DE69918086D1 - Trennfolien aus stahllegierung und kupfer/stahl-verbundfolien zur anwendung in der herstellung von leiterplatten - Google Patents
Trennfolien aus stahllegierung und kupfer/stahl-verbundfolien zur anwendung in der herstellung von leiterplattenInfo
- Publication number
- DE69918086D1 DE69918086D1 DE69918086T DE69918086T DE69918086D1 DE 69918086 D1 DE69918086 D1 DE 69918086D1 DE 69918086 T DE69918086 T DE 69918086T DE 69918086 T DE69918086 T DE 69918086T DE 69918086 D1 DE69918086 D1 DE 69918086D1
- Authority
- DE
- Germany
- Prior art keywords
- films
- steel alloy
- copper
- steel
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US210349 | 1994-03-23 | ||
US58262 | 1998-04-10 | ||
US09/058,262 US6129998A (en) | 1998-04-10 | 1998-04-10 | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US09/182,956 US6127051A (en) | 1998-04-10 | 1998-10-29 | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US182956 | 1998-10-29 | ||
US193461 | 1998-11-17 | ||
US09/193,461 US6129990A (en) | 1998-04-10 | 1998-11-17 | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US09/210,349 US6130000A (en) | 1998-04-10 | 1998-12-11 | Copper and steel components for use in manufacturing printed circuit boards |
PCT/US1999/007795 WO1999053737A1 (en) | 1998-04-10 | 1999-04-09 | Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69918086D1 true DE69918086D1 (de) | 2004-07-22 |
DE69918086T2 DE69918086T2 (de) | 2005-07-07 |
Family
ID=27489958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69918086T Expired - Fee Related DE69918086T2 (de) | 1998-04-10 | 1999-04-09 | Trennfolien aus stahllegierung und kupfer/stahl-verbundfolien zur anwendung in der herstellung von leiterplatten |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1070443B1 (de) |
JP (1) | JP2002511663A (de) |
AT (1) | ATE269630T1 (de) |
AU (1) | AU3485699A (de) |
DE (1) | DE69918086T2 (de) |
TW (1) | TW407440B (de) |
WO (1) | WO1999053737A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6955740B2 (en) | 2002-01-10 | 2005-10-18 | Polyclad Laminates, Inc. | Production of laminates for printed wiring boards using protective carrier |
AT411893B (de) * | 2002-12-27 | 2004-07-26 | C2C Technologie Fuer Leiterpla | Trennplatte zum herstellen von leiterplattenkomponenten |
CN117177461A (zh) * | 2023-09-28 | 2023-12-05 | 威科电子模块(深圳)有限公司 | 一种厚膜电路板的印刷工艺 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765048A1 (de) * | 1968-03-26 | 1971-07-01 | Siemens Ag | Verfahren zum Kontaktieren von Stromtraegern aus Aluminium |
JP2556897B2 (ja) * | 1989-02-23 | 1996-11-27 | ファナック株式会社 | 多層プリント配線板の外層材及び製造方法 |
DE4116543C2 (de) * | 1991-05-21 | 1995-07-27 | Siemens Nixdorf Inf Syst | Verfahren zum Verpressen von mehrlagigen Leiterplatten |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
US5942314A (en) * | 1997-04-17 | 1999-08-24 | Mitsui Mining & Smelting Co., Ltd. | Ultrasonic welding of copper foil |
DE29719716U1 (de) * | 1997-11-06 | 1997-12-11 | Carl Aug. Picard GmbH & Co. KG, 42857 Remscheid | Trennblech |
-
1999
- 1999-04-09 TW TW088105668A patent/TW407440B/zh not_active IP Right Cessation
- 1999-04-09 EP EP99916559A patent/EP1070443B1/de not_active Expired - Lifetime
- 1999-04-09 DE DE69918086T patent/DE69918086T2/de not_active Expired - Fee Related
- 1999-04-09 AU AU34856/99A patent/AU3485699A/en not_active Abandoned
- 1999-04-09 AT AT99916559T patent/ATE269630T1/de not_active IP Right Cessation
- 1999-04-09 WO PCT/US1999/007795 patent/WO1999053737A1/en not_active Application Discontinuation
- 1999-04-09 JP JP2000544167A patent/JP2002511663A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TW407440B (en) | 2000-10-01 |
DE69918086T2 (de) | 2005-07-07 |
JP2002511663A (ja) | 2002-04-16 |
ATE269630T1 (de) | 2004-07-15 |
EP1070443A1 (de) | 2001-01-24 |
WO1999053737A1 (en) | 1999-10-21 |
AU3485699A (en) | 1999-11-01 |
EP1070443B1 (de) | 2004-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |