ZA200104980B - Shock-risistant epoxide resin compositions. - Google Patents
Shock-risistant epoxide resin compositions. Download PDFInfo
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- ZA200104980B ZA200104980B ZA200104980A ZA200104980A ZA200104980B ZA 200104980 B ZA200104980 B ZA 200104980B ZA 200104980 A ZA200104980 A ZA 200104980A ZA 200104980 A ZA200104980 A ZA 200104980A ZA 200104980 B ZA200104980 B ZA 200104980B
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- South Africa
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- composition
- component
- compositions
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- 239000000203 mixture Substances 0.000 title claims description 71
- 229920000647 polyepoxide Polymers 0.000 title claims description 61
- 239000003822 epoxy resin Substances 0.000 title claims description 50
- 230000001070 adhesive effect Effects 0.000 claims description 70
- 239000000853 adhesive Substances 0.000 claims description 65
- 229920001577 copolymer Polymers 0.000 claims description 26
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 23
- -1 rheology aids Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 235000013824 polyphenols Nutrition 0.000 claims description 14
- 239000007795 chemical reaction product Substances 0.000 claims description 13
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 230000009477 glass transition Effects 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 239000003981 vehicle Substances 0.000 claims description 10
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 7
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 7
- 125000005442 diisocyanate group Chemical group 0.000 claims description 7
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 7
- 229920005906 polyester polyol Polymers 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 6
- 150000002357 guanidines Chemical class 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 5
- 239000004849 latent hardener Substances 0.000 claims description 5
- 238000000518 rheometry Methods 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 239000003085 diluting agent Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000000080 wetting agent Substances 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- HAMNKKUPIHEESI-UHFFFAOYSA-N aminoguanidine Chemical class NNC(N)=N HAMNKKUPIHEESI-UHFFFAOYSA-N 0.000 claims 2
- 150000004984 aromatic diamines Chemical class 0.000 claims 2
- LFMQNMXVVXHZCC-UHFFFAOYSA-N 1,3-benzothiazol-2-yl n,n-diethylcarbamodithioate Chemical compound C1=CC=C2SC(SC(=S)N(CC)CC)=NC2=C1 LFMQNMXVVXHZCC-UHFFFAOYSA-N 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 125000002897 diene group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- QROGIFZRVHSFLM-UHFFFAOYSA-N prop-1-enylbenzene Chemical compound CC=CC1=CC=CC=C1 QROGIFZRVHSFLM-UHFFFAOYSA-N 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 11
- 239000004831 Hot glue Substances 0.000 description 10
- 239000004848 polyfunctional curative Substances 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000005056 polyisocyanate Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 229920013646 Hycar Polymers 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004823 Reactive adhesive Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 235000013877 carbamide Nutrition 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 150000002924 oxiranes Chemical class 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- 150000003672 ureas Chemical class 0.000 description 3
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical class NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical class NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 229920002396 Polyurea Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000004494 ethyl ester group Chemical group 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- CHJJGSNFBQVOTG-UHFFFAOYSA-N methylguanidine Chemical compound CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 2
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
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- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- NQOFYFRKWDXGJP-UHFFFAOYSA-N 1,1,2-trimethylguanidine Chemical compound CN=C(N)N(C)C NQOFYFRKWDXGJP-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- UTCOUOISVRSLSH-UHFFFAOYSA-N 1,2-Anthracenediol Chemical class C1=CC=CC2=CC3=C(O)C(O)=CC=C3C=C21 UTCOUOISVRSLSH-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- LINDOXZENKYESA-UHFFFAOYSA-N 1,2-dimethylguanidine Chemical compound CNC(N)=NC LINDOXZENKYESA-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- AGJCSCSSMFRMFQ-UHFFFAOYSA-N 1,4-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=C(C(C)(C)N=C=O)C=C1 AGJCSCSSMFRMFQ-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 description 1
- MCMFEZDRQOJKMN-UHFFFAOYSA-N 1-butylimidazole Chemical compound CCCCN1C=CN=C1 MCMFEZDRQOJKMN-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- LLVWLCAZSOLOTF-UHFFFAOYSA-N 1-methyl-4-[1,4,4-tris(4-methylphenyl)buta-1,3-dienyl]benzene Chemical compound C1=CC(C)=CC=C1C(C=1C=CC(C)=CC=1)=CC=C(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 LLVWLCAZSOLOTF-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NBNGHXWJFSMASY-UHFFFAOYSA-N 2,3,4-tris(dimethylamino)phenol Chemical compound CN(C)C1=CC=C(O)C(N(C)C)=C1N(C)C NBNGHXWJFSMASY-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QFRHTANKIYQYLO-UHFFFAOYSA-N 2-ethyl-2-methylimidazole Chemical compound CCC1(C)N=CC=N1 QFRHTANKIYQYLO-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- DUHQIGLHYXLKAE-UHFFFAOYSA-N 3,3-dimethylglutaric acid Chemical compound OC(=O)CC(C)(C)CC(O)=O DUHQIGLHYXLKAE-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000005510 Diuron Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 1
- 229920000877 Melamine resin Chemical class 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-N Salicylic acid Natural products OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229920001079 Thiokol (polymer) Polymers 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- HHSPVTKDOHQBKF-UHFFFAOYSA-J calcium;magnesium;dicarbonate Chemical class [Mg+2].[Ca+2].[O-]C([O-])=O.[O-]C([O-])=O HHSPVTKDOHQBKF-UHFFFAOYSA-J 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000007965 phenolic acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3215—Polyhydroxy compounds containing aromatic groups or benzoquinone groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19858921A DE19858921A1 (de) | 1998-12-19 | 1998-12-19 | Schlagfeste Epoxidharz-Zusammensetzungen |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA200104980B true ZA200104980B (en) | 2002-09-18 |
Family
ID=7891881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA200104980A ZA200104980B (en) | 1998-12-19 | 2001-06-18 | Shock-risistant epoxide resin compositions. |
Country Status (19)
Country | Link |
---|---|
US (1) | US6776869B1 (fr) |
EP (1) | EP1155082B1 (fr) |
JP (1) | JP2002533511A (fr) |
KR (1) | KR20010093854A (fr) |
CN (1) | CN1330684A (fr) |
AR (1) | AR021895A1 (fr) |
AT (1) | ATE277117T1 (fr) |
AU (1) | AU1975700A (fr) |
BR (1) | BR9916372A (fr) |
CA (1) | CA2355611A1 (fr) |
CZ (1) | CZ20012245A3 (fr) |
DE (2) | DE19858921A1 (fr) |
ES (1) | ES2228147T3 (fr) |
HU (1) | HUP0104671A2 (fr) |
PL (1) | PL349508A1 (fr) |
SK (1) | SK8632001A3 (fr) |
TR (1) | TR200101730T2 (fr) |
WO (1) | WO2000037554A1 (fr) |
ZA (1) | ZA200104980B (fr) |
Families Citing this family (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040181013A1 (en) * | 1998-10-06 | 2004-09-16 | Henkel Teroson Gmbh | Impact resistant epoxide resin compositions |
KR20020089439A (ko) * | 2000-04-10 | 2002-11-29 | 헨켈 코만디트게젤샤프트 아우프 악티엔 | 내충격성 에폭시 수지 조성물 |
DE10062009A1 (de) * | 2000-12-13 | 2002-07-04 | Henkel Teroson Gmbh | Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis |
US6787579B2 (en) | 2001-05-02 | 2004-09-07 | L&L Products, Inc. | Two-component (epoxy/amine) structural foam-in-place material |
US6887914B2 (en) | 2001-09-07 | 2005-05-03 | L&L Products, Inc. | Structural hot melt material and methods |
US6793274B2 (en) * | 2001-11-14 | 2004-09-21 | L&L Products, Inc. | Automotive rail/frame energy management system |
EP1456286B1 (fr) | 2001-12-21 | 2012-06-13 | Henkel AG & Co. KGaA | Systemes expansibles a base de resine epoxyde modifies avec des polymeres thermoplastiques |
US20030192643A1 (en) | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
EP1359202A1 (fr) | 2002-05-03 | 2003-11-05 | Sika Schweiz AG | Composition de résine époxy réticulable par application de chaleur |
US20040053055A1 (en) * | 2002-07-03 | 2004-03-18 | Robinson John W. | Rubber toughened epoxy resins for resin infusion processing, methods of using the resins and articles made therefrom |
EP1431325A1 (fr) | 2002-12-17 | 2004-06-23 | Sika Technology AG | Composition de résine époxy durcissable à la chaleur ayant une résistance au choc à basse température |
US20040204551A1 (en) * | 2003-03-04 | 2004-10-14 | L&L Products, Inc. | Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
DE10312815A1 (de) | 2003-03-22 | 2004-10-07 | Henkel Kgaa | Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen |
US7125461B2 (en) * | 2003-05-07 | 2006-10-24 | L & L Products, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
US7071263B2 (en) * | 2003-05-19 | 2006-07-04 | 3M Innovative Properties Company | Epoxy adhesives and bonded substrates |
US7199165B2 (en) * | 2003-06-26 | 2007-04-03 | L & L Products, Inc. | Expandable material |
JP2005042086A (ja) * | 2003-07-07 | 2005-02-17 | Nitto Denko Corp | ポリアミドイミド樹脂、ポリアミドイミド樹脂の製造方法、ポリアミドイミド樹脂組成物、被膜形成材料、及び電子部品用接着剤 |
US7557169B2 (en) * | 2003-07-07 | 2009-07-07 | Dow Global Technologies, Inc. | Capping isocyanate prepolymer or polyisocyanate/polyether polyol or polyamine mixture |
US20050070634A1 (en) * | 2003-07-07 | 2005-03-31 | Andreas Lutz | Process for applying a streamable epoxy adhesive |
EP1498441A1 (fr) * | 2003-07-16 | 2005-01-19 | Sika Technology AG | Compositions réticulables à la chaleur comprenant un modificateur de résistance au choc à basse température |
DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
US20050159531A1 (en) * | 2004-01-20 | 2005-07-21 | L&L Products, Inc. | Adhesive material and use therefor |
ES2276182T5 (es) * | 2004-03-12 | 2015-04-10 | Dow Global Technologies Llc | Composición adhesiva epoxídica |
DE102004013845B3 (de) * | 2004-03-20 | 2005-11-03 | Bundesrepublik Deutschland, vertreten durch das Bundesministerium der Verteidigung, dieses vertreten durch das Bundesamt für Wehrtechnik und Beschaffung | Vorrichtung und Verfahren zum Auftragen von Klebstoff |
US20050230027A1 (en) * | 2004-04-15 | 2005-10-20 | L&L Products, Inc. | Activatable material and method of forming and using same |
EP1602702B2 (fr) † | 2004-06-01 | 2020-09-16 | Dow Global Technologies LLC | Composition époxyde adhésive |
US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
EP1695990A1 (fr) * | 2005-02-28 | 2006-08-30 | Dow Global Technologies Inc. | Composition adhesive epoxy a deux composants |
DE102005018671B4 (de) * | 2005-04-21 | 2008-10-09 | Henkel Ag & Co. Kgaa | Schlagzähe Epoxidharz-Zusammensetzungen |
DE602005020260D1 (de) * | 2005-06-02 | 2010-05-12 | Dow Global Technologies Inc | Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis |
US8551620B2 (en) | 2005-06-08 | 2013-10-08 | Ppg Industries Ohio, Inc. | Multi-layer aircraft adhesive |
US7875149B2 (en) | 2005-06-08 | 2011-01-25 | Ppg Industries Ohio, Inc. | Aircraft adhesive |
EP1741734A1 (fr) | 2005-07-05 | 2007-01-10 | Sika Technology AG | Composition réticulable à la chaleur et résistant au choc à basse température comprenant des résines époxydes solides |
ES2375498T3 (es) * | 2005-08-24 | 2012-03-01 | Henkel Ag & Co. Kgaa | Resinas epoxi que tienen una resistencia al impacto mejorada. |
US8475694B2 (en) | 2005-10-25 | 2013-07-02 | Zephyros, Inc. | Shaped expandable material |
JP4870447B2 (ja) * | 2006-02-22 | 2012-02-08 | 富士フイルム株式会社 | カラーフィルタ用インクジェットインク、カラーフィルタ、およびそれらの製造方法、ならびにそれらを用いた液晶表示装置 |
DE102006012550A1 (de) * | 2006-03-18 | 2007-09-20 | Degussa Gmbh | Verwendung einer substituierten Guanidin-Verbindung sowie deren Salze oder Hydrate als Härter für Epoxidharze |
US8288447B2 (en) * | 2006-06-07 | 2012-10-16 | Henkel Ag & Co. Kgaa | Foamable compositions based on epoxy resins and polyesters |
EP1876194A1 (fr) * | 2006-06-30 | 2008-01-09 | Sika Technology AG | Composition thermodurcissable adaptée au collage de substrats revêtus |
JP5307714B2 (ja) * | 2006-07-31 | 2013-10-02 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 硬化性エポキシ樹脂系粘着組成物 |
CN101547990B (zh) * | 2006-10-06 | 2012-09-05 | 汉高股份及两合公司 | 可泵送的耐洗掉的环氧膏状粘合剂 |
US20080105992A1 (en) * | 2006-11-08 | 2008-05-08 | Zephyros | Mixed masses sealant |
US20080265516A1 (en) * | 2006-11-08 | 2008-10-30 | Zephyros, Inc. | Two stage sealants and method of forming and/or using the same |
JP5145354B2 (ja) * | 2006-12-21 | 2013-02-13 | ダウ グローバル テクノロジーズ エルエルシー | 乗り物の窓を取り付けるための接着剤として有用な組成物 |
US8088245B2 (en) * | 2007-04-11 | 2012-01-03 | Dow Global Technologies Llc | Structural epoxy resins containing core-shell rubbers |
US8097119B2 (en) * | 2007-04-11 | 2012-01-17 | Dow Global Technologies Llc | Heat-resistant structural epoxy resins |
KR101282624B1 (ko) * | 2007-05-22 | 2013-07-12 | 주식회사 유니테크 | 일액형 강판보강제 실러 조성물 |
WO2008157571A2 (fr) * | 2007-06-20 | 2008-12-24 | Dow Global Technologies, Inc. | Adhésifs époxydes résistants à l'écrasement ayant une très faible sensibilité aux variations de température |
WO2009015149A1 (fr) * | 2007-07-23 | 2009-01-29 | Dow Global Technologies Inc. | Composition vulcanisable de polyuréthane à deux parties ayant un module g sensiblement constant sur la plage de températures d'utilisation |
KR20100059818A (ko) * | 2007-07-26 | 2010-06-04 | 헨켈 코포레이션 | 경화성 에폭시 수지계 접착제 조성물 |
WO2009025991A1 (fr) * | 2007-08-17 | 2009-02-26 | Dow Global Technologies, Inc. | Adhésifs époxy en deux parties résistants aux chocs |
US20090099312A1 (en) * | 2007-10-15 | 2009-04-16 | Carl Duane Weber | Amine terminated tougheners for epoxy resin based adhesives and materials |
US20090104448A1 (en) * | 2007-10-17 | 2009-04-23 | Henkel Ag & Co. Kgaa | Preformed adhesive bodies useful for joining substrates |
MX2010004855A (es) * | 2007-10-30 | 2010-06-30 | Henkel Ag & Co Kgaa | Adhesivos de pasta epoxi resistentes al lavado. |
EP2062928A1 (fr) * | 2007-11-21 | 2009-05-27 | Sika Technology AG | Améliorateur de la résilience pour compositions de résine époxyde |
DE102007059183A1 (de) | 2007-12-06 | 2009-06-10 | Henkel Ag & Co. Kgaa | Verfahren zur Verstärkung, Dämmung, Dämpfung und/oder Abdichtung von Hohlbauteilen |
WO2009094295A1 (fr) * | 2008-01-22 | 2009-07-30 | Dow Global Technologies Inc. | Adhésifs structuraux en résine époxy contenant des agents de durcissement élastomères allongés par polyphénol à fonctionnalité époxyde |
ATE484547T1 (de) * | 2008-01-30 | 2010-10-15 | Sika Technology Ag | Auswaschbeständige hitzehärtende epoxidharzklebstoffe |
DE102008009371A1 (de) | 2008-02-14 | 2009-08-20 | Henkel Ag & Co. Kgaa | Verfahren zur Herstellung eines Wärmetauschers |
GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
CN102057010A (zh) * | 2008-04-11 | 2011-05-11 | 3M创新有限公司 | 单组分环氧基结构粘合剂 |
DE102008023276A1 (de) | 2008-05-13 | 2009-11-19 | Henkel Ag & Co. Kgaa | Verbinden von Rohren mit thermisch härtbaren Klebstoffen |
EP2135909B1 (fr) * | 2008-06-12 | 2018-01-10 | Henkel IP & Holding GmbH | Compositions deux-composants d'adhésifs structurels d'époxide fortement renforcés de la nouvelle génération |
DE102008034105A1 (de) | 2008-07-21 | 2010-01-28 | Henkel Ag & Co. Kgaa | Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff |
CN102119201B (zh) * | 2008-08-11 | 2013-07-03 | 陶氏环球技术有限责任公司 | 含有用酚和羟基封端的丙烯酸酯或羟基封端的甲基丙烯酸酯封端的弹性体增韧剂的单组分结构环氧树脂粘合剂 |
BRPI0912919B1 (pt) * | 2008-08-22 | 2019-04-24 | Dow Global Technologies Llc | Composição bicomponente e método para ligar dois ou mais substratos entre si |
CN101818037B (zh) * | 2009-02-27 | 2014-12-31 | 汉高(中国)投资有限公司 | 一种室温固化环氧结构胶粘剂组合物及其制备方法 |
DE102009028180A1 (de) | 2009-08-03 | 2011-02-10 | Henkel Ag & Co. Kgaa | Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator |
WO2011025873A1 (fr) | 2009-08-31 | 2011-03-03 | Cytec Technology Corp. | Compositions adhésives haute performance |
JP5752126B2 (ja) | 2009-09-11 | 2015-07-22 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性及び硬化済み接着剤組成物 |
CN102482548B (zh) | 2009-09-11 | 2014-03-12 | 3M创新有限公司 | 固化性和固化的粘合剂组合物 |
GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
KR20120112447A (ko) | 2009-11-05 | 2012-10-11 | 다우 글로벌 테크놀로지스 엘엘씨 | 케톡심으로 캠핑된 탄성중합체성 강인화제를 함유하는 구조용 에폭시 수지 접착제 |
DE102009054999A1 (de) | 2009-12-18 | 2011-06-22 | Henkel AG & Co. KGaA, 40589 | Verbundbauteil |
DE102010004792A1 (de) | 2010-01-16 | 2011-07-28 | Aktiebolaget Skf | Verfahren zum Festlegen eines Lagerrings an oder in einem Bauteil |
EP2542403B2 (fr) | 2010-03-04 | 2023-08-16 | Zephyros Inc. | Stratifié structurel composite |
EP2619268A4 (fr) | 2010-09-23 | 2017-03-29 | Henkel IP & Holding GmbH | Composition époxy résistant aux vapeurs chimiques |
GB201016530D0 (en) | 2010-09-30 | 2010-11-17 | Zephyros Inc | Improvements in or relating to adhesives |
EP2436712A1 (fr) * | 2010-10-01 | 2012-04-04 | Sika Technology AG | Modificateurs de la résilience pour compositions de résine époxyde |
WO2012064724A2 (fr) | 2010-11-12 | 2012-05-18 | 3M Innovative Properties Company | Compositions durcissables et durcies |
US9290683B2 (en) | 2010-11-12 | 2016-03-22 | 3M Innovative Properties Company | Curable and cured compositions |
DE102011003915A1 (de) | 2011-02-10 | 2012-08-16 | Aktiebolaget Skf | Dichtungsanordnung |
DE102011005500A1 (de) | 2011-03-14 | 2012-09-20 | Aktiebolaget Skf | Lagerring eines Gleit- oder Wälzlagers |
CN105378019A (zh) * | 2013-07-24 | 2016-03-02 | 陶氏环球技术有限责任公司 | 可固化组合物 |
CN105637007A (zh) | 2013-07-26 | 2016-06-01 | 泽费罗斯股份有限公司 | 包括纤维状载体的热固性粘合膜 |
WO2015064561A1 (fr) | 2013-10-29 | 2015-05-07 | 株式会社カネカ | Composition de résine durcissable contenant des particules fines de polymère et ayant une stabilité améliorée au stockage |
GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
WO2016099878A1 (fr) | 2014-12-15 | 2016-06-23 | Zephyros, Inc. | Composition époxy contenant un copolyamide et un copolymère séquencé à séquences polyamide et polyéther |
DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
US11254846B2 (en) | 2017-05-02 | 2022-02-22 | Lg Chem, Ltd. | Two part adhesive composition |
GB2599165B (en) * | 2020-09-29 | 2022-09-28 | Henkel Ag & Co Kgaa | Hybrid epoxy composition |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5278257A (en) | 1987-08-26 | 1994-01-11 | Ciba-Geigy Corporation | Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin |
ES2025260B3 (es) * | 1987-08-26 | 1992-03-16 | Ciba-Geigy Ag | Resinas epoxidicas modificadas |
EP0338985B1 (fr) * | 1988-04-18 | 1994-05-18 | Ciba-Geigy Ag | Résines époxy modifiées |
US4962138A (en) | 1988-05-27 | 1990-10-09 | W. R. Grace & Co.-Conn. | Reactive hot melt structural adhesive |
ES2068911T3 (es) | 1988-07-28 | 1995-05-01 | Ciba Geigy Ag | Combinaciones de flexibilizadores para resinas epoxi. |
US5202390A (en) | 1988-07-28 | 1993-04-13 | Ciba-Geigy Corporation | Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer |
DE3827626A1 (de) | 1988-08-10 | 1990-03-08 | Teroson Gmbh | Reaktiver schmelzklebstoff |
KR100193147B1 (ko) * | 1990-03-30 | 1999-06-15 | 월터클라웨인, 한느-피터 위트린 | 개질된 에폭시 수지 |
US5789482A (en) | 1990-03-30 | 1998-08-04 | Ciba Specialty Chemicals Corporation | Epoxy resin with anhydride, toughener and active hydrogen-containing compound |
JP3294268B2 (ja) | 1991-06-26 | 2002-06-24 | ヘンケル・テロソン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 反応性ホットメルト接着剤 |
US5290857A (en) | 1991-09-04 | 1994-03-01 | Nippon Zeon Co., Ltd. | Epoxy resin adhesive composition |
JP3655646B2 (ja) | 1993-05-24 | 2005-06-02 | 日産自動車株式会社 | エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物 |
-
1998
- 1998-12-19 DE DE19858921A patent/DE19858921A1/de not_active Ceased
-
1999
- 1999-12-10 CN CN99814488A patent/CN1330684A/zh active Pending
- 1999-12-10 CZ CZ20012245A patent/CZ20012245A3/cs unknown
- 1999-12-10 TR TR2001/01730T patent/TR200101730T2/xx unknown
- 1999-12-10 PL PL99349508A patent/PL349508A1/xx not_active Application Discontinuation
- 1999-12-10 CA CA002355611A patent/CA2355611A1/fr not_active Abandoned
- 1999-12-10 SK SK863-2001A patent/SK8632001A3/sk unknown
- 1999-12-10 WO PCT/EP1999/009732 patent/WO2000037554A1/fr not_active Application Discontinuation
- 1999-12-10 US US09/868,566 patent/US6776869B1/en not_active Expired - Fee Related
- 1999-12-10 ES ES99963471T patent/ES2228147T3/es not_active Expired - Lifetime
- 1999-12-10 DE DE59910606T patent/DE59910606D1/de not_active Revoked
- 1999-12-10 EP EP99963471A patent/EP1155082B1/fr not_active Revoked
- 1999-12-10 AT AT99963471T patent/ATE277117T1/de not_active IP Right Cessation
- 1999-12-10 AU AU19757/00A patent/AU1975700A/en not_active Abandoned
- 1999-12-10 JP JP2000589618A patent/JP2002533511A/ja active Pending
- 1999-12-10 HU HU0104671A patent/HUP0104671A2/hu unknown
- 1999-12-10 BR BR9916372-1A patent/BR9916372A/pt not_active IP Right Cessation
- 1999-12-10 KR KR1020017007724A patent/KR20010093854A/ko not_active Application Discontinuation
- 1999-12-17 AR ARP990106526A patent/AR021895A1/es unknown
-
2001
- 2001-06-18 ZA ZA200104980A patent/ZA200104980B/en unknown
Also Published As
Publication number | Publication date |
---|---|
US6776869B1 (en) | 2004-08-17 |
DE19858921A1 (de) | 2000-06-21 |
CN1330684A (zh) | 2002-01-09 |
WO2000037554A1 (fr) | 2000-06-29 |
AR021895A1 (es) | 2002-08-07 |
HUP0104671A2 (hu) | 2002-03-28 |
KR20010093854A (ko) | 2001-10-29 |
PL349508A1 (en) | 2002-07-29 |
EP1155082A1 (fr) | 2001-11-21 |
DE59910606D1 (de) | 2004-10-28 |
CZ20012245A3 (cs) | 2001-11-14 |
BR9916372A (pt) | 2001-09-18 |
TR200101730T2 (tr) | 2001-10-22 |
ES2228147T3 (es) | 2005-04-01 |
EP1155082B1 (fr) | 2004-09-22 |
SK8632001A3 (en) | 2001-11-06 |
AU1975700A (en) | 2000-07-12 |
CA2355611A1 (fr) | 2000-06-29 |
JP2002533511A (ja) | 2002-10-08 |
ATE277117T1 (de) | 2004-10-15 |
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