Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes

Definitions

• This disclosure relates to a mounter device, a tape peeling device, a substrate transfer device, a tape peeling method, and a substrate transfer method.
• Patent Document 1 a device equipped with a mechanism for peeling adhesive tape off a semiconductor wafer is known (see Patent Document 1).
• the above-mentioned mechanism is configured so that a peeling force can be applied to peel the adhesive tape from the semiconductor wafer by attaching the peeling tape to the non-adhesive side of the adhesive tape attached to the semiconductor wafer and winding the peeling tape along the upper surface (inclined surface) of the peeling member while the lower surface (horizontal surface) of the knife-edge-shaped peeling member faces the non-adhesive side of the adhesive tape.
• the above-mentioned mechanism can only apply a peeling force in a direction along the top surface (slope) of the peeling member, so there is a risk that undesired forces will be applied to the semiconductor wafer when peeling the adhesive tape from the semiconductor wafer, resulting in damage to the semiconductor wafer.
• a mounter device is a mounter device that attaches adhesive tape to a ring frame and a substrate, or separates the ring frame and the substrate that are attached to the adhesive tape, and has a tape peeling mechanism that peels off the adhesive tape attached to the substrate, and the tape peeling mechanism is configured so that the peeling angle can be made different at the start and end of peeling.
• the above-mentioned mounter device can reduce damage to the substrate when peeling off the adhesive tape from the substrate.
• FIG. 1 is a diagram illustrating a configuration example of a substrate transfer apparatus.
• FIG. 2 is a diagram illustrating an example of the configuration of a mount frame.
• FIG. FIG. 4 is a front view of a portion of the tape application mechanism.
• FIG. 13 is a right side view of another portion of the taping mechanism.
• FIG. 13 is a right side view of the third robot.
• 1 is a flowchart showing an example of the flow of a substrate transfer method.
• 5A to 5C are schematic diagrams illustrating the state of a mount frame in each step of a substrate transfer method. 1 is a schematic diagram of a portion of a substrate transfer apparatus operating in a first step of a substrate transfer method.
• FIG. 11 is a schematic diagram of a portion of a substrate transfer apparatus operating in a second step of a substrate transfer method.
• 11 is a schematic diagram of a portion of a substrate transfer apparatus operating in a third step of a substrate transfer method.
• FIG. 11 is a schematic diagram of a portion of a substrate transfer apparatus operating in a fourth step of a substrate transfer method.
• FIG. 11 is a schematic diagram of a portion of a substrate transfer apparatus operating in a fifth step of a substrate transfer method.
• FIG. FIG. 13 is a schematic diagram of a portion of a substrate transfer apparatus operating in a sixth step of the substrate transfer method.
• FIG. 13 is a schematic diagram of a portion of a substrate transfer apparatus operating in an eighth step of a substrate transfer method.
• FIG. 2 is a diagram illustrating a configuration example of a mounter device.
• FIG. 13 is a diagram illustrating another configuration example of a mounter device.
• FIG. 1 is a diagram showing an example of the configuration of the substrate transfer apparatus 100. Specifically, the upper diagram in FIG. 1 is a top view (plan view) of the substrate transfer apparatus 100, and the lower diagram in FIG. 1 is a front view of the substrate transfer apparatus 100.
• X1 represents one direction of the X axis constituting the three-dimensional orthogonal coordinate system
• X2 represents the other direction of the X axis
• Y1 represents one direction of the Y axis constituting the three-dimensional orthogonal coordinate system
• Y2 represents the other direction of the Y axis
• Z1 represents one direction of the Z axis constituting the three-dimensional orthogonal coordinate system
• Z2 represents the other direction of the Z axis.
• the X1 side of the substrate transfer apparatus 100 corresponds to the front side (front side) of the substrate transfer apparatus 100
• the X2 side of the substrate transfer apparatus 100 corresponds to the rear side (rear side) of the substrate transfer apparatus 100.
• the Y1 side of the substrate transfer apparatus 100 corresponds to the left side of the substrate transfer apparatus 100, and the Y2 side of the substrate transfer apparatus 100 corresponds to the right side of the substrate transfer apparatus 100.
• the Z1 side of the substrate transfer apparatus 100 corresponds to the upper side of the substrate transfer apparatus 100, and the Z2 side of the substrate transfer apparatus 100 corresponds to the lower side of the substrate transfer apparatus 100.
• the substrate transfer device 100 is configured to be able to transfer a substrate from one mount frame MF to another mount frame MF.
• the mount frame MF is a member that includes a substrate and is used when handling substrates such as semiconductor wafers with various devices.
• the mount frame MF includes a ring frame F, adhesive tape T, and a wafer W, which is a semiconductor wafer.
• FIG. 2 is a diagram showing an example of the configuration of the mount frame MF.
• the wafer W is a disk-shaped semiconductor wafer having a central axis WX.
• the wafer W is affixed to the center of the adhesive tape T affixed to one surface of the ring frame F and is supported by the adhesive tape T inside the ring frame F.
• the mount frames MF handled by the substrate transfer apparatus 100 include a first mount frame MF1 and a second mount frame MF2.
• the substrate transfer apparatus 100 is configured to transfer a wafer W from the first mount frame MF1 to the second mount frame MF2. Therefore, the wafer W in the second mount frame MF2 is the wafer W in the first mount frame MF1.
• the first mount frame MF1 is the input (material) to the substrate transfer apparatus 100
• the second mount frame MF2 is the output (product) from the substrate transfer apparatus 100.
• FIG. 2 is a perspective view of the first mount frame MF1.
• the center view of FIG. 2 is a cross-sectional view of the first mount frame MF1.
• the center view of FIG. 2 shows the cross-sections of the ring frame F (first ring frame F1), adhesive tape T (first adhesive tape T1), and wafer W when a virtual plane perpendicular to the XY plane including the cutting line CL1 in the upper view of FIG. 2 is viewed from the X1 side.
• the lower view of FIG. 2 is a cross-sectional view of the second mount frame MF2, and corresponds to the center view of FIG. 2.
• the cross-sections of the wafer W and ring frame F are shown in solid color (white) for clarity.
• the cross section of the first adhesive tape T1 is represented by a diagonal line pattern for clarity
• the cross section of the adhesive tape T is represented by a dot pattern for clarity.
• the side surfaces of the wafer W, the first adhesive tape T1, the second adhesive tape T2, and the ring frame F are represented by a solid color (white), a diagonal line pattern, a dot pattern, and a solid color (white), respectively.
• the first mount frame MF1 includes a first ring frame F1, a first adhesive tape T1, and a wafer W, as shown in the upper and center diagrams of FIG. 2.
• the wafer W is attached to the first adhesive tape T1 attached to the lower surface of the first ring frame F1, and is supported by the first adhesive tape T1 inside the first ring frame F1.
• the second mount frame MF2 includes a second ring frame F2, a second adhesive tape T2, and a wafer W, as shown in the lower diagram of FIG. 2.
• the wafer W is attached to the second adhesive tape T2 attached to the upper surface of the second ring frame F2, and is supported by the second adhesive tape T2 inside the second ring frame F2.
• the first adhesive tape T1 is attached to the main surface of the wafer W
• the second adhesive tape T2 is attached to the back surface of the wafer W.
• the main surface of the wafer W is the surface on which the circuit pattern, etc. is formed, and is also called the “holding surface” that holds the circuit pattern, etc.
• the back surface of the wafer W is the surface opposite the main surface, and is also called the "non-holding surface.”
• the second adhesive tape T2 is a different adhesive tape from the first adhesive tape T1
• the second ring frame F2 is a different ring frame from the first ring frame F1.
• the second ring frame F2 may be the first ring frame F1.
• the first ring frame F1 may be reused after being separated from the first adhesive tape T1, and attached to the second adhesive tape T2.
• first adhesive tape T1 and the second adhesive tape T2 are formed primarily from PET (Polyethylene Terephthalate) to provide rigidity to the wafer W, but they may be formed using other known materials besides PET.
• first ring frame F1 and the second ring frame F2 are formed from stainless steel, but they may be formed from other metals, or may be formed from materials other than metals, such as synthetic resins.
• the substrate transfer device 100 includes a first loader 1, a second loader 2, a wafer separation mechanism 3, an ultraviolet irradiation mechanism 4, a ring frame recovery unit 5, a ring frame supply unit 6, a robot RB, a tape application mechanism MT, and a tape peeling mechanism RM, as shown in the upper diagram of FIG. 1.
• the first loader 1 is a device for taking in the mount frame MF into the substrate transfer apparatus 100.
• the second loader 2 is a device for taking in the wafer W (single unit) instead of the mount frame MF into the substrate transfer apparatus 100.
• the second loader 2 is configured to be able to take in the wafer W that is not supported by the adhesive tape T attached to the ring frame into the substrate transfer apparatus 100. Since the substrate transfer apparatus 100 includes the second loader 2, it is possible to produce the first mount frame MF1. Note that either the first loader 1 or the second loader 2 may be omitted.
• the wafer separation mechanism 3 is configured to separate the mount frame MF into the wafer W and the ring frame F.
• FIG. 3 is a front view of the wafer separation mechanism 3.
• the wafer separation mechanism 3 includes a first table TBL1, a frame 31, a cutter lifting drive unit 32, a lifting frame 33, a cutter rotation drive unit 34, a rotating frame unit 35, a cutter unit 36, and a cutter blade 37.
• the cutter lifting drive unit 32 is configured to be able to lift and lower the lifting frame 33 relative to the frame 31.
• the cutter rotation drive unit 34 is configured to be able to rotate the rotating frame unit 35 around the rotation axis 3X.
• the cutter unit 36 is connected to the rotating frame unit 35 so as to be able to rotate together with the rotating frame unit 35 around the rotation axis 3X, and is configured to have a lifting function for lifting and lowering the cutter blade 37 relative to the rotating frame unit 35.
• the wafer separation mechanism 3 is provided with two cutter units 36 so as to be able to handle two different sizes of wafers W, but may be configured to be provided with only one cutter unit 36, or may be configured to be provided with three or more cutter units 36. By providing multiple cutter units 36, the wafer separation mechanism 3 can accommodate multiple wafers W of different sizes.
• the cutter unit 36 may also have a function to detect when the cutter blade 37 comes into contact with an object other than the adhesive tape T, such as the wafer W or a foreign object. This is to prevent damage to the wafer W and the cutter blade 37.
• the cutter unit 36 may also be equipped with a heater for heating the cutter blade 37.
• the heated cutter blade 37 can be used to make it easier to cut the adhesive tape T, thereby extending the life of the cutter blade 37.
• the ultraviolet irradiation mechanism 4 is configured to make it easier to peel the adhesive tape T from the substrate.
• the ultraviolet irradiation mechanism 4 irradiates the adhesive tape T attached to the wafer W with ultraviolet light to harden the adhesive tape T, thereby making it easier to peel the adhesive tape T from the substrate.
• the ultraviolet irradiation mechanism 4 irradiates the first adhesive tape T1 attached to the main surface of the wafer W with ultraviolet light to harden the first adhesive tape T1, thereby making it easier to peel the first adhesive tape T1 from the wafer W.
• the ultraviolet irradiation mechanism 4 may also be equipped with an alignment mechanism for positioning the wafer W when irradiating the wafer W with ultraviolet light.
• the ring frame recovery section 5 is configured to recover ring frames F that have been separated from the mount frame MF.
• the ring frame recovery section 5 is configured to recover ring frames F that have been detached from the mount frame MF by the wafer separation mechanism 3.
• the ring frame recovery section 5 recovers the first ring frames F1 that constituted the first mount frame MF1 from the wafer separation mechanism 3 (first table TBL1) and stacks them in the center of the ring frame recovery section 5.
• the first ring frames F1 stacked by the ring frame recovery section 5 are typically manually transported out of the substrate transfer device 100 in a lump when a certain number is reached.
• the ring frame supply unit 6 is configured to be able to supply ring frames F one by one.
• the ring frame supply unit 6 is configured to be able to supply another ring frame F (second ring frame F2) to replace the ring frame F (first ring frame F1) that has been separated from the mount frame MF by the wafer separation mechanism 3.
• the ring frame supply unit 6 is configured to be able to supply the second ring frames F2 piled up in its center one by one to the tape attachment mechanism MT (second table TBL2). Note that the second ring frames F2 piled up in the center of the ring frame supply unit 6 are typically replenished manually.
• the tape application mechanism MT is configured to be able to apply the adhesive tape T to the wafer W and the ring frame F.
• the tape application mechanism MT is also configured to be able to cut the adhesive tape T applied to the wafer W and the ring frame F along the ring frame F.
• Figure 4 is a front view of a portion of the tape application mechanism MT
• Figure 5 is a right side view of another portion of the tape application mechanism MT.
• the upper view of Figure 4 shows the state when the application roller MT5 and the peeling roller MT6 are positioned at the left ends
• the lower view of Figure 4 shows the state when the application roller MT5 and the peeling roller MT6 are positioned at the right ends.
• FIG. 4 shows the state when the application roller MT5 and the peeling roller MT6 are positioned at the right ends.
• FIG. 4 omits the illustration of the second mechanism (cutter lift drive unit MT11, lift frame MT12, cutter rotation drive unit MT13, rotating frame unit MT14, and cutter unit MT15) located above the second table TBL2 in FIG. 5, and conversely, FIG. 5 omits the illustration of the first mechanism (applying roller MT5, peeling roller MT6, tape supply roller MT7, tape recovery roller MT8, protective tape recovery roller MT9, and tape holding unit MT10) located above the second table TBL2 in FIG. 4.
• the second mechanism is positioned slightly higher than the first mechanism so as to partially overlap the first mechanism.
• the tape application mechanism MT includes a wafer holding unit MT1, a ring frame holding unit MT2, a positioning unit MT3, a lifting drive unit MT4, an application roller MT5, a peeling roller MT6, a tape supply roller MT7, a tape recovery roller MT8, a protective tape recovery roller MT9, a tape holding unit MT10, a cutter lifting drive unit MT11, a lifting frame MT12, a cutter rotation drive unit MT13, a rotating frame unit MT14, and a cutter unit MT15.
• the wafer holding part MT1, the ring frame holding part MT2, the positioning unit MT3, and the lifting drive part MT4 constitute the second table TBL2.
• the application roller MT5, the peeling roller MT6, the tape supply roller MT7, the tape recovery roller MT8, the protective tape recovery roller MT9, and the tape holding unit MT10 constitute the first mechanism.
• the cutter lifting drive part MT11, the lifting frame MT12, the cutter rotation drive part MT13, the rotating frame part MT14, and the cutter unit MT15 constitute the second mechanism.
• the first mechanism is configured to be able to apply the second adhesive tape T2 to the wafer W and the second ring frame F2, and to peel off the excess part of the second adhesive tape T2.
• the second mechanism is configured to be able to cut the second adhesive tape T2 applied to the wafer W and the second ring frame F2, and separate it into a circular part and an excess part.
• the height of the wafer holding part MT1 and the height of the ring frame holding part MT2 are configured so that they can be adjusted individually by numerical control.
• the tape application mechanism MT can accommodate cases where the thickness of the wafer W and the thickness of the second ring frame F2 are different, and can also accommodate multiple types of wafers W with different thicknesses.
• the cutter lifting drive unit MT11 is configured to lift and lower the lifting frame MT12.
• the cutter rotation drive unit MT13 is configured to rotate the rotating frame unit MT14 around the rotation axis MTX.
• the cutter unit MT15 is connected to the rotating frame unit MT14 so that it can rotate together with the rotating frame unit MT14 around the rotation axis MTX, and is configured to have a lifting function that lifts and lowers the cutter blade MT16 relative to the rotating frame unit MT14.
• the tape application mechanism MT has two cutter units MT15 so that it can accommodate two different sizes of wafers W, but it may be configured to have only one cutter unit MT15, or three or more cutter units MT15. By having multiple cutter units MT15, the tape application mechanism MT can accommodate multiple wafers W of different sizes.
• the robot RB is an example of a transfer device for transferring an object from one position to another position in the substrate transfer device 100.
• the object is, for example, a wafer W, a mount frame MF, or a ring frame F.
• the robot RB is a multi-axis transfer robot, and includes a first robot RB1, a second robot RB2, and a third robot RB3, as shown in FIG. 1.
• the first robot RB1 is configured to be able to transfer an object between the second loader 2, the wafer separation mechanism 3, the ultraviolet irradiation mechanism 4, and the tape attachment mechanism MT.
• the second robot RB2 is configured to be able to transfer an object between the first loader 1, the wafer separation mechanism 3, and the tape peeling mechanism RM.
• the third robot RB3 is configured to be able to transfer an object between the wafer separation mechanism 3, the ring frame recovery unit 5, the ring frame supply unit 6, the tape attachment mechanism MT, and the tape peeling mechanism RM.
• FIG. 6 is a right side view of the third robot RB3.
• the upper view of FIG. 6 (shown by a two-dot chain line) is a right side view of the third robot RB3 before the robot is turned upside down
• the lower view of FIG. 6 (shown by a solid line) is a right side view of the third robot RB3 after the robot is turned upside down.
• the upper view of FIG. 6 shows the second mount frame MF2 held by the suction pad SC of the robot hand RH attached to the tip of the third robot RB3 with the first adhesive tape T1 positioned below the wafer W.
• the lower view of FIG. 6 shows the second mount frame MF2 released from the suction pad SC of the robot hand RH with the first adhesive tape T1 positioned above the wafer W and placed on the third table TBL3, which is part of the tape peeling mechanism RM.
• the reversing mechanism RV of the third robot RB3 is configured to rotate the robot hand RH around the rotation axis RX.
• the robot hand RH may be configured to be replaceable depending on the application.
• the first robot RB1 and the second robot RB2 may have a reversing mechanism similar to that of the third robot RB3.
• the robot hand RH of the third robot RB3 has a suction pad SC that adsorbs the ring frame F, but the robot hand RH of the first robot RB1 may have a suction pad that adsorbs the wafer W.
• the suction pad that adsorbs the wafer W may be a known suction mechanism such as a vacuum chuck as described in U.S. Patent No. 8,858,756.
• the substrate transfer device 100 can achieve complex transfer of an item in a forward direction from one position to another position (transfer including inversion) compared to when a conveyor or a trancer is used.
• the substrate transfer device 100 can also achieve transfer of an item in a reverse direction from another position to one position.
• the substrate transfer device 100 may also be configured to be able to use a conveyor or a trancer.
• the tape peeling mechanism RM is configured to be able to peel off the adhesive tape T attached to the substrate.
• the tape peeling mechanism RM is configured to be able to peel off the first adhesive tape T1 attached to the main surface of the wafer W using a peeling tape.
• FIG. 7 is a flow chart showing an example of the flow of the substrate transfer method.
• Figure 8 is a schematic diagram showing the state of the mount frame MF at each step of the substrate transfer method.
• the substrate transfer device 100 supplies (prepares) the first mount frame MF1 (first process ST1).
• the top left diagram in Figure 8 shows the state of the first mount frame MF1 placed on the first table TBL1 of the wafer separation mechanism 3 in the first process ST1.
• FIG. 9 is a schematic diagram of a portion of the substrate transfer device 100 operating in the first process ST1.
• the left diagram of FIG. 9 is a front view of the first loader 1 on which the magazine MG is set
• the right diagram of FIG. 9 is a front view of the first table TBL1 on which one first mount frame MF1 removed from the magazine MG is placed.
• the magazine MG is a container capable of storing a plurality of first mount frames MF1 in a stacked state.
• the first mount frame MF1 is stored in the magazine MG with the first adhesive tape T1 located below the wafer W.
• the first mount frame MF1 is illustrated in a simplified form for clarity.
• the second robot RB2 inserts the robot hand RH between the uppermost first mount frame MF1 and the second-lowest first mount frame MF1 of the multiple first mount frames MF1 stored in the magazine MG.
• the second robot RB2 then lifts the robot hand RH to remove one first mount frame MF1 from the magazine MG.
• the second robot RB2 then moves the removed first mount frame MF1 onto the first table TBL1 of the wafer separation mechanism 3, as shown in the right diagram of FIG. 9.
• the wafer separation mechanism 3 then raises the positioning unit 3U of the first table TBL1 to receive the first mount frame MF1.
• the positioning unit 3U typically has four support parts capable of supporting the outer periphery of the first mount frame MF1, and each support part is configured to be able to move in the radial direction of the first mount frame MF1.
• the positioning unit 3U which has received the first mount frame MF1, moves down while positioning the first mount frame MF1 relative to the first table TBL1, bringing the first mount frame MF1 into contact with the support surface of the first table TBL1.
• the first table TBL1 holds the first mount frame MF1 by adsorbing it with a suction pad (not shown).
• the substrate transfer device 100 cuts the first adhesive tape T1 (second process ST2).
• the second diagram from the top on the left side of Figure 8 shows the state of the first mount frame MF1 when the first adhesive tape T1 is cut by the cutter blade 37 of the wafer separation mechanism 3 in the second process ST2.
• FIG. 10 is a schematic diagram of a portion of the substrate transfer device 100 operating in the second process ST2.
• the upper diagram of FIG. 10 is a front view of a portion of the wafer separation mechanism 3 when cutting of the first adhesive tape T1 begins
• the lower diagram of FIG. 10 is a front view of a portion of the wafer separation mechanism 3 after cutting of the first adhesive tape T1.
• the wafer separation mechanism 3 is configured to separate the first mount frame MF1 transferred to the first table TBL1 into the wafer W and the first ring frame F1.
• the wafer separation mechanism 3 raises the first table TBL1 by the lift drive unit 38, as shown in the upper diagram of FIG. 10, and lowers the cutter blade 37 by the cutter lift drive unit 32 (see FIG. 3) and the cutter unit 36, so that the cutter blade 37 contacts the first adhesive tape T1.
• the wafer separation mechanism 3 brings the cutter blade 37 into contact with the first adhesive tape T1 at a position in the radial direction of the wafer W that is a distance greater than the thickness of the wafer W from the outer edge of the wafer W in order to suppress or prevent damage to the wafer W.
• the wafer separation mechanism 3 rotates the rotating frame portion 35 (see FIG. 3) around the rotation axis 3X using the cutter rotation drive portion 34 (see FIG. 3), and cuts the first adhesive tape T1 so as to form a circular cutting line.
• the wafer separation mechanism 3 lowers the first table TBL1 using the lift drive portion 38.
• the lower diagram in FIG. 10 shows the state of the first table TBL1 after it has been lowered.
• the substrate transfer device 100 recovers the first ring frame F1 (third process ST3).
• the third diagram from the top on the left side of Figure 8 shows the state of the wafer W and first adhesive tape T1 after the first ring frame F1 has been recovered in the third process ST3.
• FIG. 11 is a schematic diagram of a portion of the substrate transfer device 100 operating in the third process ST3.
• the left diagram in FIG. 11 is a front view of a portion of the third robot RB3 that transfers the first ring frame F1 to the ring frame recovery section 5
• the right diagram in FIG. 11 is a front view of a portion of the first robot RB1 that transfers the wafer W to the second table TBL2 of the tape application mechanism MT.
• the third robot RB3 suctions the first ring frame F1 with the suction pad SC of the robot hand RH attached to its tip, and lifts the first ring frame F1 by raising the robot hand RH.
• the third robot RB3 then transfers the first ring frame F1 to the ring frame recovery unit 5.
• a circular outer surplus portion T1C which is part of the first adhesive tape T1, is attached to the first ring frame F1.
• the outer surplus portion T1C is the portion of the first adhesive tape T1 cut by the cutter blade 37 of the wafer separation mechanism 3 that will be recovered (discarded) in the third step ST3, and has a shape that surrounds the inner circular portion T1M, which is the remaining portion that is not recovered (discarded) at this stage.
• the first robot RB1 sucks up the wafer W that is still placed on the first table TBL1 using the suction mechanism of the robot hand RH attached to the tip of the first robot RB1, and lifts up the wafer W by raising the robot hand RH.
• the first robot RB1 then transfers the sucked wafer W to the second table TBL2 of the tape application mechanism MT. Note that an inner circular portion T1M, which is part of the first adhesive tape T1, is attached to the wafer W.
• the area indicated by the two-dot chain line in the right diagram of Figure 11 shows the state of the first robot RB1, the wafer W, and the first adhesive tape T1 (inner circular portion T1M) before the wafer W is placed on the second table TBL2.
• the first robot RB1 lowers the robot hand RH, so that the wafer W and first adhesive tape T1 (inner circular portion T1M) held by the robot hand RH can be placed on the second table TBL2.
• the second table TBL2 holds the wafer W and first adhesive tape T1 (inner circular portion T1M) by adsorbing the inner circular portion T1M attached to the main surface of the wafer W with a suction pad (not shown).
• the substrate transfer device 100 supplies (prepares) the second ring frame F2 (fourth process ST4).
• the bottom left diagram in FIG. 8 shows the state of the wafer W and first adhesive tape T1 (inner circular portion T1M) after the second ring frame F2 has been supplied in the fourth process ST4.
• FIG. 12 is a schematic diagram of a portion of the substrate transfer device 100 operating in the fourth process ST4. Specifically, FIG. 12 is a front view of a portion of the third robot RB3 that transfers the second ring frame F2 from the ring frame supply unit 6 to the second table TBL2 of the tape application mechanism MT.
• the third robot RB3 transfers the first ring frame F1 to the ring frame recovery section 5 using the robot hand RH, and then uses the suction pad SC to pick up the second ring frame F2 in the ring frame supply section 6. The third robot RB3 then lifts up the second ring frame F2 that has been picked up and transfers it to the second table TBL2.
• the second table TBL2 receives the second ring frame F2 by the positioning unit MT3.
• the positioning unit MT3 positions the second ring frame F2 relative to the ring frame holding portion MT2 of the second table TBL2, while bringing the second ring frame F2 into contact with the support surface of the ring frame holding portion MT2.
• the ring frame holding portion MT2 holds the second ring frame F2 by adsorbing it with a suction pad (not shown). Note that the wafer W with the inner circular portion T1M of the first adhesive tape T1 affixed is already placed on the wafer holding portion MT1 of the second table TBL2.
• the substrate transfer apparatus 100 applies the second adhesive tape T2 (fifth process ST5).
• the top diagram on the right side of Figure 8 shows the state of the wafer W and the first adhesive tape T1 (inner circular portion T1M) after the second adhesive tape T2 has been applied in the fifth process ST5.
• FIG. 13 is a schematic diagram of a portion of the substrate transfer device 100 operating in the fifth process ST5.
• the left diagram in FIG. 13 is a front view of a portion of the tape application mechanism MT when the application roller MT5 is applying the second adhesive tape T2 to the wafer W and the second ring frame F2.
• the right diagram in FIG. 13 is a front view of a portion of the tape application mechanism MT after the application roller MT5 has applied the second adhesive tape T2 to the wafer W and the second ring frame F2.
• the second adhesive tape T2 waits above the second table TBL2, stretched on both sides, as shown in the upper diagram of FIG. 4.
• the tape application mechanism MT raises the second table TBL2 using the lifting and lowering drive unit MT4, so that the height of the upper surfaces of the second ring frame F2 and the wafer W is approximately the same as the height of the lower surface of the second adhesive tape T2.
• the tape application mechanism MT moves the application roller MT5 from left to right along the guide GD (see the top diagram of FIG. 4).
• the application roller MT5 moves from left to right while pressing the second adhesive tape T2 against each of the second ring frame F2 and the wafer W.
• the second adhesive tape T2 is applied to the upper surfaces of each of the second ring frame F2 and the wafer W.
• the substrate transfer apparatus 100 cuts the second adhesive tape T2 (sixth step ST6).
• the second diagram from the top on the right side of Figure 8 shows the state of the wafer W, first adhesive tape T1 (inner circular portion T1M), and second adhesive tape T2 when the cutter blade MT16 for cutting the second adhesive tape T2 is pressed against the second adhesive tape T2 in the sixth step ST6.
• FIG. 14 is a schematic diagram of a portion of the substrate transfer device 100 operating in the sixth step ST6. Specifically, FIG. 14 is a front view of a portion of the tape application mechanism MT when the cutter blade MT16 is cutting the second adhesive tape T2.
• the tape application mechanism MT moves the application roller MT5 from left to right, then lowers the cutter blade MT16 by the cutter unit MT15, pierces the cutting edge of the cutter blade MT16 into the second adhesive tape T2, and presses the cutting edge of the cutter blade MT16 against the second ring frame F2.
• the tape application mechanism MT then rotates the rotating frame part MT14 360 degrees around the rotation axis MTX by the cutter rotation drive part MT13.
• the tape application mechanism MT can cut the second adhesive tape T2 along the second ring frame F2 and separate the second adhesive tape T2 into an inner circular part T2M and an outer excess part T2C.
• the outer excess portion T2C is the portion of the second adhesive tape T2 that is cut by the cutter blade MT16 and that is peeled off (discarded) in the sixth step ST6, and has a shape that surrounds the inner circular portion T2M, which is the remaining portion that is not peeled off (discarded) at this stage.
• the tape application mechanism MT moves the peeling roller MT6 from right to left along the guide GD as shown in FIG. 4, and the outer excess portion T2C is peeled off by the peeling roller MT6.
• the peeled outer excess portion T2C is taken up and collected by the protective tape recovery roller MT9.
• the substrate transfer apparatus 100 inverts the second mount frame MF2 (seventh step ST7).
• the third diagram from the top on the right side of Figure 8 shows the state of the second mount frame MF2 lifted from the second table TBL2 by the third robot RB3 in the seventh step ST7.
• the second mount frame MF2 is composed of the wafer W, the second ring frame F2, and the second adhesive tape T2 (inner circular portion T2M), and at this stage, the first adhesive tape T1 (inner circular portion T1M) is affixed to the main surface of the wafer W.
• the third robot RB3 rotates the robot hand RH around the rotation axis RX using the reversing mechanism RV as shown in the lower diagram of Figure 6, and then reverses the second mount frame MF2 upside down so that the inner circular portion T1M of the first adhesive tape T1 faces upward, and then places the second mount frame MF2 on the third table TBL3 of the tape peeling mechanism RM.
• the substrate transfer apparatus 100 peels off the first adhesive tape T1 (eighth step ST8).
• the bottom right diagram of FIG. 8 shows the state of the second mount frame MF2 when the inner circular portion T1M of the first adhesive tape T1 is peeled off in the eighth step ST8.
• the second mount frame MF2 after the inner circular portion T1M has been peeled off in the bottom right diagram of FIG. 8 corresponds to the second mount frame MF2 in the bottom diagram of FIG. 2, which is the output (product) from the substrate transfer apparatus 100, flipped upside down.
• Figure 15 is a front view of the tape peeling mechanism RM
• Figures 16 and 17 are front views of the removal head RM1, which is part of the tape peeling mechanism RM.
• the five figures in Figure 16 are figures for explaining the series of movements of the removal head RM1 until the peeling of the first adhesive tape T1 starts, and the series of movements of the removal head RM1 progress from the topmost figure to the bottommost figure.
• Figure 18 is a perspective view of the removal head RM1. Specifically, the upper diagram in FIG. 18 shows the state of the removal head RM1 before peeling of the first adhesive tape T1 begins, and the lower diagram in FIG. 18 shows the state of the removal head RM1 when peeling of the first adhesive tape T1 is being performed.
• the tape peeling mechanism RM is configured to be able to peel off the first adhesive tape T1 attached to the main surface of the wafer W using the peeling tape PT.
• the tape peeling mechanism RM includes a third table TBL3, a removal head RM1, a peeling tape recovery roller RM2, a peeling tape supply roller RM3, a slider RM4, a heat seal RM5, a removal wedge RM6, and a driven roller DR, as shown in FIG. 15.
• the driven roller DR includes a first driven roller DR1 to an eleventh driven roller DR11.
• the third table TBL3 includes a positioning unit RM7.
• the positioning unit RM7 positions the second mount frame MF2 relative to the third table TBL3, and the second mount frame MF2 is adsorbed by a suction pad (not shown) to hold the second mount frame MF2.
• the second mount frame MF2 is in a state where the inner circular portion T1M of the first adhesive tape T1 is affixed to the main surface of the wafer W.
• the tape peeling mechanism RM uses the slider RM4 to move the third table TBL3 to position the end of the wafer W (the inner circular portion T1M of the first adhesive tape T1) directly under the heat generating portion HT of the heat seal RM5.
• the tape peeling mechanism RM may move the remove head RM1 along the guide GD (see FIG. 15), or may move the remove head RM1 and the third table TBL3 simultaneously.
• the tape peeling mechanism RM lowers the heat seal RM5 and heats part of the peeling tape PT while pressing it against the end of the inner circular portion T1M with the heating part HT, thereby welding the part to the end of the inner circular portion T1M.
• the top diagram in Figure 18 shows the state of the remove head RM1 (heat seal RM5) at this time.
• the tape peeling mechanism RM raises the heat seal RM5 as shown in the third diagram from the top in Figure 16. Even if the heat seal RM5 rises, the welded portion WP of the peeling tape PT is welded to the end of the inner circular portion T1M, so at this stage it does not rise with the heat seal RM5.
• the tape peeling mechanism RM uses the slider RM4 to move the third table TBL3 to the left in order to position the welded portion WP directly under the tip of the remove wedge RM6, which is an example of a peeling member.
• the tape peeling mechanism RM may move the remove head RM1 along the guide GD (see Figure 15), or may move the remove head RM1 and the third table TBL3 simultaneously.
• the tape peeling mechanism RM lowers the remove wedge RM6 so that the tip of the remove wedge RM6 presses against the welded portion WP, as shown in the bottom diagram of Figure 16.
• the tape peeling mechanism RM drives the peeling tape recovery roller RM2 (see FIG. 15) and the peeling tape supply roller RM3 (see FIG. 15) to generate a peeling force PF.
• the tape peeling mechanism RM also uses the slider RM4 to move the third table TBL3 to the left.
• the peel angle ⁇ which is the angle of the line of action of the peel force PF relative to the top surface (horizontal plane) of the wafer W, becomes a value of ⁇ 1, and peeling of the first adhesive tape T1 (inner circular portion T1M) from the top surface of the wafer W begins.
• the peel angle ⁇ is a different angle from the wedge angle, which is the angle of the tip of the remove wedge RM6, and is typically larger than the wedge angle.
• the lower diagram in Figure 18 shows a state similar to the state of the remove head RM1 (remove wedge RM6) at this time. Strictly speaking, the lower diagram in Figure 18 shows the state when peeling of the first adhesive tape T1 (inner circular portion T1M) from the top surface of the wafer W has progressed further.
• the tape peeling mechanism RM can pull the welded portion WP almost straight up with an appropriate peeling force PF while holding down the first adhesive tape T1 (inner circular portion T1M) with the removal wedge RM6. Therefore, the tape peeling mechanism RM can start peeling the first adhesive tape T1 (inner circular portion T1M) from the top surface of the wafer W without causing cracks or the like in the wafer W.
• the tape peeling mechanism RM raises the remove wedge RM6 as shown in the second diagram from the top of FIG. 17. Also, as shown in the second, third, and fourth (bottom) diagrams from the top of FIG. 17, the tape peeling mechanism RM continues to collect the peeling tape PT and the first adhesive tape T1 (inner circular portion T1M) by the peeling tape collection roller RM2 (see FIG. 15) while moving the third table TBL3 leftward so that the peeling angle ⁇ becomes values ⁇ 2, ⁇ 3, and ⁇ 4 that are smaller than the value ⁇ 1 at the start of peeling. At this time, the tape peeling mechanism RM may move the remove head RM1 along the guide GD (see FIG. 15), or may move the remove head RM1 and the third table TBL3 simultaneously.
• the peel angle ⁇ is controlled to be maximum at value ⁇ 1 at the start of peeling, to decrease in order to values ⁇ 2 and ⁇ 3, and to be minimum at value ⁇ 4 at the completion of peeling. That is, the peel angle ⁇ is controlled to decrease gradually from the start of peeling to the completion of peeling.
• the peel angle ⁇ may be controlled to maintain value ⁇ 3 after decreasing gradually from value ⁇ 1 to value ⁇ 3, for example. That is, the peel angle ⁇ may be controlled to be approximately constant for a portion of the period between the start of peeling and the completion of peeling. Alternatively, the peel angle ⁇ may be controlled to increase for a portion of the period between the start of peeling and the completion of peeling.
• the tape peeling mechanism RM may be controlled to maintain or increase the peel angle ⁇ during the period in which the peel width increases, and to reduce the peel angle ⁇ during the period in which the peel width decreases.
• the peel width is the length of the part of the inner circular portion T1M that is actually peeled in the X-axis direction, and increases as the peel line LS (see the lower diagram in FIG. 18) approaches the center of the circular wafer W, is maximum when the peel line LS passes through the center of the circular wafer W, and decreases as the peel line LS moves away from the center of the circular wafer W.
• the peel line LS corresponds to the boundary line between the part of the inner circular portion T1M that has already been peeled and the part that has not yet been peeled.
• the tape peeling mechanism RM can prevent the peeling tape PT from pulling the wafer W with undesired force in an undesired direction via the first adhesive tape T1 (inner circular portion T1M), thereby preventing damage to the wafer W due to cracking, etc.
• the peeling tape PT is a heat-sealing tape configured to be heated by the heat seal RM5 and welded to the first adhesive tape T1 (inner circular portion T1M), but it may also be an adhesive tape configured to adhere to the first adhesive tape T1 (inner circular portion T1M). In this case, adhesion of the peeling tape PT to the first adhesive tape T1 (inner circular portion T1M) may be achieved by pressing with the seventh driven roller DR7 (see FIG. 15). Also, the heat seal RM5 may be omitted.
• the tape peeling mechanism RM may also be configured to control the peeling force by adjusting the driving force of the peeling tape recovery roller RM2.
• the tape peeling mechanism RM may be configured so that the peeling force is constant during peeling, or so that the peeling force can be made different at the start and end of peeling.
• the peeling force may be controlled so that it gradually decreases from the start of peeling to the end of peeling.
• the tape peeling mechanism RM raises the removal wedge RM6 after the first adhesive tape T1 (inner circular portion T1M) starts to peel off from the wafer W.
• the tape peeling mechanism RM may leave the removal wedge RM6 in contact with the upper surface of the first adhesive tape T1 (inner circular portion T1M) without raising it.
• the removal wedge RM6 has the effect of preventing the diced chips, etc. from adhering to the first adhesive tape T1 to be peeled off and lifting up from the substrate (wafer W).
• the removal wedge RM6 is configured so that its width in the X-axis direction is slightly larger than the width of the peeling tape PT as shown in the lower diagram of FIG. 18, but may be configured so as to be larger than the width of the wafer W if it is to have the function of preventing the diced chips, etc. from lifting up.
• the substrate transfer apparatus 100 is configured to transfer a substrate (wafer W) having a first adhesive tape (first adhesive tape T1) attached to the holding surface side to a second adhesive tape (second adhesive tape T2), as shown in FIG. 2.
• the substrate transfer device 100 includes a tape application mechanism MT that applies a second adhesive tape (second adhesive tape T2) to the ring frame F (second ring frame F2) and the non-holding surface side of the substrate (wafer W) as shown in FIG. 13, a tape cutting section (cutter blade MT16) that cuts the second adhesive tape (second adhesive tape T2) along the outer shape of the ring frame F (second ring frame F2) as shown in FIG.
• a reversing mechanism RV that reverses the substrate (wafer W) adhesively held in the ring frame F (second ring frame F2) via the second adhesive tape (second adhesive tape T2) as shown in FIG. 6, and a tape peeling mechanism RM that peels off the first adhesive tape (first adhesive tape T1) from the substrate (wafer W) as shown in FIG. 15.
• the tape peeling mechanism RM is configured to be able to change the peeling angle ⁇ between the start and end of peeling as shown in FIG. 17.
• the substrate transfer device 100 has the effect of suppressing damage to the substrate (wafer W) when peeling off the adhesive tape T (first adhesive tape T1) from the substrate (wafer W).
• the tape peeling mechanism RM may be included in the mounter device MD.
• the mounter device MD is a device that attaches adhesive tape T to a ring frame F and a substrate (wafer W), or a device that separates the ring frame F and substrate (wafer W) attached to the adhesive tape T.
• the mounter device MD may be a device that assembles a mount frame MF, or a device that separates a mount frame MF.
• the mounter device MD may be a normal mounter device NMD that attaches adhesive tape T to a substrate (wafer W) and a ring frame F positioned on a table to fabricate a mount frame MF.
• the mounter device MD may be a reverse mounter device RMD that separates a mount frame MF placed on a table into a substrate (wafer W) and a ring frame F.
• the mounter device MD may have a tape peeling mechanism RM that peels off the adhesive tape T attached to the substrate (wafer W).
• the tape peeling mechanism RM may also be configured to change the peeling angle ⁇ between the start and end of peeling.
• a normal mounter device NMD which is an example of a mounter device MD
• a mounter device MD may be configured to include a second loader 2, a ring frame supply unit 6, a tape application mechanism MT, a robot RB, and a tape peeling mechanism RM, as shown in FIG. 19.
• a reverse mounter device RMD which is another example of a mounter device MD, may be configured to include a first loader 1, a wafer separation mechanism 3, a ring frame recovery unit 5, a robot RB, and a tape peeling mechanism RM, as shown in FIG. 20.
• the mounter device MD may be configured as a device that combines a normal mounter device NMD and a reverse mounter device RMD.
• the mounter device has the effect of suppressing damage to the substrate (wafer W) when peeling off the adhesive tape T from the substrate (wafer W).
• the tape peeling mechanism RM may include a heating device (heat seal RM5) that heats the peeling tape PT that comes into contact with the adhesive tape T (first adhesive tape T1), and a recovery mechanism (peeling tape recovery roller RM2) that recovers the peeling tape PT.
• the peeling tape PT is heated by the heating device (heat seal RM5) and welded to the adhesive tape T (first adhesive tape T1), and the adhesive tape T (first adhesive tape T1) is pulled by the peeling tape PT recovered by the recovery mechanism (peeling tape recovery roller RM2) and peeled off from the substrate (wafer W) as shown in FIG. 17.
• the tape peeling mechanism RM can use a heat-sealed tape as the peeling tape PT, which has the effect of increasing the bonding strength between the peeled adhesive tape T (first adhesive tape T1) and the peeling tape PT compared to when an adhesive tape is used as the peeling tape PT.
• the tape peeling mechanism RM can suppress variations in the peeling force, which is the force used to peel the adhesive tape T (first adhesive tape T1) from the substrate (wafer W), which in turn has the effect of further suppressing damage to the substrate (wafer W) when the adhesive tape T (first adhesive tape T1) is peeled from the substrate (wafer W).
• the tape peeling mechanism RM may also be configured as a separate tape peeling device independent of the substrate transfer device 100 or the mounter device.
• the tape peeling device may be, for example, a device that peels off the adhesive tape T (second adhesive tape T2) attached to the substrate (wafer W), and may be configured to be able to change the peeling angle ⁇ between the start and end of peeling.
• the tape peeling device has the effect of suppressing damage to the substrate (wafer W) when peeling the adhesive tape T from the substrate (wafer W).
• the substrate transfer apparatus 100 is configured to be able to perform a substrate transfer method as shown in Figures 7 and 8.
• the substrate transfer method is a method of transferring a substrate (wafer W) having a first adhesive tape (first adhesive tape T1) attached to the holding surface side thereof to a second adhesive tape (second adhesive tape T2).
• the substrate transfer method includes an attachment step (fifth step ST5) of attaching a second adhesive tape (second adhesive tape T2) to the ring frame F (second ring frame F2) and the non-holding surface side of the substrate (wafer W), a second tape cutting step (sixth step ST6) of cutting the second adhesive tape (second adhesive tape T2) along the outer shape of the ring frame F (second ring frame F2), an inversion step (seventh step ST7) of inverting the substrate (wafer W) adhesively held in the ring frame F (second ring frame F2) via the second adhesive tape (second adhesive tape T2), and a tape peeling step (eighth step ST8) of peeling off the first adhesive tape (inner circular portion T1M of the first adhesive tape T1) from the substrate (wafer W).
• an attachment step (fifth step ST5) of attaching a second adhesive tape (second adhesive tape T2) to the ring frame F (second ring frame F2) and the non-holding surface side of the substrate (wafer W)
• the first adhesive tape (the inner circular portion T1M of the first adhesive tape T1) is peeled off from the substrate (wafer W) so that the peeling angle ⁇ is different at the start and end of peeling.
• the substrate transfer device 100 has the effect of suppressing damage to the substrate (wafer W) when peeling off the adhesive tape T (first adhesive tape T1) from the substrate (wafer W).
• the substrate transfer device 100, the mounter device, or the tape peeling device may be configured to perform a tape peeling method.
• the tape peeling method is a method for peeling off an adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) attached to a substrate (wafer W).
• the tape peeling method includes an attachment step (see the second diagram from the top in FIG. 16) for attaching a peeling tape PT to the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1), and a tape peeling step (see FIG.
• the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) to which the peeling tape PT is attached from the substrate (wafer W).
• the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) is peeled off from the substrate (wafer W) so that the peeling angle ⁇ is different between when peeling starts (value ⁇ 1) and when peeling ends (value ⁇ 4).
• This tape peeling method provides the substrate transfer device 100, mounter device, or tape peeling device with the advantage of being able to suppress damage to the substrate (wafer W) when peeling the adhesive tape T (first adhesive tape T1) from the substrate (wafer W).
• the peeling tape PT may be configured to be heated while pressed against the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) and welded to the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1), as shown in the second diagram from the top in Figure 16.
• This attachment process allows the substrate transfer device 100, mounter device, or tape peeling device to use a heat-sealed tape as the peeling tape PT, which has the effect of increasing the bonding strength between the peeled adhesive tape T (first adhesive tape T1) and the peeling tape PT compared to when an adhesive tape is used as the peeling tape PT.
• the tape peeling mechanism RM can suppress variations in the peeling force, which is the force used to peel the adhesive tape T (first adhesive tape T1) from the substrate (wafer W), which in turn has the effect of further suppressing damage to the substrate (wafer W) when the adhesive tape T (first adhesive tape T1) is peeled from the substrate (wafer W).

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• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

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Citations (8)

• 2024
  • 2024-04-05 JP JP2025513933A patent/JPWO2024214641A1/ja active Pending
  • 2024-04-05 CN CN202480024704.4A patent/CN120937129A/zh active Pending
  • 2024-04-05 WO PCT/JP2024/014045 patent/WO2024214641A1/ja not_active Ceased
  • 2024-04-05 EP EP24788666.6A patent/EP4697379A1/en active Pending
  • 2024-04-05 KR KR1020257037672A patent/KR20250173548A/ko active Pending
  • 2024-04-08 TW TW113113023A patent/TW202449971A/zh unknown

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