ATE154834T1 - Substrat mit verbesserter oberflächemorphologie mittels schmelzflüssigen spritzens - Google Patents

Substrat mit verbesserter oberflächemorphologie mittels schmelzflüssigen spritzens

Info

Publication number
ATE154834T1
ATE154834T1 AT91810992T AT91810992T ATE154834T1 AT E154834 T1 ATE154834 T1 AT E154834T1 AT 91810992 T AT91810992 T AT 91810992T AT 91810992 T AT91810992 T AT 91810992T AT E154834 T1 ATE154834 T1 AT E154834T1
Authority
AT
Austria
Prior art keywords
metal
substrate
coating
surface morphology
article
Prior art date
Application number
AT91810992T
Other languages
German (de)
English (en)
Inventor
Lynne M Ernes
Richard C Carlson
Kenneth L Hardee
Original Assignee
Eltech Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24541661&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE154834(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Eltech Systems Corp filed Critical Eltech Systems Corp
Application granted granted Critical
Publication of ATE154834T1 publication Critical patent/ATE154834T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/02—Electrodes; Connections thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Pinball Game Machines (AREA)
AT91810992T 1990-12-26 1991-12-20 Substrat mit verbesserter oberflächemorphologie mittels schmelzflüssigen spritzens ATE154834T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63391490A 1990-12-26 1990-12-26

Publications (1)

Publication Number Publication Date
ATE154834T1 true ATE154834T1 (de) 1997-07-15

Family

ID=24541661

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91810992T ATE154834T1 (de) 1990-12-26 1991-12-20 Substrat mit verbesserter oberflächemorphologie mittels schmelzflüssigen spritzens

Country Status (12)

Country Link
EP (1) EP0493326B1 (nl)
JP (1) JP2825383B2 (nl)
KR (1) KR100235378B1 (nl)
AT (1) ATE154834T1 (nl)
AU (1) AU643350B2 (nl)
CA (1) CA2056943C (nl)
DE (1) DE69126656T2 (nl)
DK (1) DK0493326T3 (nl)
ES (1) ES2104684T3 (nl)
GR (1) GR3024677T3 (nl)
MX (1) MX9102511A (nl)
TW (1) TW197475B (nl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314601A (en) * 1989-06-30 1994-05-24 Eltech Systems Corporation Electrodes of improved service life
JP3228644B2 (ja) * 1993-11-05 2001-11-12 東京エレクトロン株式会社 真空処理装置用素材及びその製造方法
WO1997017478A1 (de) * 1995-11-08 1997-05-15 Fissler Gmbh Verfahren zur erzeugung einer antihaftbeschichtung sowie mit einer solchen versehene gegenstände
CA2627605A1 (en) * 2005-09-20 2007-03-29 Kudu Industries Inc. Process for hardfacing a progressing cavity pump/motor rotor
FI118159B (fi) * 2005-10-21 2007-07-31 Outotec Oyj Menetelmä elektrokatalyyttisen pinnan muodostamiseksi elektrodiin ja elektrodi
ITMI20070980A1 (it) * 2007-05-15 2008-11-16 Industrie De Nora Spa Elettrodo per celle elettrolitiche a membrana
EP2022447A1 (en) 2007-07-09 2009-02-11 Astra Tech AB Nanosurface
ITMI20102354A1 (it) * 2010-12-22 2012-06-23 Industrie De Nora Spa Elettrodo per cella elettrolitica
CN104073842A (zh) * 2011-10-13 2014-10-01 金川集团有限公司 一种电积、电解镍的阴极板
WO2013191140A1 (ja) 2012-06-18 2013-12-27 旭化成株式会社 複極式アルカリ水電解ユニット、及び電解槽
JP6234754B2 (ja) * 2013-09-18 2017-11-22 株式会社神戸製鋼所 電極用金属板及び電極
US20160326624A1 (en) * 2014-01-31 2016-11-10 Hewlett-Packard Development Company, L.P. Surface Treatments of Metal Substrates
JP7334095B2 (ja) * 2019-01-21 2023-08-28 Ｄｏｗａメタルマイン株式会社 錫の電解採取方法
DE102020120412A1 (de) 2020-08-03 2022-02-03 Canon Production Printing Holding B.V. Vorrichtung zum Erwärmen eines Aufzeichnungsträgers mit einem auf dem Aufzeichnungsträger gedruckten Druckbild

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2320329A (en) * 1942-08-06 1943-05-25 Metallizing Engineering Co Inc Spray metal coated, metal surfaced articles
DE2300422C3 (de) * 1973-01-05 1981-10-15 Hoechst Ag, 6000 Frankfurt Verfahren zur Herstellung einer Elektrode
JPS5137837A (ja) * 1974-09-27 1976-03-30 Tokyo Metarikon Kk Himakukeiseiho
DE3106587C2 (de) * 1981-02-21 1987-01-02 Heraeus Elektroden GmbH, 6450 Hanau Elektrode und deren Verwendung
JPS60159199A (ja) * 1984-01-27 1985-08-20 Plasma Giken Kogyo Kk 二酸化鉛電極
JPS63176453A (ja) * 1987-01-16 1988-07-20 Dainippon Toryo Co Ltd 金属溶射被膜の作製方法
DE3712684A1 (de) * 1987-04-14 1988-10-27 Castolin Sa Verfahren zum herstellen einer gespritzten oberflaeche mit definierter rauhigkeit sowie dessen verwendung
JPH01150000A (ja) * 1987-12-07 1989-06-13 Nippon Steel Corp 電気メッキ用不溶性陽極
JPH01152294A (ja) * 1987-12-09 1989-06-14 Nippon Mining Co Ltd 不溶性アノード用材料の製造方法
JPH01177399A (ja) * 1988-01-07 1989-07-13 Kawasaki Steel Corp 電気めっき用Ｐｂ系不溶性陽極
JPH02200799A (ja) * 1989-01-27 1990-08-09 Kobe Steel Ltd 電解用不溶性電極及びそれを使用したカチオン電着塗装方法
GB8903322D0 (en) * 1989-02-14 1989-04-05 Ici Plc Electrolytic process
TW214570B (nl) * 1989-06-30 1993-10-11 Eltech Systems Corp

Also Published As

Publication number Publication date
ES2104684T3 (es) 1997-10-16
DK0493326T3 (da) 1997-12-29
EP0493326A2 (en) 1992-07-01
GR3024677T3 (en) 1997-12-31
KR920011628A (ko) 1992-07-24
AU643350B2 (en) 1993-11-11
DE69126656D1 (de) 1997-07-31
EP0493326A3 (en) 1993-03-17
AU8995491A (en) 1992-07-02
CA2056943C (en) 1997-11-11
MX9102511A (es) 1992-06-01
JPH04301062A (ja) 1992-10-23
KR100235378B1 (ko) 1999-12-15
EP0493326B1 (en) 1997-06-25
DE69126656T2 (de) 1998-01-02
JP2825383B2 (ja) 1998-11-18
CA2056943A1 (en) 1992-06-27
TW197475B (nl) 1993-01-01

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee