ZA200303177B - A multi-chip integrated circuit carrier. - Google Patents
A multi-chip integrated circuit carrier. Download PDFInfo
- Publication number
- ZA200303177B ZA200303177B ZA200303177A ZA200303177A ZA200303177B ZA 200303177 B ZA200303177 B ZA 200303177B ZA 200303177 A ZA200303177 A ZA 200303177A ZA 200303177 A ZA200303177 A ZA 200303177A ZA 200303177 B ZA200303177 B ZA 200303177B
- Authority
- ZA
- South Africa
- Prior art keywords
- carrier
- integrated circuit
- island
- wafer
- receiving
- Prior art date
Links
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 23
- 208000002740 Muscle Rigidity Diseases 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 27
- 239000007787 solid Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000003491 array Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 230000000930 thermomechanical effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LVROLHVSYNLFBE-UHFFFAOYSA-N 2,3,6-trichlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C=CC=CC=2)=C1Cl LVROLHVSYNLFBE-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/147—Semiconductor insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/693,068 US6507099B1 (en) | 2000-10-20 | 2000-10-20 | Multi-chip integrated circuit carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200303177B true ZA200303177B (en) | 2003-11-06 |
Family
ID=24783181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200303177A ZA200303177B (en) | 2000-10-20 | 2003-04-24 | A multi-chip integrated circuit carrier. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6507099B1 (ja) |
| EP (1) | EP1346615A4 (ja) |
| JP (2) | JP3839404B2 (ja) |
| KR (1) | KR100538160B1 (ja) |
| CN (1) | CN1239057C (ja) |
| AU (2) | AU2002210253B2 (ja) |
| IL (2) | IL155465A0 (ja) |
| SG (1) | SG125991A1 (ja) |
| WO (1) | WO2002034018A1 (ja) |
| ZA (1) | ZA200303177B (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6710457B1 (en) * | 2000-10-20 | 2004-03-23 | Silverbrook Research Pty Ltd | Integrated circuit carrier |
| US6775906B1 (en) * | 2000-10-20 | 2004-08-17 | Silverbrook Research Pty Ltd | Method of manufacturing an integrated circuit carrier |
| US7052117B2 (en) * | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
| DE10361106A1 (de) * | 2003-12-22 | 2005-05-04 | Infineon Technologies Ag | Halbleiterbauteil mit einem Halbleiterchip und einer steifen Umverdrahtungsplatte und Verfahren zur Herstellung derselben |
| US8491076B2 (en) | 2004-03-15 | 2013-07-23 | Fujifilm Dimatix, Inc. | Fluid droplet ejection devices and methods |
| US7281778B2 (en) * | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
| US8708441B2 (en) | 2004-12-30 | 2014-04-29 | Fujifilm Dimatix, Inc. | Ink jet printing |
| US7988247B2 (en) * | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
| DE102010042379A1 (de) * | 2010-10-13 | 2012-04-19 | Robert Bosch Gmbh | Elektronisches Bauteil |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62257756A (ja) * | 1986-04-30 | 1987-11-10 | Nec Corp | シリコン基板 |
| JPH01258458A (ja) * | 1988-04-08 | 1989-10-16 | Nec Corp | ウェーハ集積型集積回路 |
| JPH0242739A (ja) * | 1988-08-01 | 1990-02-13 | Toagosei Chem Ind Co Ltd | Ｃｏｂ実装プリント回路板 |
| US4989063A (en) * | 1988-12-09 | 1991-01-29 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid wafer scale microcircuit integration |
| JPH0685010A (ja) * | 1992-09-02 | 1994-03-25 | Toshiba Corp | マルチチップモジュール |
| DE4342767A1 (de) * | 1993-12-15 | 1995-06-22 | Ant Nachrichtentech | Verfahren zur Herstellung einer quaderförmigen Vertiefung zur Aufnahme eines Bauelementes in einer Trägerplatte |
| JP2755252B2 (ja) * | 1996-05-30 | 1998-05-20 | 日本電気株式会社 | 半導体装置用パッケージ及び半導体装置 |
| JP2940491B2 (ja) * | 1996-10-17 | 1999-08-25 | 日本電気株式会社 | マルチチップモジュールにおけるフリップチップ実装構造及び方法並びにマルチチップモジュールにおけるフリップチップ実装用基板 |
| US6075711A (en) * | 1996-10-21 | 2000-06-13 | Alpine Microsystems, Inc. | System and method for routing connections of integrated circuits |
| US6064576A (en) * | 1997-01-02 | 2000-05-16 | Texas Instruments Incorporated | Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
| JPH11135675A (ja) * | 1997-10-30 | 1999-05-21 | Kawasaki Steel Corp | 半導体装置及びその製造方法 |
| JP3398319B2 (ja) * | 1997-12-16 | 2003-04-21 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| WO1999059206A2 (en) * | 1998-05-13 | 1999-11-18 | Koninklijke Philips Electronics N.V. | Semiconductor device and method for making the device |
| JP2997746B2 (ja) | 1998-05-27 | 2000-01-11 | 亜南半導体株式会社 | 印刷回路基板 |
| JP3020201B2 (ja) | 1998-05-27 | 2000-03-15 | 亜南半導体株式会社 | ボールグリッドアレイ半導体パッケージのモールディング方法 |
| US6050832A (en) * | 1998-08-07 | 2000-04-18 | Fujitsu Limited | Chip and board stress relief interposer |
| US6175158B1 (en) * | 1998-09-08 | 2001-01-16 | Lucent Technologies Inc. | Interposer for recessed flip-chip package |
| JP2000174161A (ja) | 1998-12-04 | 2000-06-23 | Nec Home Electronics Ltd | フレキシブル基板及びこれを用いた半導体装置の実装方法 |
| JP2000228584A (ja) | 1999-02-09 | 2000-08-15 | Canon Inc | 多層プリント配線基板 |
| US6341071B1 (en) | 1999-03-19 | 2002-01-22 | International Business Machines Corporation | Stress relieved ball grid array package |
| US6078505A (en) | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
| JP3494593B2 (ja) * | 1999-06-29 | 2004-02-09 | シャープ株式会社 | 半導体装置及び半導体装置用基板 |
| JP2001094228A (ja) | 1999-09-22 | 2001-04-06 | Seiko Epson Corp | 半導体装置の実装構造 |
| JP3268300B2 (ja) * | 1999-09-27 | 2002-03-25 | 独立行政法人通信総合研究所 | 多段ハーメチックシール |
-
2000
- 2000-10-20 US US09/693,068 patent/US6507099B1/en not_active Expired - Fee Related
-
2001
- 2001-10-19 JP JP2002537088A patent/JP3839404B2/ja not_active Expired - Fee Related
- 2001-10-19 AU AU2002210253A patent/AU2002210253B2/en not_active Ceased
- 2001-10-19 IL IL15546501A patent/IL155465A0/xx unknown
- 2001-10-19 CN CNB018177611A patent/CN1239057C/zh not_active Expired - Fee Related
- 2001-10-19 WO PCT/AU2001/001331 patent/WO2002034018A1/en active IP Right Grant
- 2001-10-19 EP EP01977989A patent/EP1346615A4/en not_active Withdrawn
- 2001-10-19 SG SG200501722A patent/SG125991A1/en unknown
- 2001-10-19 KR KR10-2003-7005532A patent/KR100538160B1/ko not_active IP Right Cessation
- 2001-10-19 AU AU1025302A patent/AU1025302A/xx active Pending
-
2003
- 2003-04-15 IL IL155465A patent/IL155465A/en not_active IP Right Cessation
- 2003-04-24 ZA ZA200303177A patent/ZA200303177B/en unknown
-
2005
- 2005-10-24 JP JP2005308822A patent/JP4528246B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1239057C (zh) | 2006-01-25 |
| EP1346615A1 (en) | 2003-09-24 |
| AU2002210253B2 (en) | 2004-03-04 |
| JP3839404B2 (ja) | 2006-11-01 |
| CN1471803A (zh) | 2004-01-28 |
| IL155465A (en) | 2010-11-30 |
| WO2002034018A1 (en) | 2002-04-25 |
| JP2006054493A (ja) | 2006-02-23 |
| SG125991A1 (en) | 2006-10-30 |
| KR20030074609A (ko) | 2003-09-19 |
| IL155465A0 (en) | 2003-11-23 |
| US6507099B1 (en) | 2003-01-14 |
| AU1025302A (en) | 2002-04-29 |
| EP1346615A4 (en) | 2006-02-01 |
| KR100538160B1 (ko) | 2005-12-21 |
| JP2004511919A (ja) | 2004-04-15 |
| JP4528246B2 (ja) | 2010-08-18 |
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