CN101472404A - 多层电路板及其制作方法 - Google Patents
多层电路板及其制作方法 Download PDFInfo
- Publication number
- CN101472404A CN101472404A CN200710203397.4A CN200710203397A CN101472404A CN 101472404 A CN101472404 A CN 101472404A CN 200710203397 A CN200710203397 A CN 200710203397A CN 101472404 A CN101472404 A CN 101472404A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating barrier
- hole
- pressing
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000003825 pressing Methods 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 230000004888 barrier function Effects 0.000 claims description 78
- 238000002360 preparation method Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 34
- 238000010586 diagram Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920006361 Polyflon Polymers 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (9)
- 【权利要求1】一种多层电路板的制作方法,包括步骤:提供形成在离型基底表面的铜箔,并将所述铜箔制作为线路;提供具有通孔的绝缘层,并对通孔进行金属化;将多个形成在离型基底表面的线路与多个具有金属化通孔的绝缘层进行交替叠合形成预定层数的预压合电路板,使得该预压合电路板中每一绝缘层的两个相对表面分别结合有一层线路,且使得该绝缘层两个相对表面的线路分别覆盖该绝缘层中的金属化通孔;对上述得到的预压合电路板进行压合,从而得到多层电路板。
- 【权利要求2】如权利要求1所述的多层电路板的制作方法,其特征在于,在交替叠合形成预压合电路板过程中,处于该预压合电路板内层的线路与绝缘层结合后,去除与该内层线路相结合的离型基底。
- 【权利要求3】如权利要求2所述的多层电路板的制作方法,其特征在于,对所述预压合电路板进行压合后去除处于该预压合电路板最外层的离型基底。
- 【权利要求4】如权利要求1所述的多层电路板的制作方法,其特征在于,所述形成在离型基底表面的铜箔是将铜箔与离型材料压合于一起而制得的。
- 【权利要求5】如权利要求1所述的多层电路板的制作方法,其特征在于,所述将所述铜箔制作为线路的方法包括激光法或化学蚀刻法。
- 【权利要求6】如权利要求1所述的多层电路板的制作方法,其特征在于,所述绝缘层为半固化胶片。
- 【权利要求7】如权利要求1所述的多层电路板的制作方法,其特征在于,进行压合制程前在离型基底以及绝缘层中分别形成对位孔。
- 【权利要求8】如权利要求1所述的方法制作的多层电路板,其包括多个内层板,每一内层板包括具有金属化通孔的绝缘层与形成于该绝缘层两相对表面的线路,所述形成于该绝缘层两相对表面的线路分别将该绝缘层中的金属化通孔的两端覆盖使得该金属化通孔成为盲孔。
- 【权利要求9】如权利要求8所述的多层电路板,其特征在于,所述绝缘层为半固化胶片,形成于该绝缘层两相对表面的线路嵌设于该绝缘层中。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710203397.4A CN101472404B (zh) | 2007-12-25 | 2007-12-25 | 多层电路板及其制作方法 |
US12/164,422 US8052881B2 (en) | 2007-12-25 | 2008-06-30 | Method of manufacturing multilayer printed circuit board having buried holes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710203397.4A CN101472404B (zh) | 2007-12-25 | 2007-12-25 | 多层电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101472404A true CN101472404A (zh) | 2009-07-01 |
CN101472404B CN101472404B (zh) | 2011-12-07 |
Family
ID=40787362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710203397.4A Expired - Fee Related CN101472404B (zh) | 2007-12-25 | 2007-12-25 | 多层电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8052881B2 (zh) |
CN (1) | CN101472404B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101772280B (zh) * | 2009-12-23 | 2011-11-09 | 深南电路有限公司 | 一种丝网塞孔的制作工艺 |
CN101695224B (zh) * | 2009-11-06 | 2011-12-28 | 深南电路有限公司 | 多层印刷电路板的加工方法 |
CN102595799A (zh) * | 2011-12-30 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | 高密度互联印刷电路板的制造方法 |
CN102083282B (zh) * | 2009-11-27 | 2012-11-21 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
WO2015032102A1 (zh) * | 2013-09-09 | 2015-03-12 | 富国工业(惠阳)有限公司 | 一种线路板加工工艺 |
CN105140206A (zh) * | 2014-05-26 | 2015-12-09 | 旭德科技股份有限公司 | 基板结构及其制作方法 |
CN107416581A (zh) * | 2016-05-24 | 2017-12-01 | Jx金属株式会社 | 卷筒状积层体及其制造方法,以及制造积层体、增层基板、印刷配线板、电子机器的方法 |
CN115529747A (zh) * | 2022-05-19 | 2022-12-27 | 世大新材料(深圳)有限公司 | 多层板生产线及多层线路板加工方法 |
CN115529726A (zh) * | 2022-05-19 | 2022-12-27 | 世大新材料(深圳)有限公司 | 多用途线路板生产线、多用途生产线的应用及其制备方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9426901B2 (en) * | 2011-10-12 | 2016-08-23 | General Electric Company | Patterning method for component boards |
CN103379750B (zh) * | 2012-04-27 | 2016-06-01 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
CN104378931B (zh) * | 2014-11-21 | 2017-11-28 | 江门崇达电路技术有限公司 | 一种pcb中金属化沉孔的制作方法 |
CN104812163A (zh) * | 2015-04-07 | 2015-07-29 | 广东欧珀移动通信有限公司 | 一种hdi pcb叠层结构 |
CN105555040B (zh) * | 2016-02-03 | 2019-02-12 | 江门崇达电路技术有限公司 | 一种可提高外层图形及钻孔位置精度的pcb的制作方法 |
CN105848428B (zh) * | 2016-04-22 | 2018-07-31 | 深圳崇达多层线路板有限公司 | 一种在pcb上制作金属化盲孔的方法 |
JP7086503B2 (ja) * | 2018-06-20 | 2022-06-20 | コナ アイ カンパニー リミテッド | メタルカードの製造方法 |
CN111542178B (zh) * | 2020-05-13 | 2021-07-16 | 上海泽丰半导体科技有限公司 | 一种多层电路板的制作工艺和多层电路板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1194023A4 (en) * | 1999-12-14 | 2005-11-09 | Matsushita Electric Ind Co Ltd | MULTILAYER CONDUCTOR PLATE AND ITS MANUFACTURING METHOD |
TWI242398B (en) * | 2000-06-14 | 2005-10-21 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of manufacturing the same |
JP3653452B2 (ja) * | 2000-07-31 | 2005-05-25 | 株式会社ノース | 配線回路基板とその製造方法と半導体集積回路装置とその製造方法 |
JP2004079773A (ja) * | 2002-08-19 | 2004-03-11 | Taiyo Yuden Co Ltd | 多層プリント配線板及びその製造方法 |
JP4383219B2 (ja) * | 2003-04-01 | 2009-12-16 | 日本シイエムケイ株式会社 | プリント配線板の製造方法 |
US7178229B2 (en) * | 2003-11-20 | 2007-02-20 | E. I. Du Pont De Nemours And Company | Method of making interlayer panels |
KR100970063B1 (ko) * | 2005-04-27 | 2010-07-16 | 히다치 가세고교 가부시끼가이샤 | 복합체, 프리프레그, 금속박장 적층판, 회로 기판 접속재및 다층 인쇄 배선판 및 그의 제조 방법 |
US8809690B2 (en) * | 2010-03-04 | 2014-08-19 | Rogers Corporation | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
-
2007
- 2007-12-25 CN CN200710203397.4A patent/CN101472404B/zh not_active Expired - Fee Related
-
2008
- 2008-06-30 US US12/164,422 patent/US8052881B2/en not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101695224B (zh) * | 2009-11-06 | 2011-12-28 | 深南电路有限公司 | 多层印刷电路板的加工方法 |
CN102083282B (zh) * | 2009-11-27 | 2012-11-21 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
CN101772280B (zh) * | 2009-12-23 | 2011-11-09 | 深南电路有限公司 | 一种丝网塞孔的制作工艺 |
CN102595799A (zh) * | 2011-12-30 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | 高密度互联印刷电路板的制造方法 |
CN102595799B (zh) * | 2011-12-30 | 2015-03-25 | 柏承科技(昆山)股份有限公司 | 高密度互联印刷电路板的制造方法 |
WO2015032102A1 (zh) * | 2013-09-09 | 2015-03-12 | 富国工业(惠阳)有限公司 | 一种线路板加工工艺 |
CN105140206A (zh) * | 2014-05-26 | 2015-12-09 | 旭德科技股份有限公司 | 基板结构及其制作方法 |
US9538647B2 (en) | 2014-05-26 | 2017-01-03 | Subtron Technology Co., Ltd. | Substrate structure and manufacturing method thereof |
CN105140206B (zh) * | 2014-05-26 | 2018-05-25 | 旭德科技股份有限公司 | 基板结构及其制作方法 |
CN107416581A (zh) * | 2016-05-24 | 2017-12-01 | Jx金属株式会社 | 卷筒状积层体及其制造方法,以及制造积层体、增层基板、印刷配线板、电子机器的方法 |
CN115529747A (zh) * | 2022-05-19 | 2022-12-27 | 世大新材料(深圳)有限公司 | 多层板生产线及多层线路板加工方法 |
CN115529726A (zh) * | 2022-05-19 | 2022-12-27 | 世大新材料(深圳)有限公司 | 多用途线路板生产线、多用途生产线的应用及其制备方法 |
WO2023221809A1 (zh) * | 2022-05-19 | 2023-11-23 | 世大新材料(深圳)有限公司 | 多层板生产线及多层线路板加工方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090159559A1 (en) | 2009-06-25 |
CN101472404B (zh) | 2011-12-07 |
US8052881B2 (en) | 2011-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101472404B (zh) | 多层电路板及其制作方法 | |
US7152318B2 (en) | Method for manufacturing built-up printed circuit board with stacked type via-holes | |
US10064292B2 (en) | Recessed cavity in printed circuit board protected by LPI | |
JP2006165496A (ja) | ビアポストにより層間伝導性を有するパラレル多層プリント基板およびその製造方法 | |
TW201406224A (zh) | 多層線路板及其製作方法 | |
KR20110028951A (ko) | 인쇄회로기판 및 그의 제조방법 | |
CN102246608A (zh) | 布线板及其制造方法 | |
CN110167289B (zh) | 一种多层电路板的制作方法 | |
TW201406222A (zh) | 多層線路板及其製作方法 | |
KR20110081856A (ko) | 배선판 및 그의 제조 방법 | |
KR20040083152A (ko) | 다층 연성 인쇄회로기판의 제조방법 | |
KR20070037859A (ko) | 구리 필 도금을 이용한 인쇄회로기판의 제조 방법 | |
KR100744994B1 (ko) | 다층 인쇄회로기판 및 그 제조방법 | |
CN103582321A (zh) | 多层线路板及其制作方法 | |
CN103037637A (zh) | 多层电路板及多层电路板的制作方法 | |
CN208691632U (zh) | 一种双面电路板 | |
CN111417271A (zh) | 一种多层pcb板及其制备方法 | |
KR100754071B1 (ko) | 전층 ivh 공법의 인쇄회로기판의 제조방법 | |
CN102958293A (zh) | 具有断差结构的电路板的制作方法 | |
KR20030071112A (ko) | 빌드업 인쇄회로기판 및 이의 제조공정 | |
JPH01140698A (ja) | 多層印刷配線板の製造方法 | |
KR20100019781A (ko) | 패키지 기판 제조방법 | |
KR100567088B1 (ko) | 인쇄회로기판에서의 부품 삽입홀의 가공 방법 | |
KR101936415B1 (ko) | 도전볼을 이용한 동박 적층판의 제조방법 | |
JP2001237549A (ja) | 多層配線基板およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 518103 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 |