JP5829378B2 - 平面材料層の一部を除去する方法および多層構造体 - Google Patents
平面材料層の一部を除去する方法および多層構造体 Download PDFInfo
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- JP5829378B2 JP5829378B2 JP2009549741A JP2009549741A JP5829378B2 JP 5829378 B2 JP5829378 B2 JP 5829378B2 JP 2009549741 A JP2009549741 A JP 2009549741A JP 2009549741 A JP2009549741 A JP 2009549741A JP 5829378 B2 JP5829378 B2 JP 5829378B2
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- Prior art keywords
- layer
- material layer
- adhesion
- printed circuit
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B1/00—Knobs or handles for wings; Knobs, handles, or press buttons for locks or latches on wings
- E05B1/0092—Moving otherwise than only rectilinearly or only rotatively
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B1/00—Knobs or handles for wings; Knobs, handles, or press buttons for locks or latches on wings
- E05B1/0053—Handles or handle attachments facilitating operation, e.g. by children or burdened persons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims (7)
- リジッド部(1)と、前記リジッド部(1)に積層されるフレキシブル部(10)とを含んで構成されるリジッドフレキシブルプリント回路基板の製造において、前記リジッド部(1)の複数のサブポーション(12、13)への分割のために当該リジッド部(1)を形成する平坦または平面の材料層(3)の一部を除去する方法であって、
前記材料層(3)が、銅からなる金属層であり、当該材料層(3)と前記フレキシブル部(10)を形成する層とを接合する、平坦または平面の少なくとも1つのさらなる材料層(9)と接着され、
前記一部(11)が除去される材料層(3)の領域または区域において、前記さらなる材料層(9)に対する当該材料層(3)の直接接着がない状態が維持され、当該直接接着のない状態が、材料層(3、9)同士の接着を妨げる接着防止材料(8)を塗布することにより、これらの材料層(3、9)の間に接着層を介在させることなく接着防止材料(8)を介在させることで実現され、
接着防止材料(8)が、さらなる材料層(9)の硬化を生じさせる、フレキシブル部(10)の積層に関する接続または加圧工程における温度上昇に対し、当該材料(8)の融解を生じるほどに高い軟化点または融点を有し、
接着防止材料(8)が、ワックス成分を溶媒中に分散させたワックスペーストの状態で塗布され、さらに、接着防止材料(8)が、分離成分およびバインダーを含む、方法。 - 接着防止材料(8)が、印刷によって塗布されることを特徴とする、請求項1に記載の方法。
- 接着防止材料(8)が、隣接する材料層に対して極性の相違を有することを特徴とする、請求項1または2に記載の方法。
- 接着防止材料(8)が、炭化水素系ワックスおよび油、ポリエチレン化合物系またはポリプロピレン化合物系ワックスおよび油、有機ポリフルオロ化合物系ワックスおよび油、脂肪酸類とアルコール類またはポリアミド類とのエステル類、有機シリコン化合物、および/またはそれらの混合物を含むことを特徴とする、請求項1から3のいずれか一項に記載の方法。
- 接着防止材料(8)が、無機フィラーおよび/または有機フィラー、ならびに無機添加剤および/または有機添加剤を含むことを特徴とする、請求項1から4のいずれか一項に記載の方法。
- 接着防止材料(8)が、25μm未満の層厚で塗布されることを特徴とする、請求項1から5のいずれか一項に記載の方法。
- 前記材料層の除去される一部(11)の端領域が、ミリング、スクラッチングまたは切断によって画定および/または除去されることを特徴とする、請求項1から6のいずれか一項に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0010007U AT10030U1 (de) | 2007-02-16 | 2007-02-16 | Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte |
ATGM100/2007 | 2007-02-16 | ||
ATGM728/2007 | 2007-12-03 | ||
AT0072807U AT11664U1 (de) | 2007-02-16 | 2007-12-03 | Verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hiefür |
PCT/AT2008/000027 WO2008098269A1 (de) | 2007-02-16 | 2008-01-30 | Verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hierfür |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010518647A JP2010518647A (ja) | 2010-05-27 |
JP5829378B2 true JP5829378B2 (ja) | 2015-12-09 |
Family
ID=39473608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009549741A Active JP5829378B2 (ja) | 2007-02-16 | 2008-01-30 | 平面材料層の一部を除去する方法および多層構造体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8541689B2 (ja) |
EP (1) | EP2119327B1 (ja) |
JP (1) | JP5829378B2 (ja) |
KR (1) | KR101516440B1 (ja) |
AT (2) | AT11664U1 (ja) |
WO (1) | WO2008098269A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT11663U1 (de) * | 2007-02-16 | 2011-02-15 | Austria Tech & System Tech | Haftverhinderungsmaterial, verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hiefür |
FI122216B (fi) | 2009-01-05 | 2011-10-14 | Imbera Electronics Oy | Rigid-flex moduuli |
AT12321U1 (de) | 2009-01-09 | 2012-03-15 | Austria Tech & System Tech | Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement |
AT12322U1 (de) * | 2009-01-27 | 2012-03-15 | Dcc Dev Circuits & Components Gmbh | Verfahren zur herstellung einer mehrlagigen leiterplatte, haftverhinderungsmaterial sowie mehrlagige leiterplatte und verwendung eines derartigen verfahrens |
AT12317U1 (de) * | 2010-04-13 | 2012-03-15 | Austria Tech & System Tech | Verfahren zur integration eines elektronischen bauteils in eine leiterplatte sowie leiterplatte mit einem darin integrierten elektronischen bauteil |
US8519270B2 (en) * | 2010-05-19 | 2013-08-27 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
CN103096647B (zh) * | 2011-10-31 | 2016-01-13 | 健鼎(无锡)电子有限公司 | 弯折式印刷电路板的制造方法 |
AT13231U1 (de) | 2011-12-05 | 2013-08-15 | Austria Tech & System Tech | Verfahren zum herstellen einer leiterplatte unter entfernung eines teilbereichs derselben sowie verwendung eines derartigen verfahrens |
AT13229U1 (de) * | 2011-12-05 | 2013-08-15 | Austria Tech & System Tech | Verfahren zum herstellen einer leiterplatte unter entfernung eines teilbereichs derselben sowie verwendung eines derartigen verfahrens |
CN203015273U (zh) | 2012-12-24 | 2013-06-19 | 奥特斯(中国)有限公司 | 印制电路板 |
US10219384B2 (en) | 2013-11-27 | 2019-02-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
AT515101B1 (de) | 2013-12-12 | 2015-06-15 | Austria Tech & System Tech | Verfahren zum Einbetten einer Komponente in eine Leiterplatte |
US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
AT515447B1 (de) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte |
US9764532B2 (en) | 2014-07-01 | 2017-09-19 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
US9997442B1 (en) | 2016-12-14 | 2018-06-12 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method of manufacturing the same |
KR102345112B1 (ko) * | 2019-12-16 | 2021-12-30 | 삼성전기주식회사 | 인쇄회로기판 |
CN114309740B (zh) * | 2021-12-24 | 2023-07-04 | 丝艾工业科技(海安)有限公司 | 一种降面铣削装饰件的制备方法 |
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DE4003344C1 (ja) | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
US6293008B1 (en) * | 1994-03-23 | 2001-09-25 | Dyconex Pantente Ag | Method for producing foil circuit boards |
JPH0837378A (ja) | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | キャビティ付多層配線板の製造法 |
JPH0837381A (ja) | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | 端子付多層配線板の製造法 |
US5645673A (en) | 1995-06-02 | 1997-07-08 | International Business Machines Corporation | Lamination process for producing non-planar substrates |
US6245382B1 (en) * | 1999-02-24 | 2001-06-12 | Datacard, Inc. | Method for making protective film |
US6909054B2 (en) * | 2000-02-25 | 2005-06-21 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for producing multilayer printed wiring board |
JP3820415B2 (ja) * | 2002-03-07 | 2006-09-13 | 株式会社デンソー | プリント基板の製造方法及びプリント基板の構造 |
DE20221189U1 (de) * | 2002-09-19 | 2005-05-19 | Ruwel Ag | Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich |
JP2006173187A (ja) | 2004-12-13 | 2006-06-29 | Fujikura Ltd | リジッド・フレックス多層プリント配線板及びその製造方法 |
JP2006237088A (ja) | 2005-02-22 | 2006-09-07 | Sumitomo Metal Electronics Devices Inc | 多層プリント配線板の製造方法 |
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- 2007-12-03 AT AT0072807U patent/AT11664U1/de not_active IP Right Cessation
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2008
- 2008-01-30 EP EP08700293A patent/EP2119327B1/de active Active
- 2008-01-30 US US12/449,611 patent/US8541689B2/en active Active
- 2008-01-30 KR KR1020097017488A patent/KR101516440B1/ko active IP Right Grant
- 2008-01-30 JP JP2009549741A patent/JP5829378B2/ja active Active
- 2008-01-30 AT AT08700293T patent/ATE531240T1/de active
- 2008-01-30 WO PCT/AT2008/000027 patent/WO2008098269A1/de active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
US8541689B2 (en) | 2013-09-24 |
US20100059262A1 (en) | 2010-03-11 |
JP2010518647A (ja) | 2010-05-27 |
AT11664U1 (de) | 2011-02-15 |
EP2119327B1 (de) | 2011-10-26 |
WO2008098269A1 (de) | 2008-08-21 |
ATE531240T1 (de) | 2011-11-15 |
KR101516440B1 (ko) | 2015-05-04 |
EP2119327A1 (de) | 2009-11-18 |
KR20090111852A (ko) | 2009-10-27 |
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