JPWO2024214641A1 - - Google Patents
Info
- Publication number
- JPWO2024214641A1 JPWO2024214641A1 JP2025513933A JP2025513933A JPWO2024214641A1 JP WO2024214641 A1 JPWO2024214641 A1 JP WO2024214641A1 JP 2025513933 A JP2025513933 A JP 2025513933A JP 2025513933 A JP2025513933 A JP 2025513933A JP WO2024214641 A1 JPWO2024214641 A1 JP WO2024214641A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023064943 | 2023-04-12 | ||
| PCT/JP2024/014045 WO2024214641A1 (ja) | 2023-04-12 | 2024-04-05 | マウンター装置、テープ剥離装置、基板転写装置、テープ剥離方法、及び基板転写方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024214641A1 true JPWO2024214641A1 (cg-RX-API-DMAC7.html) | 2024-10-17 |
Family
ID=93059205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025513933A Pending JPWO2024214641A1 (cg-RX-API-DMAC7.html) | 2023-04-12 | 2024-04-05 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4697379A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2024214641A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20250173548A (cg-RX-API-DMAC7.html) |
| CN (1) | CN120937129A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202449971A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2024214641A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4550510B2 (ja) * | 2004-07-27 | 2010-09-22 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| JP4963655B2 (ja) * | 2007-10-02 | 2012-06-27 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| JP5113621B2 (ja) * | 2008-05-14 | 2013-01-09 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| US8858756B2 (en) | 2011-10-31 | 2014-10-14 | Masahiro Lee | Ultrathin wafer debonding systems |
| JP6695173B2 (ja) * | 2016-03-07 | 2020-05-20 | 日東電工株式会社 | 基板転写方法および基板転写装置 |
| JP3220900U (ja) * | 2019-01-29 | 2019-04-11 | リンテック株式会社 | シート剥離装置 |
| JP7558058B2 (ja) * | 2020-12-28 | 2024-09-30 | 日機装株式会社 | 剥離機構及びこれを用いた積層装置 |
| JP7748255B2 (ja) | 2021-10-27 | 2025-10-02 | 大王製紙株式会社 | 繊維状セルロース複合樹脂 |
-
2024
- 2024-04-05 JP JP2025513933A patent/JPWO2024214641A1/ja active Pending
- 2024-04-05 CN CN202480024704.4A patent/CN120937129A/zh active Pending
- 2024-04-05 WO PCT/JP2024/014045 patent/WO2024214641A1/ja not_active Ceased
- 2024-04-05 EP EP24788666.6A patent/EP4697379A1/en active Pending
- 2024-04-05 KR KR1020257037672A patent/KR20250173548A/ko active Pending
- 2024-04-08 TW TW113113023A patent/TW202449971A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4697379A1 (en) | 2026-02-18 |
| TW202449971A (zh) | 2024-12-16 |
| WO2024214641A1 (ja) | 2024-10-17 |
| KR20250173548A (ko) | 2025-12-10 |
| CN120937129A (zh) | 2025-11-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251006 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20251006 |