WO2023282212A1 - 露光装置、露光方法および電子デバイスの製造方法 - Google Patents

露光装置、露光方法および電子デバイスの製造方法 Download PDF

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Publication number
WO2023282212A1
WO2023282212A1 PCT/JP2022/026499 JP2022026499W WO2023282212A1 WO 2023282212 A1 WO2023282212 A1 WO 2023282212A1 JP 2022026499 W JP2022026499 W JP 2022026499W WO 2023282212 A1 WO2023282212 A1 WO 2023282212A1
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Prior art keywords
state
exposure
spatial light
light modulator
optical system
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PCT/JP2022/026499
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English (en)
French (fr)
Japanese (ja)
Inventor
正紀 加藤
仁 水野
恭志 水野
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株式会社ニコン
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Priority to CN202280044691.8A priority Critical patent/CN117546099A/zh
Priority to JP2023533110A priority patent/JPWO2023282212A1/ja
Priority to KR1020247000673A priority patent/KR20240019288A/ko
Publication of WO2023282212A1 publication Critical patent/WO2023282212A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control

Definitions

  • the present invention relates to an exposure apparatus, an exposure method, and an electronic device manufacturing method.
  • This application claims priority based on Japanese Patent Application No. 2021-111770 filed on July 5, 2021, the content of which is incorporated herein.
  • an exposure apparatus that irradiates a substrate with illumination light through an optical system
  • light modulated by a spatial light modulator is passed through a projection optical system, and an image of this light is projected onto a resist coated on the substrate.
  • An exposure apparatus that forms an image and performs exposure is known (see, for example, Patent Document 1).
  • an illumination optical system a spatial light modulator illuminated by light from the illumination optical system, and a projection apparatus for irradiating an exposure target with the light emitted from the spatial light modulator.
  • an optical system a stage on which an exposure target is placed and which relatively moves the exposure target and the projection optical system in a predetermined scanning direction, and a control section for controlling a spatial light modulator, wherein the spatial light modulation
  • the device has a plurality of mirrors that can be switched between an ON state in which light can be emitted to the projection optical system by adjusting the tilt and an OFF state in which light is not emitted to the projection optical system
  • the control unit includes: controlling the spatial light modulator to switch between a first state and a second state with respect to the plurality of mirrors, wherein the first state and the second state correspond to the ON state of the mirrors; at least one of which is different from each other, and the light emitted from the spatial light modulator in the first state and the light
  • an exposure method for exposing the exposure target using the exposure apparatus described above is provided.
  • an electronic device manufacturing method including exposing the exposure target by the exposure method described above.
  • FIG. 3 is a diagram showing an overview of the configurations of an illumination module and a projection module; It is a figure which shows the outline
  • 4 is a diagram showing an overview of the configuration of an optical modulation section; FIG. FIG. 4 is a diagram showing the outline of the configuration of the light modulating section, and showing the ON state of the mirror in the center of the paper.
  • FIG. 4 is a diagram showing the outline of the configuration of the light modulating section, and showing the OFF state of the mirror in the center of the paper.
  • FIG. 1 is a diagram showing an overview of the external configuration of an exposure apparatus 1 of this embodiment.
  • the exposure apparatus 1 is an apparatus that irradiates an exposure target with modulated light.
  • the exposure apparatus 1 is a step-and-scan projection exposure apparatus that exposes rectangular glass substrates used in electronic devices such as liquid crystal displays (flat panel displays). is a so-called scanner.
  • the glass substrate, which is the object to be exposed may have at least one side length or diagonal length of 500 mm or more.
  • the glass substrate, which is the object to be exposed may be a substrate for a flat panel display.
  • An exposure target (for example, a substrate for a flat panel display) exposed by the exposure apparatus 1 is developed and provided as a product.
  • a resist is formed on the surface of the exposure object.
  • the apparatus main body of the exposure apparatus 1 is configured similarly to the apparatus main body disclosed in US Patent Application Publication No. 2008/0030702, for example.
  • the exposure apparatus 1 includes a base 11, an anti-vibration table 12, a main column 13, a stage 14, an optical surface plate 15, an illumination module 16, a projection module 17 (projection optical system), a light source unit 18, an optical fiber 19, and an optical modulator 20. (not shown in FIG. 1) and a control unit 21 .
  • the direction parallel to the optical axis direction of the projection module 17 that irradiates the light modulated by the light modulation section 20 onto the exposure object is defined as the Z-axis direction
  • the direction of a predetermined plane orthogonal to the Z-axis is defined as the X-axis direction
  • the X-axis direction and the Y-axis direction are directions orthogonal (intersecting) each other.
  • the base 11 is the base of the exposure apparatus 1 and is installed on the anti-vibration table 12 .
  • the base 11 supports a stage 14 on which an object to be exposed is placed so as to be movable in the X-axis direction and the Y-axis direction.
  • the stage 14 supports the exposure target.
  • the stage 14 is for positioning the exposure object with high precision with respect to a plurality of partial images of the circuit pattern projected via the projection module 17 in scanning exposure.
  • the stage 14 drives the object to be exposed in directions of six degrees of freedom (the above-described X-, Y-, and Z-axis directions and rotational directions about the respective axes).
  • the stage 14 is moved in the X-axis direction during scanning exposure, and moved in the Y-axis direction when changing the exposure target area on the exposure target. A plurality of exposure target areas are formed on the exposure target.
  • the stage 14 relatively moves the object to be exposed and the projection module 17 in the scanning direction.
  • the exposure apparatus 1 is capable of exposing a plurality of exposure target areas on one exposure target.
  • a stage device such as that disclosed in US Patent Application Publication No. 2012/0057140 can be used.
  • the stage device is a so-called coarse and fine movement stage device including, for example, a gantry type two-dimensional coarse movement stage and a fine movement stage that is finely driven with respect to the two-dimensional coarse movement stage.
  • the coarse movement stage can move the exposure object in directions of three degrees of freedom in the horizontal plane
  • the fine movement stage can finely move the exposure object in directions of six degrees of freedom.
  • the main column 13 supports the optical surface plate 15 above the stage 14 (in the positive direction of the Z axis).
  • the optical platen 15 supports the illumination module 16 , the projection module 17 and the light modulation section 20 .
  • FIG. 2 is a diagram showing the outline of the configuration of the lighting module 16, the projection module 17, and the light modulating section 20.
  • the illumination module 16 is arranged above the optical surface plate 15 and connected to the light source unit 18 via the optical fiber 19 .
  • the lighting modules 16 include a first lighting module 16A, a second lighting module 16B, a third lighting module 16C and a fourth lighting module 16D.
  • the first lighting module 16A to the fourth lighting module 16D are not distinguished, they are collectively referred to as the lighting module 16.
  • FIG. 1 when the first lighting module 16A to the fourth lighting module 16D are not distinguished, they are collectively referred to as the lighting module 16.
  • Each of the first lighting module 16A to the fourth lighting module 16D converts the light emitted from the light source unit 18 via the optical fiber 19 into a first light modulating section 20A, a second light modulating section 20B, and a third light modulating section. The light is guided to each of 20C and the fourth optical modulation section 20D. The lighting module 16 illuminates the light modulating section 20 .
  • the light modulation section 20 is controlled based on the circuit pattern to be transferred to the exposure object, and modulates the illumination light from the illumination module 16, which will be described later in detail.
  • the modulated light modulated by the light modulating section 20 is guided to the projection module 17 .
  • the first optical modulating section 20A to the fourth optical modulating section 20D are arranged at different positions on the XY plane. In the following description, when the first optical modulation section 20A to the fourth optical modulation section 20D are not distinguished, they are collectively referred to as the optical modulation section 20.
  • the projection module 17 is arranged below the optical surface plate 15 and irradiates the exposure object placed on the stage 14 with modulated light modulated by the spatial light modulator 201 .
  • the projection module 17 causes the light modulated by the light modulation section 20 to form an image on the exposure target, thereby exposing the exposure target.
  • the projection module 17 projects the pattern on the light modulating section 20 onto the exposure target.
  • the projection module 17 includes first projection modules 17A to A fourth projection module 17D is included. In the following description, when the first projection module 17A to the fourth projection module 17D are not distinguished, they are collectively referred to as the projection module 17.
  • a unit composed of the first illumination module 16A, the first light modulation section 20A, and the first projection module 17A is called a first exposure module.
  • a unit composed of the second illumination module 16B, the second light modulation section 20B, and the second projection module 17B is called a second exposure module.
  • Each exposure module is provided at a mutually different position on the XY plane, and can expose a pattern at a different position of the exposure target placed on the stage 14 .
  • the stage 14 can scan-expose the entire surface of the exposure target or the entire surface of the exposure target area by moving relative to the exposure module in the X-axis direction, which is the scanning direction.
  • the illumination module 16 is also called an illumination system.
  • the illumination module 16 (illumination system) illuminates a spatial light modulator 201 (spatial light modulation element) of the light modulation section 20, which will be described later.
  • the projection module 17 is also called a projection unit.
  • the projection module 17 (projection section) may be a one-to-one system that projects the image of the pattern on the light modulation section 20 at one-to-one magnification, or may be an enlargement system or a reduction system.
  • the projection module 17 is preferably made of one or two kinds of glass materials (especially quartz or fluorite).
  • a pair of light source units 18 (light source unit R18R, light source unit L18L) is provided.
  • the light source unit 18 a light source unit using a laser with high coherence as a light source, a light source unit using a light source such as a semiconductor laser type UV-LD, and a light source unit using a lens relay type retarder can be adopted.
  • Examples of the light source 18a included in the light source unit 18 include lamps and laser diodes that emit light with wavelengths of 405 nm and 365 nm.
  • the exposure apparatus 1 includes a position measuring unit (not shown) composed of an interferometer, an encoder, etc., in addition to the units described above, and measures the relative position of the stage 14 with respect to the optical surface plate 15 .
  • the exposure apparatus 1 includes an AF (Auto Focus) section (not shown) that measures the position of the stage 14 or the exposure target on the stage 14 in the Z-axis direction, in addition to the above sections.
  • the exposure apparatus 1 includes an alignment unit (not shown) that measures the relative positions of each pattern when another pattern is superimposed on the already exposed pattern on the exposure target.
  • the AF section and/or the alignment section may have a TTL (Through the Lens) configuration for measurement via the projection module 17 .
  • FIG. 3 is a diagram showing the outline of the configuration of the exposure module. Taking the first exposure module as an example, an example of specific configurations of the illumination module 16, the light modulation section 20, and the projection module 17 will be described.
  • the illumination module 16 includes a module shutter 161 and an illumination optical system 162.
  • the module shutter 161 switches whether to guide the pulsed light supplied from the optical fiber 19 to the illumination optical system 162 .
  • the illumination optical system 162 emits the pulsed light supplied from the optical fiber 19 to the light modulation section 20 through a collimator lens, a fly-eye lens, a condenser lens, etc., thereby illuminating the light modulation section 20 substantially uniformly. do.
  • the fly-eye lens wavefront-divides the pulsed light incident on the fly-eye lens, and the condenser lens superimposes the wavefront-divided light onto the light modulation section.
  • the illumination optical system 162 may have a rod integrator instead of the fly-eye lens.
  • the light modulation section 20 has a mask.
  • the mask is a spatial light modulator (SLM).
  • the light modulation section 20 includes a spatial light modulator 201 and an off light absorption plate 202 .
  • the spatial light modulator 201 is a digital mirror device (digital micromirror device, DMD).
  • the spatial light modulator 201 can spatially and temporally modulate the illumination light.
  • FIG. 4 is a diagram showing an overview of the configuration of the spatial light modulator 201 of this embodiment. Description will be made using a three-dimensional orthogonal coordinate system of Xm-axis, Ym-axis, and Zm-axis in FIG.
  • the spatial light modulator 201 comprises a plurality of micromirrors 203 (mirrors) arranged on the XmYm plane.
  • the micromirrors 203 constitute elements (pixels) of the spatial light modulator 201 .
  • the spatial light modulator 201 can change the tilt angle around the Xm axis and around the Ym axis. For example, as shown in FIG.
  • the micromirror 203 is turned on by tilting around the Ym axis, and turned off by tilting around the Xm axis as shown in FIG.
  • Micromirrors 203 in the ON state emit light to projection module 17 .
  • a micromirror 203 in the off state does not emit light to the projection module 17 .
  • the spatial light modulator 201 controls the direction in which incident light is reflected for each element by switching the tilt direction of the micromirror 203 for each micromirror 203 .
  • the digital micromirror device of the spatial light modulator 201 has a pixel count of about 4 Mpixels, and can switch the on state and off state of the micromirror 203 at a period of about 10 kHz.
  • a plurality of elements of the spatial light modulator 201 are individually controlled at predetermined time intervals.
  • the spatial light modulator 201 is a DMD
  • the element is the micromirror 203
  • the predetermined time interval is the period (for example, period 10 kHz) at which the micromirror 203 is switched between the ON state and the OFF state.
  • the off-light absorption plate 202 absorbs light (off-light) emitted (reflected) from the elements of the spatial light modulator 201 that are turned off. Light emitted from the ON-state elements of the spatial light modulator 201 is guided to the projection module 17 .
  • the projection module 17 projects the light emitted from the ON-state elements of the spatial light modulator 201 onto the exposure object.
  • the projection module 17 includes a magnification adjustment section 171 and a focus adjustment section 172 .
  • Light modulated by the spatial light modulator 201 enters the magnification adjustment unit 171 .
  • the magnification adjustment unit 171 adjusts the magnification of the image on the focal plane 163 of the modulated light emitted from the spatial light modulator 201, that is, the surface of the exposure object, by driving some lenses in the optical axis direction.
  • the focus adjustment unit 172 drives the entire lens group in the optical axis direction so that the modulated light emitted from the spatial light modulator 201 forms an image on the surface of the exposure object measured by the AF unit described above. Then, adjust the imaging position, that is, the focus.
  • the projection module 17 projects only the light image emitted from the turned-on element of the spatial light modulator 201 onto the surface of the exposure object. Therefore, the projection module 17 can project and expose the image of the pattern formed by the ON elements of the spatial light modulator 201 onto the surface of the exposure object. That is, the projection module 17 can form spatially modulated light on the surface of the exposure object.
  • the spatial light modulator 201 can switch the micromirror 203 between the ON state and the OFF state at a predetermined cycle (frequency) as described above, the projection module 17 can transmit temporally modulated light to It can be formed on the surface of the exposure object. That is, the exposure apparatus 1 performs exposure by changing the substantial pupil state at an arbitrary exposure position.
  • the Xm-axis is parallel to the X-axis and the Ym-axis is parallel to the Y-axis.
  • the micromirror 203 in the ON state tilts with respect to the X-axis direction, which is the scanning direction.
  • the Ym axis is also called the first tilt axis T1.
  • the plurality of micromirrors 203 rotate around the first tilt axis T1 (Ym axis), and the plurality of micromirrors 203 adjust their tilts with respect to the scanning direction to turn on. , to emit light to the projection module 17 .
  • the plurality of micromirrors 203 are arranged linearly in the scanning direction, and the plurality of micromirrors 203 are also arranged in the direction of the first tilt axis T1.
  • control unit 21 is configured by, for example, a computer having an arithmetic unit such as a CPU and a storage unit.
  • the computer controls each part of the exposure apparatus 1 according to a program that controls each part that operates in exposure processing.
  • the controller 21 controls operations of the illumination module 16, the light modulator 20, the projection module 17, and the stage 14, for example.
  • the storage unit is configured using a computer-readable storage medium device such as memory.
  • the storage unit stores various information regarding exposure processing.
  • the storage unit stores, for example, information related to exposure patterns during exposure processing.
  • the storage unit stores information input via the communication unit or the input unit, for example.
  • the communication unit includes a communication interface for connecting the exposure apparatus to an external device.
  • the input unit includes input devices such as a mouse, keyboard, and touch panel. The input unit receives input of various information for the exposure apparatus.
  • the stage 14 relatively moves the exposure object in a predetermined scanning direction with respect to the projection module.
  • the light emitted by the projection module scans the exposure object based on the information about the exposure pattern stored in the storage unit, and a predetermined exposure pattern is formed.
  • FIG. 7 is a diagram showing an overview of the configuration of the spatial light modulator 201.
  • FIG. 8 is a diagram showing the exposure field PI on the exposure object 23.
  • the spatial light modulator 201 has a plurality of micromirrors 203 (mirrors) arranged on the XmYm plane.
  • the micromirrors 203 are arranged in a 5 ⁇ 5 matrix.
  • one micromirror 203 included in the spatial light modulator 201 may be called a pixel.
  • the micromirror 203 is turned on by tilting around the Ym axis, and turned off by tilting around the Xm axis.
  • a micromirror 203 in the ON state is called an "ON pixel”.
  • the micromirrors 203 in the OFF state are called "OFF pixels”.
  • the spatial light modulator 201 switches between a first state and a second state in which the exposure target 23 is irradiated with a predetermined exposure pattern.
  • the controller 21 turns on one or more predetermined micromirrors 203 among the plurality of micromirrors 203 .
  • the second to fourth micromirrors 203 from the left are in the ON state.
  • the second to fourth micromirrors 203 from the top are in the ON state.
  • a total of five micromirrors 203 that are turned on are arranged in a cross shape as a whole. These five micromirrors 203 are called a first micromirror group 205 .
  • the exposure visual field PI (exposure pattern) on the exposure object 23 has a cross shape corresponding to the micromirror 203 in the ON state.
  • the exposure field PI is positioned in the center of the exposure object 23 .
  • FIG. 9 is a diagram showing an overview of the configuration of the spatial light modulator 201.
  • FIG. 10 is a diagram showing the exposure field PI on the exposure object 23.
  • the mode shown in FIG. 9 is the second state of the spatial light modulator 201.
  • the third to fifth micromirrors from the left Mirror 203 is in the ON state.
  • the second to fourth micromirrors 203 from the top are in the ON state.
  • a total of five micromirrors 203 that are turned on are arranged in a cross shape as a whole.
  • the control unit 21 can switch between the first state and the second state.
  • the five micromirrors 203 that are turned on are called a second micromirror group 206 .
  • the second micromirror group 206 has the same shape as the first micromirror group 205 in the first state (see FIG. 7). It is different from the micromirrors 203 that make up the micromirror group 205 .
  • the second micromirror group 206 is composed of the micromirrors 203 that are shifted to the right by one pixel with respect to the first micromirror group 205 . That is, although at least one of the micromirrors to be in the ON state is different between the first state and the second state of the spatial light modulator 201, it is the same in both the first state and the second state.
  • a shaped exposure pattern can be formed.
  • exposure patterns having the same shape include exposure patterns with different magnifications and defocused exposure patterns.
  • exposure patterns with different magnifications are formed by adjusting the magnification adjustment unit 171 of the projection module 17 .
  • the focus adjustment unit 172 of the projection module 17 a defocused exposure pattern is formed.
  • the exposure visual field PI (exposure pattern) on the exposure object 23 has a cross shape corresponding to the micromirror 203 in the ON state.
  • the exposure field PI shown in FIG. 10 and the exposure field PI shown in FIG. 8 have the same shape.
  • the irradiation position can be changed. That is, the position of the exposure field PI on the exposure object 23 can be set to the center as in the first state.
  • the timing of switching between the first state and the second state of the spatial light modulator 201 is not particularly limited. Switching between the first state and the second state may be performed for each scanning exposure, may be performed periodically at a predetermined timing, or may be performed when the exposure of the exposure target 23 is completed. It may be performed before the scanning exposure of the next exposure object is started, or it may be performed at a longer cycle.
  • the micromirror 203 If the ON state of the micromirror 203 continues for a long time, a phenomenon may occur in which the micromirror 203 is fixed in that state. If there is a micromirror 203 stuck in the ON state, a specific position on the exposure object 23 may be unnecessarily exposed. That is, although the micromirror 203 should be in the off state, it may expose a position that should not be exposed because it is fixed in the on state. However, in this embodiment, by switching the spatial light modulator 201 between the first state and the second state for exposure (see FIGS. 8 and 10), the micromirror 203 stays on for a long time. can be suppressed. This can prevent the micromirror 203 from sticking.
  • a light blocking member is provided to block the light from the micromirror 203. Unnecessary exposure of a specific position can be suppressed by blocking with a member.
  • the light shielding member may be provided so as to be able to shield at least part of the light emitted from the spatial light modulator 201 , and may be provided so as to be able to shield at least part of the light incident on the spatial light modulator 201 .
  • the light shielding member is placed between the optical fiber 19 and the illumination optical system 162, inside the illumination optical system 162, between the illumination optical system 162 and the spatial light modulator 201, inside the projection module 17, and between the projection module 17 and the exposure object 23.
  • another exposure module provided in the exposure apparatus 1 may be used to scan and expose the exposure object 23 .
  • the exposure module used at this time is preferably the exposure module provided next to the exposure module having the spatial light modulator 201 to which the micromirror 203 is fixed, and which exposure module to use is set in advance. you can As a result, the exposure apparatus 1 can be prevented from being stopped to replace the spatial light modulator 201, for example, and the exposure of the exposure object 23 can be continued.
  • the micromirror 203 may be switched between an ON state and an OFF state at times other than during exposure processing.
  • the ratio of on-state time to off-state time may be, for example, 1:2 to 2:1, preferably 1:1. Switching between the ON state and the OFF state may be performed continuously throughout the time other than during the exposure process, or may be performed only during a predetermined period of time.
  • the micromirror 203 may be maintained in a neutral state between the ON state and the OFF state at times other than during the exposure process.
  • the neutral state may be maintained continuously throughout the time other than during the exposure process, or may be maintained only for a predetermined period of time.
  • the micro-mirror 203 may be switched between the ON state and the OFF state in the opposite phase to the switching between the ON state and the OFF state during the scanning exposure at a time other than during the exposure process. That is, during scanning exposure, the micromirror 203 is exposed while being switched between the ON state and the OFF state.
  • the micromirror 203 may be operated at a time equal to or less than the holding time. These prevent the micromirror 203 from sticking.
  • the spatial light modulator may calibrate the tilt angle of the mirror by applying voltage.
  • the power (illuminance) of the light from the mirror may be measured and the variation thereof may be calibrated.
  • the exposure apparatus 1 of the present embodiment it is possible to prevent the micromirror 203 from being turned on for a long time. Therefore, the micromirror 203 can be operated normally. Therefore, good exposure processing is possible.
  • the part of the micromirror 203 that is turned on differs between the first state and the second state of the spatial light modulator 201 . Therefore, sticking of the micromirror 203 is less likely to occur. Therefore, the micromirror 203 can be operated normally. Therefore, good exposure processing is possible.
  • the exposure apparatus 1 of this embodiment may include a master clock (oscillator that generates a master clock) (not shown) that serves as a reference for synchronization.
  • a master clock oscillator that generates a master clock
  • devices such as the stage 14, the illumination module 16, the projection module 17, and the light modulation section 20 may be driven based on the master clock.
  • the control unit 21 can control the operation of each device based on the master clock. By referring to the master clock, the operation timing of each device is appropriately adjusted individually, and the relationship of operation timings among a plurality of devices is appropriately set.
  • the second micromirror group 206 (see FIG. 9) is shifted to the right by one pixel with respect to the first micromirror group 205 (see FIG. 7).
  • the position of the second micromirror group with respect to the first micromirror group is not limited to this.
  • the second micromirror group may be slid by two pixels or more with respect to the first micromirror group, and the direction of sliding movement is not limited to the right direction on the paper surface of FIGS. It may be in the vertical direction.
  • the second micromirror group may be at a position rotationally displaced about the center of the first micromirror group.
  • the second micromirror group may have a reduced or enlarged shape of the first micromirror group.
  • the first micromirror group and the second micromirror group may be different in at least one micromirror, or may be different in all micromirrors.
  • the control unit 21 changes the position from the first micromirror group 205 (see FIG. 7) to the second micromirror group 206 (see FIG. 9).
  • the exposure object 23 is moved to the right.
  • the method of exposure alignment on the exposure object 23 is not limited to this.
  • the control unit 21 may perform exposure alignment on the exposure object 23 by adjusting the position of the spatial light modulator 201 .
  • the control unit 21 may adjust the exposure position on the exposure target 23 by adjusting the projection position by the projection module 17 .
  • one projection module 17 eg, first projection module 17A
  • another projection module 17 eg, second projection module 17B
  • the exposure apparatus 1 can manufacture an electronic device such as a liquid crystal display (flat panel display) using the exposure method described above.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
PCT/JP2022/026499 2021-07-05 2022-07-01 露光装置、露光方法および電子デバイスの製造方法 WO2023282212A1 (ja)

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KR1020247000673A KR20240019288A (ko) 2021-07-05 2022-07-01 노광 장치, 노광 방법 및 전자 디바이스의 제조 방법

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JP2004056080A (ja) * 2002-05-30 2004-02-19 Dainippon Screen Mfg Co Ltd 画像記録装置
JP2006054471A (ja) * 2004-08-13 2006-02-23 Asml Holding Nv マスクレスリソグラフィシステムおよびマスクレスリソグラフィ方法
JP2006173215A (ja) * 2004-12-14 2006-06-29 National Institute Of Advanced Industrial & Technology 露光方法及び露光装置
JP2007041281A (ja) * 2005-08-03 2007-02-15 Fujifilm Corp 黒色画像及びその製造方法、並びに遮光膜付き基板及び液晶表示素子
WO2009045477A1 (en) * 2007-10-02 2009-04-09 Olympus Corporation Projection apparatus comprising spatial light modulator
US20150241798A1 (en) * 2014-02-21 2015-08-27 Palo Alto Research Center Incorporated Method and system to operate arrays of reflective elements for extended lifetime operation in use with high intensity power light sources
JP2016525231A (ja) * 2013-07-16 2016-08-22 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学コンポーネント
JP2020194162A (ja) * 2019-05-29 2020-12-03 中強光電股▲ふん▼有限公司 マイクロプロジェクター及びマイクロプロジェクターの制御方法

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JP2000155377A (ja) * 1998-11-19 2000-06-06 Noritsu Koki Co Ltd 写真焼付装置
JP2004056080A (ja) * 2002-05-30 2004-02-19 Dainippon Screen Mfg Co Ltd 画像記録装置
JP2006054471A (ja) * 2004-08-13 2006-02-23 Asml Holding Nv マスクレスリソグラフィシステムおよびマスクレスリソグラフィ方法
JP2006173215A (ja) * 2004-12-14 2006-06-29 National Institute Of Advanced Industrial & Technology 露光方法及び露光装置
JP2007041281A (ja) * 2005-08-03 2007-02-15 Fujifilm Corp 黒色画像及びその製造方法、並びに遮光膜付き基板及び液晶表示素子
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JP2016525231A (ja) * 2013-07-16 2016-08-22 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学コンポーネント
US20150241798A1 (en) * 2014-02-21 2015-08-27 Palo Alto Research Center Incorporated Method and system to operate arrays of reflective elements for extended lifetime operation in use with high intensity power light sources
JP2020194162A (ja) * 2019-05-29 2020-12-03 中強光電股▲ふん▼有限公司 マイクロプロジェクター及びマイクロプロジェクターの制御方法

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