KR20250173548A - 마운터 장치, 테이프 박리 장치, 기판 전사 장치, 테이프 박리 방법, 및 기판 전사 방법 - Google Patents

마운터 장치, 테이프 박리 장치, 기판 전사 장치, 테이프 박리 방법, 및 기판 전사 방법

Info

Publication number
KR20250173548A
KR20250173548A KR1020257037672A KR20257037672A KR20250173548A KR 20250173548 A KR20250173548 A KR 20250173548A KR 1020257037672 A KR1020257037672 A KR 1020257037672A KR 20257037672 A KR20257037672 A KR 20257037672A KR 20250173548 A KR20250173548 A KR 20250173548A
Authority
KR
South Korea
Prior art keywords
peeling
tape
adhesive tape
substrate
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257037672A
Other languages
English (en)
Korean (ko)
Inventor
히로미쯔 이
요시노리 카츠시마
Original Assignee
테이코쿠 테이핑 시스템 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테이코쿠 테이핑 시스템 컴퍼니 리미티드 filed Critical 테이코쿠 테이핑 시스템 컴퍼니 리미티드
Publication of KR20250173548A publication Critical patent/KR20250173548A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H01L21/67132—
    • H01L21/6836—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020257037672A 2023-04-12 2024-04-05 마운터 장치, 테이프 박리 장치, 기판 전사 장치, 테이프 박리 방법, 및 기판 전사 방법 Pending KR20250173548A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-064943 2023-04-12
JP2023064943 2023-04-12
PCT/JP2024/014045 WO2024214641A1 (ja) 2023-04-12 2024-04-05 マウンター装置、テープ剥離装置、基板転写装置、テープ剥離方法、及び基板転写方法

Publications (1)

Publication Number Publication Date
KR20250173548A true KR20250173548A (ko) 2025-12-10

Family

ID=93059205

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257037672A Pending KR20250173548A (ko) 2023-04-12 2024-04-05 마운터 장치, 테이프 박리 장치, 기판 전사 장치, 테이프 박리 방법, 및 기판 전사 방법

Country Status (6)

Country Link
EP (1) EP4697379A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024214641A1 (cg-RX-API-DMAC7.html)
KR (1) KR20250173548A (cg-RX-API-DMAC7.html)
CN (1) CN120937129A (cg-RX-API-DMAC7.html)
TW (1) TW202449971A (cg-RX-API-DMAC7.html)
WO (1) WO2024214641A1 (cg-RX-API-DMAC7.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6695173B2 (ja) 2016-03-07 2020-05-20 日東電工株式会社 基板転写方法および基板転写装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4550510B2 (ja) * 2004-07-27 2010-09-22 リンテック株式会社 シート剥離装置及び剥離方法
JP4963655B2 (ja) * 2007-10-02 2012-06-27 リンテック株式会社 シート剥離装置及び剥離方法
JP5113621B2 (ja) * 2008-05-14 2013-01-09 リンテック株式会社 シート剥離装置及び剥離方法
US8858756B2 (en) 2011-10-31 2014-10-14 Masahiro Lee Ultrathin wafer debonding systems
JP3220900U (ja) * 2019-01-29 2019-04-11 リンテック株式会社 シート剥離装置
JP7558058B2 (ja) * 2020-12-28 2024-09-30 日機装株式会社 剥離機構及びこれを用いた積層装置
JP7748255B2 (ja) 2021-10-27 2025-10-02 大王製紙株式会社 繊維状セルロース複合樹脂

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6695173B2 (ja) 2016-03-07 2020-05-20 日東電工株式会社 基板転写方法および基板転写装置

Also Published As

Publication number Publication date
EP4697379A1 (en) 2026-02-18
JPWO2024214641A1 (cg-RX-API-DMAC7.html) 2024-10-17
TW202449971A (zh) 2024-12-16
WO2024214641A1 (ja) 2024-10-17
CN120937129A (zh) 2025-11-11

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