ES2079222T3 - Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente. - Google Patents

Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente.

Info

Publication number
ES2079222T3
ES2079222T3 ES93104080T ES93104080T ES2079222T3 ES 2079222 T3 ES2079222 T3 ES 2079222T3 ES 93104080 T ES93104080 T ES 93104080T ES 93104080 T ES93104080 T ES 93104080T ES 2079222 T3 ES2079222 T3 ES 2079222T3
Authority
ES
Spain
Prior art keywords
adherence
improvement
procedure
current
metal layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93104080T
Other languages
English (en)
Inventor
Henning Dr Giesecke
Gerhard-Dieter Dr Wolf
Wilfried Dr Haese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Application granted granted Critical
Publication of ES2079222T3 publication Critical patent/ES2079222T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

REVESTIMIENTOS METALICOS SEPARADOS SIN CORRIENTE ELECTRICA CON ADHERENCIA MEJORADA, QUE PUEDEN SER OBTENIDOS POR UN PROCEDIMIENTO EN EL QUE SE RECUBRE LA SUPERFICIE DEL SUBSTRATO A METALIZAR CON UNA FORMULACION, CONSISTENTE EN LACAS ENDURECIBLES CON RAYOS ULTRAVIOLETA, QUE CONTIENEN COMPUESTOS DE METALES NOBLES COMO ACTIVADORES, Y ADICIONALMENTE, BIEN SUSTANCIAS DE RELLENO O DISOLVENTES O UNA COMBINACION DE SUSTANCIAS DE RELLENO Y DISOLVENTES, ESTAS LACAS SON ENDURECIDAS POR RADIACIONES ULTRAVIOLETA, Y LOS SUBSTRATOS ASI TRATADOS SON METALIZADOS A CONTINUACION SIN CORRIENTE ELECTRICA.
ES93104080T 1992-03-25 1993-03-12 Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente. Expired - Lifetime ES2079222T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4209708A DE4209708A1 (de) 1992-03-25 1992-03-25 Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten

Publications (1)

Publication Number Publication Date
ES2079222T3 true ES2079222T3 (es) 1996-01-01

Family

ID=6454999

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93104080T Expired - Lifetime ES2079222T3 (es) 1992-03-25 1993-03-12 Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente.

Country Status (7)

Country Link
US (1) US5436034A (es)
EP (1) EP0562393B1 (es)
JP (1) JP3279713B2 (es)
AT (1) ATE130051T1 (es)
CA (1) CA2092159C (es)
DE (2) DE4209708A1 (es)
ES (1) ES2079222T3 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996027691A1 (de) * 1995-03-06 1996-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Palladiumhaltiges precursormaterial und verfahren zur herstellung von metallischen mikrostrukturen auf dielektrischen substraten mit einem palladiumhaltigen precursormaterial
DE19508341A1 (de) * 1995-03-09 1996-09-12 Bosch Gmbh Robert Verfahren zum stromlosen Metallisieren von elektrisch nicht leitenden Substraten
JPH1197840A (ja) * 1997-09-16 1999-04-09 Electro Kemi:Kk プリント配線板の製造法
DE19812880A1 (de) 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
DE19833593C2 (de) * 1998-07-25 2002-03-14 Daimler Chrysler Ag Verfahren zur selektiven Metallisierung
GB2381274A (en) * 2001-10-29 2003-04-30 Qinetiq Ltd High resolution patterning method
US7261920B2 (en) * 2002-04-24 2007-08-28 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US8002948B2 (en) * 2002-04-24 2011-08-23 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
US7156945B2 (en) * 2002-04-24 2007-01-02 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
DE10238938B4 (de) 2002-08-24 2004-07-29 Robert Bosch Gmbh Verfahren zur Herstellung eines Schichtsystems und Verwendung des Verfahrens
US8435603B2 (en) 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
GB0401825D0 (en) * 2003-12-05 2004-03-03 Conductive Inkjet Tech Ltd Formation of solid layers on substrates
WO2006123144A2 (en) * 2005-05-18 2006-11-23 Conductive Inkjet Technology Limited Formation of layers on substrates
WO2007000833A1 (ja) * 2005-06-29 2007-01-04 Harima Chemicals, Inc. 導電性回路の形成方法
US7767126B2 (en) * 2005-08-22 2010-08-03 Sipix Imaging, Inc. Embossing assembly and methods of preparation
EP2918704B1 (de) * 2014-03-14 2019-08-07 FRANZ Oberflächentechnik GmbH & Co KG Verfahren zum Konditionieren eines Bauteils

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305460A (en) * 1964-01-23 1967-02-21 Gen Electric Method of electroplating plastic articles
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
US4268536A (en) * 1978-12-07 1981-05-19 Western Electric Company, Inc. Method for depositing a metal on a surface
DE3025307A1 (de) * 1980-07-04 1982-01-28 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung
US4368281A (en) * 1980-09-15 1983-01-11 Amp Incorporated Printed circuits
US4344982A (en) * 1980-12-31 1982-08-17 Mobil Oil Corporation Carbonate-acrylate or alkylacrylate radiation curable coating compositions and method of curing
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
DE3571545D1 (en) * 1984-09-19 1989-08-17 Bayer Ag Method of partially activating a substrate surfaces
GB8501086D0 (en) * 1985-01-16 1985-02-20 Canning W Materials Ltd Metal coating
DE3667800D1 (de) * 1985-08-23 1990-02-01 Ciba Geigy Ag Mischung aus olefin und dibenzalaceton-palladiumkomplex und deren verwendung.
DE3625587A1 (de) * 1986-07-29 1988-02-04 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen
DE3627256A1 (de) * 1986-08-12 1988-02-18 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen
DE3627265A1 (de) * 1986-08-12 1988-02-18 Heinz Dr Ing Steffen Verfahren zum betrieb einer kompostanlage
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
DE3743780A1 (de) * 1987-12-23 1989-07-06 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
DE4015717A1 (de) * 1990-05-16 1991-11-21 Bayer Ag Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung

Also Published As

Publication number Publication date
DE59300875D1 (de) 1995-12-14
JPH0617255A (ja) 1994-01-25
CA2092159C (en) 2004-01-27
CA2092159A1 (en) 1993-09-26
DE4209708A1 (de) 1993-09-30
EP0562393A1 (de) 1993-09-29
ATE130051T1 (de) 1995-11-15
JP3279713B2 (ja) 2002-04-30
EP0562393B1 (de) 1995-11-08
US5436034A (en) 1995-07-25

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