201012329 九、發明說明： 【發明所屬之技術領域】 本發明係一種具有散熱金屬層之電路基板成形方法 之 尤其是一種節省製程時間以減少成本的具有散熱金屬層 基板成形方法。 s 【先前技術】 一般電子電機使用的單層硬質電路基板，係具有—姓 Ο[Technical Field] The present invention relates to a circuit board forming method having a heat dissipating metal layer, and more particularly to a method for forming a heat dissipating metal layer substrate which saves process time and reduces cost. s [Prior Art] A single-layer hard circuit substrate used in general electronic motors has a surname 姓
刻電路層及一絕緣層，蝕刻電路層多為銅金屬材料，而絕 緣層多為玻璃纖維材質，而用於汽車上的單層硬質電路基 板’如防鎖死煞車系統（ABS)使用之單層硬質電路基板， 其中蝕刻電路層會經由蝕刻製程而形成電路，以令其他電 子元件以表面黏著技術（SMT)設置於蝕刻電路上，然而， 因主動或被動元件在電路工作時會產生高熱，而對於電路 工作穩定度要求高的環境下，溫度的變化會大大地影響其 工作穩疋度’如第六圖所示，故於單層硬質電路基板（8〇) 未形成有钮刻電路層（81)的絕緣層（82)另一面會形成有一 放…、金屬層（83)(如第一圖所示），以加速電路板上的電子 元件散熱’而目前散熱金屬層（83)多使用鋁金屬材料，惟 此種具有散熱金屬層（83)的電路基板（80)，於蝕刻電路層 (81)上形成姓刻電路的製程中，蝕刻電路層（81)的金屬會 遭受触刻液的化學侵蝕，而導致蝕刻電路層（81)不美觀， 甚至損壞。 為避免政熱金屬層（83)表面於姓刻製程中受到破壞， f用如第七圖所示之具有散熱金屬層之電路基板成形方法 201012329 係包括以下步驟： 提供具有蚀刻金屬層（81)、絕緣層（82)以及散熱金屬 層（83)之電路基板（80); 於該之電路基板（8〇)之散熱金屬層（83)上貼上離形膠 紙（90) ’以保護該金屬材質； 製作線路姓刻製程，其包括利用蝕刻程序蝕刻該具有 蝕刻金屬層（81)的電路基板（8〇)，並在蝕刻金屬層（8彳）上形 成數個有預設的钱刻電路單元（84); 利用刀具（如銑刀）沿者切除線（85)將電路基板（8〇)四 周緣未形成有蝕刻電路單元（84)的多餘部分切除； 將已把多餘部分切除之離形膠紙（9〇)自該已把多餘部 分切除並形成有蝕刻電路單元（84)的電路基板（8〇)之散熱 金屬層（83)上撕除； 再將該形成有蝕刻電路單元（84)電路基板（80)沿著分 割線（86)進行切割，使蝕刻電路單元（84)形成個別的單元 體。 既有的具有散熱金屬層（81)之電路基板（80)成形方法 係在進行蝕刻程序前在該散熱金屬層（83)上貼上離形膠紙 (90)，以保護該散熱金屬層（83)，使其在之後續的蝕刻程 序中不致遭受蝕刻液的侵蝕。 然而，在完成蝕刻程序後，尚須將該離形膠紙（9〇)自 該散熱金屬層（83)上撕除，才能進行後續的步驟，因此使 得製作流程繁複且冗長，因此使得製作成本增加不符合 經濟效益。 5 201012329 【發明内容】 本發明人有鑒於既有將離形膠紙貼覆於該基板之散熱 金屬層上的製作方法，於後續尚須將該離形膠紙自該基板 之散熱金屬層上撕除，因此造成製作流程繁複且冗長，不 符合經濟效益，因此經過不斷的研究以及無數次的試驗之 後，終於發明出此具有散熱金屬層之電路基板成形方法。 本發明之目的係在於提供一種節省製程時間以減少成 本的具有散熱金屬層之電路基板成形方法。 為達上述目的，本發明之具有散熱金屬層之電路基板 成形方法係包括： 提供一基板組，各基板組係包括二基板，各基板包括 -姓刻金屬層、-絕緣層以及—散熱金屬I，先將二基板 以其散熱金屬層四週邊相互面對黏結形成黏合部，以便將 二蝕刻金屬層露於基板組外側； 進行該基板組之蝕刻製程，於蝕刻金屬層上形成有數 個預設的姓刻電路單元； 利用刀具將基板組四週邊緣未形成有蝕刻電路單元多 餘之黏合部去除’可將具㈣刻電路單元的基板組彼此分 開； 再將具有㈣電路單元的各基板進行Μ，形成個別 之蝕刻電路單元體。 結， 時， 本發明方法藉由將二基板的散熱金屬層相互面對黏 可讓散熱金屬層不會裸露於外’因此在進行钱刻製程 該等基板之散熱金屬層完全不會接_㈣液，故散 6 .201012329 ♦ 熱金屬層能完全避免蝕刻液的侵蝕； 而且本發明能夠在蝕刻製程中一次將二具有散熱金屬 層之基板的蝕刻金屬層皆形成預設的蝕刻電路單元，所以 能夠節省時間及成本，而提高經濟效益。 【實施方式】 本發明之具有散熱金屬層之電路基板成形方法，其係 用於印刷電路板的製成，該方法係包括： 提供一電路基板（1〇)組，請參看第一及二圖所示，該 ❹ 電路基板（10)組包括二基板（10)，各基板（10)包括—蝕刻金 屬層（12)、一散熱金屬層以及設置於該散熱金屬層（11) 和蚀刻金屬層（12)之間的絕緣層3) ’該蝕刻金屬層（12)具 有複數蚀刻電路單元（14)，且於電路基板（1〇)之散熱金屬 層（11)的四周緣不會形成有蝕刻電路單元（14)處塗佈黏著 劑（20)的黏合部（15)，以使二電路基板（1〇)的散熱金屬層（11) 相對且相互壓緊貼合，並使二蝕刻金屬層（12)露於外側； 進行蝕刻製程，，請參看第三圖所示，蝕刻電路基板（1〇) 組之二蝕刻金屬層（12)，使二蝕刻金屬層（12)上皆形成有 蝕刻線路（12’）； 使該具有蝕刻電路單元（14)之電路基板（1 〇)組進行防 焊處理’其係包括防焊前處理步驟以及防焊網印步驟； 再次於該具有散熱金屬層（12)之電路基板（1〇)組鑽孔 以形成内容孔； 請參看第四及五圖所示，利用刀具（如銑刀）將該電路 基板（10)組沿著黏著劑（20)之邊緣切割線（16)將基板（1〇)的 7 .201012329 四周緣未形成有蝕刻電路單元（14)的黏合部（1 5)切除，亦 即將基板（10)有黏著劑（2〇)的部分去除，以令二形成有蚀 刻電路單元（14)的基板（1〇)部分，因失去相互黏著之力而 互相分開； 再將已經分開的各別形成有蝕刻電路單元（1 4)的基板 (1 〇)部分，進一步利用刀具（如銑刀）沿著分割線（1 7)將其進 一步切割成個別的蝕刻電路單元（14)個體； 最後進行有機保焊劑製程（Organic Solderability Preservative，〇SP)，其係在蝕刻電路單元（14)上施加防污 齊I與保焊劑，以保持電路單元（彳4)個體於之後儲存與組裝 製程中良好的焊錫性。 於本發明所屬領域中具有通常知識者皆能依照不同需 求而增加或調整步驟，但其皆屬於本發明之範疇。 由於在般的具有散熱金屬層之電路基板製程中，電 路基板之四周緣未形成蝕刻電路單元部分，原本就會被切 0 除因此本發明係在二具有散熱金屬層之電路基板之四周 緣塗佈黏著劑’以讓二電路基板之四周緣在經過切除（例如 以銑刀)後’即可順勢分開，而無需額外加入分開二具有蝕 亥J電路單元之電路基板之步驟，所以製程步驟相當簡單、 省時。 而且當—片t路基板以既有的方式進行敍刻以及切割 後最少僅可雜曰 、 又于一片具有蝕刻電路單元的電路基板，但因 為使用本發明之-jg ^The circuit layer and an insulating layer are etched, the etched circuit layer is mostly copper metal material, and the insulating layer is mostly made of glass fiber material, and the single-layer hard circuit substrate used in the automobile, such as the anti-lock braking system (ABS), is used. a layer of a rigid circuit substrate, wherein the etched circuit layer forms an electrical circuit through an etching process to allow other electronic components to be disposed on the etched circuit by surface mount technology (SMT). However, since the active or passive components generate high heat during operation of the circuit, In the environment where the circuit operation stability is high, the temperature change will greatly affect the stability of the operation. As shown in the sixth figure, the button circuit layer is not formed on the single-layer rigid circuit substrate (8〇). The other side of the insulating layer (82) of (81) is formed with a metal layer (83) (as shown in the first figure) to accelerate the heat dissipation of the electronic components on the circuit board, and the current heat dissipation metal layer (83) is more The aluminum metal material is used, but the circuit substrate (80) having the heat dissipation metal layer (83) is subjected to a process of forming a circuit on the etching circuit layer (81), and the metal of the etching circuit layer (81) is subjected to contact. The chemical attack of the liquid causes the etched circuit layer (81) to be unsightly or even damaged. In order to prevent the surface of the political hot metal layer (83) from being damaged in the process of the last name, the circuit substrate forming method 201012329 having the heat dissipating metal layer as shown in FIG. 7 includes the following steps: providing an etched metal layer (81) a circuit board (80) of an insulating layer (82) and a heat dissipating metal layer (83); a release adhesive tape (90) is attached to the heat dissipation metal layer (83) of the circuit board (8 〇) to protect the Metal material; manufacturing a circuit name engraving process, which comprises etching the circuit substrate (8 〇) having the etched metal layer (81) by an etching process, and forming a plurality of preset money on the etched metal layer (8 彳) Circuit unit (84); using a cutter (such as a milling cutter) along the cut-off line (85) to cut off the excess portion of the circuit substrate (84) that is not formed with the etching circuit unit (84); The release adhesive tape (9〇) is peeled off from the heat dissipation metal layer (83) of the circuit substrate (8〇) from which the excess portion has been cut and formed with the etching circuit unit (84); (84) The circuit board (80) is along the dividing line (86) Line cutting, etching circuit unit (84) forming individual cells thereof. The existing circuit substrate (80) having the heat dissipation metal layer (81) is formed by applying a release adhesive tape (90) on the heat dissipation metal layer (83) before the etching process to protect the heat dissipation metal layer ( 83), so that it will not be eroded by the etching solution in the subsequent etching process. However, after the etching process is completed, the release adhesive tape (9〇) must be removed from the heat dissipation metal layer (83) to perform the subsequent steps, thereby making the production process complicated and lengthy, thus making the manufacturing cost The increase is not in line with economic benefits. 5 201012329 SUMMARY OF THE INVENTION The present inventors have in view of the existing method of attaching a release adhesive tape to the heat dissipation metal layer of the substrate, and the release adhesive paper must be subsequently applied to the heat dissipation metal layer of the substrate. The tearing off, thus making the production process complicated and lengthy, is not economical, so after continuous research and numerous tests, the circuit board forming method with the heat-dissipating metal layer was finally invented. SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit board forming method having a heat dissipating metal layer which saves processing time and reduces cost. To achieve the above objective, the method for forming a circuit substrate having a heat dissipating metal layer of the present invention includes: providing a substrate group, each substrate group comprising two substrates, each substrate comprising a metal layer, an insulating layer, and a heat dissipating metal I First, the two substrates are bonded to each other with the periphery of the heat dissipation metal layer to form an adhesive portion, so as to expose the two etching metal layers to the outside of the substrate group; the etching process of the substrate group is performed, and a plurality of presets are formed on the etching metal layer. The surname engraved circuit unit; the excess of the etched circuit unit is not formed by the edge of the substrate group by the cutter; the substrate group of the circuit unit can be separated from each other; and the substrates having the (4) circuit unit are then smashed. Individual etched circuit unit bodies are formed. In the method, the method of the present invention can prevent the heat-dissipating metal layer from being exposed to the outside by bonding the heat-dissipating metal layers of the two substrates to each other. Therefore, the heat-dissipating metal layer of the substrates is not completely connected during the process. Liquid, so disperse 6.201012329 ♦ The hot metal layer can completely avoid the etching of the etching liquid; and the invention can form the etching metal layer of the substrate with the heat dissipating metal layer into the preset etching circuit unit at one time in the etching process, so It saves time and costs and increases economic efficiency. [Embodiment] A circuit board forming method having a heat dissipating metal layer of the present invention is used for manufacturing a printed circuit board, the method comprising: providing a circuit board (1 〇) group, please refer to the first and second figures As shown, the 电路 circuit substrate (10) includes two substrates (10), each substrate (10) including an etched metal layer (12), a heat dissipating metal layer, and a heat dissipating metal layer (11) and an etched metal layer. (12) Insulation layer 3) 'The etched metal layer (12) has a plurality of etched circuit units (14), and no etching is formed on the peripheral edges of the heat dissipation metal layer (11) of the circuit substrate (1) The bonding unit (15) of the adhesive (20) is applied to the circuit unit (14) so that the heat dissipation metal layers (11) of the two circuit substrates (1) are pressed against each other and the two etching metal layers are adhered. (12) exposed on the outside; for etching process, please refer to the third figure, etch the circuit substrate (1〇), the second etching metal layer (12), so that the two etching metal layers (12) are formed with etching Line (12'); the circuit board having the etched circuit unit (14) (1) The group performs the solder resist process 'which includes the pre-weld processing step and the solder resist screen printing step; again drills the circuit substrate (1 〇) group having the heat dissipating metal layer (12) to form the content hole; As shown in Figures 4 and 5, the circuit substrate (10) is cut along the edge of the adhesive (20) by a cutter (such as a milling cutter). The peripheral edge of the substrate (1〇) of 7.201012329 is not formed. The adhesive portion (15) of the etching circuit unit (14) is cut away, that is, the portion of the substrate (10) having the adhesive (2) is removed, so that the substrate (1) of the etching circuit unit (14) is formed. In part, they are separated from each other by the force of mutual adhesion; the substrate (1 〇) portion of the etched circuit unit (14) is formed separately, and the tool (such as a milling cutter) is further used along the dividing line (1). 7) further cutting it into individual etched circuit units (14); finally performing an Organic Solderability Preservative (〇SP), which applies antifouling I and solder resist on the etched circuit unit (14) To keep the circuit unit (彳4) individual After the storage and assembly process, good solderability. Anyone having ordinary skill in the art to which the present invention pertains can add or adjust steps in accordance with different needs, but all fall within the scope of the present invention. In the process of the circuit substrate having the heat dissipation metal layer, the etching circuit unit portion is not formed on the peripheral edge of the circuit substrate, and the invention is originally cut by 0. Therefore, the present invention is applied to the periphery of the circuit substrate having the heat dissipation metal layer. The cloth adhesive 'to allow the peripheral edges of the two circuit substrates to be separated after being cut (for example, by milling cutters), without the need to additionally add the steps of separating the circuit substrates having the circuit blocks, so the process steps are equivalent Simple and time saving. Moreover, when the substrate is etched and cut in an existing manner, at least only a circuit board having an etched circuit unit can be used, but the -jg ^ of the present invention is used.
程係將二具有散熱金屬層之基板黏合， 因此經過姓刻、A 除邊緣後，最少可獲得二片具有蝕刻電 8 201012329 路單疋的電路基板，因此一次流程進行後，以本發明所提 供之方法而得之具有蝕刻電路單元的電路基板數量較既有The process is to bond two substrates with a heat-dissipating metal layer. Therefore, after the edge is removed and A is removed, at least two circuit boards having etching electrodes are obtained. Therefore, after one process is performed, the present invention provides The number of circuit boards having etched circuit units is higher than that of the existing method
方法所得之具有蝕刻電路單元的電路基板多出兩倍，故可 降低各板材的製作成本D 本發明藉由將二電路基板之散熱金屬層四週邊對合黏 貼，使散熱金屬層不會裸露於外，故可完全杜絕散熱金屬 層在蝕刻過程中受到蝕刻液的侵蝕，亦能夠同時蝕刻二具 有散熱金屬層之電路基板，以減少各製成之電路單元所需 ❹花費的時間，因此各電路單元的成本即可降低，使得各姓 刻電路單元更具有市場競爭力。 【圖式簡單說明】 苐圖係本發明二電路基板組疊合前的立體示意圖。 第二圖係本發明二電路基板之散熱金屬層相互黏合後 之剖面示意圖。 第三圖係本發明具有散熱金屬層之電路基板組經蝕刻 後的剖面示意圖》 第四圖係本發明具有散熱金屬層之電路基板組之邊緣 切割後的示意圖。 第五圖係本發明具有散熱金屬層之電路基板 切割後的立體示意圖。 纽 第六圖係習用具有散熱金屬層之電路基板的立體分解 圖。 第七圖係習用具有散熱金屬層之電路基板與離形膠紙 貼合前之立體示意圖。 201012329 【主要元件符號說明】 (10) 基板 (11) 散熱金 屬層 (12) 敍 刻金屬層 (12，) 蝕刻線路 (13) 絕 緣層 (14) 電路單 元 (15) 黏 合部 (16) 切割線 (17) 分 割線 (20) 黏著劑 (80) 電 路基板 (81) 蝕刻電 路層 (82) 絕 緣層 (83) 散熱金 屬層 (84) 電 路單元 (85) 切除線 (86) 分 割線 (90) 離形膠 紙The circuit board with the etched circuit unit obtained by the method is twice as large, so that the manufacturing cost of each board can be reduced. The present invention can prevent the heat-dissipating metal layer from being exposed by bonding the four sides of the heat-dissipating metal layer of the two circuit board. In addition, the heat dissipation metal layer can be completely eroded by the etching liquid during the etching process, and the circuit substrate having the heat dissipation metal layer can be simultaneously etched to reduce the time required for each of the fabricated circuit units, and thus the circuits are The cost of the unit can be reduced, making each circuit unit more market competitive. BRIEF DESCRIPTION OF THE DRAWINGS A schematic view of a two-circuit substrate assembly of the present invention before being superposed. The second figure is a schematic cross-sectional view of the heat dissipating metal layers of the two circuit substrates of the present invention bonded to each other. The third drawing is a schematic cross-sectional view of the circuit substrate of the present invention having a heat dissipating metal layer after etching. The fourth drawing is a schematic view of the edge of the circuit substrate group having the heat dissipating metal layer. Fig. 5 is a perspective view showing the circuit board having a heat dissipating metal layer after cutting according to the present invention. The sixth figure is an exploded perspective view of a circuit board having a heat dissipating metal layer. The seventh figure is a schematic perspective view of a circuit board having a heat dissipating metal layer before being attached to a release adhesive tape. 201012329 [Explanation of main component symbols] (10) Substrate (11) Heat dissipating metal layer (12) Engraved metal layer (12,) Etching line (13) Insulation layer (14) Circuit unit (15) Adhesive part (16) Cutting line (17) Separation line (20) Adhesive (80) Circuit board (81) Etched circuit layer (82) Insulation layer (83) Heat sink metal layer (84) Circuit unit (85) Cut-off line (86) Split line (90) Release adhesive tape