2006-04-07 | 2008-11-21 | Chi Mei El Corp | Organic light emitting device and method of fabricating the same |
EP2222755B1 (de) * | 2007-12-07 | 2016-10-05 | Agfa-Gevaert N.V. | Schichtaufbau mit verbesserter stabilität gegenüber der einwirkung von sonnenlicht |
US8865025B2 (en) * | 2008-04-11 | 2014-10-21 | Solvay Usa, Inc. | Doped conjugated polymers, devices, and methods of making devices |
IT1392069B1 (it) * | 2008-11-27 | 2012-02-09 | St Microelectronics Srl | Metodo per realizzare un dispositivo elettronico organico a film sottile e corrispondente dispositivo |
CN102639758B (zh) | 2009-06-08 | 2016-05-18 | 莫杜美拓有限公司 | 用于防腐蚀的电镀纳米叠层涂层和包层 |
KR100969172B1 (ko) * | 2009-06-22 | 2010-07-14 | 한국기계연구원 | 마스크 템플릿을 이용한 미세패턴 형성방법 |
EP2453471A3 (de) * | 2010-11-15 | 2013-05-15 | Dyconex AG | Verfahren zur galvanischen Abscheidung einer Elektrode auf einem dielektrischen Substrat |
TWI462244B (zh) * | 2011-10-17 | 2014-11-21 | Ind Tech Res Inst | 異方向性導電膜片及其製作方法 |
BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
EA201500949A1 (ru) | 2013-03-15 | 2016-02-29 | Модьюметл, Инк. | Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие |
WO2014145771A1 (en) * | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes |
EP2971266A4 (de) | 2013-03-15 | 2017-03-01 | Modumetal, Inc. | Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen |
JP6171609B2 (ja) * | 2013-06-19 | 2017-08-02 | 東ソー株式会社 | 透明導電膜用塗工液及びこれを用いた透明導電膜 |
CA2961508C (en) | 2014-09-18 | 2024-04-09 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
CN106794673B (zh) | 2014-09-18 | 2021-01-22 | 莫杜美拓有限公司 | 通过电沉积和添加制造工艺制备制品的方法 |
KR102312314B1 (ko) * | 2015-01-28 | 2021-10-13 | 삼성디스플레이 주식회사 | 터치 센서 장치 및 그 제조 방법 |
KR102320639B1 (ko) * | 2015-02-04 | 2021-11-02 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 이의 제조 방법 |
KR102322084B1 (ko) * | 2015-04-30 | 2021-11-04 | 삼성디스플레이 주식회사 | 터치 센서 장치 및 그 제조 방법 |
WO2017092923A1 (en) * | 2015-12-03 | 2017-06-08 | Mycronic AB | Method and system for manufacturing a workpiece using a polymer layer |
KR102629580B1 (ko) * | 2016-01-08 | 2024-01-26 | 삼성디스플레이 주식회사 | 플렉서블 터치 스크린 패널 및 플렉서블 터치 스크린 패널의 제조 방법 |
AR109584A1 (es) | 2016-09-08 | 2018-12-26 | Modumetal Inc | Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos |
CN110637107B (zh) | 2017-03-24 | 2022-08-19 | 莫杜美拓有限公司 | 具有电镀层的升降柱塞以及用于生产其的系统和方法 |
WO2018195516A1 (en) | 2017-04-21 | 2018-10-25 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
US11519093B2 (en) | 2018-04-27 | 2022-12-06 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3793106A (en) * | 1969-12-31 | 1974-02-19 | Macdermid Inc | Process for forming plastic parts having surfaces receptive to adherent coatings |
US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
US5264108A (en) * | 1992-09-08 | 1993-11-23 | The United States Of America As Represented By The United States Department Of Energy | Laser patterning of laminated structures for electroplating |
-
1994
- 1994-02-28 US US08/203,104 patent/US5427841A/en not_active Expired - Fee Related
- 1994-03-03 AT AT94200542T patent/ATE180920T1/de not_active IP Right Cessation
- 1994-03-03 DE DE69418746T patent/DE69418746T2/de not_active Expired - Fee Related
- 1994-03-03 TW TW083101852A patent/TW292989B/zh active
- 1994-03-07 JP JP6035952A patent/JPH06350221A/ja active Pending
-
1995
- 1995-03-30 US US08/413,747 patent/US5620800A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69418746T2 (de) | 1999-12-02 |
DE69418746D1 (de) | 1999-07-08 |
US5620800A (en) | 1997-04-15 |
JPH06350221A (ja) | 1994-12-22 |
TW292989B (de) | 1996-12-11 |
US5427841A (en) | 1995-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |