KR950007618A - 구리부착적층판 및 프린트배선판 - Google Patents

구리부착적층판 및 프린트배선판 Download PDF

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Publication number
KR950007618A
KR950007618A KR1019930015101A KR930015101A KR950007618A KR 950007618 A KR950007618 A KR 950007618A KR 1019930015101 A KR1019930015101 A KR 1019930015101A KR 930015101 A KR930015101 A KR 930015101A KR 950007618 A KR950007618 A KR 950007618A
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KR
South Korea
Prior art keywords
copper
printed wiring
board
copper clad
wiring boards
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KR1019930015101A
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English (en)
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KR0127665B1 (ko
Inventor
무네오 사이다
유타카 히라자와
카쯔히로 요시무라
Original Assignee
카와키타 토오루
미쯔이킨조쿠코교 가부시기가이샤
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=13867972&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR950007618(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 카와키타 토오루, 미쯔이킨조쿠코교 가부시기가이샤 filed Critical 카와키타 토오루
Publication of KR950007618A publication Critical patent/KR950007618A/ko
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal

Abstract

본 발명은, 박리강도를 저하시키는 일없이, 높은 값의 에칭팩터를 얻게되고, 또한 배선패턴의 근본에 구리입자가 부착, 잔존하는 일 없고, 미세한 파인위치의 배선패턴을 가진 프린트배선판 및 이것에 사용되는 구리부착적 층판을 제공하는 것을 목적으로 한 것이며, 그 구성에 있어서, 광택면(1a)쪽에 구리전착물(2)이 형성된 전해구리박(1)을, 기판(3)의 한쪽면 또는 양면에, 그 광택면(1a)쪽에서 접착해서 이루어진 구리부착적층판 및 이 구리부착적층판을 사용한 프린트배선판인 것을 특징으로 하는 것이다.

Description

구리부착적층판 및 프린트배선판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 배선패턴의 에칭팩터에 대한 설명도.
제2도는 본 발명의 구리부착적층판의 제조공정도.
제3도는 실시예 1에 의해 얻게된 피인피치의 배선패턴의 단면도.
제4도는 비교예 2에 의해 얻게된 피인피치의 배선패턴의 단면도.

Claims (2)

  1. 광택면쪽에 구리전착물이 형성된 전해구리박을, 기판의 한쪽면 또는 양면에, 그 광택면쪽에서 접착해서 이루어지는 구리부착적층판.
  2. 특허청구 범위 제1항 기재의 구기부착적층판을 사용한 프린트배선판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930015101A 1993-03-19 1993-08-04 구리부착적층판 및 프린트배선판 KR0127665B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5085765A JP2762386B2 (ja) 1993-03-19 1993-03-19 銅張り積層板およびプリント配線板
JP92-85765 1993-03-19
JP93-85765 1993-03-19

Publications (2)

Publication Number Publication Date
KR950007618A true KR950007618A (ko) 1995-03-21
KR0127665B1 KR0127665B1 (ko) 1997-12-30

Family

ID=13867972

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930015101A KR0127665B1 (ko) 1993-03-19 1993-08-04 구리부착적층판 및 프린트배선판

Country Status (10)

Country Link
US (1) US5437914A (ko)
EP (1) EP0616489B1 (ko)
JP (1) JP2762386B2 (ko)
KR (1) KR0127665B1 (ko)
AT (1) ATE155311T1 (ko)
DE (1) DE69312049T2 (ko)
ES (1) ES2105046T3 (ko)
MY (1) MY108905A (ko)
SG (1) SG46186A1 (ko)
TW (1) TW232120B (ko)

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JP5636224B2 (ja) * 2010-08-06 2014-12-03 三井金属鉱業株式会社 フィラー含有樹脂層付金属箔及びフィラー含有樹脂層付金属箔の製造方法
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CN104244586A (zh) * 2013-07-04 2014-12-24 漳州市福世通电子有限公司 一种卷式ic卡线路板铜箔与基材的固化方法
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Also Published As

Publication number Publication date
JPH06270331A (ja) 1994-09-27
TW232120B (ko) 1994-10-11
EP0616489A1 (en) 1994-09-21
KR0127665B1 (ko) 1997-12-30
JP2762386B2 (ja) 1998-06-04
SG46186A1 (en) 1998-02-20
DE69312049T2 (de) 1998-02-26
EP0616489B1 (en) 1997-07-09
MY108905A (en) 1996-11-30
DE69312049D1 (de) 1997-08-14
ES2105046T3 (es) 1997-10-16
ATE155311T1 (de) 1997-07-15
US5437914A (en) 1995-08-01

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