WO2022122989A1 - Silber-bismut-elektrolyt zur abscheidung von hartsilberschichten - Google Patents
Silber-bismut-elektrolyt zur abscheidung von hartsilberschichten Download PDFInfo
- Publication number
- WO2022122989A1 WO2022122989A1 PCT/EP2021/085127 EP2021085127W WO2022122989A1 WO 2022122989 A1 WO2022122989 A1 WO 2022122989A1 EP 2021085127 W EP2021085127 W EP 2021085127W WO 2022122989 A1 WO2022122989 A1 WO 2022122989A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silver
- bismuth
- electrolyte
- iii
- soluble
- Prior art date
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- 239000003792 electrolyte Substances 0.000 title claims abstract description 70
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 36
- 239000004332 silver Substances 0.000 title claims abstract description 36
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 34
- CCXYPVYRAOXCHB-UHFFFAOYSA-N bismuth silver Chemical compound [Ag].[Bi] CCXYPVYRAOXCHB-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 16
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 11
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910001152 Bi alloy Inorganic materials 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims description 30
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- -1 silver hydantoins Chemical class 0.000 claims description 10
- 239000000080 wetting agent Substances 0.000 claims description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 239000007859 condensation product Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 150000007513 acids Chemical class 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- PPNKDDZCLDMRHS-UHFFFAOYSA-N bismuth(III) nitrate Inorganic materials [Bi+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PPNKDDZCLDMRHS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012990 dithiocarbamate Substances 0.000 claims description 4
- 150000004659 dithiocarbamates Chemical class 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 4
- 229940098221 silver cyanide Drugs 0.000 claims description 4
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 150000001622 bismuth compounds Chemical class 0.000 claims description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 3
- 229940100890 silver compound Drugs 0.000 claims description 3
- 150000003379 silver compounds Chemical class 0.000 claims description 3
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 3
- MSBGPEACXKBQSX-UHFFFAOYSA-N (4-fluorophenyl) carbonochloridate Chemical compound FC1=CC=C(OC(Cl)=O)C=C1 MSBGPEACXKBQSX-UHFFFAOYSA-N 0.000 claims description 2
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims description 2
- JKFYKCYQEWQPTM-UHFFFAOYSA-N 2-azaniumyl-2-(4-fluorophenyl)acetate Chemical compound OC(=O)C(N)C1=CC=C(F)C=C1 JKFYKCYQEWQPTM-UHFFFAOYSA-N 0.000 claims description 2
- RYKLZUPYJFFNRR-UHFFFAOYSA-N 3-hydroxypiperidin-2-one Chemical compound OC1CCCNC1=O RYKLZUPYJFFNRR-UHFFFAOYSA-N 0.000 claims description 2
- ZSILVJLXKHGNPL-UHFFFAOYSA-L S(=S)(=O)([O-])[O-].[Ag+2] Chemical compound S(=S)(=O)([O-])[O-].[Ag+2] ZSILVJLXKHGNPL-UHFFFAOYSA-L 0.000 claims description 2
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 2
- 229910021612 Silver iodide Inorganic materials 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims description 2
- SULICOHAQXOMED-UHFFFAOYSA-H bis(5,6-dihydroxy-4,7-dioxo-1,3,2-dioxabismepan-2-yl) 2,3-dihydroxybutanedioate Chemical compound [Bi+3].[Bi+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SULICOHAQXOMED-UHFFFAOYSA-H 0.000 claims description 2
- ANERHPOLUMFRDC-UHFFFAOYSA-K bismuth citrate Chemical compound [Bi+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O ANERHPOLUMFRDC-UHFFFAOYSA-K 0.000 claims description 2
- TXKAQZRUJUNDHI-UHFFFAOYSA-K bismuth tribromide Chemical compound Br[Bi](Br)Br TXKAQZRUJUNDHI-UHFFFAOYSA-K 0.000 claims description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims description 2
- QSBNOZODKXUXSP-UHFFFAOYSA-K bismuth;azane;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound N.[Bi+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QSBNOZODKXUXSP-UHFFFAOYSA-K 0.000 claims description 2
- MNMKEULGSNUTIA-UHFFFAOYSA-K bismuth;methanesulfonate Chemical compound [Bi+3].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O MNMKEULGSNUTIA-UHFFFAOYSA-K 0.000 claims description 2
- IAQAJTTVJUUIQJ-UHFFFAOYSA-N bismuth;trihydrate Chemical compound O.O.O.[Bi] IAQAJTTVJUUIQJ-UHFFFAOYSA-N 0.000 claims description 2
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 claims description 2
- 229910001958 silver carbonate Inorganic materials 0.000 claims description 2
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims description 2
- 229940096017 silver fluoride Drugs 0.000 claims description 2
- 229940045105 silver iodide Drugs 0.000 claims description 2
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 2
- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 claims description 2
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 2
- 229910001923 silver oxide Inorganic materials 0.000 claims description 2
- FJOLTQXXWSRAIX-UHFFFAOYSA-K silver phosphate Chemical compound [Ag+].[Ag+].[Ag+].[O-]P([O-])([O-])=O FJOLTQXXWSRAIX-UHFFFAOYSA-K 0.000 claims description 2
- 229910000161 silver phosphate Inorganic materials 0.000 claims description 2
- 229940019931 silver phosphate Drugs 0.000 claims description 2
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 claims description 2
- 229910000367 silver sulfate Inorganic materials 0.000 claims description 2
- RHUVFRWZKMEWNS-UHFFFAOYSA-M silver thiocyanate Chemical compound [Ag+].[S-]C#N RHUVFRWZKMEWNS-UHFFFAOYSA-M 0.000 claims description 2
- LMEWRZSPCQHBOB-UHFFFAOYSA-M silver;2-hydroxypropanoate Chemical compound [Ag+].CC(O)C([O-])=O LMEWRZSPCQHBOB-UHFFFAOYSA-M 0.000 claims description 2
- 238000005496 tempering Methods 0.000 claims description 2
- VPKAOUKDMHJLAY-UHFFFAOYSA-J tetrasilver;phosphonato phosphate Chemical compound [Ag+].[Ag+].[Ag+].[Ag+].[O-]P([O-])(=O)OP([O-])([O-])=O VPKAOUKDMHJLAY-UHFFFAOYSA-J 0.000 claims description 2
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- KOECRLKKXSXCPB-UHFFFAOYSA-K triiodobismuthane Chemical compound I[Bi](I)I KOECRLKKXSXCPB-UHFFFAOYSA-K 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 20
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- LGFYIAWZICUNLK-UHFFFAOYSA-N antimony silver Chemical compound [Ag].[Sb] LGFYIAWZICUNLK-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N sarcosine Chemical compound C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 4
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 4
- TXTQARDVRPFFHL-UHFFFAOYSA-N [Sb].[H][H] Chemical compound [Sb].[H][H] TXTQARDVRPFFHL-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- FJPGAMCQJNLTJC-UHFFFAOYSA-N 2,3-Heptanedione Chemical compound CCCCC(=O)C(C)=O FJPGAMCQJNLTJC-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- KVFQMAZOBTXCAZ-UHFFFAOYSA-N 3,4-Hexanedione Chemical compound CCC(=O)C(=O)CC KVFQMAZOBTXCAZ-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- BACYUWVYYTXETD-UHFFFAOYSA-N N-Lauroylsarcosine Chemical compound CCCCCCCCCCCC(=O)N(C)CC(O)=O BACYUWVYYTXETD-UHFFFAOYSA-N 0.000 description 2
- 108010077895 Sarcosine Proteins 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910002065 alloy metal Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 235000015165 citric acid Nutrition 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000004870 electrical engineering Methods 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- ILPNRWUGFSPGAA-UHFFFAOYSA-N heptane-2,4-dione Chemical compound CCCC(=O)CC(C)=O ILPNRWUGFSPGAA-UHFFFAOYSA-N 0.000 description 2
- MWVFCEVNXHTDNF-UHFFFAOYSA-N hexane-2,3-dione Chemical compound CCCC(=O)C(C)=O MWVFCEVNXHTDNF-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- XTEGVFVZDVNBPF-UHFFFAOYSA-N naphthalene-1,5-disulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1S(O)(=O)=O XTEGVFVZDVNBPF-UHFFFAOYSA-N 0.000 description 2
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
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- VAIFYHGFLAPCON-UHFFFAOYSA-N 1,3-Diacetylpropane Chemical compound CC(=O)CCCC(C)=O VAIFYHGFLAPCON-UHFFFAOYSA-N 0.000 description 1
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- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
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- 229910005569 NiB Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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- 229920002873 Polyethylenimine Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- HJPBEXZMTWFZHY-UHFFFAOYSA-N [Ti].[Ru].[Ir] Chemical compound [Ti].[Ru].[Ir] HJPBEXZMTWFZHY-UHFFFAOYSA-N 0.000 description 1
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- 238000013019 agitation Methods 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
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- 125000000217 alkyl group Chemical group 0.000 description 1
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- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
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- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
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- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 125000005228 aryl sulfonate group Chemical group 0.000 description 1
- MIAUJDCQDVWHEV-UHFFFAOYSA-N benzene-1,2-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1S(O)(=O)=O MIAUJDCQDVWHEV-UHFFFAOYSA-N 0.000 description 1
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- OATNQHYJXLHTEW-UHFFFAOYSA-N benzene-1,4-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=C(S(O)(=O)=O)C=C1 OATNQHYJXLHTEW-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
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- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 1
- JDIBGQFKXXXXPN-UHFFFAOYSA-N bismuth(3+) Chemical compound [Bi+3] JDIBGQFKXXXXPN-UHFFFAOYSA-N 0.000 description 1
- BRCWHGIUHLWZBK-UHFFFAOYSA-K bismuth;trifluoride Chemical compound F[Bi](F)F BRCWHGIUHLWZBK-UHFFFAOYSA-K 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 1
- 229920001436 collagen Polymers 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000002484 cyclic voltammetry Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229940116901 diethyldithiocarbamate Drugs 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- YGSZNSDQUQYJCY-UHFFFAOYSA-L disodium;naphthalene-1,5-disulfonate Chemical compound [Na+].[Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1S([O-])(=O)=O YGSZNSDQUQYJCY-UHFFFAOYSA-L 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 150000002332 glycine derivatives Chemical class 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- NPEWZDADCAZMNF-UHFFFAOYSA-N gold iron Chemical compound [Fe].[Au] NPEWZDADCAZMNF-UHFFFAOYSA-N 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- DGCTVLNZTFDPDJ-UHFFFAOYSA-N heptane-3,5-dione Chemical compound CCC(=O)CC(=O)CC DGCTVLNZTFDPDJ-UHFFFAOYSA-N 0.000 description 1
- NDOGLIPWGGRQCO-UHFFFAOYSA-N hexane-2,4-dione Chemical compound CCC(=O)CC(C)=O NDOGLIPWGGRQCO-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- CJTCBBYSPFAVFL-UHFFFAOYSA-N iridium ruthenium Chemical compound [Ru].[Ir] CJTCBBYSPFAVFL-UHFFFAOYSA-N 0.000 description 1
- ULFQGKXWKFZMLH-UHFFFAOYSA-N iridium tantalum Chemical compound [Ta].[Ir] ULFQGKXWKFZMLH-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 description 1
- KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- OKPOXDDOJSVKKG-UHFFFAOYSA-M potassium N-phenylcarbamodithioate Chemical compound C1(=CC=CC=C1)NC([S-])=S.[K+] OKPOXDDOJSVKKG-UHFFFAOYSA-M 0.000 description 1
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229940043230 sarcosine Drugs 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Definitions
- the present invention relates to an electrolyte for the deposition of hard silver layers, the element bismuth being alloyed with the silver. Also addressed is a method for depositing a corresponding silver-bismuth alloy from an electrolyte according to the invention and a correspondingly deposited layer.
- Electrical contacts are installed in practically all electrical devices today. Their application ranges from simple connectors to safety-relevant, demanding switching contacts in the communications sector, for the automotive industry or aerospace technology. Good electrical conductivity, low and long-term stable contact resistance, good corrosion and wear resistance with the lowest possible insertion forces and good resistance to thermal stress are required from the contact surfaces.
- plug contacts are often coated with a hard gold alloy layer consisting of gold-cobalt, gold-nickel or gold-iron. These layers have good wear resistance, good solderability, low and long-term stable contact resistance and good corrosion resistance. Due to the rising price of gold, cheaper alternatives are being sought.
- silver-rich silver alloys (hard silver) has proven advantageous as a replacement for hard gold coating. Also because of the high electrical conductivity and good oxidation resistance, silver and silver alloys are among the most important contact materials in electrical engineering. Depending on the metal that is alloyed, these silver alloy layers have similar layer properties to the previously used hard gold layers or layer combinations such as palladium-nickel with gold flash. In addition, the price of silver is relatively low compared to other precious metals, especially hard gold alloys.
- Silver-antimony electrolytes are mainly used in industry to deposit hard silver layers.
- the deposited antimony-alloyed hard silver layers have a hardness of approx. 160 - 180 HV in the deposited state.
- the permanent hardness after temperature exposure of up to 1000 hours at 150°C is approx. 120 HV.
- the requirements for temperature resistance are constantly increasing.
- the electrical properties must also be taken into account.
- Pure silver is characterized by very low contact resistance values.
- the contact resistance of the silver alloy layers must not increase too much due to the addition of the second metal and the resulting increase in hardness.
- the target value is a maximum contact resistance of 10 mOhm with a contact force of 50 cN.
- Silver-antimony coatings with a maximum of 3% antimony meet this requirement.
- the permanent hardness is limited to values of max. 120-140 HV.
- the antimony(III) used in the electrolyte is anodically converted to its pentavalent oxidation state during operation and is therefore no longer effective as a hardener.
- the service life of the electrolytes is therefore limited and processing is made more difficult, since a high level of analytical work is required to determine the antimony(III) content.
- JPH11279787A describes silver and silver alloy deposits with Sn, Bi, Zn, In, Cu, Sb, Ti, Fe, Ni or Co as alloy partners using aminothiophenol compounds, also in the strongly acidic pH range. Again, there are problems with strongly acidic electrolytes when coating copper or copper alloy substrates.
- DE2731595B1 describes the use of a brightener combination of ketone-carbon disulfide condensation products in cyanide silver baths. However, alloying with bismuth is not mentioned here.
- Electroplating baths are solutions containing metal salts from which metal deposits (coatings) can be electrochemically deposited onto substrates (objects). Such galvanic baths are often also referred to as “electrolytes”. Accordingly, the aqueous galvanic baths are referred to below as “electrolytes”.
- an aqueous electrolyte for the electrolytic deposition of silver-bismuth alloys on conductive substrates which has the following features:
- a soluble cyanide in particular potassium cyanide
- a soluble brightener additive A which is a reaction product of ketones or dithiocarbamates with carbon disulfide
- Another soluble brightener B selected from the Group of condensation products of arylsulfonic acids with formaldehyde;
- the silver is provided in the electrolyte according to the invention via correspondingly soluble silver salts.
- These are preferably those selected from silver methanesulfonate, silver carbonate, silver phosphate, silver pyrophosphate, silver nitrate, silver oxide, silver lactate, silver fluoride, silver bromide, silver chloride, silver iodide, silver thiocyanate, silver thiosulfate, silver hydantoins, silver sulfate, silver cyanide and alkali silver cyanide. Potassium silver cyanide is very preferred.
- the person skilled in the art can specifically select the amount of silver for his application purposes. As a rule, the silver concentration based on the metal is 0.5 - 200g/l.
- this value is 1-100 g/l and very particularly preferably 10-50 g/l.
- the silver can also get into the electrolyte in the form of a soluble anode containing silver (Praktician Galvanotechnik, 5th edition, Eugen G. Leuze Verlag, p. 342f, 1997).
- the second alloying metal in the electrolyte according to the invention is bismuth.
- the bismuth is preferably in the oxidation state (III).
- advantageous compounds are those selected from bismuth(III) oxide, bismuth(III) hydroxide, bismuth(III) fluoride, bismuth(III) chloride, bismuth(III) bromide, bis- mut(III) iodide, bismuth(III) methanesulfonate, bismuth(III) nitrate, bismuth(III) tartrate, bismuth(III) citrate, in particular ammonium bismuth citrate.
- the amount of the metal can be selected by the person skilled in the art, but is usually 0.1 - 50 g/l based on the Metal. In a preferred embodiment, this value is 0.5-10 g/l and very particularly preferably 1-5 g/l.
- cyanides in the electrolyte according to the invention. These are used in the form of soluble compounds. The person skilled in the art knows which compounds are suitable for the present purpose. Sodium cyanide and, in particular, potassium cyanide are preferably used in the present case. This also serves as a conducting salt. It is used in an amount of 5-200 g/l, preferably 10-100 g/l and very preferably 20-80 g/l.
- the electrolyte contains certain organic compounds that have one or more carboxylic acid groups.
- these are di-, tri- or tetracarboxylic acids.
- these are well known to those skilled in the art for the present purpose and can be found, for example, in the literature (Beyer-Walter, Textbook of Organic Chemistry, 22nd edition, S. Hirzel-Verlag, p. 324 et seq.).
- acids selected from the group consisting of oxalic acid, citric acid, tartaric acid, succinic acid, maleic acid, glutaric acid, adipic acid, malonic acid and malic acid.
- Oxalic acid, malonic acid, citric acid and tartaric acid are extremely preferred.
- the acids are naturally present in their anionic form in the electrolyte at the pH value to be set.
- the carboxylic acids mentioned here are added to the electrolyte in a concentration of 0.05-2 moles per liter, preferably 0.1-1 mole per liter and very particularly preferably between 0.2-0.5 mole per liter.
- Reaction products of carbon disulfide and ketones or dithiocarbamates are used as brightener additive A in the electrolyte according to the invention.
- the specialist knows which products come into question here. These are described, for example, in patents DE885036C, DE2731595B1 or DE959775C.
- ketones to be used are preferably those selected from the group consisting of propanone, 2-butanone, 2-pentanone, 3-pentanone, 2,3-hexanedione, 2,4-hexanedione, 2,5- hexanedione, 3,4-hexanedione, 2-heptanone, 3-heptanone, 4-heptanone, 2,3-heptanedione, 2,4-heptanedione, 2,5-heptanedione, 2,4-heptanedione, 3,5-heptanedione, 2,6-heptanedione, acetophenone.
- the dithiocarbamates to be used in the present case are preferably those selected from the group consisting of alkali metal diethyldithiocarbamate, alkali metal phenyldithiocarbamate. These reaction products are used in the electrolyte in an amount of >0-5000 mg/l, preferably 1-500 mg/l and very particularly preferably 5-200 mg/l.
- Brightener B which is also used in the electrolyte, is a condensation product of one or more aryl sulfonic acids and formaldehyde.
- Such polymers are known to those skilled in the art.
- DE2731595B1 these are used together with the above-mentioned condensation products of ketones and carbon disulfide in silver deposition.
- 1-Naphthalenesulfonic acid and 2-naphthalenesulfonic acid are particularly preferably used in this connection.
- arylsulfonic acids can also be used for this purpose and are available to those skilled in the art, such as phenolsulfonic acid, benzenesulfonic acid, 1,2-benzenedisulfonic acid, 1,3-benzenedisulfonic acid, 1,4-benzenedisulfonic acid, 1,5-naphthalenedisulfonic acid, pyridine-3-sulfonic acid .
- This brightening additive B is used in a concentration of >0-5000 mg/l, more preferably 5-2500 mg/l and very preferably 100-1000 mg/l in the electrolyte according to the invention.
- anionic and nonionic surfactants can also be used as wetting agents in the present electrolyte, such as polyethylene glycol adducts, fatty alcohol sulfates, alkyl sulfates, alkylsulfonates, arylsulfonates, alkylarylsulfonates, heteroaryl sulfates, betaines, fluorosurfactants and their salts and derivatives (see also: Kanani, N: Galvanotechnik; Hanser Verlag, Kunststoff Vienna, 2000; page 84 ff).
- Wetting agents also include, for example, substituted glycine derivatives commercially known as Hamposyl®.
- Hamposyl® are N-acyl sarcosinates, ie condensation products of fatty acid acyl residues and N-methylglycine (sarcosine). Silver coatings deposited from these baths are white and lustrous to high gloss.
- the wetting agents lead to a pore-free layer.
- Further advantageous wetting agents are those selected from the following group: nonionic wetting agents such as, for example, beta-naphtholethoxylate potassium salt, fatty alcohol polyglycol ethers, polyethylene imines, polyethylene glycols and mixtures thereof. Wetting agents with a molecular weight below 2000 g/mol are particularly advantageous.
- anionic wetting agents such as N-dodecanoyl-N-methylglycine, (N-lauroylsarcosine) Na salt, alkyl collagen hydrolyzate, 2-ethylhexyl sulfate Na salt, lauryl ether sulfate Na salt, 1-naphthalenesulfonic acid Na salt, 1,5- naphthalenedisulfonic acid sodium salt and mixtures thereof, cationic wetting agents such as 1 H-imidazolium-1-ethenyl (or 3-methyl), methyl sulfate homopolymers
- the electrolyte according to the invention is used in a basic pH range. Optimum results can be achieved at pH values in the electrolyte of 10 - 14. Those skilled in the art know how to adjust the pH of the electrolyte. This is preferably in the strongly basic range, more preferably >11. It is extremely advantageous to choose extremely basic deposition conditions, in which the pH is above 12 and can even reach up to 13, in borderline cases even up to 14.
- the pH can be adjusted as required by a person skilled in the art. However, he will be guided by the idea of introducing as few additional substances into the electrolyte as possible that could adversely affect the deposition of the alloy in question.
- the pH is therefore adjusted solely by adding a base. All compounds which are suitable for a corresponding application can serve as the base for the person skilled in the art. He preferably uses alkali metal hydroxides for this purpose, in particular potassium hydroxide.
- a further object of the present invention is a method for the electrolytic deposition of silver alloy coatings from an electrolyte as just described.
- an electrically conductive substrate is immersed in the electrolyte according to the invention and between an anode in contact with the electrolyte and the substrate as cathode established a current flow.
- the temperature prevailing during the deposition of the silver and silver alloy coatings can be chosen at will by those skilled in the art. He will be guided by a sufficient deposition rate and the applicable current density range on the one hand and on economic aspects and the stability of the electrolyte on the other. It is advantageous to set a temperature of 20°C to 90°C, preferably 25°C to 65°C and particularly preferably 30°C to 50°C.
- the current density that is established between the cathode and the anode during the deposition process in the electrolyte according to the invention can be selected by the person skilled in the art according to the efficiency and quality of the deposition.
- the current density in the electrolyte is advantageously set to 0.2 to 150 A/dm 2 depending on the application and the type of coating system. If necessary, the current densities can Adjusting the system parameters such as the structure of the coating cell, flow rates, anode and cathode conditions, etc. can be increased or decreased.
- a current density of 0.2-100 A/dm 2 , preferably 0.2-50 A/dm 2 and very particularly preferably 0.5-30 A/dm 2 is advantageous.
- low, medium and high current density ranges are defined as follows:
- High current density range greater than 5 A/dm 2 .
- the electrolyte according to the invention and the method according to the invention can be used for the electrolytic deposition of silver-bismuth coatings for technical applications, for example electrical plug connections and printed circuit boards, and for decorative applications such as jewelry and watches.
- the electrolyte according to the invention is of an alkaline type. There may be fluctuations in the pH of the electrolyte during electrolysis. In a preferred embodiment of the present method, the person skilled in the art therefore proceeds in such a way that he monitors the pH value during the electrolysis and, if necessary, adjusts it to the desired value. Potassium hydroxide is advantageously used to adjust the pH.
- anodes can be used when using the electrolyte. Soluble or insoluble anodes are just as suitable as the combination of soluble and insoluble anodes. If a soluble anode is used, it is particularly preferred if a silver anode or a silver bismuth anode or a bismuth anode is used (DE1228887, Practical Galvanotechnik, 5th edition, Eugen G. Leuze Verlag, p. 342f, 1997).
- the insoluble anodes used are preferably those made from a material selected from the group consisting of platinized titanium, graphite, mixed metal oxides, glassy carbon anodes and special carbon material (“Diamond Like Carbon” DLC) or combinations of these anodes.
- Insoluble anodes made of platinized titanium or titanium coated with mixed metal oxides are advantageous, the mixed metal oxides are preferably selected from iridium oxide, ruthenium oxide, tantalum oxide and mixtures thereof.
- Iridium-transition metal oxide mixed oxide anodes particularly preferably mixed oxide anodes made from iridium-ruthenium mixed oxide, iridium-ruthenium-titanium mixed oxide or iridium-tantalum mixed oxide, are also advantageously used to carry out the invention. More can be found at Cobley, AJ et al. (The use of insoluble anodes in Acid Sulphate Copper Electrodeposition Solutions, Trans IMF, 2001, 79(3), pp. 113 and 114).
- thin layer thicknesses in the range from 0.1 to 0.3 ⁇ m of silver alloy are used, for example for the coating of plastic caps in rack operation.
- low current densities in the range from 0.25 to 0.75 A/dm 2 are used.
- Another application of low current densities is in drum or vibration technology, for example when coating contact pins.
- 0.5 to 3 ⁇ m of silver alloy are applied in the current density range of 0.25 to 0.75 A/dm 2 .
- Layer thicknesses in the range from 1 to 10 ⁇ m are typically deposited in rack operation for technical and decorative applications with current densities in the range from 1 to 5 A/dm 2 . For technical applications, a layer thickness of up to 25 ⁇ m is sometimes deposited.
- layers are deposited over a relatively large range from about 0.5 to about 5 ⁇ m with the highest possible deposition speeds and thus the highest possible current densities of between 5 and 50 A/dm 2 .
- relatively high layer thicknesses of a few 10 ⁇ m to a few millimeters are deposited, for example in the case of electroforming.
- Pulsed direct current can also be used instead of direct current.
- the current flow is interrupted for a certain period of time (pulse plating).
- pulse plating With reverse pulse plating, the polarity of the electrodes is reversed so that the coating is partially anodicly detached. In this way, the layer structure is controlled in constant alternation with cathodic pulses.
- simple pulse conditions such as 1 s current flow (ton) and 0.5 s pulse pause (totr) at medium current densities led to homogeneous, shiny and white coatings.
- the subject matter of the present invention is also a silver-bismuth alloy layer with a thickness of 0.1-50 ⁇ m produced by the method according to the invention with a hardness of >200 HV after tempering the coating at 150° C. for 1000 h.
- An upper limit of the hardness lies in the technically available hardness metal layer. It can be as high as 350 HV or even more preferably as high as 400 HV ( Figure 1).
- the preferred thickness of the layer according to the invention is in the ranges specified above, preferably 0.5-30 ⁇ m and very preferably 1-5 ⁇ m.
- the alloy layer according to the invention is preferably deposited on a nickel or nickel alloy layer or a copper or copper alloy layer.
- Suitable substrate materials that are used to advantage here are copper-based materials such as pure copper, brass, bronze (e.g. CuSn, CuSnZn) or special copper alloys for connectors such as alloys with silicon, beryllium, tellurium, phosphorus or iron-based materials such as iron or stainless steel or nickel or a nickel alloy such as NiP, NiW.NiB, gold or silver.
- the substrate materials can also be multi-layer systems that have been coated galvanically or with another coating technique. This applies, for example, to iron materials that have been nickel- or copper-plated and then optionally gold-plated or coated with pre-silver.
- Another substrate material is a wax core that has been pre-coated with conductive silver lacquer (electroforming).
- the present electrolyte produces a shiny, silvery-looking deposit.
- the deposited alloy metal layer advantageously has an L* value greater than +97.
- the a* value is preferably -0.2 to 0.2 and the b* value is between +2 and +4 according to the Cielab color system (EN ISO 11664-4 - latest version on the filing date). The values were determined with a Konica-Minolta CM-700d.
- the electrolyte according to the invention is stable over the long term. Coatings suitable for the application described could be obtained by combining the brightening additives described for the deposition of silver and the alloying of silver with bismuth. These have sufficiently low contact resistances and, moreover, retain a surprisingly high degree of hardness even after exposure to heat. This was not to be expected from the available state of the art. Examples:
- 1 liter of the electrolyte mentioned in the respective exemplary embodiment is heated to the temperature stated in the exemplary embodiment using a magnetic stirrer while stirring with a 60 mm long cylindrical magnetic stirring rod at at least 200 rpm. This agitation and temperature is also maintained during coating.
- Silver plates or mixed metal oxide-coated titanium serve as anodes.
- a mechanically polished brass sheet with an area of at least 0.2 dm 2 serves as the cathode. This can be coated beforehand with at least 5 ⁇ m of nickel from an electrolyte, which produces high-gloss layers. A gold layer approximately 0.1 ⁇ m thick can also be deposited on the nickel layer.
- the cathode is positioned in the electrolyte between the anodes and moved parallel to them at at least 5 cm/second. The distance between anode and cathode should not change.
- the cathode is coated by applying a direct electric current between the anode and cathode.
- the amperage is chosen so that at least 0.5 A/dm 2 is reached on the surface. Higher current densities can be selected if the electrolyte mentioned in the application example is intended to be used to produce layers that can be used for technical and decorative purposes.
- the duration of the current flow is chosen so that at least a layer thickness of 0.5 to 1 ⁇ m is achieved on average over the area. Higher layer thicknesses can be produced if the electrolyte mentioned in the application example is intended to produce layers with a quality that can be used for technical and decorative purposes.
- the cathode is removed from the electrolyte and rinsed with deionized water. The cathodes can be dried by compressed air, warm air or centrifugation.
- the area of the cathode, the magnitude and duration of the applied current, and the weight of the cathode before and after deposition are documented and used to determine the average film thickness and deposition efficiency.
- DE2731595 b) reaction product of 2,5-hexanedione with carbon disulfide corresponding to DE2731595 c) reaction product of potassium phenyldithiocarbamate with carbon disulfide corresponding to DE959775 d) naphthalenesulfonic acid-formaldehyde condensation product corresponding to DE2731595 Coatings obtained from an electrolyte according to Example No. 3 (Table 1) were coated at 150° C for 100 and 500 hours and then the hardness values determined. The results are shown in FIG.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2023535548A JP2023553958A (ja) | 2020-12-11 | 2021-12-10 | 硬質銀層の堆積のための銀-ビスマス電解液 |
US18/256,321 US20240035184A1 (en) | 2020-12-11 | 2021-12-10 | Silver-Bismuth Electrolyte for Separating Hard Silver Layers |
KR1020237023357A KR20230121097A (ko) | 2020-12-11 | 2021-12-10 | 경질 은 층의 침착을 위한 은-비스무트 전해질 |
CN202180082618.5A CN116601338A (zh) | 2020-12-11 | 2021-12-10 | 用于沉积硬银层的银-铋电解液 |
EP21836441.2A EP4259856A1 (de) | 2020-12-11 | 2021-12-10 | Silber-bismut-elektrolyt zur abscheidung von hartsilberschichten |
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DE102020133188.6A DE102020133188A1 (de) | 2020-12-11 | 2020-12-11 | Silber-Bismut-Elektrolyt zur Abscheidung von Hartsilberschichten |
DE102020133188.6 | 2020-12-11 |
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PCT/EP2021/085127 WO2022122989A1 (de) | 2020-12-11 | 2021-12-10 | Silber-bismut-elektrolyt zur abscheidung von hartsilberschichten |
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US (1) | US20240035184A1 (de) |
EP (1) | EP4259856A1 (de) |
JP (1) | JP2023553958A (de) |
KR (1) | KR20230121097A (de) |
CN (1) | CN116601338A (de) |
DE (1) | DE102020133188A1 (de) |
WO (1) | WO2022122989A1 (de) |
Citations (8)
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DE2731595B1 (de) | 1977-07-13 | Friedr. Blasberg Gmbh & Co Kg, 5650 Solingen | Verwendung einer Glanzzusatz-Kombination in cyanidischen Silberbädern | |
DE885036C (de) | 1950-09-15 | 1953-07-30 | Otto Heinrich August Lammert | Verfahren zur Erzeugung glaenzender Silberniederschlaege |
DE959775C (de) | 1954-09-18 | 1957-03-14 | Max Schloetter Fa Dr Ing | Cyankalisches Bad zur galvanischen Abscheidung glaenzender Silberniederschlaege |
DE1182014B (de) | 1960-04-12 | 1964-11-19 | Riedel & Co | Bad zum galvanischen Abscheiden von Silber-Antimon- oder Silber-Wismut-Legierungen hoher Haerte |
CH408582A (de) * | 1960-04-12 | 1966-02-28 | Wmf Wuerttemberg Metallwaren | Bad zum galvanischen Abscheiden von Silberlegierungen, insbesondere für die Herstellung von versilberten Tafelbestecken |
DE1228887B (de) | 1961-10-26 | 1966-11-17 | Riedel & Co | Verfahren zum galvanischen Abscheiden von Silber-Antimon- oder Silber-Wismut-Legierungen hoher Haerte |
US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
DE102018120357A1 (de) * | 2018-08-21 | 2020-02-27 | Umicore Galvanotechnik Gmbh | Elektrolyt zur Abscheidung von Silber und Silberlegierungsüberzügen |
-
2020
- 2020-12-11 DE DE102020133188.6A patent/DE102020133188A1/de active Pending
-
2021
- 2021-12-10 EP EP21836441.2A patent/EP4259856A1/de active Pending
- 2021-12-10 WO PCT/EP2021/085127 patent/WO2022122989A1/de active Application Filing
- 2021-12-10 US US18/256,321 patent/US20240035184A1/en active Pending
- 2021-12-10 KR KR1020237023357A patent/KR20230121097A/ko unknown
- 2021-12-10 CN CN202180082618.5A patent/CN116601338A/zh active Pending
- 2021-12-10 JP JP2023535548A patent/JP2023553958A/ja active Pending
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DE885036C (de) | 1950-09-15 | 1953-07-30 | Otto Heinrich August Lammert | Verfahren zur Erzeugung glaenzender Silberniederschlaege |
DE959775C (de) | 1954-09-18 | 1957-03-14 | Max Schloetter Fa Dr Ing | Cyankalisches Bad zur galvanischen Abscheidung glaenzender Silberniederschlaege |
DE1182014B (de) | 1960-04-12 | 1964-11-19 | Riedel & Co | Bad zum galvanischen Abscheiden von Silber-Antimon- oder Silber-Wismut-Legierungen hoher Haerte |
CH408582A (de) * | 1960-04-12 | 1966-02-28 | Wmf Wuerttemberg Metallwaren | Bad zum galvanischen Abscheiden von Silberlegierungen, insbesondere für die Herstellung von versilberten Tafelbestecken |
DE1228887B (de) | 1961-10-26 | 1966-11-17 | Riedel & Co | Verfahren zum galvanischen Abscheiden von Silber-Antimon- oder Silber-Wismut-Legierungen hoher Haerte |
DE2731595B1 (de) | 1977-07-13 | Friedr. Blasberg Gmbh & Co Kg, 5650 Solingen | Verwendung einer Glanzzusatz-Kombination in cyanidischen Silberbädern | |
DE2731595A1 (de) | 1977-07-13 | 1979-01-18 | Blasberg Gmbh & Co Kg Friedr | Verwendung einer glanzzusatz-kombination in cyanidischen silberbaedern |
US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
DE102018120357A1 (de) * | 2018-08-21 | 2020-02-27 | Umicore Galvanotechnik Gmbh | Elektrolyt zur Abscheidung von Silber und Silberlegierungsüberzügen |
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COBLEY, A.J. ET AL.: "The use uf insoluble Anodes in Acid Sulphate Copper Electrodeposition Solutions", TRANS IMF, vol. 79, no. 3, 2001, pages 113,114, XP001023283 |
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KRASTEV I.: "Elektrolytische Abscheidung und Eigenschaften von zyklisch modulierten Silber-Wismut-Legierungsüberzügen", 1 January 2005 (2005-01-01), pages 1790, XP055789210, Retrieved from the Internet <URL:https://www.leuze-verlag.de/fachzeitschriften/galvanotechnik/artikelarchiv-gt/7139-elektrolytische-abscheidung-und-eigenschaften-von-zyklisch-modulierten-silber-wismut-legierungsberzgen/file> [retrieved on 20210323] * |
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JP2023553958A (ja) | 2023-12-26 |
DE102020133188A1 (de) | 2022-06-15 |
KR20230121097A (ko) | 2023-08-17 |
EP4259856A1 (de) | 2023-10-18 |
CN116601338A (zh) | 2023-08-15 |
US20240035184A1 (en) | 2024-02-01 |
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