CN120937129A - 安装装置、胶带剥离装置、基板转印装置、胶带剥离方法及基板转印方法 - Google Patents

安装装置、胶带剥离装置、基板转印装置、胶带剥离方法及基板转印方法

Info

Publication number
CN120937129A
CN120937129A CN202480024704.4A CN202480024704A CN120937129A CN 120937129 A CN120937129 A CN 120937129A CN 202480024704 A CN202480024704 A CN 202480024704A CN 120937129 A CN120937129 A CN 120937129A
Authority
CN
China
Prior art keywords
peeling
tape
adhesive tape
substrate
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480024704.4A
Other languages
English (en)
Chinese (zh)
Inventor
李浩充
胜岛吉则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Imperial Film System Co ltd
Original Assignee
Imperial Film System Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imperial Film System Co ltd filed Critical Imperial Film System Co ltd
Publication of CN120937129A publication Critical patent/CN120937129A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202480024704.4A 2023-04-12 2024-04-05 安装装置、胶带剥离装置、基板转印装置、胶带剥离方法及基板转印方法 Pending CN120937129A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-064943 2023-04-12
JP2023064943 2023-04-12
PCT/JP2024/014045 WO2024214641A1 (ja) 2023-04-12 2024-04-05 マウンター装置、テープ剥離装置、基板転写装置、テープ剥離方法、及び基板転写方法

Publications (1)

Publication Number Publication Date
CN120937129A true CN120937129A (zh) 2025-11-11

Family

ID=93059205

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480024704.4A Pending CN120937129A (zh) 2023-04-12 2024-04-05 安装装置、胶带剥离装置、基板转印装置、胶带剥离方法及基板转印方法

Country Status (6)

Country Link
EP (1) EP4697379A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024214641A1 (cg-RX-API-DMAC7.html)
KR (1) KR20250173548A (cg-RX-API-DMAC7.html)
CN (1) CN120937129A (cg-RX-API-DMAC7.html)
TW (1) TW202449971A (cg-RX-API-DMAC7.html)
WO (1) WO2024214641A1 (cg-RX-API-DMAC7.html)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4550510B2 (ja) * 2004-07-27 2010-09-22 リンテック株式会社 シート剥離装置及び剥離方法
JP4963655B2 (ja) * 2007-10-02 2012-06-27 リンテック株式会社 シート剥離装置及び剥離方法
JP5113621B2 (ja) * 2008-05-14 2013-01-09 リンテック株式会社 シート剥離装置及び剥離方法
US8858756B2 (en) 2011-10-31 2014-10-14 Masahiro Lee Ultrathin wafer debonding systems
JP6695173B2 (ja) * 2016-03-07 2020-05-20 日東電工株式会社 基板転写方法および基板転写装置
JP3220900U (ja) * 2019-01-29 2019-04-11 リンテック株式会社 シート剥離装置
JP7558058B2 (ja) * 2020-12-28 2024-09-30 日機装株式会社 剥離機構及びこれを用いた積層装置
JP7748255B2 (ja) 2021-10-27 2025-10-02 大王製紙株式会社 繊維状セルロース複合樹脂

Also Published As

Publication number Publication date
EP4697379A1 (en) 2026-02-18
JPWO2024214641A1 (cg-RX-API-DMAC7.html) 2024-10-17
TW202449971A (zh) 2024-12-16
WO2024214641A1 (ja) 2024-10-17
KR20250173548A (ko) 2025-12-10

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