CN105140206B - 基板结构及其制作方法 - Google Patents
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Abstract
本发明公开一种基板结构及其制作方法。该基板结构包括基板以及承载器。基板包括第一贯孔、第一表面以及相对第一表面的第二表面。第一贯孔贯穿基板,以连通第一表面及第二表面。承载器包括第二贯孔、离型层、绝缘胶层以及金属层。绝缘胶层设置于离型层以及金属层之间。承载器以离型层贴附于第二表面。第二贯孔对应第一贯孔而贯穿承载器,以暴露第一贯孔。
Description
技术领域
本发明涉及一种基板结构及其制作方法,且特别是涉及一种基板与承载器可分离的基板结构及其制作方法。
背景技术
在各类电子产品中都会使用到电路基板作为电信号传导、电源供应、接地的连接。随着电子产品的微小化,电路基板也越来越朝向轻薄且线路密集化的趋势发展。然而,上述轻薄化的基板在芯片封装制作工艺中,容易造成基板破裂或是打线不良的情形发生,为了提高制作工艺良率及工作效率,一般会先将多个良品基板通过黏着层黏贴于承载器上,以提升基板整体结构的刚性,再将此黏贴后的基板与承载器进行后续的芯片封装处理。
然而,当基板具有用以排气或共振的气孔或音孔以符合其特殊需求时,气孔或音孔内的空气容易因热压合或是其他高温制作工艺而受热膨胀,进而推挤覆盖气孔或音孔的承载器,导致基板在处理过程中自承载器脱离的问题,影响制作工艺良率。因此,业界极需要一种既可使基板与承载器在制作工艺处理过程中稳定结合,又能使基板与承载器易于分离的方法。
发明内容
本发明的目的在于提供一种基板结构,其良率较高且承载器可与基板分离。
本发明的再一目的在于提供一种基板结构的制作方法,其制作出来的基板结构的良率较高且承载器可与基板分离。
为达上述目的,本发明的基板结构包括基板以及承载器。基板包括第一贯孔、第一表面以及相对第一表面的第二表面。第一贯孔贯穿基板,以连通第一表面及第二表面。承载器包括第二贯孔、离型层、绝缘胶层以及金属层。绝缘胶层设置于离型层以及金属层之间。承载器以离型层贴附于第二表面。第二贯孔对应第一贯孔而贯穿承载器,以暴露第一贯孔。
本发明的基板结构的制作方法包括下列步骤。首先,提供基板。基板包括第一表面以及相对第一表面的第二表面。接着,形成第一贯孔于基板上。第一贯孔贯穿基板,以连通第一表面及第二表面。接着,提供承载器。承载器包括离型层、绝缘胶层以及金属层。绝缘胶层设置于离型层以及金属层之间。之后,形成第二贯孔于承载器上,其中,第二贯孔贯穿承载器。接着,压合基板于承载器的离型层上,其中,第二贯孔的位置对应于第一贯孔,以暴露第一贯孔。
在本发明的一实施例中,上述的第二贯孔的孔径大于第一贯孔的孔径。
在本发明的一实施例中,上述的离型层的材料包括聚乙烯对苯二甲酸酯(polyethylene terephthalate,PET)或聚酰亚胺薄膜(PI film)。
在本发明的一实施例中,上述的绝缘胶层的材料包括半固化树脂(prepreg)。
在本发明的一实施例中,上述的金属层包括铜箔层。
在本发明的一实施例中,上述的基板为单层线路板。
在本发明的一实施例中,上述的基板为多层线路板。
在本发明的一实施例中,上述的基板还包括介电层、多个接垫以及图案化防焊层。接垫分别设置于介电层的相对两表面。图案化防焊层覆盖两表面并暴露接垫。第一贯孔贯穿介电层以及图案化防焊层。
在本发明的一实施例中,上述的基板还包括多个导通孔。各导通孔分别连接对应设置于两表面的接垫。
在本发明的一实施例中,上述的基板结构还包括覆盖接垫的表面处理层。
在本发明的一实施例中,上述的提供形成第一贯孔及第二贯孔的方式包括机械钻孔。
在本发明的一实施例中,上述的提供该承载器的步骤还包括:压合离型层、绝缘胶层以及金属层,以形成承载器。
基于上述,本发明的基板由于厚度较薄,故为了避免基板于封装制作工艺中破裂,本发明先将基板压合于具有离型层的承载器上,以提升基板结构整体的刚性,并可通过离型层易于与基板剥离的特性,使基板能于制作工艺完成后轻易地与承载器分离。
此外,本发明的基板还具有至少一第一贯孔,以作为透气的气孔或是共振的音孔之用,而承载器上还具有与前述的第一贯孔对应的至少一第二贯孔,使基板在设置于承载器上后,承载器可通过第二贯孔而暴露基板的第一贯孔。如此,在后续的热压合或其他高温制作工艺中,第一贯孔内的空气可轻易地由第二贯孔排出,不会聚积于基板与承载器之间,也不会经热膨胀后而推挤承载器,导致基板与承载器之间的结合松脱而使基板与承载器脱离。因此,本发明的基板结构可符合特殊应用的基板的特殊需求,更可提高基板结构的制作良率。
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附的附图作详细说明如下。
附图说明
图1至图6是依照本发明的一实施例的一种基板结构的制作方法的流程剖面示意图。
符号说明
100:基板结构
110:基板
110a:第一表面
110b:第二表面
112:第一贯孔
114:介电层
115:接垫
117:图案化防焊层
118:表面处理层
116:导通孔
120:承载器
122:离型层
124:绝缘胶层
126:金属层
128:第二贯孔
D1、D2:孔径
具体实施方式
有关本发明之前述及其他技术内容、特点与功效,在以下配合参考附图的各实施例的详细说明中,将可清楚的呈现。以下实施例中所提到的方向用语,例如:「上」、「下」、「前」、「后」、「左」、「右」等,仅是参考附加附图的方向。因此,使用的方向用语是用来说明,而并非用来限制本发明。并且,在下列各实施例中,相同或相似的元件将采用相同或相似的标号。
图1至图6是依照本发明的一实施例的一种基板结构的制作方法的流程剖面示意图。本实施例的基板结构的制作方法包括下列步骤。首先,请参照图1,提供基板110。基板110包括第一表面110a以及相对第一表面110a的第二表面110b。具体而言,基板110可如图1所示为单层线路板,其包括介电层114、多个接垫115、图案化防焊层117以及多个导通孔116。上述的多个接垫115分别设置于介电层114的相对两表面。各导通孔116则如图1所示分别连接对应设置于介电层114的相对两表面的接垫115。图案化防焊层117覆盖介电层114的相对两表面,并暴露接垫115。当然,在本发明的其他实施例中,基板110也可继续再堆叠其他的叠构,也就是说,基板110也可为多层线路板。
此外,基板110还可包括表面处理(surface finishing)层118,以覆盖被图案化防焊层117所暴露的接垫115,表面处理层118的材料可包括铜基合金、镍基合金、钯基合金、铂基合金、银基合金、金基合金、钛基合金、或前述的组合。
请接续参照图2,形成第一贯孔112于基板110上,其中,第一贯孔112贯穿基板110,以连通第一表面110a及第二表面110b。更进一步而言,第一贯孔112如图2所示贯穿基板110的介电层114以及图案化防焊层117,以例如作为透气的气孔或是共振的音孔之用。在本实施例中,形成第一贯孔112的方法包括机械钻孔或是激光钻孔,当然,本发明并不以此为限。
接着,请参照图3,提供承载器120。承载器120包括离型层122、绝缘胶层124以及金属层126。在本实施例中,承载器120可例如是通过依序将离型层122、绝缘胶层124以及金属层126压合在一起而形成,以使绝缘胶层124位于离型层122以及金属层126之间,其中,离型层122的材料可包括聚乙烯对苯二甲酸酯(polyethylene terephthalate,PET)、聚酰亚胺薄膜(PI film)或其他适合的材料。绝缘胶层124的材料则可包括半固化树脂(prepreg)等绝缘胶材,而金属层126可为铜箔层。此外,本实施例的流程顺序仅为示意,基板110与承载器120的提供或制作并无先后顺序,在本发明的其他实施例中,也可先提供承载器120再提供基板110,或是同时提供制作好的基板110与承载器120,本发明并不局限于此。
之后,请参照图4,形成第二贯孔128于承载器120上,其中,第二贯孔128分别贯穿离型层122、绝缘胶层124以及金属层126,以贯穿承载器120。在本实施例中,第二贯孔128的孔径D2可大于图2所示的第一贯孔112的孔径D1。此外,形成第二贯孔128的方法可与形成第一贯孔112的方法相同或相似,也包括机械钻孔或是激光钻孔,当然,本发明并不以此为限。
接着,请同时参照图5及图6,压合基板110与承载器,以形成如图6所示的基板结构100。具体而言,基板110是如图5所示的以第二表面110b压合于承载器120的离型层122上。并且,第二贯孔128的位置对应于第一贯孔112,且第二贯孔128的孔径D2可约略大于第一贯孔112的孔径D1,以如图6所示的暴露第一贯孔112。如此,基板结构100的制作即大致完成。
依前述的制作方法所完成的基板结构100如图6所示包括基板110以及承载器120。基板110包括第一贯孔112、相对的第一表面110a以及第二表面110b。第一贯孔112贯穿基板110,以连通第一表面110a及第二表面110b。承载器120则包括第二贯孔128、离型层122、绝缘胶层124以及金属层126。绝缘胶层124位于离型层122以及金属层126之间。承载器120是以离型层122贴附于基板110的第二表面110b。第二贯孔128则对应于第一贯孔112并贯穿承载器120,以暴露第一贯孔112,其中,第二贯孔128的孔径D2可约略大于第一贯孔112的孔径D1。
综上所述,本发明的基板由于厚度较薄,因此,为了避免基板于封装制作工艺中破裂,本发明先将基板压合于具有离型层的承载器上,以提升基板结构整体的刚性,并可通过离型层易于与基板剥离的特性,于制作工艺完成后轻易地将基板自承载器上分离。
并且,本发明的基板还具有第一贯孔,以作为透气的气孔或是共振的音孔之用,而承载器上还具有与前述的第一贯孔对应的第二贯孔,使基板在设置于承载器上后,承载器可通过第二贯孔而暴露基板的第一贯孔。如此,在后续的热压合或其他高温制作工艺中,第一贯孔内的空气可轻易地由第二贯孔排出,不会聚积于基板与承载器之间,也不会经热膨胀后而推挤承载器,导致基板与承载器之间的结合松脱而使基板与承载器脱离。因此,本发明的基板结构可符合特殊应用的基板的特殊需求,更可提高基板结构的制作良率。
虽然结合以上实施例公开了本发明,然而其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,可作些许的更动与润饰,故本发明的保护范围应当以附上的权利要求所界定的为准。
Claims (15)
1.一种基板结构,其特征在于包括:
基板,包括第一贯孔、第一表面以及相对该第一表面的第二表面,该第一贯孔贯穿该基板,以连通该第一表面及该第二表面;以及
承载器,包括第二贯孔、离型层、绝缘胶层以及金属层,该绝缘胶层设置于该离型层以及该金属层之间,该承载器以该离型层贴附于该第二表面,该第二贯孔对应该第一贯孔而贯穿该承载器,以暴露该第一贯孔,其中该第二贯孔的孔径大于该第一贯孔的孔径。
2.如权利要求1所述的基板结构,其中该离型层的材料包括聚乙烯对苯二甲酸酯或聚酰亚胺薄膜。
3.如权利要求1所述的基板结构,其中该绝缘胶层的材料包括半固化树脂。
4.如权利要求1所述的基板结构,其中该金属层包括铜箔层。
5.如权利要求1所述的基板结构,其中该基板为单层线路板。
6.如权利要求1所述的基板结构,其中该基板为多层线路板。
7.如权利要求1所述的基板结构,其中该基板还包括介电层、多个接垫以及图案化防焊层,该些接垫分别设置于该介电层的相对两表面,该图案化防焊层覆盖该两表面并暴露该些接垫,该第一贯孔贯穿该介电层以及该图案化防焊层。
8.如权利要求7所述的基板结构,其中该基板还包括多个导通孔,各该导通孔分别连接对应设置于该两表面的该些接垫。
9.如权利要求7所述的基板结构,还包括:
表面处理层,覆盖该些接垫。
10.一种基板结构的制作方法,其特征在于包括:
提供基板,该基板包括第一表面以及相对该第一表面的第二表面;
形成第一贯孔于该基板上,该第一贯孔贯穿该基板,以连通该第一表面及该第二表面;
提供承载器,该承载器包括离型层、绝缘胶层以及金属层,该绝缘胶层设置于该离型层以及该金属层之间;
形成第二贯孔于该承载器上,该第二贯孔贯穿该承载器;以及
压合该基板于该承载器的该离型层上,该第二贯孔的位置对应于该第一贯孔,以暴露该第一贯孔,其中该第二贯孔的孔径大于该第一贯孔的孔径。
11.如权利要求10所述的基板结构的制作方法,其中提供形成该第一贯孔及该第二贯孔的方式包括机械钻孔。
12.如权利要求10所述的基板结构的制作方法,其中该离型层的材料包括聚乙烯对苯二甲酸酯或聚酰亚胺薄膜。
13.如权利要求10所述的基板结构的制作方法,其中该绝缘胶层的材料包括半固化树脂。
14.如权利要求10所述的基板结构的制作方法,其中该金属层包括铜箔层。
15.如权利要求10所述的基板结构的制作方法,其中提供该承载器的步骤还包括:
压合该离型层、该绝缘胶层以及该金属层,以形成该承载器。
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