AR002790A1 - Dispositivo de celulas de memoria estacionaria grabables y borrables electricamente y procedimiento para su elaboracion. - Google Patents

Dispositivo de celulas de memoria estacionaria grabables y borrables electricamente y procedimiento para su elaboracion.

Info

Publication number
AR002790A1
AR002790A1 ARP960103507A AR10350796A AR002790A1 AR 002790 A1 AR002790 A1 AR 002790A1 AR P960103507 A ARP960103507 A AR P960103507A AR 10350796 A AR10350796 A AR 10350796A AR 002790 A1 AR002790 A1 AR 002790A1
Authority
AR
Argentina
Prior art keywords
recordable
memory cells
elaboration
procedure
electronic erasable
Prior art date
Application number
ARP960103507A
Other languages
English (en)
Inventor
Wolfgang Dr Krautschneider
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of AR002790A1 publication Critical patent/AR002790A1/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels

Abstract

Un dispositivo de células de memoria estacionaria grabables y borrables eléctricamente comprende células de memoria, siempre con un transistor MOS conuna puerta flotante (6). Los transistores MOS están dispuestos en hileras que corren paralelas.En él, las hileras contiguas siempre corren en formaalternada en el piso de los surcos longitudinales (4) y entre surcos longitudinales (4). Mediante pasos de proceso autoajustables se logra unrequerimiento de superficie por célula dememo ria de 2F exponente 2 (F:tamano estructural mínimo).
ARP960103507A 1995-07-10 1996-07-10 Dispositivo de celulas de memoria estacionaria grabables y borrables electricamente y procedimiento para su elaboracion. AR002790A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19525070A DE19525070C2 (de) 1995-07-10 1995-07-10 Elektrisch schreib- und löschbare Festwertspeicherzellenanordnung und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
AR002790A1 true AR002790A1 (es) 1998-04-29

Family

ID=7766442

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP960103507A AR002790A1 (es) 1995-07-10 1996-07-10 Dispositivo de celulas de memoria estacionaria grabables y borrables electricamente y procedimiento para su elaboracion.

Country Status (8)

Country Link
US (1) US5943572A (es)
EP (1) EP0838092B1 (es)
JP (1) JPH11509044A (es)
KR (1) KR100417727B1 (es)
AR (1) AR002790A1 (es)
DE (2) DE19525070C2 (es)
IN (1) IN189362B (es)
WO (1) WO1997003469A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603810C1 (de) * 1996-02-02 1997-08-28 Siemens Ag Speicherzellenanordnung und Verfahren zu deren Herstellung
US6576547B2 (en) 1998-03-05 2003-06-10 Micron Technology, Inc. Residue-free contact openings and methods for fabricating same
DE19823733A1 (de) * 1998-05-27 1999-12-02 Siemens Ag Halbleiter-Speicherzellenanordnung und entsprechendes Herstellungsverfahren
DE19929233C1 (de) * 1999-06-25 2001-02-01 Siemens Ag Speicherzellenanordnung mit auf einer Grabenseitenwand angeordnetem Floating-Gate und Herstellungsverfahren
US6329687B1 (en) * 2000-01-27 2001-12-11 Advanced Micro Devices, Inc. Two bit flash cell with two floating gate regions
US6762092B2 (en) * 2001-08-08 2004-07-13 Sandisk Corporation Scalable self-aligned dual floating gate memory cell array and methods of forming the array
US6952033B2 (en) 2002-03-20 2005-10-04 Silicon Storage Technology, Inc. Semiconductor memory array of floating gate memory cells with buried bit-line and raised source line
US6917069B2 (en) * 2001-10-17 2005-07-12 Silicon Storage Technology, Inc. Semiconductor memory array of floating gate memory cells with buried bit-line and vertical word line transistor
US6720611B2 (en) * 2002-01-28 2004-04-13 Winbond Electronics Corporation Fabrication method for flash memory
US7411246B2 (en) 2002-04-01 2008-08-12 Silicon Storage Technology, Inc. Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried bit-line and raised source line, and a memory array made thereby
US6952034B2 (en) * 2002-04-05 2005-10-04 Silicon Storage Technology, Inc. Semiconductor memory array of floating gate memory cells with buried source line and floating gate
US6891220B2 (en) * 2002-04-05 2005-05-10 Silicon Storage Technology, Inc. Method of programming electrons onto a floating gate of a non-volatile memory cell
US6894930B2 (en) 2002-06-19 2005-05-17 Sandisk Corporation Deep wordline trench to shield cross coupling between adjacent cells for scaled NAND
EP1514309B1 (en) * 2002-06-19 2013-11-27 SanDisk Technologies Inc. Deep wordline trench to shield cross coupling between adjacent cells of nand memory
US6906379B2 (en) * 2003-08-28 2005-06-14 Silicon Storage Technology, Inc. Semiconductor memory array of floating gate memory cells with buried floating gate
TWI241017B (en) * 2005-01-03 2005-10-01 Powerchip Semiconductor Corp Non-volatile memory device and manufacturing method and operating method thereof
US7745285B2 (en) * 2007-03-30 2010-06-29 Sandisk Corporation Methods of forming and operating NAND memory with side-tunneling
US8148768B2 (en) * 2008-11-26 2012-04-03 Silicon Storage Technology, Inc. Non-volatile memory cell with self aligned floating and erase gates, and method of making same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715953B2 (ja) * 1985-08-09 1995-02-22 株式会社リコー 書換え可能なメモリ装置とその製造方法
US5156989A (en) * 1988-11-08 1992-10-20 Siliconix, Incorporated Complementary, isolated DMOS IC technology
JPH05102436A (ja) * 1991-10-09 1993-04-23 Ricoh Co Ltd 半導体メモリ装置とその製造方法
JPH07254651A (ja) * 1994-03-16 1995-10-03 Toshiba Corp 半導体集積回路装置
US5376572A (en) * 1994-05-06 1994-12-27 United Microelectronics Corporation Method of making an electrically erasable programmable memory device with improved erase and write operation

Also Published As

Publication number Publication date
US5943572A (en) 1999-08-24
DE19525070A1 (de) 1997-01-16
IN189362B (es) 2003-02-15
KR100417727B1 (ko) 2004-04-17
KR19990028827A (ko) 1999-04-15
DE19525070C2 (de) 2001-12-06
DE59608152D1 (de) 2001-12-13
EP0838092A1 (de) 1998-04-29
WO1997003469A1 (de) 1997-01-30
JPH11509044A (ja) 1999-08-03
EP0838092B1 (de) 2001-11-07

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