WO2022215692A1 - 露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法および露光方法 - Google Patents
露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法および露光方法 Download PDFInfo
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- WO2022215692A1 WO2022215692A1 PCT/JP2022/017099 JP2022017099W WO2022215692A1 WO 2022215692 A1 WO2022215692 A1 WO 2022215692A1 JP 2022017099 W JP2022017099 W JP 2022017099W WO 2022215692 A1 WO2022215692 A1 WO 2022215692A1
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
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- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Definitions
- the present invention relates to an exposure apparatus, a device manufacturing method, a flat panel display manufacturing method, and an exposure method.
- This application claims priority based on Japanese Patent Application No. 2021-066819 filed on April 9, 2021, the contents of which are incorporated herein.
- One aspect of the present invention is an exposure apparatus that scans and exposes a substrate using an exposure unit that includes an optical modulator. 2 stages, a measurement unit that measures information of the second substrate, and a generation unit that generates control data of an exposure pattern for exposing the second substrate based on the information, the generation unit comprising: The control data is generated during the exposure process of the first substrate.
- Another aspect of the present invention is an exposure apparatus that scans and exposes a substrate by an exposure unit having an optical modulator, in which a first stage that supports a first substrate and a second substrate that is different from the first substrate are supported. and a generator that generates control data of an exposure pattern for exposing the second substrate, the first stage has an acquisition unit that acquires information about the light of the exposure unit, The generation unit generates the control data based on the information acquired by the acquisition unit.
- Another aspect of the present invention is an exposure apparatus that scans and exposes a substrate via an optical modulator in which a plurality of elements are controlled according to an image pattern, comprising: a stage that supports a first substrate; is a receiving unit that receives information on a second substrate that is scanned and exposed by the exposure device after scanning exposure on the first substrate, measured by a different device; and based on the information received by the receiving unit, the A generator that generates control data for controlling the plurality of elements during scanning exposure of the second substrate, and a memory that stores the control data during exposure processing of the first substrate.
- One aspect of the present invention includes exposing the substrate using the exposure apparatus described above and developing the exposed substrate.
- One aspect of the present invention includes exposing a flat panel display substrate using the exposure apparatus described above and developing the exposed substrate.
- an exposure method for scanning and exposing a substrate by an exposure unit having an optical modulator the step of supporting a first substrate on a first stage; supporting two substrates; measuring information of the second substrate; and generating control data of an exposure pattern for exposing the second substrate during exposure processing of the first substrate based on the information.
- a first substrate is supported on a first stage that includes an acquisition unit that acquires information about light from the exposure unit.
- One aspect of the present invention is an exposure method for scanning and exposing a substrate via an optical modulator in which a plurality of elements are controlled according to an image pattern, comprising the steps of: supporting a first substrate on a stage; a receiving unit receiving information on a second substrate to be scanned and exposed by the exposure apparatus after the first substrate is scanned and exposed, the information being measured by an apparatus different from the exposure apparatus that performs the exposure; generating control data for controlling the plurality of elements during scanning exposure of the second substrate based on the information; storing the control data in a memory during exposure processing of the first substrate; have
- One aspect of the present invention includes exposing the substrate by the exposure method described above and developing the exposed substrate.
- One aspect of the present invention includes exposing a flat panel display substrate by the exposure method described above and developing the exposed substrate.
- FIG. 1 is a perspective view showing the configuration of an exposure apparatus according to an embodiment
- FIG. It is a side view which shows schematic structure of an exposure apparatus.
- 3 is a side view showing a schematic configuration of an illumination/projection module of the exposure apparatus;
- FIG. 4 is a perspective view showing ON/OFF operation of a spatial light modulator;
- FIG. 4 is a diagram showing the operation of the spatial light modulator, and is a diagram in a power off state;
- FIG. 4 is a diagram showing the operation of the spatial light modulator, and is a diagram of the ON state of the spatial light modulator.
- FIG. 4 is a diagram showing the operation of the spatial light modulator, and is a diagram of the spatial light modulator in the OFF state; 3 is a side view showing a schematic configuration of a first alignment system provided on the substrate stage; FIG. It is a side view which shows schematic structure of the 2nd alignment system provided in an optical platen.
- FIG. 4 is a diagram illustrating an example of an operation flow of exposure processing of an exposure apparatus;
- FIG. 10 is a diagram showing a modification of the operation flow of exposure processing of the exposure apparatus;
- FIG. 1 is a perspective view showing an example of an exposure apparatus according to this embodiment.
- the exposure device 1 is a device that irradiates a substrate 10 with illumination light via an optical system.
- the exposure apparatus 1 passes light modulated by a spatial light modulator 75 (see FIG. 2) through a projection optical system (illumination/projection module 7 described later), and forms an image of this light on a photosensitive material (resist). It is used for exposure.
- the substrate 10 is a display glass substrate coated with, for example, a resist on its surface.
- the exposure apparatus 1 includes a plurality of (two, for example) substrate stages 4 (4A, 4B) supporting a substrate 10, and a scanning stage 4 (4A, 4B) for exposing the substrate 10 with a predetermined exposure pattern.
- An exposure apparatus main body 2 for performing exposure and a substrate exchange section 3 for transporting and placing the substrate 10 on the substrate stage 4 are provided.
- first direction X1 A direction perpendicular to (crossing) the first direction is defined as a second direction X2.
- a direction perpendicular to (crossing) the first direction X1 and the second direction X2 is defined as a third direction X3.
- the substrate stage 4 holds a rectangular substrate 10 in plan view. During scanning exposure, the substrate stage 4 moves in the first direction X1 with respect to the main body of the exposure apparatus, as will be described later. Also, the substrate stage 4 moves in the second direction X2 in order to expose a plurality of exposure regions on the substrate 10, respectively.
- the second direction X2 is also called a non-scanning direction.
- the exposure apparatus main body 2 has an exposure unit 20, an optical surface plate 21, an alignment system 5, and an autofocus system .
- the exposure unit 20 incorporates the spatial light modulation element 75 described above, is supplied with light from the light source 61, and irradiates light in a preset exposure pattern.
- the exposure unit 20 is mounted on an optical surface plate 21.
- the optical surface plate 21 is kinematically supported at three points by a column 22 provided so as to straddle the base plate 11 extending in the first direction X1 on which the substrate stage 4 is placed.
- the optical surface plate 21 is arranged so that the center of gravity is positioned approximately at the center of the base plate 11 in the first direction X1.
- the base plate 11 is installed on the floor via a plurality of anti-vibration bases 111 .
- the base plate 11 is a base extending in the first direction X1, and a pair of stages 4A and 4B, which will be described later, are mounted on the upper surface 11a.
- the upper surface 11a of the base plate 11 is provided with guides (not shown) that guide the substrate stage 4 along the first direction X1.
- the column 22 has a pair of horizontal members 221 extending in the second direction X2 and legs 222 extending downward from both ends of the horizontal members 221 and connected to the base plate 11 . Since the load of the optical surface plate 21 is applied to the legs 222 , an anti-vibration table (not shown) may be arranged at the connection between the base plate 11 and the legs 222 . Three V-grooves are formed at appropriate positions on the upper surface of the horizontal member 221 . The optical surface plate 21 is placed in the V-groove via three balls on a pair of horizontal members 221 with the upper surface 21a facing in the horizontal direction.
- the optical surface plate 21 is equipped with an illumination/projection module 7, an AF system 23, and a second alignment system 5B, which will be described later.
- the optical surface plate 21 is provided with a plurality of first through holes 21b (see FIG. 2) penetrating in the thickness direction in order to guide the exposure light onto the substrate 10.
- any method can be appropriately applied as long as the method can ensure rigidity.
- the substrate stage 4 is for positioning the substrate 10 with high accuracy with respect to a plurality of partial images of the exposure pattern projected via the projection module 7B, which will be described later.
- the substrate stage 4 is driven in six degrees of freedom (first direction X1, second direction X2, third direction X3, and ⁇ X1, ⁇ X2, and ⁇ X3 directions rotating around axes X1, X2, and X3).
- the substrate stage 4 has a first substrate stage 4A arranged on one side of the base plate 11 and a second substrate stage 4B arranged on the other side. These substrate stages 4A and 4B are formed in a flat plate shape, and attract and hold the substrate 10 on the upper surface 4a by a method such as vacuum suction.
- the pair of substrate stages 4A and 4B are guided by guides (not shown) on the base plate 11, the positions of the substrate stages 4A and 4B are measured and controlled by an interferometer 53 and an encoder, and the positions of the substrate stages 4A and 4B are measured and controlled in the first direction X1 and the second direction X2. is moved to
- a linear motor system or the like can be adopted in which the substrate stage 4 is levitated by air and moved by magnetic force.
- the movable range of the first substrate stage 4A and the movable range of the second substrate stage 4B overlap. Part of the movable range of each substrate stage 4 overlaps because it is common without depending on the substrate stages 4A and 4B (especially the stroke required for exposure).
- the substrate stages 4A and 4B are provided movably so that the first substrate stage 4A and the second substrate stage 4B do not collide or interfere with each other.
- At least one substrate stage 4 must also be provided with a sensor for measuring the distance between the .
- the movement path of the substrate stage 4 is set so as to pass below the exposure unit 20 . That is, the substrate stage 4 is configured to be transported to a light irradiation position (also referred to as an exposure position) by the exposure unit 20 and to pass through the irradiation position. Then, while the substrate stage 4 passes through the exposure unit 20 , the exposure pattern of the image formed by the exposure unit 20 is exposed onto the substrate 10 .
- a light irradiation position also referred to as an exposure position
- a plurality of exchange pins 41 used when exchanging the substrate 10 are provided so as to be retractable in the vertical direction (third direction X3).
- These exchange pins 41 are arranged at predetermined intervals in the first direction X1 and the second direction X2 in the region where the substrate 10 is arranged on the upper surface 4a of the substrate stage 4.
- the replacement pin 41 protrudes upward, the bottom surface of the substrate 10 is supported by the tip of the pin.
- the substrate 10 can be raised and lowered by moving the exchange pin 41 in and out.
- the protruding length of the replacement pin 41 from the upper surface 4a is set to at least a length that allows the substrate support portions 31 of the replacement arms 3A and 3B, which will be described later, to advance below the raised substrate 10 .
- the substrate exchanging section 3 unloads the exposed substrate 10 on the substrate stage 4 to the outside of the substrate stage 4, and moves the substrate 10 to be exposed next to the substrate stage from which the exposed substrate 10 was unloaded. 4 Carry it up.
- the substrate exchange section 3 includes a first exchange arm 3A for rapidly exchanging the substrate 10 on the first substrate stage 4A and a second exchange arm 3B for rapidly exchanging the substrate 10 on the second substrate stage 4B. and have.
- the first exchange arm 3A and the second exchange arm 3B are each provided with a loading arm for loading the substrate 10 onto the substrate stage 4 and a loading arm for loading the substrate 10 out.
- These exchange arms 3A and 3B have substrate support portions 31 at the tips of the arms.
- the exchange arms 3A and 3B are arranged on the sides of the substrate stages 4A and 4B in the second direction X2, and are movable in the first direction X1, the second direction X2 and the third direction X3.
- the exchange arms 3A and 3B are moved in the second direction X2 to advance the substrate support section 31 below the substrate 10, and further raise it to support the substrate 10 from below. , 4B, the substrate 10 can be removed from the substrate stages 4A, 4B.
- the position of the substrate stage 4 on the base plate when the substrate is transported onto the substrate stage 4 by the substrate replacement part is called a substrate replacement position.
- the substrate 10 is coated with a photosensitive resist, carried into the exposure apparatus 1, and placed on a plurality of exchange pins 41 provided on the substrate stages 4A and 4B by the exchange arms 3A and 3B. Then, the exchange pins 41 are lowered and held by being attracted to the substrate holders on the substrate stages 4A and 4B. In this way, since the substrate stages 4A and 4B must be driven from the substrate exchange position to the exposure position, for example, in the case of a stage measurement system such as the interferometer 53, interference occurs between the exposure position side and the substrate exchange position side. This can be handled by switching a total of 53 measurement beams.
- FIG. 3 is a diagram showing the configuration of the exposure unit 20. As shown in FIG. As shown in FIG. 3, the exposure unit 20 exposes the light source unit 6 (see FIG. 1), the light source 61 of the light source unit 6, and the light from the light source 61 using a spatial light modulator 75 (described later). and an illumination/projection module 7 for.
- the exposure unit 20 exposes the light source unit 6 (see FIG. 1), the light source 61 of the light source unit 6, and the light from the light source 61 using a spatial light modulator 75 (described later). and an illumination/projection module 7 for.
- the light source units 6 are provided in pairs.
- a light source unit using a highly coherent laser as the light source 61 a light source unit using a light source 61 such as a semiconductor laser type UV-LD, and a light source unit using a lens relay type retarder can be adopted.
- the light source 61 is a lamp or a laser diode that emits a wavelength of 405 nm or 365 nm, or a laser capable of pulse emission in accordance with the driving of the spatial modulation element 75 .
- the optical system of the illumination/projection module 7 includes an illumination module 7A, a projection module 7B, and a modulator 7C.
- the number of lighting modules 7A is the same as that of the projection modules 7B in a one-to-one relationship.
- the illumination module 7A takes in the laser beam L from the light source unit 6 into the illumination module 7A through the optical fiber 71, and transmits the laser beam to the spatial light modulator 75 through the collimator lens 721, the fly-eye lens 723, and the main condenser lens 724. Illuminate the light L substantially uniformly.
- the illumination module 7A is provided with a module shutter 73 that can turn on/off the laser light L emitted from the optical fiber 71 at high speed for each of the illumination module 7A and the projection module 7B.
- the illumination module 7A causes the laser light L output from the light source 61 of the light source unit 6 shown in FIG. 1 to enter the spatial light modulation element 75 as illumination light for exposure.
- Illumination module 7A includes optical fiber 71, collimator lens 721, illumination wedge 722, fly-eye lens 723, and main condenser lens 724, as described above.
- the optical fiber 71 for example, a quartz fiber is used.
- Output light (laser light L) from the light source 61 is guided by the optical fiber 71 and enters the collimator lens 721 .
- the collimating lens 721 converts the light that is emitted from the optical fiber 71 and spreads into parallel light and emits the parallel light.
- the illumination wedge 722 adjusts the intensity (power) of light emitted from the optical fiber 71 .
- the light that has passed through the collimator lens 721 passes through a fly-eye lens 723 and a main condenser lens 724, is reflected by a mirror 725, and enters the spatial light modulator 75 at a predetermined reflection angle.
- the illumination module 7A and the light source unit 6 can be considered to illuminate the spatial light modulation element 75 together, and the two may be collectively referred to as an illumination system.
- the modulation section 7C modulates illumination light to create a pattern, and includes a spatial light modulation element 75 and an OFF light absorption plate 74.
- a digital mirror device is adopted as an example of the spatial light modulation element 75 .
- the spatial light modulation element 75 has a plurality of elements (mirrors in a digital mirror device).
- FIG. 4 shows how the spatial light modulation element 75 is turned ON/OFF to display a predetermined pattern.
- the individual mirrors of the spatial light modulator 75 are rotatable around the X1 axis and around the X2 axis.
- FIG. 5A shows a state in which the spatial light modulation element 75 is powered off.
- the spatial light modulator 75 shown in FIG. 5B shows an ON state in which light from the illumination module 7A is reflected toward the substrate 10 by tilting the mirror around the x2 axis.
- the spatial light modulation element 75 shown in FIG. 5C turns the light from the illumination module 7A into OFF light L2 by tilting the mirror around the x1 axis, and directs the light to the OFF light absorption plate 74 instead of the substrate 10. is shown.
- the spatial light modulator 75 can control the ON state and OFF state of each mirror based on the control data to form a pattern.
- the spatial light modulating element 75 can periodically update the pattern on the spatial light modulating element 75 by periodically driving the individual mirrors. Since the light source 61 needs to illuminate the spatial light modulation element 75 every pattern update cycle, it is preferable that the light source 61 emits pulsed light at a constant period or is capable of pulsed light emission only for a predetermined period.
- the light source 61 may emit continuous light. In that case, the continuous light is converted into pulsed light by switching a shutter (not shown) or modulated by an acoustooptic modulator (not shown).
- the light emitted from the light source 61 may be substantially pulsed light.
- the spatial light modulation element 75 is mounted on a stage (not shown), and minutely moved in the first direction X1 and/or the second direction X2 while being mounted on the stage. As a result, the spatial light modulator 75 is moved with respect to the illumination light, and the position of the projected image of the pattern on the substrate 10 can be changed, for example, the deviation of the projected position from the target value can be corrected.
- the projection module 7B is supported by the optical surface plate 21 and arranged below the spatial light modulation element 75 of the modulation section 7C.
- a magnification adjustment unit 76 that adjusts the magnification for projecting one pixel of the spatial light modulator 75 with a predetermined size, and a focus that adjusts the focus by driving the lens in the third direction X3. and an adjustment unit 77 .
- the projection module 7B projects, exposes, and forms an image of the pattern formed on the spatial light modulation element 75 onto the substrate 10 .
- the projection module 7B reduces and projects the pattern on the spatial light modulator 75 onto the substrate 10 at a projection magnification of 1/2 to 1/10.
- the projection module 7B can slightly correct the projection magnification by driving the magnification adjustment lens 761 of the magnification adjustment section 76 in the third direction X3. Note that the projection magnification is not limited to reduction, and may be enlargement or equal magnification.
- the focus adjustment unit 77 includes one or more focus adjustment lenses 771 mainly for adjusting the focus of projection onto the substrate 10 of the spatial light modulator 75 .
- the projection modules 7B are arranged in multiple rows on the optical surface plate 21 along the first direction X1.
- the alignment system 5 includes a first alignment system 5A (see FIG. 6) provided on the substrate stages 4A and 4B, and a second alignment system 5B (see FIG. 7) provided on the optical surface plate 21. ) and/or
- the first alignment system 5A is embedded in predetermined positions of the substrate stages 4A and 4B.
- the first alignment system 5A measures the position of the substrate 10 with respect to the substrate stages 4A and 4B.
- the first alignment system 5A is arranged at four corners of the substrate stage 4, for example.
- the substrate stage 4 is provided with through holes 42 penetrating in the stage thickness direction at four corners where the first alignment system 5A is provided.
- the first alignment system 5A includes a lens 511 arranged in the through-hole 42 of the substrate stage 4A and an alignment mark of the substrate 10 placed at a predetermined position on the substrate stage 4A. It has a light source 513 (for example, an LED) that irradiates the alignment mark 12 and a measurement unit 512 that detects the light reflected by the alignment mark 12 .
- a light source 513 for example, an LED
- the positions of, for example, the four corners of the substrate 10 are measured, and the X1-direction position, X2-direction position, rotation amount ( ⁇ X3), and X1-direction position are measured.
- the arrangement of the first alignment system 5A on the substrate stage 4 is not limited to four corners as described above. For example, when it occurs due to a process such as the non-linear shape of the substrate 10, a considerable number of first alignment systems 5A, such as 4 locations.times.4 rows, are arranged. Since the first alignment system 5A is a unit different from the projection module 7B, it can be said that it is an off-axis alignment system.
- the first alignment system 5A measures using the pixels of the camera of the measurement unit 512 as a reference.
- AF systems 23 are arranged on both sides of the projection module 7B with respect to the first direction X1 (see FIG. 7).
- the AF system 23 can measure the position of the substrate 10 in the X3 direction prior to the exposure process regardless of the scanning direction of the substrate 10 (the first direction X1).
- the focus adjustment unit 77 drives the focus lens 771 based on the measurement result of the AF system 23 to adjust the focus of the pattern image of the spatial light modulation element 75 .
- the substrate stage 4 has a calibration measurement system 52, an interferometer 53 for measuring the position of the substrate stage 4, and an illuminance measuring device .
- the calibration measurement system 52 is used for measuring and calibrating the positions of various modules.
- the calibration measuring system 52 is also used for calibrating the second alignment system 5B arranged on the optical surface plate 21 .
- the first alignment system 5A in the substrate stage 4 measures the imaging position of the pattern generated by the spatial light modulation element 75 that performs exposure.
- the position of the first alignment system 5A on the substrate stage 4 with respect to the imaging system can be measured from the image positions of the interferometer 53 for measuring the position and the alignment system 5.
- the second alignment system 5B may be arranged on the optical surface plate 21 above the first substrate stage 4A and the second substrate stage 4B.
- the second alignment system 5B measures the position of the substrate 10 with respect to the substrate stages 4A and 4B.
- the second alignment system 5B is arranged in a second through hole 21c that penetrates the optical surface plate 21 in the thickness direction. If the second alignment system 5B is used to measure the position of the substrate 10 with respect to the substrate stages 4A and 4B, the first alignment system 5A must be provided on the first substrate stage 4A and the second substrate stage 4B. good.
- the second alignment system 5B includes a lens 551 arranged below the second through hole 21c of the optical surface plate 21 and a substrate 10 arranged above the lens 551 and placed at a predetermined position on the substrate stage 4. It has an optical sensor 552 that irradiates measurement light toward the alignment mark 12 and a measurement unit 553 that detects the light reflected by the alignment mark 12 . Similarly to the first alignment system 5A, the second alignment system 5B is arranged to position the substrate 10 in the first direction X1, the position in the second direction X2, and rotate it when the substrate 10 is placed on the substrate stage 4.
- the second alignment system 5B measures not only the entire substrate 10 but also a partial area, so that the non-linear component of the deformation of the substrate 10 and the exposure area specified in advance (for example, divided into four areas) can be measured. It is also possible to calculate six parameters (positional information) in the exposure area).
- the optical platen 21 is formed extending in the first direction X1.
- the second alignment 5B is provided on the optical platen 21 apart from the illumination/projection module 7 with respect to the first direction X1.
- the substrate stage 4 moves the alignment mark 12 on the substrate 10 to a position (alignment measurement position) where the second alignment 5B can measure.
- a certain degree of freedom can be given to the measurement of the arrangement of the alignment marks 12 provided on the substrate 10 .
- the optical surface plate 21 also supports an alignment system CE (second alignment system 5B) provided between the projection modules 7B provided apart from each other in the first direction X1.
- the interferometer for measuring the position of the substrate stage 4 when measuring the alignment marks on the substrate 10 by the second alignment system 5B at both ends switches to the interferometer for exposure at the exposure position. It is arranged to measure the position of the substrate 10 or the substrate stage 4 at the exposure position as necessary.
- the exposure apparatus 1 is connected to and controlled by a data control section having a memory.
- the data control unit is connected to each part (alignment system 5 (5A, 5B), substrate stage 4, optical system (illumination module 7A, projection module 7B, and modulation unit 7C)) of exposure apparatus 1, and transmits and receives measurement values. Commands for control operations to the exposure apparatus 1 are issued.
- the data control unit has a function of generating and correcting control data for driving the spatial light modulator 75 by measurement, and stores correction data of the control data in the memory.
- the data control unit divides the mask data into the number of illumination/projection modules 7, generates control data from the divided mask data, and stores the control data in the memory.
- the spatial light modulator 75 updates 4 Mpixels at an update rate of approximately 10 kHz, for example, so the memory stores a large amount of control data at high speed.
- the data control unit transmits control data stored in the memory to each of the plurality of illumination/projection modules 7 .
- the illumination/projection module 7 Upon receiving the control data, the illumination/projection module 7 performs various exposure preparations.
- the illumination/projection module 7 loads the received mask data into the spatial light modulator 75 .
- the exposure apparatus 1 measures and calibrates the illuminance (light information) according to the recipe.
- the illuminance measuring device 54 arranged on the first substrate stage 4A measures the illuminance of light from the illuminance measuring pattern generated on the spatial light modulator 75 .
- the exposure apparatus 1 uses the measurement results of the illuminance measured using each of the plurality of illumination modules/projection modules 7, and the illumination wedge 722 arranged in the illumination module 7A detects the illuminance difference between the illumination/projection modules 7. Adjust the illuminance so that it disappears.
- the exposure apparatus 1 measures the exposure positions of the second alignment system 5B arranged on the optical surface plate 21, the illumination module 7A and the projection module 7B using the calibration measurement system 52.
- the calibration measurement system 52 measures the arrangement of the illumination module 7A and projection module 7B and the position of the second alignment system 5B, and determines the relative positional relationship between the illumination module 7A and projection module 7B and the second alignment system 5B. calculate.
- the position of the first alignment system 5A provided on the first substrate stage 4A is measured based on pixels of the camera of the measurement unit 512.
- the first alignment system 5A performs measurement using the exposure pattern of the spatial light modulator 75 projected by the projection module 7B.
- the exposure apparatus 1 calculates the relative positional relationship between the illumination module 7A, the projection module 7B, and the first alignment system 5A based on the measurement results.
- the exposure apparatus 1 also calculates the relative positional relationship between the illumination module 7A and projection module 7B and the first alignment system 5A by the same method for the second substrate stage 4B.
- the exposure apparatus 1 thus calculates the relative positional relationship between the illumination module 7A, the projection module 7B, and the alignment system 5 .
- the substrate exchange section 3 places the substrate 10 on the first substrate stage 4A.
- the first alignment system 5A observes and measures the alignment mark 12 of the substrate 10, and calculates the relative position of the first alignment system 5A with respect to the substrate 10 with respect to the apparatus.
- the first substrate stage 4A moves below the second alignment system 5B
- the second alignment system 5B observes and measures the alignment mark 12 of the substrate 10, and the relative position of the second alignment system 5B with respect to the substrate 10 with respect to the apparatus. Calculate the position.
- the position on the substrate where the pattern is exposed is determined. , that is, the projection position is known.
- the data control section corrects the exposure data (mask data, pattern data, control data) in order to correct this deviation amount.
- the exposure apparatus 1 not only corrects the exposure data by the data control unit in order to correct the amount of deviation, but also moves the substrate stage 4 itself to reduce the amount of deviation, and then corrects the correction data by the data control unit. may be generated/corrected. In this case, the correction amount of data correction by the data control section can be reduced.
- the exposure apparatus 1 may change the exposure position on the substrate 10 by moving the stage on which the spatial light modulator 75 is mounted.
- the exposure apparatus 1 may correct the shift amount by performing data correction by the data control unit and correction of the exposure position by moving the substrate stage 4 , or by performing data correction by the data control unit and the spatial light modulation element 75 .
- the shift amount may be corrected by correcting the exposure position by movement, or by correcting the data by the data control unit, correcting the exposure position by movement of the substrate stage 4, and correcting the exposure position by movement of the spatial light modulation element 75.
- You may correct
- the exposure apparatus 1 it is also possible to calculate the correction value for each panel of the substrate 10, such as a liquid crystal television, and obtain the correction value for the substrate stage 4.
- FIG. When the substrate 10 is partially corrected in this way, the correction values are almost always different for each of the illumination module 7A and the projection module 7B. Corrects the digital exposure data to be used.
- the flowchart shown in FIG. 8 shows an example of an operation flow for performing both the exposure operation and the correction data creation operation for creating correction data in each of the first substrate stage 4A and the second substrate stage 4B.
- the first substrate stage 4A uses the first exchange arm 3A (see FIG. 1) of the substrate exchange section 3 to place the substrate 10 (referred to as the first substrate) on the first substrate stage 4A. to be placed.
- the alignment system 5 measures the alignment marks 12 on the first substrate 10 (step S11).
- step S11 the data control unit described above calculates a correction value (correction data) for the digital exposure data (step S12). Then, the data control unit stores the correction data obtained in step S12 in the memory and transmits it to the illumination/projection module 7.
- step S13 the exposure apparatus 1 performs overlapping exposure on the first substrate 10 on the first substrate stage 4A based on the transmitted correction data and recipe information for the first substrate 10 (step S13).
- the exposure apparatus 1 After the preceding exposure operation (step S21) is completed on the second substrate stage 4B, the exposure apparatus 1 performs the exposure operation on the first substrate 10 by the above-described first substrate stage 4A. During the exposure operation for the first substrate 10 by the first substrate stage 4A, the exposure apparatus 1 unloads the substrate 10 exposed in step S21 from the second substrate stage 4B, and replaces the new substrate 10 (which is the second substrate with ) is transported to the second substrate stage 4B (step S22). At least one of the operation of unloading the exposed substrate 10 from the first substrate stage 4A and the operation of loading the substrate 10 to be exposed next onto the first substrate stage 4A will be collectively referred to as the substrate transport operation. .
- first alignment system 5A and/or second alignment system 5B measures alignment mark 12 on second substrate 10 (step S23).
- the calibration of errors due to the first alignment system 5A, the second alignment system 5B, the alignment system CE, and interferometer switching is performed by calibration using stage marks or substrate marks.
- the data control unit drives the spatial light modulator 75, which is the correction data used in the exposure performed next on the second substrate stage 4B, that is, the exposure of the second substrate 10. is calculated (step S24). Then, the data control unit stores the correction data obtained in step S24 in the memory and transmits it to the illumination/projection module 7. FIG. After that, the exposure apparatus 1 performs overlapping exposure on the second substrate 10 on the second substrate stage 4B based on the transmitted correction data and recipe information for the second substrate 10 (step S25). The exposure apparatus 1 unloads the first substrate 10 mounted on the first substrate stage 4A and exposed in step 13 from the first substrate stage 4A in parallel with the overlapping exposure of the second substrate 10 .
- the exposure apparatus 1 is provided with a plurality of substrate stages 4, so that during the exposure processing of the first substrate 10 performed on one of the first substrate stages 4A, the first alignment is performed on the other of the second substrate stages 4B.
- system 5A and/or second alignment system 5B processing steps from alignment measurement of second substrate 10 to generation of correction data and data transmission can be performed.
- the occurrence of takt delay can be suppressed.
- “during exposure processing” means the operation of moving the substrate stage 4 from the replacement position to the alignment measurement position, the exposure operation for the substrate 10, and the time from the end of the exposure operation for the substrate 10 until the substrate stage 4 moves to the replacement position. It is a process including the operation of The exposure operation is either an operation of performing scanning exposure on the substrate 10 or an operation of moving the substrate stage 4 in the X1 direction or the X2 direction in order to change the exposure area for scanning exposure.
- the data control unit uses light information such as illuminance measured by the illuminance measuring device 54 and the calibration measurement system 52 provided on the second substrate stage 4B during the exposure process, and uses the information on the light such as the illuminance to be placed on the first substrate stage 4A. Correction data for exposing the placed substrate 10 may be calculated.
- the data control unit may calculate the correction data using only the light information, or may use the measurement result of the alignment system 5 and the light information to calculate the correction data.
- the exposure apparatus 1 in addition to the array measurement of the plurality of illumination modules 7A and projection modules 7B, measurements related to the exposure position and data correction are performed in advance. By performing curvature (straightness) correction, etc., it is possible to calculate a correction value based on data and transmit the correction data during the exposure operation. In this way, it is possible to transmit the data considering the alignment of the substrate 10 and the arrangement of the modules without affecting the takt time.
- the exposure apparatus performs alignment using the alignment system 5, calculates correction values using the results of the alignment in the data control unit, generates correction data, and transmits the correction data. After completion, exposure of the substrate is performed.
- the exposure apparatus may be in a state in which the substrate cannot be exposed, that is, waiting for exposure, until correction data generation and correction data transmission are completed.
- the combined time of the exposure of the substrate on the substrate stage and the time until the exposed substrate is unloaded from the substrate stage is, for example, 100 seconds.
- the time required for loading the substrate into the substrate stage before exposing the substrate on the substrate stage, performing alignment measurement for the substrate, creating correction data, and sending the correction data, until the substrate is unloaded 100 seconds
- the exposure apparatus 1 of this embodiment by providing a plurality of (two in this embodiment) substrate stages 4A and 4B, it is possible to improve the work efficiency in exposure. Specifically, while the first substrate 10 on one of the substrate stages 4A and 4B (for example, the first substrate stage 4A) is being exposed, the other stage (for example, the second substrate stage 4A) is exposed. 4B), the exposed substrate 10 is unloaded, the second substrate 10 is loaded, and alignment operation/correction data generation/data transmission are all performed, so that the second substrate 10 is exposed immediately after the exposure of the first substrate 10 is completed. Exposure of the substrate 10 can begin.
- the time required from the completion of the exposure of the first substrate to the start of exposure of the next substrate can be reduced.
- the takt time of 150 seconds can be reduced to 100 seconds or less (only the exposure operation time within 100 seconds).
- the data control unit includes a memory for transmitting data for exposure to the spatial light modulator 75 and a memory for storing data for performing exposure with consideration given to the alignment of the second substrate 10B. is necessary.
- a large-capacity memory may comprise an area for storing data for the first substrate stage 4A and an area for storing data for the second substrate stage 4B.
- the data control unit may have individual memories, and a switcher may be used to switch the memory to be finally transmitted to the spatial light modulator 75. .
- the first substrate stage 4A is provided exclusively for exposure operation, and the second substrate stage 4B is provided exclusively for alignment operation and data correction operation. Therefore, the first alignment system 5A is provided only on the second substrate stage 4B.
- the configuration of the data control unit according to the modification is the same as that of the above embodiment.
- the substrate stage 4 may be arranged so that the movable range of the first substrate stage 4A and the movable range of the second substrate stage 4B do not overlap.
- the first exposure ⁇ is performed on the first substrate 10 in step S31, and then the second exposure ⁇ is performed on the second substrate in step S32 after the first exposure ⁇ .
- the third exposure ⁇ is performed on the third substrate 10 in step S33.
- step S41 while the first exposure ⁇ is being performed on the first substrate 10 on the first substrate stage 4A on the second substrate stage 4B, the exposure is performed next to the first exposure ⁇ .
- Alignment operation is performed by the first alignment system 5A with respect to the second substrate 10 for the second exposure ⁇ , and correction data is created by the data control unit.
- the first exchange arm 3A (see FIG. 1) of the substrate exchange section 3 is used to mount the second substrate 10 on the second substrate stage 4B.
- the alignment mark 12 of the second substrate 10 is measured by the first alignment system 5A.
- the data control unit calculates a correction value (correction data) for the digital exposure data for driving the spatial light modulator 75 through measurement by the first alignment system 5A. Then, the data control unit stores the obtained correction data in the memory.
- the exposed first substrate 10 is unloaded from the first substrate stage 4A using the substrate exchange section 3 shown in FIG.
- the second substrate 10 for which the correction data has been created in step S41 is transferred from the second substrate stage 4B to the first substrate stage 4A using the substrate exchange section 3.
- FIG. 1 When the second substrate 10 is transferred from the second substrate stage 4B to the first substrate stage 4A, the first substrate stage 4A moves to detect the alignment mark 12 by the second alignment 5B, and the first substrate The position of the second substrate 10 with respect to the stage 4A is grasped.
- the first alignment 5A measures and grasps the position of the second substrate 10 with respect to the first substrate stage 4A.
- the positional relationship between the second substrate stage 4B and the second substrate 10 (before remounting) is generated.
- the corrected data cannot be used as is. This is the positional relationship between the second substrate stage 4B and the second substrate 10 (before remounting to the first substrate stage 4A) and the first substrate stage 4A and (after remounting to the first substrate stage 4A). This is because the positional relationship of the second substrate 10 is different.
- the positional relationship between the first stage 4A and the second stage 4B is measured in advance so that the position of the substrate 10 (the position obtained by measuring the alignment marks 12) with respect to each of the stages 4A and 4B before and after the remounting can be known.
- the positional relationship between the second substrate stage 4B and the second substrate 10 before being remounted on the first substrate stage 4A
- the positional relationship between the first substrate stage 4A and the second substrate 10 after being remounted on the first substrate stage 4A.
- a relative comparison can be made between the positional relationship of the two substrates 10 .
- step S32 the second substrate 10 on the first substrate stage 4A is subjected to the second exposure based on the correction data and recipe information of the second substrate transmitted from the data control unit. ⁇ is performed (step S32). It should be noted that the correction data may be further corrected by the deviation amount found by the relative comparison. The position of the stage and/or the position of the spatial light modulator 75 may be adjusted while correcting the correction data.
- step S42 while the second exposure ⁇ is being performed on the second substrate 10 on the first substrate stage 4A on the second substrate stage 4B, the third exposure ⁇ performed next to the second exposure ⁇ Alignment is performed by the alignment system 5 with respect to the third substrate 10 for the purpose, and correction data is created by the data control unit.
- the first exchange arm 3A (see FIG. 1) of the substrate exchange section 3 is used to place the third substrate 10 on the second substrate stage 4B.
- the alignment mark 12 of the third substrate 10 is measured by the alignment system 5 .
- the data control unit calculates a correction value (correction data) for the digital exposure data for driving the spatial light modulator 75 through measurement by the alignment system 5 .
- the data control unit stores the obtained correction data in the memory. Thereafter, the same operations are sequentially repeated on the first substrate stage 4A and the second substrate stage 4B.
- the alignment of the other substrate stage 4A, 4B is performed.
- the second substrate stage 4B dedicated to data correction can perform processing steps from alignment of the substrate 10 to data transmission using the first alignment system 5, and the correction data can be transmitted. As a result, the occurrence of takt delay can be suppressed.
- the substrate 10 is transferred between the first substrate stage 4A dedicated to exposure and the second substrate stage 4B dedicated to alignment and data correction in the exposure apparatus 1.
- the second substrate stage 4B does not have to be provided in the exposure apparatus 1, and may be provided in an apparatus different from the exposure apparatus 1.
- FIG. This is because, for example, there are many alignment marks 12 to be measured in the alignment measurement, and the creation of correction data by the data control unit is not completed before the next exposure of the substrate 10 is started. If the number of alignment points is large, the second substrate stage 4B may be provided in an apparatus different from the exposure apparatus 1.
- Another device is, for example, a coater that applies a photosensitive material (resist) to the substrate 10 or a device that precedes the coater and performs a predetermined process on the substrate 10 .
- the exposure apparatus 1 has a receiving section that receives the result of measurement by another apparatus.
- the data control unit uses the received data to create correction data.
- the memory of the data control unit includes a data storage unit for the substrate being exposed, a data storage unit for the substrate 10 that has been processed by another device and has already been measured, and a data storage unit that is currently being measured. of storage units and three storage units are required.
- the data control unit selectively reads data according to the substrate.
- a data measurement device (which is a device different from the exposure device 1) is used for superimposition before exposure processing, and measurement is performed, and the measurement data and the substrate are compared and managed, so that exposure is being performed now.
- Data processing other than the substrate should be stored in the memory.
- the data measuring machine and the exposure apparatus can be set to almost the same environment (holder and substrate temperature) changes, so that the magnification that cannot be corrected on the substrate stage 4 side can be measured without almost any change. It should be noted that the difference due to adsorption of the substrate and the like due to measurement by the data measuring device and the exposure device can be obtained from the result of the final overlay exposure and input to the data correction as a process offset.
- the alignment system 5 is provided at a position apart from the projection module 7B with respect to the first direction X1, that is, an off-axis alignment in which the optical axis of the projection module 7B and the alignment axis are misaligned has been described. . Not limited to this, on-axis alignment in which the optical axis of the projection module 7B and the alignment axis overlap, and alignment with a TTL (Through the lens) configuration measured via the projection module 7B may be used together.
- the optical modulator includes a liquid crystal element, a digital mirror device (digital micromirror device, DMD), a magneto-optical light modulator (Magneto Optical Spatial Light Modulator, MOSLM), and the like.
- the light modulator may be of a reflective type that reflects the illumination light from the illumination module 7A, which is an illumination optical system, a transmissive type that transmits the illumination light, or a diffraction type that diffracts the illumination light.
- the light modulator can spatially and temporally modulate the illumination light.
- the first substrate 10 is supported in the exposure apparatus that scans and exposes the substrate 20 via the light modulator (spatial light modulation element 75) in which a plurality of elements are controlled according to the image pattern.
- a second substrate stage 4B that supports a second substrate 10 different from the first substrate 10; a measurement unit that measures information about the second substrate 10; and a generation unit that generates control data for controlling the plurality of elements during scanning exposure of 10 during exposure processing of the first substrate 10 .
- the work efficiency in exposure can be improved by providing a plurality of substrate stages 4A and 4B. That is, while the first substrate 10 on one of the substrate stages 4A and 4B (for example, the first substrate stage 4A) is being exposed, the other stage (for example, the second substrate stage 4B) is exposed. Immediately after the exposure of the first substrate 10 is completed, all the operations of unloading the exposed substrate 10, loading the second substrate 10, and alignment operation by the measurement unit/correction data generation/data transmission by the generation unit are performed. , the exposure of the second substrate 10 can be started. Thus, when the exposure apparatus has only one substrate stage 4, the time required from the completion of the exposure of the first substrate to the start of exposure of the next substrate 10 can be reduced. can be done. As a result, in this embodiment, it is possible to eliminate the waiting time for exposure that occurs in the conventional exposure apparatus 1 having only one substrate stage 4 .
- the measurement unit measures information of the second substrate 10 during exposure processing of the first substrate 10 .
- the first substrate stage 4A dedicated to exposure, the second substrate stage 4A dedicated to alignment (measurement) and data correction of the other substrate stage 4A, 4B is exposed. Since the information of the substrate 10 can be measured by the two-substrate stage 4B, it is possible to suppress the occurrence of takt delay.
- the measurement unit includes the first substrate stage 4A that supports the first substrate 10 to be exposed by the exposure unit 20 having the optical modulator (spatial light modulation element 75), and the measurement unit. It is provided apart from the exposure unit 20 (light modulator (spatial light modulation element 75)) so as not to collide with the second substrate stage 4B that supports the second substrate 10 to be measured.
- the movable range of the first substrate stage 4A and the movable range of the second substrate stage 4B are arranged so as not to overlap each other.
- Information on the substrate 10 can be measured by the measuring unit on the substrate stage 4 . Since both operations can be performed in parallel, it is possible to suppress the occurrence of takt delays and eliminate waiting time for exposure.
- the measuring section is installed on the second substrate stage 4B.
- the information of the second substrate 10 can be measured by the measuring section on the second substrate stage 4B during the exposure operation by the first substrate stage 4A.
- the second substrate 10 measured by the second substrate stage 4B is transported and placed on the first substrate stage 4A, and based on the measured information, the first substrate stage 4A
- the upper second substrate 10 can be exposed. That is, the second substrate 10 can be exposed with the minimum waiting time immediately after the exposure of the first substrate 10 . Since both operations can be performed in parallel in this way, it is possible to suppress the occurrence of takt delays and eliminate the exposure waiting time.
- the first substrate stage 4A during or before the exposure processing of the first substrate 10, outputs information about the light of the exposure unit 20 having the light modulator (spatial light modulation element 75). and the generating unit generates control data based on the information and the information obtained by the obtaining unit.
- the first substrate 10 is supported by the exposure apparatus.
- the first substrate stage 4A has an acquisition unit that acquires information about the light of the exposure unit 20, and the generation unit generates control data based on the information acquired by the acquisition unit. .
- the acquisition unit acquires information about the light of the exposure unit 20 on the second substrate stage 4B, and the generation unit can generate exposure pattern control data based on the information acquired by the acquisition unit. Therefore, the second substrate 10 on the first substrate stage 4A can be exposed based on the exposure pattern generated by the generator.
- the generation unit generates control data during the exposure processing of the first substrate 10 .
- the first substrate 10 is exposed next to the first substrate 10 in the generation unit. Since the exposure pattern control data can be generated based on the information about the light of the second substrate 10, it is possible to suppress the occurrence of takt delay.
- the acquisition unit acquires information about light during or before the exposure processing of the first substrate 10 .
- the acquisition section acquires the information about the light of the exposure unit 20 on the second substrate stage 4B, and generates the information.
- the section can generate exposure pattern control data based on the information acquired by the acquisition section.
- the acquisition unit acquires at least one of the information on the illuminance of light and the information on the first substrate stage 4A.
- the generation unit can generate exposure pattern control data based on the information acquired by the acquisition unit, so exposure can be performed with higher accuracy.
- the generator includes a memory for storing control data generated during exposure processing of the first substrate 10 .
- control data generated by the generator can be stored in the memory, so that it can be efficiently stored in the memory at an appropriate timing during exposure of the first substrate 10 or before the start of exposure of the second substrate 10 .
- the control data obtained can be transmitted to the exposure unit 20 .
- a transmission section that transmits the control data from the memory to the exposure unit 20 is provided, and the transmission section controls the exposure unit 20 before the exposure unit 20 starts exposing the second substrate 10. Send the data to the exposure unit 20 .
- control data generated by the generator and stored in the memory can be efficiently transmitted to the exposure unit 20 before the exposure of the second substrate 10 is started.
- a drive unit for moving the second substrate stage 4B is provided, and the drive unit moves the second substrate stage 4B to the exposure unit 20 that has received the control data in the scanning exposure of the second substrate 10.
- the second substrate stage 4B that supports 10 is moved.
- the second substrate stage 4B can be driven by the driving section and moved to a position where exposure by the exposure unit 20 is possible. That is, the exposure unit 20 can expose the second substrate 10 on the second substrate stage 4B. In this way, exposure can be performed by alternately switching between the first substrate stage 4A and the second substrate stage 4B at positions where the exposure unit 20 can be exposed.
- the transfer unit that carries out the first substrate 10 from the first substrate stage 4A and carries the third substrate 10 into the first substrate stage 4A from which the first substrate 10 has been carried out; and a measuring device for measuring information about the third substrate 10 on the one-substrate stage 4A, and the generating unit generates control data of an exposure pattern for exposing the third substrate 10 based on the information.
- the transfer section unloads the first substrate 10 on the first substrate stage 4A, carries the third substrate 10 onto the first substrate stage 4A, and carries out the third substrate on the first substrate stage 4A.
- Information about 10 can be measured by a measuring device, and exposure pattern control data can be generated based on the measured information in the generation unit.
- the measurement apparatus includes the second substrate stage 4B that supports the second substrate 10 to be exposed by the exposure unit 20, and the first substrate stage 4B that supports the third substrate 10 to be measured by the measurement apparatus. It is provided apart from the exposure unit 20 so as not to collide with the substrate stage 4A.
- information on the third substrate 10 can be measured by the measuring device on the first substrate stage 4A during the operation of exposing the third substrate 10 on the second substrate stage 4B. Since both operations can be performed in parallel in this way, it is possible to suppress the occurrence of takt delays and eliminate the exposure waiting time.
- the measuring device is installed on the first substrate stage 4A.
- the information of the substrate 10 supported by both the first substrate stage 4A and the second substrate stage 4B can be measured by the measurement devices provided on each of the substrate stages 4A and 4B. Therefore, during the operation of exposing the substrate 10 on one substrate stage 4 , the information on the substrate 10 can be measured by the measuring device on the other substrate stage 4 . Since both operations can be performed in parallel in this way, it is possible to suppress the occurrence of takt delays and eliminate the exposure waiting time.
- the memory includes the first memory for recording the information of the substrate 10 supported by the second substrate stage 4B measured by the measuring device, and the information on the first substrate stage measured by the measuring device. and a second memory for recording information of the substrate 10 supported by 4A.
- control data generated by the generators of the first substrate stage 4A and the second substrate stage 4B are stored in the first memory and the second memory corresponding to the substrate stages 4A and 4B, respectively. Therefore, the control data stored in the memory can be efficiently transmitted to the exposure unit 20 during the exposure of the substrate 10 or at an appropriate timing before the exposure of the substrate 10 is started.
- the transport unit is provided with a transport unit that transports the second substrate 10 from the second substrate stage 4B to the first substrate stage 4A, and a drive unit that moves the first substrate stage 4A. loads the second substrate 10 onto the first substrate stage 4A from which the first substrate 10 was carried out after the control data is generated by the generation unit, and the driving device supports the loaded second substrate 10. 1
- the substrate stage 4A is moved with respect to the exposure unit 20. As shown in FIG.
- the first substrate stage 4A can be driven by the driving device and moved to a position where exposure by the exposure unit 20 is possible. That is, the second substrate 10 on the second substrate stage 4B can be transported onto the first substrate stage 4A by the transport unit, and the exposure unit 20 can expose the second substrate 10 on the first substrate stage 4A. . In this way, the first substrate stage 4A can be placed at a position where exposure can be performed by the exposure unit 20, and exposure can be performed.
- the transport section loads the third substrate 10 onto the second substrate stage 4B from which the second substrate 10 has been carried out, and transfers the information of the third substrate 10 on the second substrate stage 4B.
- a measurement unit is provided for measurement, and the generation unit generates control data regarding the third substrate 10 during exposure processing of the second substrate 10 .
- the information of the third substrate 10 carried into the second substrate stage 4B is measured by the measurement unit, and the information of the measurement unit is measured by the generation unit.
- Control data can be generated based on the information of the third substrate 10 measured in . Since both operations can be performed in parallel in this way, it is possible to suppress the occurrence of takt delays and eliminate the exposure waiting time.
- the generation unit corrects preset exposure data and generates control data.
- the generation unit can perform correction by comparing the set exposure data and the measurement information based on the exposure data set in advance based on the information measured by the measurement unit. High correction can be made.
- a plurality of exposure units 20 are provided, and the light source 61 and the light from the light source 61 are dividedly exposed using a plurality of spatial light modulators 75 .
- the light source 61 and the light from the light source 61 can be dividedly exposed by the plurality of spatial light modulation elements 75 using a plurality of exposure units 20 .
- the substrate stage 4 that supports the first substrate 10 and , a receiving unit for receiving information about a second substrate 10 scanned and exposed by the exposure apparatus 1 after the first substrate 10 is scanned and exposed, which is measured by an apparatus different from the exposure apparatus; and a generator that generates control data for controlling a plurality of elements during scanning exposure of the second substrate 10, and a memory that stores the control data during the exposure processing of the first substrate 10.
- the projection unit projects the image of the image pattern onto the first substrate or the second substrate, and the projection unit projects the image during the scanning exposure of the first substrate or the second substrate. and a position changer for changing the position on the first substrate or the second substrate.
- the position changing unit controls at least one of the substrate stage 4, the substrate stage 4 holding the optical modulator 75, and part of the projection system to change the position.
- the transport unit that unloads the first substrate 10 from the substrate stage 4 and loads the second substrate 10 and the measurement unit that measures the information of the second substrate transported to the substrate stage 4. and has.
- the measurement unit measures marks measured for measuring information on the second substrate 10 by a different device, and acquires information on the second substrate 10 .
- a control unit may be provided that associates identification information for identifying the substrate 10 with information of the second substrate 10 measured by another device or control data. It is possible.
- the substrate 10 can be exposed using the exposure apparatus 1 without waiting for exposure, and the exposed substrate 10 can be developed, thereby efficiently manufacturing devices.
- the work efficiency in exposure can be improved. That is, while the first substrate 10 on one of the substrate stages 4A and 4B (for example, the first substrate stage 4A) is being exposed, the other stage (for example, the second substrate stage 4B) is exposed. Immediately after the exposure of the first substrate 10 is completed, all the operations of unloading the exposed substrate 10, loading the second substrate 10, and alignment operation by the measurement unit/correction data generation/data transmission by the generation unit are performed. , the exposure of the second substrate 10 can be started. Thus, when the exposure apparatus has only one substrate stage 4, the time required from the completion of the exposure of the first substrate to the start of exposure of the next substrate 10 can be reduced. can be done. As a result, in this embodiment, it is possible to eliminate the waiting time for exposure that occurs in the conventional exposure apparatus 1 having only one substrate stage 4 .
- the first substrate stage 4A that has an acquisition section that acquires information about the light from the exposure unit 20.
- second substrate 10 supporting the first substrate 10, supporting the second substrate 10 different from the first substrate 10 on the second substrate stage 4B, and the second substrate 10 based on the information acquired by the acquiring unit. and generating control data for an exposure pattern to be exposed.
- the acquisition unit acquires information about the light of the exposure unit 20 on the second substrate stage 4B, and the generation unit can generate exposure pattern control data based on the information acquired by the acquisition unit. Therefore, the second substrate 10 on the first substrate stage 4A can be exposed based on the exposure pattern generated by the generator.
- the step of supporting the first substrate on a stage a receiving unit receiving information about a second substrate to be scanned and exposed by the exposure device after the first substrate is scanned and exposed, the information being measured by a device different from the exposure device that scans and exposes the substrate; generating control data for controlling the plurality of elements during scanning exposure of the second substrate, based on the information received by; storing the control data in a memory during exposure processing of the first substrate; and a step.
- the steps of exposing the substrate 10 by the exposure method according to any one of (27) to (29) and developing the exposed substrate 10 are included.
- the step of exposing the substrate 10 without the waiting time for exposure and developing the exposed substrate 10 enables efficient manufacturing of the device.
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Abstract
Description
本願は、2021年4月9日に出願された日本国特願2021-066819号に基づき優先権を主張し、その内容をここに援用する。
図1は、本実施形態に係る露光装置の一例を示す斜視図である。露光装置1は、光学系を介して基板10に照明光を照射する装置である。露光装置1は、空間光変調素子75(図2参照)で変調した光を投影光学系(後述する照明・投影モジュール7)に通し、この光による像を感光材料(レジスト)上に結像させて露光するものである。基板10は、表面に例えばレジストを塗布したディスプレイ用のガラス基板である。
一対の基板ステージ4A、4Bは、ベースプレート11上の不図示の案内ガイドに案内され、干渉計53やエンコーダによって基板ステージ4A、4Bの位置を計測、制御し、第1方向X1や第2方向X2へ移動される。このときの基板ステージ4A、4Bの移動機構としては、例えば、エアーにより基板ステージ4を浮上させるとともに磁力によって移動させるリニアモータ方式等を採用することができる。
図3に示すように、露光ユニット20は、光源ユニット6(図1参照)と、光源ユニット6の光源61と光源61からの光とを空間光変調素子75(後述する)を用いて露光するための照明・投影モジュール7と、を備えている。
投影モジュール7Bは、空間光変調素子75に形成されたパターンの像を基板10上に投影、露光、形成するものである。
フォーカス調整部77は、空間光変調素子75の基板10上へ投影する主にフォーカスを調整するための1枚もしくは複数枚のフォーカス調整レンズ771を備えている。
なお、基板ステージ4における第1アライメント系5Aの配置としては、上述したように四隅であることに制限されることはない。例えば、基板10の非線形形状などのプロセス起因で発生する場合には、4箇所×4列など相当数の第1アライメント系5Aが配置される。第1アライメント系5Aは、投影モジュール7Bとは異なるユニットであるため、オフアクシスアライメント系であると言える。
校正用計測系52は、各種複数のモジュールの位置の計測及び校正のために使用される。校正用計測系52は、光学定盤21上に配置された第2アライメント系5Bの校正にも用いられる。
第2アライメント系5Bは、基板ステージ4A、4Bに対する基板10の位置を計測するものである。第2アライメント系5Bは、光学定盤21を厚さ方向に貫通して設けられる第2貫通孔21cに配置されている。第2アライメント系5Bにより、基板ステージ4A、4Bに対する基板10の位置を計測するような構成であれば、第1アライメント系5Aを第1基板ステージ4A及び第2基板ステージ4Bに設ける構成としなくてよい。
第2アライメント系5Bは、第1アライメント系5Aと同様に、基板ステージ4上に基板10が載置された場合に、基板10に関する、第1方向X1の位置,第2方向X2の位置,回転量(θX3),第1方向X1の縮小/拡大倍率,第2方向X2の縮小/拡大倍率,直交度の6つのパラメータ(位置情報)を計測することにより算出することができる。また、第2アライメント系5Bは、基板10全体を計測するたけでなく部分的な領域を計測することで、基板10の変形の非線形成分であったり、予め指定された露光領域(例えば4分割した露光領域)での6つのパラメータ(位置情報)の算出を行ったりすることができる。
また、光学定盤21は、第1方向X1に関して互いに離れて設けられた投影モジュール7Bの間に設けられたアライメント系CE(第2アライメント系5B)を支持する。アライメント系CEは、両端にある第2アライメント系5Bにより基板10上のアライメントマークの計測を行う際に基板ステージ4の位置計測を行う干渉計が、露光位置では露光用の干渉計と切り替えを行う必要があるため、露光位置での基板10、もしくは基板ステージ4の位置を計測するために配置してある。
先ず、図1に示すように、露光装置1に露光するためのレシピが投入されると、露光するためのマスクデータ(パターンデータ、画像データ)がマスクパターンサーバーより選択される。そして、データ制御部は、マスクデータを照明・投影モジュール7の数に分割し、分割したマスクデータから制御データを生成し、メモリに格納する。このとき、空間光変調素子75は、例えば略10kHz程度の更新レートで4Mpixelを更新するため、メモリは大容量の制御データを高速に格納する。データ制御部は、メモリに格納された制御データを、複数の照明・投影モジュール7のそれぞれへ送信する。照明・投影モジュール7は、制御データを受信すると、各種の露光準備を行う。照明・投影モジュール7は、受信したマスクデータを空間光変調素子75へロードする。
すなわち、校正用計測系52は、照明モジュール7A及び投影モジュール7Bの配置と第2アライメント系5Bの位置を計測し、これら照明モジュール7A及び投影モジュール7Bと第2アライメント系5Bとの相対位置関係を算出する。
図2に示すように、第1基板ステージ4Aに設けられている第1アライメント系5Aの位置は、測定部512のカメラの画素を基準に計測する。第1アライメント系5Aは、投影モジュール7Bによって投影された空間光変調素子75の露光パターンを用いて計測する。露光装置1は、計測結果に基づいて、照明モジュール7A及び投影モジュール7Bと第1アライメント系5Aとの相対位置関係を算出する。露光装置1は、第2基板ステージ4Bについても同様に方法により、照明モジュール7A及び投影モジュール7Bと第1アライメント系5Aとの相対位置関係を算出する。露光装置1は、このようにして、照明モジュール7A及び投影モジュール7Bとアライメント系5との相対位置関係を算出する。
図8に示すように、第1基板ステージ4Aは、基板交換部3の第1交換アーム3A(図1参照)を使用して第1基板ステージ4A上に基板10(これを第1基板という)を載置する。その後、アライメント系5は、第1基板10上のアライメントマーク12を計測する(ステップS11)。
なお、第1アライメント系5Aと第2アライメント系5B、さらにアライメント系CE、干渉計乗り換えによる誤差の校正は、ステージマークもしくは基板マークでの校正で行われる。
ここで、露光処理中とは、基板ステージ4が交換位置からアライメント計測位置へ移動する動作、基板10に対する露光動作、基板10に対する露光動作が終了してから基板ステージ4が交換位置へ移動するまでの動作を含めた処理である。なお、露光動作とは、基板10に対する走査露光を行う動作と、走査露光を行う露光領域を変更するために基板ステージ4がX1方向またはX2方向へ移動する動作との何れかの動作である。
図9に示す変形例による露光装置1における露光動作フローでは、第1基板ステージ4Aが露光動作専用に設けられ、第2基板ステージ4Bがアライメント動作及びデータ補正動作の専用に設けられている。そのため、第1アライメント系5Aは、第2基板ステージ4Bにのみ設けられている。変形例によるデータ制御部の構成は、上記の実施形態と同様である。基板ステージ4は、第1基板ステージ4Aの移動可能範囲と、第2基板ステージ4Bの移動可能範囲とが重ならないように配置されていてもよい。
第1基板ステージ4Aでは、時系列で、ステップS31で第1基板10に対して第1露光αが実施され、第1露光αの次にステップS32で第2基板に対して第2露光βが実施され、第2露光βの次にステップS33で第3基板10に対して第3露光γが実施される。
具体的に第2基板ステージ4Bでは、基板交換部3の第1交換アーム3A(図1参照)を使用して第2基板ステージ4B上に第2基板10を載置する。その後、第1アライメント系5Aによって第2基板10のアライメントマーク12を計測する。データ制御部では、第1アライメント系5Aによる計測によって空間光変調素子75を駆動するためのデジタル露光データの補正値(補正データ)を算出する。そして、データ制御部では、得られた補正データをメモリに格納する。
第1基板ステージ4Aは、第2基板10を第2基板ステージ4Bから第1基板ステージ4Aに載せ替えた際に、第2アライメント5Bにより、アライメントマーク12を検出するために移動し、第1基板ステージ4Aに対する第2基板10の位置を把握する。もしくは、第1アライメント5Aは、第1基板ステージ4Aに対する第2基板10の位置を計測し、その位置を把握する。
具体的に第2基板ステージ4Bでは、基板交換部3の第1交換アーム3A(図1参照)を使用して第2基板ステージ4B上に第3基板10を載置する。その後、アライメント系5によって第3基板10のアライメントマーク12を計測する。データ制御部では、アライメント系5による計測によって空間光変調素子75を駆動するためのデジタル露光データの補正値(補正データ)を算出する。そして、データ制御部では、得られた補正データをメモリに格納する。
以下、第1基板ステージ4Aと第2基板ステージ4Bでは、同様の動作が順次繰り返し行われる。
つまり露光処理前の重ね合わせるための(露光装置1とは別の装置である)データ計測機を用いて、計測を行い、計測データと基板を突き合わせて管理することで、今露光を行っている基板とは別のデータ処理をメモリに格納すればよいことになる。この時のデータ計測機と露光装置とは、ほぼ同等の環境(ホルダや基板温度)変化にすることで、基板ステージ4側で補正できない倍率をほぼ変化なく計測することが可能となる。
なお、このデータ計測機と露光機での計測による基板の吸着などによる差は、最終的に重ね合わせ露光した結果から求めてプロセスオフセットとしてデータ補正に入力しておくことも可能である。
Claims (31)
- 画像パターンに応じて複数の素子が制御される光変調器を介して、基板を走査露光する露光装置において、
第1基板を支持する第1ステージと、
前記第1基板とは異なる第2基板を支持する第2ステージと、
前記第2基板の情報を計測する計測部と、
前記情報に基づいて、前記第2基板の走査露光時に前記複数の素子を制御する制御データを、前記第1基板の露光処理中に生成する生成部と、を備える露光装置。 - 前記計測部は、前記第1基板の露光処理中に、前記第2基板の情報を計測する、請求項1に記載の露光装置。
- 前記計測部は、前記光変調器を有する露光ユニットにより露光される前記第1基板を支持する前記第1ステージと、前記計測部により計測される前記第2基板を支持する前記第2ステージと、が衝突しないように、前記光変調器と離れて設けられる、請求項1又は2に記載の露光装置。
- 前記計測部は、前記第2ステージに設置される、請求項1~3のいずれか一項に記載の露光装置。
- 前記第1ステージは、前記第1基板の露光処理中又は露光処理前に、前記光変調器を有する露光ユニットの光に関する情報を取得する取得部を有し、
前記生成部は、前記情報と、前記取得部で取得された情報とに基づき、前記制御データを生成する、請求項1~4のいずれか一項に記載の露光装置。 - 画像パターンに応じて複数の素子が制御される光変調器を有する露光ユニットにより、基板を走査露光する露光装置において、
第1基板を支持する第1ステージと、
前記第1基板とは異なる第2基板を支持する第2ステージと、
前記第2基板の走査露光時に前記複数の素子を制御する制御データを生成する生成部と、を備え、
前記第1ステージは、前記露光ユニットの光に関する情報を取得する取得部を有し、 前記生成部は、前記取得部で取得された情報に基づき、前記制御データを生成する、露光装置。 - 前記生成部は、前記第1基板の露光処理中に、前記制御データを生成する、請求項6に記載の露光装置。
- 前記取得部は、前記第1基板の露光処理中又は露光処理前に、前記光に関する情報を取得する、請求項6又は7に記載の露光装置。
- 前記取得部は、前記光の照度に関する情報と前記第1ステージに関する情報との少なくとも一つを取得する、請求項5~8のいずれか一項に記載の露光装置。
- 前記生成部は、前記第1基板の露光処理中に、生成した前記制御データを格納する、メモリを備える、請求項1~9のいずれか一項に記載の露光装置。
- 前記制御データを前記メモリから前記露光ユニットへ送信する送信部を備え、
前記送信部は、前記露光ユニットによる前記第2基板に対する露光の開始前に、前記露光ユニットに前記制御データを前記露光ユニットへ送信する、請求項10に記載の露光装置。 - 前記第2ステージを移動させる駆動部を備え、
前記駆動部は、前記第2基板に対する走査露光において、前記制御データを受信した前記露光ユニットに対して前記第2基板を支持する前記第2ステージを移動させる、請求項10又は11に記載の露光装置。 - 前記第1基板を前記第1ステージから搬出し、前記第1基板が搬出された前記第1ステージへ第3基板を搬入する搬送部と、
前記第1ステージ上の前記第3基板に関する情報を計測する計測装置と、を備え、
前記生成部は、前記情報に基づいて、前記第3基板を露光する露光パターンの制御データを生成する、請求項12に記載の露光装置。 - 前記計測装置は、前記露光ユニットにより露光される前記第2基板を支持する前記第2ステージと、前記計測装置により計測される前記第3基板を支持する前記第1ステージと、が衝突しないように、前記露光ユニットと離れて設けられる、請求項13に記載の露光装置。
- 前記計測装置は、前記第1ステージに設置される、請求項13又は14に記載の露光装置。
- 前記メモリは、前記計測装置のより計測された前記第2ステージに支持された基板の情報を記録する第1メモリと、前記計測装置で計測された前記第1ステージに支持された基板の情報を記録する第2メモリと、を有する、請求項13~15のいずれか一項に記載の露光装置。
- 前記第2基板を前記第2ステージから前記第1ステージへ搬送する搬送部と、
前記第1ステージを移動させる駆動装置と、を備え、
前記搬送部は、前記制御データが前記生成部により生成された後に、前記第1基板が搬出された前記第1ステージへ前記第2基板を搬入し、
前記駆動装置は、搬入された前記第2基板を支持する前記第1ステージを、前記露光ユニットに対して移動させる、前記請求項10又は11に記載の露光装置。 - 前記搬送部は、前記第2基板が搬出された前記第2ステージへ第3基板を搬入し、
前記第2ステージ上の前記第3基板の情報を計測する計測部が設けられており、
前記生成部は、前記第2基板の露光処理中に、前記第3基板に関する前記制御データを生成する、請求項17に記載の露光装置。 - 前記生成部は、予め設定された露光データを補正し、前記制御データを生成する、請求項1~18のいずれか一項に記載の露光装置。
- 前記露光ユニットは複数設けられ、
光源と前記光源からの光とを複数の空間光変調素子を用いて分割露光する、請求項1~19のいずれか一項に記載の露光装置。 - 画像パターンに応じて複数の素子が制御される光変調器を介して、基板を走査露光する露光装置において、
第1基板を支持するステージと、
前記露光装置とは異なる装置で計測された、前記第1基板に対する走査露光の後に前記露光装置により走査露光される第2基板の情報を受信する受信部と、
前記受信部により受信した前記情報に基づいて、前記第2基板の走査露光時に前記複数の素子を制御する制御データを生成する生成部と、
前記制御データを、前記第1基板の露光処理中に格納するメモリと、を備える露光装置。 - 前記画像パターンの像を前記第1基板または前記第2基板に投影する投影部と、
前記第1基板または前記第2基板の走査露光時に、前記投影部により前記像が投影される前記第1基板または前記第2基板上の位置を変更する位置変更部と、を備え、
前記位置変更部は、前記ステージ、前記光変調器を保持するステージ、投影系の一部のうち少なくとも1つを制御し、前記位置を変更する、請求項21に記載の露光装置。 - 前記ステージから前記第1基板を搬出し、前記第2基板を搬入する搬送部と、
前記ステージに搬送された前記第2基板の情報を計測する計測部と、を備え、
前記計測部は、前記異なる装置で前記第2基板の情報を計測するために計測されたマークを、を計測し、前記第2基板の情報を取得する、請求項21又は22に記載の露光装置。 - 前記基板を識別するための識別情報と、別の装置で計測された前記第2基板の情報、もしくは前記制御データと、を紐付けする制御部を備える、請求項21~23のいずれか1項に記載の露光装置。
- 請求項1~24のいずれか一項に記載の露光装置を用いて前記基板を露光するステップと、
露光された前記基板を現像するステップと、を含むデバイス製造方法。 - 請求項1~24のいずれか一項に記載の露光装置を用いてフラットパネルディスプレイ用の基板を露光するステップと、
露光された前記基板を現像するステップと、を含むフラットパネルディスプレイの製造方法。 - 画像パターンに応じて複数の素子が制御される光変調器を介して、基板を走査露光する露光方法において、
第1ステージに第1基板を支持するステップと、
第2ステージに前記第1基板とは異なる第2基板を支持するステップと、
前記第2基板の情報を計測するステップと、
前記情報に基づいて、前記第2基板の走査露光時に前記複数の素子を制御する制御データを、前記第1基板の露光処理中に生成するステップと、
を有する、露光方法。 - 画像パターンに応じて複数の素子が制御される光変調器を介して、基板を走査露光する露光装置において、
前記光変調器を有する露光ユニットの光に関する情報を取得する取得部を有する第1ステージに、第1基板を支持するステップと、
第2ステージに前記第1基板とは異なる第2基板を支持するステップと、
前記取得部で取得された情報に基づき、前記第2基板を露光する露光パターンの制御データを生成するステップと、
を有する、露光方法。 - 画像パターンに応じて複数の素子が制御される光変調器を介して、基板を走査露光する露光方法において、
ステージに第1基板を支持するステップと、
前記基板を走査露光する露光装置とは異なる装置で計測された、前記第1基板に対する走査露光の後に前記露光装置により走査露光される第2基板の情報を受信部で受信するステップと、
前記受信部により受信した前記情報に基づいて、前記第2基板の走査露光時に前記複数の素子を制御する制御データを生成するステップと、
前記制御データを、前記第1基板の露光処理中にメモリに格納するステップと、
を有する、露光方法。 - 請求項27から29のいずれか1項に記載の露光方法により前記基板を露光するステップと、
露光された前記基板を現像するステップと、を含むデバイス製造方法。 - 請求項27から29のいずれか1項に記載の露光方法によりフラットパネルディスプレイ用の基板を露光するステップと、
露光された前記基板を現像するステップと、を含むフラットパネルディスプレイの製造方法。
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JPH10163099A (ja) * | 1996-11-28 | 1998-06-19 | Nikon Corp | 露光方法及び露光装置 |
JP2008191303A (ja) * | 2007-02-02 | 2008-08-21 | Fujifilm Corp | 描画装置及び方法 |
JP2019105854A (ja) * | 2017-02-03 | 2019-06-27 | エーエスエムエル ネザーランズ ビー.ブイ. | 露光装置 |
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JPH08313842A (ja) * | 1995-05-15 | 1996-11-29 | Nikon Corp | 照明光学系および該光学系を備えた露光装置 |
JPH10163099A (ja) * | 1996-11-28 | 1998-06-19 | Nikon Corp | 露光方法及び露光装置 |
JP2008191303A (ja) * | 2007-02-02 | 2008-08-21 | Fujifilm Corp | 描画装置及び方法 |
JP2019105854A (ja) * | 2017-02-03 | 2019-06-27 | エーエスエムエル ネザーランズ ビー.ブイ. | 露光装置 |
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