ES2105046T3 - Laminado plaqueado de cobre y placa de circuito impreso. - Google Patents

Laminado plaqueado de cobre y placa de circuito impreso.

Info

Publication number
ES2105046T3
ES2105046T3 ES93117992T ES93117992T ES2105046T3 ES 2105046 T3 ES2105046 T3 ES 2105046T3 ES 93117992 T ES93117992 T ES 93117992T ES 93117992 T ES93117992 T ES 93117992T ES 2105046 T3 ES2105046 T3 ES 2105046T3
Authority
ES
Spain
Prior art keywords
printed circuit
circuit board
copper
copper plated
plated laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93117992T
Other languages
English (en)
Inventor
Muneo Saida
Yutaka Hirasawa
Katsuhiro Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyclad Laminates Inc
Original Assignee
Polyclad Laminates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=13867972&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2105046(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Polyclad Laminates Inc filed Critical Polyclad Laminates Inc
Application granted granted Critical
Publication of ES2105046T3 publication Critical patent/ES2105046T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10477Inverted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0353Making conductive layer thin, e.g. by etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9335Product by special process
    • Y10S428/934Electrical process
    • Y10S428/935Electroplating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12472Microscopic interfacial wave or roughness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556Organic component
    • Y10T428/12569Synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

LA PRESENTE INVENCION PROPORCIONA UN LAMINADO DE CHAPADO DE COBRE CARACTERIZADO PORQUE LA HOJA (1) DE COBRE ELECTROLITICO SOBRE EL LADO (1A) DE LA SUPERFICIE GLASEADA, DE LA CUAL SE FORMA UN ELECTRODEPOSITO DE COBRE, ESTA UNIDA A SU LADO (1A) DE SUPERFICIE GLASEADA, A UN LADO O A CADA UNO DE AMBOS LADOS DE UN SUSTRATO (3), QUE TIENE UN FORMATO (CIRCUITO) DE CABLEADO DE PASO CORTO, Y EXHIBE UN FACTOR ELEVADO DE CORROSION. LA PRESENTE INVENCION PROPORCIONA ADEMAS UN LAMINADO CHAPADO EN COBRE QUE PUEDE RESULTAR ADECUADO PARA LA PRODUCCION DE TAL CLASE DE TARJETAS DE CIRCUITOS IMPRESOS.
ES93117992T 1993-03-19 1993-11-05 Laminado plaqueado de cobre y placa de circuito impreso. Expired - Lifetime ES2105046T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5085765A JP2762386B2 (ja) 1993-03-19 1993-03-19 銅張り積層板およびプリント配線板

Publications (1)

Publication Number Publication Date
ES2105046T3 true ES2105046T3 (es) 1997-10-16

Family

ID=13867972

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93117992T Expired - Lifetime ES2105046T3 (es) 1993-03-19 1993-11-05 Laminado plaqueado de cobre y placa de circuito impreso.

Country Status (10)

Country Link
US (1) US5437914A (es)
EP (1) EP0616489B1 (es)
JP (1) JP2762386B2 (es)
KR (1) KR0127665B1 (es)
AT (1) ATE155311T1 (es)
DE (1) DE69312049T2 (es)
ES (1) ES2105046T3 (es)
MY (1) MY108905A (es)
SG (1) SG46186A1 (es)
TW (1) TW232120B (es)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
JPH08222857A (ja) * 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
JP3155920B2 (ja) * 1996-01-16 2001-04-16 三井金属鉱業株式会社 プリント配線板用電解銅箔及びその製造方法
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
EP0857402B1 (en) * 1996-08-23 2007-12-19 Nikko Materials USA, Inc. High performance flexible laminate
WO1998010628A1 (de) * 1996-09-05 1998-03-12 Siemens Aktiengesellschaft Trägerelement für einen halbleiterchip
US5989727A (en) * 1998-03-04 1999-11-23 Circuit Foil U.S.A., Inc. Electrolytic copper foil having a modified shiny side
JP3291482B2 (ja) * 1999-08-31 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法および用途
JP3291486B2 (ja) * 1999-09-06 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法およびその用途
US6372113B2 (en) 1999-09-13 2002-04-16 Yates Foil Usa, Inc. Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
US6270648B1 (en) 1999-10-22 2001-08-07 Yates Foil Usa, Inc. Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil
JP3250994B2 (ja) * 1999-12-28 2002-01-28 三井金属鉱業株式会社 電解銅箔
CN1388841A (zh) * 2000-04-05 2003-01-01 株式会社日矿材料 激光开孔用铜箔
JP3628585B2 (ja) 2000-04-05 2005-03-16 株式会社日鉱マテリアルズ 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法
GB2361713B (en) * 2000-04-14 2003-09-24 Fukuda Metal Foil Powder Method for surface treatment of copper foil
JP2004512698A (ja) * 2000-10-26 2004-04-22 オークミツイ,インク., プリント回路板製造での、酸化プロセスに代わる、微細な線形成のための銅箔への金属処理の使用
US6763575B2 (en) * 2001-06-11 2004-07-20 Oak-Mitsui Inc. Printed circuit boards having integrated inductor cores
JP4062907B2 (ja) * 2001-11-12 2008-03-19 松下電器産業株式会社 回路基板およびその製造方法
JP3898077B2 (ja) * 2001-11-13 2007-03-28 株式会社フジクラ フレキシブルプリント配線板の製造方法
DE10246094A1 (de) 2002-10-02 2004-04-22 Siemens Ag Stiftleiste
TW200500199A (en) 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
JP4226927B2 (ja) * 2003-02-18 2009-02-18 三井金属鉱業株式会社 キャパシタ層形成用の両面銅張積層板の製造方法
JP4330979B2 (ja) * 2003-11-13 2009-09-16 福田金属箔粉工業株式会社 表面処理電解銅箔
JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにtabテープ及びその製造方法
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
JP4298597B2 (ja) * 2004-07-01 2009-07-22 日東電工株式会社 配線回路基板および配線回路基板の製造方法
US7307022B2 (en) * 2004-11-19 2007-12-11 Endicott Interconnect Technologies, Inc. Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof
US6964884B1 (en) 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
US7383629B2 (en) * 2004-11-19 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
KR100716815B1 (ko) * 2005-02-28 2007-05-09 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조방법
CN100588309C (zh) * 2005-10-05 2010-02-03 日矿金属株式会社 两层挠性基板
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
US20070246158A1 (en) * 2006-04-21 2007-10-25 3M Innovative Properties Company Wiring board, production process thereof and connection method using same
JP4826569B2 (ja) * 2007-10-05 2011-11-30 日立電線株式会社 プリント配線板用金属板材およびその製造方法
JP5636224B2 (ja) * 2010-08-06 2014-12-03 三井金属鉱業株式会社 フィラー含有樹脂層付金属箔及びフィラー含有樹脂層付金属箔の製造方法
US20130284500A1 (en) * 2012-04-25 2013-10-31 Jun-Chung Hsu Laminate circuit board structure
CN104244586A (zh) * 2013-07-04 2014-12-24 漳州市福世通电子有限公司 一种卷式ic卡线路板铜箔与基材的固化方法
CN112867268A (zh) * 2021-01-05 2021-05-28 中山国昌荣电子有限公司 一种覆铜板减铜工艺

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Publication number Priority date Publication date Assignee Title
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor
US3771973A (en) * 1971-05-10 1973-11-13 Hooker Chemical Corp Metal plating of synthetic polymers
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US4191800A (en) * 1976-05-27 1980-03-04 Bell Telephone Laboratories, Incorporated Devices employing flexible substrates and method for making same
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
US4886699A (en) * 1987-10-26 1989-12-12 Rogers Corporation Glass fiber reinforced fluoropolymeric circuit laminate
US4997516A (en) * 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
TW208110B (es) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
JP3081026B2 (ja) * 1991-07-18 2000-08-28 古河サーキットフォイル株式会社 プリント配線板用電解銅箔
JPH0766933B2 (ja) * 1991-09-18 1995-07-19 三井金属鉱業株式会社 Tabテープの製造方法

Also Published As

Publication number Publication date
EP0616489B1 (en) 1997-07-09
KR950007618A (ko) 1995-03-21
KR0127665B1 (ko) 1997-12-30
ATE155311T1 (de) 1997-07-15
JP2762386B2 (ja) 1998-06-04
DE69312049D1 (de) 1997-08-14
JPH06270331A (ja) 1994-09-27
MY108905A (en) 1996-11-30
DE69312049T2 (de) 1998-02-26
SG46186A1 (en) 1998-02-20
US5437914A (en) 1995-08-01
TW232120B (es) 1994-10-11
EP0616489A1 (en) 1994-09-21

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