WO2022113942A1 - 液晶ポリマー粒子、熱硬化性樹脂組成物、および成形体 - Google Patents
液晶ポリマー粒子、熱硬化性樹脂組成物、および成形体 Download PDFInfo
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- WO2022113942A1 WO2022113942A1 PCT/JP2021/042826 JP2021042826W WO2022113942A1 WO 2022113942 A1 WO2022113942 A1 WO 2022113942A1 JP 2021042826 W JP2021042826 W JP 2021042826W WO 2022113942 A1 WO2022113942 A1 WO 2022113942A1
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- liquid crystal
- crystal polymer
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- thermosetting resin
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- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
Definitions
- the present invention relates to liquid crystal polymer particles. Furthermore, the present invention relates to a thermosetting resin composition containing the liquid crystal polymer particles, and a molded product using the thermosetting resin composition.
- liquid crystal polymer particles have been added to the resin film as an additive in order to improve the dielectric properties.
- Patent Documents 1 and 2 disclose substantially spherical liquid crystal polymer particles.
- Patent Documents 3 and 4 disclose fibril-like liquid crystal polymer particles.
- Japanese Patent No. 6295013 Japanese Unexamined Patent Publication No. 2019-001866 Special Table 2005-501760 Gazette Japanese Patent No. 5904307
- the substantially spherical liquid crystal polymer particles as described in Patent Documents 1 and 2 are excellent in handleability as a powder, it is difficult to control the orientation in the resin film when used as an additive. Therefore, there is a defect that the coefficient of linear expansion increases in proportion to the amount of addition. Further, the fibril-like liquid crystal polymer particles as described in Patent Documents 3 and 4 are not practical because the particles are liable to be entangled with each other and have difficulty in dispersibility and handling. Further, due to such properties, it is difficult to pulverize fibril-like liquid crystal polymer particles until the cumulative distribution 50% diameter D 50 in the particle size distribution becomes 20 ⁇ m or less, and when added to the resin film, the resin film is used.
- an object of the present invention is to provide liquid crystal polymer particles capable of lowering dielectric loss tangent while suppressing an increase in surface roughness and linear expansion coefficient of the resin film when added to the resin film.
- Another object of the present invention is to provide a thermosetting resin composition containing such liquid crystal polymer particles and a molded product using the thermosetting resin composition.
- the present inventor controls the shape of the liquid crystal polymer particles to be flat (substantially disk-shaped), and the molded product to which the liquid crystal polymer particles are added is a spherical liquid crystal. It was found that the dielectric properties are superior to those of the molded product to which polymer particles are added, while suppressing the increase in surface roughness and linear expansion coefficient.
- the present invention has been completed based on such findings.
- 80% by mass or more of the total particles are flat liquid crystal polymer particles.
- Liquid crystal polymer particles are provided, characterized in that they meet.
- the liquid crystal polymer particles have a melting point of 270 ° C. or higher. It is preferable that the cumulative distribution 50% diameter D 50 in the particle size distribution is 20 ⁇ m or less, and the cumulative distribution 90% diameter D 90 is 2.5 times or less the D 50 .
- the dielectric loss tangent of the liquid crystal polymer particles is 0.001 or less.
- the liquid crystal polymer particles have a structural unit (I) derived from a hydroxycarboxylic acid, a structural unit (II) derived from a diol compound, and a structural unit (III) derived from a dicarboxylic acid. It is preferable to include.
- the structural unit (I) derived from the hydroxycarboxylic acid is the structural unit derived from 6-hydroxy-2-naphthoic acid.
- the composition ratio of the structural unit (I) is preferably 40 mol% or more and 80 mol% or less with respect to the structural unit of the entire liquid crystal polymer particles.
- thermosetting resin composition containing the above liquid crystal polymer particles and a thermosetting resin is provided.
- the content of the liquid crystal polymer particles is preferably 5 parts by mass or more and 80 parts by mass or less with respect to 100 parts by mass of the thermosetting resin.
- thermosetting resin is at least one selected from the group consisting of an epoxy resin, a phenol resin, a polyimide resin, and a bismaleimide triazine resin.
- the ratio of the viscosity of the thermosetting resin composition to the viscosity of the thermosetting resin is preferably 30 or less.
- the molded product is formed from the above thermosetting resin composition.
- the molded product is in the form of a film, a sheet, or a plate.
- the ratio (a / b) of the average value a of the ferret diameter in the long axis direction and the average value b of the ferret diameter in the direction perpendicular to the long axis direction of the flat liquid crystal polymer particles is 1.2 or more.
- the ratio (a / b) is preferably 1.2 or more and 10.0 or less.
- the molded product is preferably a resin film having a thickness of 25 ⁇ m or less.
- the surface roughness Ra of the resin film of the molded product is 1.0 ⁇ m or less.
- the flat (substantially disk-shaped) liquid crystal polymer particles of the present invention By adding the flat (substantially disk-shaped) liquid crystal polymer particles of the present invention to the molded product, excellent dielectric properties can be obtained while suppressing the surface roughness.
- the long axis of the flat liquid crystal polymer particles tends to be oriented in the molded product in the horizontal axis (MD direction), so that the coefficient of linear expansion is increased. It can also be kept low.
- FIG. 6 is a photograph of an ultrathin section of a film obtained using the liquid crystal polymer particles of Example 1 taken with an optical microscope. It is a conceptual diagram which shows the major axis, the minor axis, and the thickness of a flat liquid crystal polymer particle. It is a conceptual diagram which shows the ferret diameter in the major axis direction and the ferret diameter in the direction perpendicular to the major axis direction of the flat liquid crystal polymer particles in a molded body.
- the flat liquid crystal polymer particles have the following conditions (A) and (B) having a major axis, a minor axis, and a thickness defined below.
- liquid crystal polymer particles By adding such liquid crystal polymer particles to the molded product, excellent dielectric properties can be obtained while suppressing the surface roughness.
- the long axis of the flat-shaped liquid crystal polymer particles tends to be oriented in the horizontal axis (MD direction) in the molded product, so that the coefficient of linear expansion is increased. It can also be kept low.
- the lower limit of the length and shortness which is the ratio of the major axis to the minor axis (A) in the flat liquid crystal polymer particles, is preferably 1.5 or more, more preferably 1.7 or more.
- the upper limit of the long and short degree is preferably 4.0 or less, more preferably 3.0 or less, still more preferably 2.8 or less, and even more preferably 2.5 or less.
- the lower limit of the flatness which is the ratio of the minor axis to the thickness, is preferably 1.5 or more, more preferably 1.7 or more.
- the upper limit of the flatness is not particularly limited, but may be, for example, 10.0 or less, 5.0 or less, or 3.0 or less.
- ⁇ Measuring method of major axis, minor axis, and thickness of liquid crystal polymer particles For measuring the major axis, minor axis, and thickness of the liquid crystal polymer particles, a film having a thickness of about 25 ⁇ m obtained by adding the liquid crystal polymer particles to the resin is produced. The obtained film is cut in the cross-sectional direction using a cryomicrotome to prepare ultrathin sections having a thickness of 0.5 to 2.5 ⁇ m. It can be calculated by observing the cross section of the ultrathin section with an optical microscope (optical microscope (manufactured by KEYENCE CORPORATION, model number: VHX6000)) and analyzing the cross section image.
- optical microscope optical microscope (manufactured by KEYENCE CORPORATION, model number: VHX6000)
- the three fields of view in the cross section all include the center of the film in the TD direction and are set so as not to overlap each other. As an example, it can be 1/4 position, 2/4 position, and 3/4 position of the film in the MD direction.
- the three fields of view in the vertical section all include the center of the film in the thickness direction and are set so as not to overlap each other. As an example, it can be the 1/4 position, the 2/4 position, and the 3/4 position of the film in the TD direction.
- the ferret diameter of at least 100 or more liquid crystal polymer particles is measured in major axis, minor axis, and thickness.
- the major axis, minor axis, and thickness of the liquid crystal polymer particles can be adjusted by adjusting the method for synthesizing the liquid crystal polymer particles, the pulverization method, the conditions of the sieve after pulverization, and the like.
- the particle size distribution of the liquid crystal polymer particles can be measured using a laser diffraction / scattering method particle size distribution measuring device (manufactured by Beckman Coulter, LS 13 320 dry system, equipped with a tornado dry powder module). .. Cumulative distribution 50% diameter D 50 (hereinafter referred to as "D 50 ”) in the particle size distribution represents the value of the particle size in which the cumulative distribution from the small particle size side is 50%, and the cumulative distribution 90% diameter D 90 . (Hereinafter referred to as "D 90 ”) represents the value of the particle size in which the cumulative distribution from the small particle size side is 90%.
- D 50 Cumulative distribution 50% diameter D 50
- D 90 represents the value of the particle size in which the cumulative distribution from the small particle size side is 90%.
- the liquid crystal polymer particles of the present invention preferably have a D 50 of 20 ⁇ m or less and a D 90 of 2.5 times or less of the D 50 in the particle size distribution.
- D 50 is preferably 0.1 ⁇ m or more, more preferably 1 ⁇ m or more, still more preferably 3 ⁇ m or more, and even more preferably 5 ⁇ m or more. Further, D 50 is preferably 15 ⁇ m or less, more preferably 12 ⁇ m or less, still more preferably 10 ⁇ m or less, still more preferably 6 ⁇ m or less.
- D 90 is preferably 2.2 times or less, more preferably 2.0 times or less, and further preferably 1.8 times or less of D 50 .
- D 50 and D 90 are parameters in the particle size distribution of the liquid crystal polymer particles, within the above range, the increase in the surface roughness and the coefficient of linear expansion of the resin film when added to the resin film is suppressed. However, the dielectric loss tangent can be reduced.
- the values of D 50 and D 90 should be adjusted according to the method for synthesizing the liquid crystal polymer particles, the pulverization method (crushing pressure, supply conditions, etc.) and the classification conditions (the size of the sieve after pulverization, the conditions for airflow classification, etc.). Can be done.
- a polarizing microscope (trade name: BH-2) manufactured by Olympus Corporation equipped with a hot stage for a microscope (trade name: FP82HT) manufactured by Metler is used, and the liquid crystal polymer is placed on a microscope heating stage. It can be confirmed by observing the presence or absence of optical anisotropy after heating and melting in.
- the melting point of the liquid crystal polymer particles is usually 270 ° C. or higher, preferably 280 ° C. or higher as the lower limit value, more preferably 290 ° C. or higher, still more preferably 300 ° C. or higher, and preferably the upper limit value. Is 370 ° C. or lower, preferably 360 ° C. or lower, and more preferably 350 ° C. or lower.
- the melting point of the liquid crystal polymer can be measured by using a differential scanning calorimeter (DSC) manufactured by Hitachi High-Tech Science Corporation or the like.
- the dielectric loss tangent (measurement frequency: 10 GHz) of the liquid crystal polymer particles is 0.001 or less, preferably 0.0009 or less, more preferably 0.0008 or less, and further preferably 0.0007 or less. This value is a measured value of the dielectric loss tangent in the in-plane direction of the injection-molded article of the liquid crystal polymer particles.
- the injection-molded product is a flat plate-shaped test piece having a size of 30 mm ⁇ 30 mm ⁇ 0.4 mm (thickness).
- the composition of the liquid crystal polymer which is the raw material of the liquid crystal polymer particles according to the present invention is not particularly limited, but is a structural unit (I) derived from an aromatic hydroxycarboxylic acid and a structural unit derived from an aromatic diol compound (a structural unit derived from an aromatic hydroxycarboxylic acid (I). It preferably contains a structural unit (III) derived from II) and an aromatic dicarboxylic acid. Further, the liquid crystal polymer according to the present invention may further contain a structural unit (IV) as a structural unit other than the structural units (I) to (III). Hereinafter, each structural unit contained in the liquid crystal polymer will be described.
- the unit (I) constituting the liquid crystal polymer is a structural unit derived from a hydroxycarboxylic acid, and is preferably a structural unit derived from an aromatic hydroxycarboxylic acid represented by the following formula (I).
- the structural unit (I) may include only one type, or may include two or more types.
- Ar 1 is selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a 4,4'-isopropyridendiphenyl group, a naphthyl group, an anthryl group and a phenanthryl group, if desired.
- a naphthyl group is preferable.
- the substituent include hydrogen, an alkyl group, an alkoxy group, fluorine and the like.
- the number of carbon atoms of the alkyl group is preferably 1 to 10, and more preferably 1 to 5. Further, it may be a linear alkyl group or a branched chain alkyl group.
- the number of carbon atoms contained in the alkoxy group is preferably 1 to 10, and more preferably 1 to 5.
- Examples of the monomer giving the structural unit represented by the above formula (I) include 6-hydroxy-2-naphthoic acid (HNA, the following formula (1)), and acylated products, ester derivatives, acid halides and the like thereof. Be done.
- HNA 6-hydroxy-2-naphthoic acid
- the composition ratio (mol%) of the constituent unit (I) to the constituent units of the entire liquid crystal polymer is preferably 40 mol% or more, more preferably 45 mol% or more, and further preferably 50 mol% as the lower limit value.
- the above is even more preferably 55 mol% or more.
- the upper limit is preferably 80 mol% or less, more preferably 75 mol% or less, still more preferably 70 mol% or less, still more preferably 65 mol% or less.
- the total molar ratio thereof may be within the range of the above composition ratio.
- the unit (II) constituting the liquid crystal polymer is a structural unit derived from the diol compound, and is preferably a structural unit derived from the aromatic diol compound represented by the following formula (II).
- the constituent unit (II) may contain only one type, or may contain two or more types.
- Ar 2 is selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a 4,4'-isopropyridendiphenyl group, a naphthyl group, an anthryl group and a phenanthryl group, if desired. Of these, a phenyl group and a biphenyl group are preferable.
- substituent include hydrogen, an alkyl group, an alkoxy group, fluorine and the like.
- the number of carbon atoms of the alkyl group is preferably 1 to 10, and more preferably 1 to 5. Further, it may be a linear alkyl group or a branched chain alkyl group.
- the number of carbon atoms contained in the alkoxy group is preferably 1 to 10, and more preferably 1 to 5.
- Examples of the monomer giving the structural unit (II) include 4,4-dihydroxybiphenyl (BP, the following formula (2)), hydroquinone (HQ, the following formula (3)), and methylhydroquinone (MeHQ, the following formula (4)). ), 4,4'-Isopropyridene diphenol (BisPA, the following formula (5)), and acylated products, ester derivatives, acid halides and the like thereof.
- BP 4,4-dihydroxybiphenyl
- HQ hydroquinone
- MeHQ methylhydroquinone
- (4) methylhydroquinone
- BisPA 4,4'-Isopropyridene diphenol
- acylated products ester derivatives, acid halides and the like thereof.
- the composition ratio (mol%) of the constituent unit (II) to the constituent units of the entire liquid crystal polymer is preferably 10 mol% or more, more preferably 12.5 mol% or more, and further preferably 15 as the lower limit value. It is mol% or more, and even more preferably 17.5 mol% or more.
- the upper limit is preferably 30 mol% or less, more preferably 27.5 mol% or less, still more preferably 25 mol% or less, still more preferably 22.5 mol% or less.
- the total molar ratio thereof may be within the range of the above composition ratio.
- the unit (III) constituting the liquid crystal polymer is a structural unit derived from a dicarboxylic acid, and is preferably a structural unit derived from an aromatic dicarboxylic acid represented by the following formula (III).
- the constituent unit (III) may contain only one type, or may contain two or more types.
- Ar 3 is selected from the group consisting of a phenyl group having a substituent, a biphenyl group, a 4,4'-isopropyridendiphenyl group, a naphthyl group, an anthryl group and a phenanthryl group, if desired. Of these, a phenyl group and a naphthyl group are preferable.
- substituent include hydrogen, an alkyl group, an alkoxy group, fluorine and the like.
- the number of carbon atoms of the alkyl group is preferably 1 to 10, and more preferably 1 to 5. Further, it may be a linear alkyl group or a branched chain alkyl group.
- the number of carbon atoms contained in the alkoxy group is preferably 1 to 10, and more preferably 1 to 5.
- Examples of the monomer giving the structural unit (III) include terephthalic acid (TPA, the following formula (6)), isophthalic acid (IPA, the following formula (7)), and 2,6-naphthalenedicarboxylic acid (NADA, the following formula (8)). ), And their acylated products, ester derivatives, acid halides and the like.
- TPA terephthalic acid
- IPA isophthalic acid
- NADA 2,6-naphthalenedicarboxylic acid
- the composition ratio (mol%) of the constituent unit (III) to the constituent units of the entire liquid crystal polymer is preferably 10 mol% or more, more preferably 12.5 mol% or more, and further preferably 15 as the lower limit value. It is mol% or more, and even more preferably 17.5 mol% or more.
- the upper limit is preferably 30 mol% or less, more preferably 27.5 mol% or less, still more preferably 25 mol% or less, still more preferably 22.5 mol% or less.
- the total molar ratio thereof may be within the range of the above composition ratio.
- the composition ratio of the structural unit (II) and the composition ratio of the structural unit (III) are substantially equivalent ((constituent unit (II) ⁇ structural unit (III)).
- the liquid crystal polymer may further contain other structural units other than the above-mentioned structural units (I) to (III).
- the structural unit (IV) is derived from a monomer other than the monomers giving the structural units (I) to (III), and can be polymerized with the monomers giving the structural units (I) to (III). It is not particularly limited as long as it is derived from a polymerizable monomer. Examples of the polymerizable group include a hydroxy group, a carboxyl group, an amine group, and an amide group.
- the monomer giving the structural unit (IV) has one or more, preferably two or more of these polymerizable groups. When two or more polymerizable groups are contained, the polymerizable groups may be the same or different.
- the structural unit (IV) may contain only one type, or may contain two or more types.
- the structural unit (IV) for example, the following structural unit (IV-1): Can be mentioned.
- Examples of the monomer giving the structural unit (IV-1) include acetaminophenone (AAP, the following formula (9)), p-aminophenol, 4'-acetoxyacetanilide, and acylated products, ester derivatives, acid halides and the like thereof. Can be mentioned.
- structural unit (IV) for example, the following structural unit (IV-2): Can be mentioned.
- Examples of the monomer giving the structural unit (IV-2) include 1,4-cyclohexanedicarboxylic acid (CHDA, the following formula (10)) and acylated products, ester derivatives, acid halides and the like thereof.
- CHDA 1,4-cyclohexanedicarboxylic acid
- composition ratio (mol%) of the constituent unit (IV) to the constituent unit of the entire liquid crystal polymer can be appropriately set according to the composition ratio of the constituent units (I) to (III).
- the composition ratio of each structural unit may be appropriately set so that the monomer ratio (molar ratio) of the carboxyl group to the hydroxy group and / or the amine group in the monomer preparation is in the range of approximately 1: 1. good.
- Preferred formulations of the liquid crystal polymer include: 45 mol% ⁇ 6-hydroxy-2-naphthoic acid-derived structural unit (I) ⁇ 75 mol% 12 mol% ⁇ Structural unit derived from aromatic diol compound (II) ⁇ 27.5 mol% 3 mol% ⁇ structural unit derived from terephthalic acid Structural unit (IIIA) ⁇ 25 mol% 2 mol% ⁇ 2,6-naphthalenedi A constituent unit derived from a carboxylic acid (IIIB) ⁇ 9 mol% Is. Further, more preferable formulations of the liquid crystal polymer include the following.
- liquid crystal polymer 50 mol% ⁇ 6-hydroxy-2-naphthoic acid-derived structural unit (I) ⁇ 70 mol% 15 mol% ⁇ structural unit derived from aromatic diol compound (II) ⁇ 25 mol% 9 mol% ⁇ structural unit derived from terephthalic acid Structural unit (IIIA) ⁇ 22 mol% 3 mol% ⁇ 2,6-naphthalenedi A constituent unit derived from a carboxylic acid (IIIB) ⁇ 6 mol% Is. Further, further preferable formulations of the liquid crystal polymer include the following.
- the liquid crystal polymer can be produced by polymerizing a monomer that gives the structural units (I) to (III) if desired and a monomer that gives the structural unit (IV) if desired by a conventionally known method.
- the liquid crystal polymer according to the present invention can also be produced by two-step polymerization in which a prepolymer is produced by melt polymerization and further solid-phase polymerization thereof is performed.
- Melt polymerization can be carried out in the presence of acetic anhydride under reflux acetic acid. From the viewpoint of efficiently obtaining the liquid crystal polymer, it is preferable to perform melt polymerization in the presence of 1.05 to 1.15 molar equivalents of acetic anhydride with respect to all the hydroxyl groups of the monomers constituting the liquid crystal polymer.
- the prepolymer obtained by melt polymerization is cooled and solidified, pulverized into powder or flakes, and then a known solid phase polymerization method.
- a method of heat-treating the prepolymer resin in a temperature range of 200 to 350 ° C. for 1 to 30 hours under an inert atmosphere such as nitrogen or under vacuum is preferable.
- the solid phase polymerization may be carried out with stirring, or may be carried out in a stationary state without stirring.
- the catalyst may or may not be used in the polymerization reaction.
- a conventionally known catalyst for polymerizing a liquid crystal polymer can be used.
- catalysts include metal salt catalysts such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate and antimony trioxide, and organic compounds such as nitrogen-containing heterocyclic compounds such as N-methylimidazole. Examples include catalysts.
- the amount of the catalyst used is not particularly limited, but is preferably 0.0001 to 0.1 parts by weight with respect to 100 parts by weight of the total amount of the monomers.
- the polymerization reaction device in melt polymerization is not particularly limited, but a reaction device used for the reaction of a general high-viscosity fluid is preferably used.
- these reaction devices include, for example, an anchor type, a multi-stage type, a spiral band type, a spiral shaft type, or a stirring tank type polymerization reaction device having a stirring device having various shapes of stirring blades obtained by modifying these. , Kneader, roll mill, Banbury mixer and the like, which are generally used for kneading resin.
- the liquid crystal polymer particles of the present invention can be produced by crushing and classifying the above liquid crystal polymer using a conventionally known pulverizing and classifying device. It is known that liquid crystal polymer particles tend to exhibit shape anisotropy such as fibrillation when the temperature at the time of crushing becomes high. Therefore, for example, the crushing pressure of the crushing device and the air flow of the classifying device should be adjusted. Allows the balance between the collision frequency of the particles and the rate of removal of heat generated by the collisions, thereby adjusting the length, flatness, and particle size of the particles.
- thermosetting resin composition contains the above-mentioned liquid crystal polymer particles of the present invention and a thermosetting resin.
- thermosetting resin include epoxy resin, phenol resin, polyimide resin, cyanate resin, acrylic resin, maleimide resin, bismaleimide triazine resin and the like, and polyimide resin is particularly preferable. Only one kind of these thermosetting resins may be contained, or two or more kinds thereof may be contained.
- the content of the liquid crystal polymer particles in the thermosetting resin composition is preferably 5 parts by mass or more and 80 parts by mass or less, and more preferably 10 parts by mass or more and 70 parts by mass with respect to 100 parts by mass of the thermosetting resin. It is more preferably 15 parts by mass or more and 60 parts by mass or less, and even more preferably 20 parts by mass or more and 50 parts by mass or less.
- the content of the liquid crystal polymer particles is within the above range, the dielectric loss tangent can be lowered while suppressing the increase in the surface roughness and the linear expansion coefficient of the resin film when the resin film is manufactured.
- thermosetting resin composition of the present embodiment contains liquid crystal polymer particles to reduce the dielectric loss tangent, but the addition of the liquid crystal polymer particles increases the viscosity of the thermosetting resin composition.
- the ratio of the viscosity of the thermosetting resin composition containing the liquid crystal polymer particles of the present embodiment to the viscosity of the thermosetting resin is preferably 30 or less.
- the upper limit of the viscosity ratio of the more preferable thermosetting resin composition is 20, 10, 5, 3, or 2.
- thermosetting resin composition of the present invention preferably includes at least a step of mixing the above-mentioned liquid crystal polymer particles and the thermosetting resin at a temperature lower than the melting point of the liquid crystal polymer particles.
- a thermosetting resin composition can be obtained without changing the particle size distribution of the liquid crystal polymer particles as much as possible.
- a conventionally known method can be used. For example, mixing can be performed using a Banbury mixer, a kneader, a single-screw or twin-screw extruder, or the like.
- the molded product of the present invention can be obtained by using the above-mentioned thermosetting resin composition.
- the molded article according to the present invention may contain components other than the above-mentioned liquid crystal polymer particles and the thermosetting resin as long as the effects of the present invention are not impaired. Examples of other components include colorants, dispersants, plasticizers, antioxidants, curing agents, flame retardants, heat stabilizers, ultraviolet absorbers, antistatic agents, surfactants and the like.
- the molded body is preferably in the form of a film, a sheet, or a plate.
- the thickness of the molded product is not particularly limited, but is usually 10 ⁇ m or more and 200 ⁇ m or less, preferably 150 ⁇ m or less, more preferably 100 ⁇ m or less, still more preferably 80 ⁇ m or less.
- the molded product using the thermosetting resin composition containing the liquid crystal polymer particles of the present invention can suppress the surface roughness even if it is a thin film having a thickness of 200 ⁇ m or less.
- the ratio (a / b) of the average value a of the ferret diameter in the long axis direction (MD direction) of the liquid crystal polymer particles in the molded body to the average value b of the ferret diameter in the vertical direction (TD direction) is 1.2.
- the above is preferable, 1.5 or more is more preferable, and 1.7 or more is further preferable.
- the upper limit of the above ratio (a / b) is not particularly limited, but may be, for example, 5 or less, or 3 or less.
- the above ratio (a / b) can be measured according to the method for observing the liquid crystal polymer particles in the cross section of the above-mentioned ⁇ method for measuring the major axis, the minor axis, and the thickness of the liquid crystal polymer particles>. Specifically, it is calculated by observing the cross section (FIG. 3) of the molded body to which the liquid crystal polymer particles are added with an optical microscope (manufactured by KEYENCE CORPORATION, model number: VHX6000) and analyzing the obtained image. can do. With 400 ⁇ m ⁇ 300 ⁇ m as one field of view, three fields of view in the cross section are observed at a magnification of 1000 times.
- the three fields of view in the cross section all include the center of the film in the TD direction and are set so as not to overlap each other. As an example, it can be 1/4 position, 2/4 position, and 3/4 position of the film in the MD direction.
- each ferret diameter of at least 100 or more liquid crystal polymer particles is measured and calculated as a ratio of their average values.
- the resin film of the present invention can reduce the dielectric loss tangent while suppressing the increase in the surface roughness and the coefficient of linear expansion of the resin film.
- the surface roughness Ra of the resin film is preferably 1.0 ⁇ m or less, more preferably 0.9 ⁇ m or less, and further preferably 0.8 ⁇ m or less.
- the thickness of the resin film is preferably 25 ⁇ m or less, more preferably 20 ⁇ m or less, and may be 10 ⁇ m or more.
- the above thermosetting resin composition can be obtained by molding by a conventionally known method.
- the molding method include press molding, foam molding, injection molding, extrusion molding, punch molding and the like.
- the molded product produced as described above can be processed into various shapes depending on the intended use.
- the shape of the molded product is not limited, but is, for example, a film shape, a sheet shape, or a plate shape.
- the surface roughness of the molded product can be reduced even if it is a thin film, and thus it is suitable for a film-shaped molded product.
- the electronic circuit board of the present invention can be obtained by using the above-mentioned thermosetting resin composition. Further, the electronic circuit board of the present invention includes the above-mentioned molded body.
- the electronic circuit board is preferably a flexible circuit board because it can reduce the dielectric loss tangent while suppressing the surface roughness even if it is formed in the form of a thin film.
- the liquid crystal polymer particles of the present invention can be used as a molded product as the above-mentioned film or electronic circuit board, as well as a bonding sheet, prepreg, coverlay, or the like. Further, the present invention is not limited to a molded product, and is used, for example, as a paste-like composition, and in that case, it can also be used as an adhesive, an interlayer insulating material, a sealing material, or the like.
- the temperature of the polymerization vessel in the acetic acid distillate state was raised at 0.5 ° C./min, and when the temperature of the melt in the tank reached 310 ° C., the polymer was extracted and cooled and solidified.
- the obtained polymer was pulverized and pulverized to a size passing through a sieve having an opening of 2.0 mm to obtain a prepolymer.
- the temperature of the prepolymer obtained above was raised from room temperature to 295 ° C. over 14 hours by a heater in an oven manufactured by Yamato Scientific Co., Ltd., and then the temperature was maintained at 295 ° C. for 1 hour. Solid phase polymerization was performed. Then, it was naturally dissipated at room temperature to obtain a liquid crystal polymer A.
- a polarizing microscope (trade name: BH-2) manufactured by Olympus Corporation equipped with a hot stage for a microscope (trade name: FP82HT) manufactured by Mettler, the liquid crystal polymer A is heated and melted on a microscope heating stage to obtain optics. It was confirmed that the liquid crystal property was exhibited from the presence or absence of anisotropy.
- Example 1 Liquid crystal polymer A powder is crushed by a collision plate type sonic airflow crusher (built-in classifier (adjust ring: 60 mm, center nable: center nable: ⁇ 60 mm, blower setting: -45 kPa), manufactured by Nippon Pneumatic Mfg. Co., Ltd., model number: SPK- Using 12 + UFS10), pulverization was performed under the condition of a pulverization pressure of 0.70 MPa and 10 kg / h. As a result, a flat liquid crystal polymer A1 was obtained.
- a collision plate type sonic airflow crusher built-in classifier (adjust ring: 60 mm, center nable: center nable: ⁇ 60 mm, blower setting: -45 kPa), manufactured by Nippon Pneumatic Mfg. Co., Ltd., model number: SPK- Using 12 + UFS10)
- pulverization was performed under the condition of a pulverization
- Example 2 The flat liquid crystal polymer A1 obtained in Example 1 was used as a classifier (adjusting height 30 mm, distance ring height 15 mm, guide vane gap 4 mm, center nable diameter ⁇ 40 mm, louver opening 1 mm, Nippon Pneumatic Industries, Ltd.). Manufactured by, model number: DXF2), further classification was performed to obtain flat liquid crystal polymer particles A2.
- Example 3 As a result of crushing in the same manner as in Example 1 except that the crushing pressure was set to 0.75 MPa, a flat liquid crystal polymer A3 was obtained.
- a polyamic acid varnish was prepared in a glass container equipped with a stirrer, and the liquid crystal polymer particles obtained above were dispersed in a dispersion medium and stirred to obtain a suspension. At that time, the concentration of the liquid crystal polymer particles was adjusted to be 10 to 20 parts by mass with respect to 100 parts by mass of the polyamic acid.
- the obtained suspension was applied to a glass substrate, dried, and then cured at 300 ° C. to produce a film having a thickness of about 25 ⁇ m.
- the obtained film was cut in the cross-sectional direction using a cryomicrotome to prepare ultrathin sections having a thickness of 0.5 to 2.5 ⁇ m.
- the thickness is adjusted so that 100 or more particles can be observed without overlapping in the field of view of the microscope at the magnification described later, depending on the average diameter of the number of particles to be observed. For particles with a volume average diameter of about 5 ⁇ m, a thickness of 0.5 ⁇ m was appropriate.
- the cross section of the obtained ultrathin section was observed using an optical microscope (manufactured by KEYENCE CORPORATION, model number: VHX6000), and the minor axis was observed.
- the ratio of / thickness was defined as the flatness of the particles.
- FIG. 1 is a photograph of an ultrathin section in the cross-sectional direction obtained by using the liquid crystal polymer particles of Example 1 taken with an optical microscope.
- the film was cut in the horizontal plane direction using a cryomicrotome to prepare ultrathin sections with a thickness of 0.5 to 2.5 ⁇ m.
- the obtained ultrathin section was observed with an optical microscope, and the major axis / minor axis ratio was defined as the length of the particles.
- the melting point of each liquid crystal polymer obtained above was measured by a differential scanning calorimeter (DSC) manufactured by Hitachi High-Tech Science Corporation. At this time, the temperature is raised from room temperature to 360 to 380 ° C. at a heating rate of 10 ° C./min to completely melt the polymer, and then the temperature is lowered to 30 ° C. at a rate of 10 ° C./min, and then at a rate of 10 ° C./min.
- the apex of the endothermic peak obtained when the temperature was raised to 380 ° C. was defined as the melting point (Tm 2 ). The measurement results are shown in Table 1.
- Example 4 ⁇ Manufacturing of film> (Example 4)
- m-toluidine (trol) 60%, 4,4'-diaminodiphenyl ether (DDE) 40% and N, N-dimethylacetamide are placed so as to have a predetermined concentration, and a nitrogen atmosphere is provided.
- the mixture was stirred at 25 ° C. below to obtain a solution.
- 100% pyromellitic acid dianhydride (PMDA) was added to this solution in several portions and stirred at 25 ° C. under a nitrogen atmosphere to obtain a polyamic acid varnish.
- PMDA pyromellitic acid dianhydride
- Example 5 A film having a thickness of 25 ⁇ m was produced in the same manner as in Example 4 except that the amount of the liquid crystal polymer particles A1 added was 50 parts by mass with respect to 100 parts by mass of the polyamic acid.
- Example 6 A film having a thickness of 25 ⁇ m was produced in the same manner as in Example 4 except that 30 parts by mass of the liquid crystal polymer particles A2 was added to 100 parts by mass of the polyamic acid instead of the liquid crystal polymer particles A1.
- Example 7 A film having a thickness of 25 ⁇ m was produced in the same manner as in Example 4 except that 50 parts by mass of the liquid crystal polymer particles A2 was added to 100 parts by mass of the polyamic acid instead of the liquid crystal polymer particles A1.
- Example 8 A film having a thickness of 25 ⁇ m was produced in the same manner as in Example 4 except that 30 parts by mass of the liquid crystal polymer particles A3 was added to 100 parts by mass of the polyamic acid instead of the liquid crystal polymer particles A1.
- Example 9 A film having a thickness of 25 ⁇ m was produced in the same manner as in Example 4 except that 50 parts by mass of the liquid crystal polymer particles A3 was added to 100 parts by mass of the polyamic acid instead of the liquid crystal polymer particles A1.
- Example 2 A film having a thickness of 25 ⁇ m was produced in the same manner as in Example 3 except that 50 parts by mass of the liquid crystal polymer particles A4 was added to 100 parts by mass of the polyamic acid instead of the liquid crystal polymer particles A1.
- the firing conditions when the powder of the liquid crystal polymer particles is mixed with the polyamic acid which is the precursor of the polyimide is appropriately adjusted at 300 ° C. or higher in order to sufficiently increase the imidization rate of the polyimide.
- the obtained suspension was equipped with an SP-4 type spindle on a B-type viscometer (IKA Co., Ltd., device name: ROTAVISC lo-vi Compact), and the viscosity was measured under the conditions of a rotation speed of 100 rpm and a temperature of 25 ° C. did.
- the viscosity of the polyamic acid varnish to which the liquid crystal polymer particles were not added was also measured in the same manner.
- the measurement results are shown in Table 3.
- the varnish to which the flat liquid crystal polymer particles of the present invention was added did not show a significant increase in viscosity to the extent that it became difficult to flow as compared with the varnish to which the liquid crystal polymer particles were not added, and was suitable for film production in the manufacturing process. rice field.
- Resin film 2 Flat liquid crystal polymer particles 3: Major axis 4: Minor axis 5: Thickness T: TD direction M: MD direction 6: Molded body 7: Long axis direction (MD direction) Ferret diameter 8: Major axis Ferret diameter in the direction perpendicular to the direction (TD direction)
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Abstract
Description
全体の80質量%以上の粒子が偏平状である液晶ポリマー粒子であって、
偏平状の液晶ポリマー粒子が、下記で定義される長径、短径、および厚みが下記(A)および(B)の条件:
(A)長径と短径の比である長短度が1.2以上5.0以下であること、
(B)短径と厚みの比である偏平度が1.2以上であること、
を満たすことを特徴とする、液晶ポリマー粒子が提供される。
粒径分布における累積分布50%径D50が20μm以下であり、かつ、累積分布90%径D90がD50の2.5倍以下であることが好ましい。
前記成形体がフィルム状、シート状、または板状であり、
前記偏平状の液晶ポリマー粒子の、長軸方向のフェレー径の平均値aと、前記長軸方向に対する垂直方向のフェレー径の平均値bとの比(a/b)が1.2以上である、成形体が提供される。
本発明の液晶ポリマー粒子は、全体の80質量%以上、好ましくは85質量%以上、より好ましくは90質量%以上、さらにより好ましくは95質量%以上の粒子が偏平状である。本発明においては、偏平状の液晶ポリマー粒子とは、下記で定義される長径、短径、および厚みが下記(A)および(B)の条件:
(A)長径と短径の比である長短度が1.2以上5.0以下であること、
(B)短径と厚みの比である偏平度が1.2以上であること、
を満たすことを特徴とする。このような液晶ポリマー粒子を成形品に添加することで、表面粗さを抑えながら、優れた誘電特性が得られる。特に偏平状の液晶ポリマー粒子を添加したフィルム状の成形品では、偏平状の液晶ポリマー粒子の長軸が成形品内へ横軸(MD方向)に配向しやすくなるため、線膨張係数の増大を低く抑えることもできる。
液晶ポリマー粒子の長径、短径、および厚みの測定には、樹脂に液晶ポリマー粒子を添加して得られた厚さ約25μmのフィルムを製造する。得られたフィルムを、クライオミクロトームを用いて断面方向に切削し、厚さ0.5~2.5μmの超薄切片を作成する。その超薄切片の断面を光学顕微鏡(光学顕微鏡((株)キーエンス製、型番:VHX6000))で観察し、その断面画像を解析することによって、算出することができる。液晶ポリマー粒子の形状を測定することを目的とするため、フィルムの製造においては一般的な製膜条件であれば良く、液晶ポリマー粒子の形状を大きく変えるような条件は選択されない。長径と短径を測定する場合、フィルム厚みの1/2位置における横断面(図2のx-y平面)を観察する。短径と厚みを測定する場合、フィルムのTD方向に沿った縦断面(図2のx-z平面)を観察する。400μm×300μmを1つの視野として、横断面および縦断面においてそれぞれ3視野を、倍率1000倍で観察する。横断面における3つの視野は、全てTD方向におけるフィルムの中央を含み、互いに重複しないように設定する。一例として、MD方向におけるフィルムの1/4位置、2/4位置、3/4位置とすることができる。縦断面における3つの視野は、全て厚み方向におけるフィルムの中央を含み、互いに重複しないように設定する。一例として、TD方向におけるフィルムの1/4位置、2/4位置、3/4位置とすることができる。それぞれの視野において、少なくとも100個以上の液晶ポリマー粒子の長径、短径、および厚みのフェレー径を測定する。なお、液晶ポリマー粒子の長径、短径、および厚みは、液晶ポリマー粒子の合成方法、粉砕方法や粉砕後の篩の条件等によって、調節することができる。
D50は、好ましくは0.1μm以上であり、より好ましくは1μm以上であり、さらに好ましくは3μm以上であり、より好ましくは5μm以上である。また、D50は、好ましくは15μm以下であり、より好ましくは12μm以下であり、さらに好ましくは10μm以下、さらにより好ましくは6μm以下である。
D90はD50の好ましくは2.2倍以下であり、より好ましくは2.0倍以下であり、さらに好ましくは1.8倍以下である。
液晶ポリマー粒子の粒径分布におけるパラメータであるD50およびD90の値を上記範囲内に調節することによって、樹脂フィルムに添加した際に、樹脂フィルムの表面粗さおよび線膨張係数の増大を抑えながら、誘電正接を低下させることができる。なお、D50およびD90の値は、液晶ポリマー粒子の合成方法、粉砕方法(粉砕圧や供給条件等)や分級条件(粉砕後の篩のサイズや気流分級の条件等)によって、調節することができる。
液晶ポリマーを構成する単位(I)は、ヒドロキシカルボン酸に由来する構成単位であり、下記式(I)で表される芳香族ヒドロキシカルボン酸に由来する構成単位であることが好ましい。なお、構成単位(I)は、1種のみが含まれてもよいし、2種以上含まれていてもよい。
液晶ポリマーを構成する単位(II)は、ジオール化合物に由来する構成単位であり、下記式(II)で表される芳香族ジオール化合物に由来する構成単位であることが好ましい。なお、構成単位(II)は、1種のみが含まれてもよいし、2種以上含まれていてもよい。
液晶ポリマーを構成する単位(III)は、ジカルボン酸に由来する構成単位であり、下記式(III)で表される芳香族ジカルボン酸に由来する構成単位であることが好ましい。なお、構成単位(III)は、1種のみが含まれてもよいし、2種以上含まれていてもよい。
液晶ポリマーは、上記構成単位(I)~(III)以外の他の構成単位をさらに含んでもよい。構成単位(IV)は、上記構成単位(I)~(III)を与えるモノマー以外の他のモノマーに由来するものであって、上記構成単位(I)~(III)を与えるモノマーと重合可能な重合性を有するモノマーに由来するものであれば特に限定されない。重合性基としては、例えば、ヒドロキシ基、カルボキシル基、アミン基、ならびにアミド基が挙げられる。構成単位(IV)を与えるモノマーはこれらの重合性基を1つ以上、好ましくは2つ以上有するものである。重合性基が2つ以上含まれる場合、それらの重合性基は同一であってもよいし、異なっていてもよい。構成単位(IV)は、1種のみが含まれてもよいし、2種以上含まれていてもよい。
45モル%≦6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(I)≦75モル%
12モル%≦芳香族ジオール化合物に由来する構成単位(II)≦27.5モル%
3モル%≦テレフタル酸に由来する構成単位構成単位(IIIA)≦25モル%
2モル%≦2,6-ナフタレンジカルボン酸に由来する構成単位(IIIB)≦9モル%
である。
さらに、液晶ポリマーのより好ましい配合としては、以下が挙げられる。
50モル%≦6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(I)≦70モル%
15モル%≦芳香族ジオール化合物に由来する構成単位(II)≦25モル%
9モル%≦テレフタル酸に由来する構成単位構成単位(IIIA)≦22モル%
3モル%≦2,6-ナフタレンジカルボン酸に由来する構成単位(IIIB)≦6モル%
である。
さらに、液晶ポリマーのさらにより好ましい配合としては、以下が挙げられる。
54モル%≦6-ヒドロキシ-2-ナフトエ酸に由来する構成単位(I)≦66モル%
17モル%≦芳香族ジオール化合物に由来する構成単位(II)≦23モル%
11モル%≦テレフタル酸に由来する構成単位構成単位(IIIA)≦20モル%
3モル%≦2,6-ナフタレンジカルボン酸に由来する構成単位(IIIB)≦6モル%
である。
液晶ポリマー全体の構成単位に対して、各構成単位が上記範囲内であれば、誘電正接の低い液晶ポリマー粒子を得ることができる。
液晶ポリマーは、所望により構成単位(I)~(III)を与えるモノマーおよび所望により構成単位(IV)を与えるモノマーを、従来公知の方法で重合することにより製造することができる。一実施態様において、本発明に係る液晶ポリマーは、溶融重合によりプレポリマーを作製し、これをさらに固相重合する2段階重合によっても製造することができる。
本発明の液晶ポリマー粒子は、上記の液晶ポリマーを、従来公知の粉砕・分級装置を用いて、粉砕・分級することで製造することができる。液晶ポリマー粒子は、粉砕時の温度が高くなるとフィブリル化等の形状異方性を示す傾向があることが知られているので、例えば、粉砕装置の粉砕圧や、分級装置の気流を調節することによって、粒子の衝突頻度と衝突によって発生する熱の除去速度とのバランスを変えることができ、それによって粒子の長短度、偏平度、および粒径を調節することができる。
本発明の熱硬化性樹脂組成物は、本発明の上述の液晶ポリマー粒子と、熱硬化性樹脂とを含むものである。熱硬化性樹脂としては、エポキシ樹脂、フェノール樹脂、ポリイミド樹脂、シアネート樹脂、アクリル樹脂、マレイミド樹脂およびビスマレイミドトリアジン樹脂等が挙げられ、特にポリイミド樹脂が好ましい。これらの熱硬化性樹脂は、1種のみが含まれてもよいし、2種以上含まれていてもよい。
本発明の熱硬化性樹脂組成物の製造方法は、少なくとも、上記の液晶ポリマー粒子と、熱硬化性樹脂とを、液晶ポリマー粒子の融点未満の温度で混合する工程を含むことが好ましい。液晶ポリマー粒子の融点未満の温度で混合することにより、液晶ポリマー粒子の粒径分布を極力変化させずに、熱硬化性樹脂組成物を得ることができる。混合方法としては、従来公知の方法により行うことができる。例えば、バンバリーミキサー、ニーダー、一軸または二軸押出機等を用いて混合することができる。
本発明の成形体は上記の熱硬化性樹脂組成物を用いて得ることができる。本発明による成形品は、本発明の効果を損なわない範囲において、上記の液晶ポリマー粒子および熱硬化性樹脂以外の他の成分を含んでいてもよい。他の成分としては、例えば、着色剤、分散剤、可塑剤、酸化防止剤、硬化剤、難燃剤、熱安定剤、紫外線吸収剤、帯電防止剤、界面活性剤等が挙げられる。
上記の比(a/b)は、上述の<液晶ポリマー粒子の長径、短径、および厚みの測定方法>の横断面における液晶ポリマー粒子の観察方法に準じて測定することができる。具体的には、液晶ポリマー粒子を添加した成形体の横断面(図3)を光学顕微鏡((株)キーエンス製、型番:VHX6000))で観察し、得られた画像を解析することによって、算出することができる。400μm×300μmを1つの視野として、横断面における3視野を、倍率1000倍で観察する。横断面における3つの視野は、全てTD方向におけるフィルムの中央を含み、互いに重複しないように設定する。一例として、MD方向におけるフィルムの1/4位置、2/4位置、3/4位置とすることができる。それぞれの視野において、少なくとも100個以上の液晶ポリマー粒子の各フェレー径を測定し、それらの平均値の比として算出する。
本発明の樹脂フィルムは、上記の液晶ポリマー粒子を用いることで、樹脂フィルムの表面粗さおよび線膨張係数の増大を抑えながら、誘電正接を低下させることができる。樹脂フィルムの表面粗さRaは、好ましくは1.0μm以下であり、より好ましくは0.9μm以下であり、さらに好ましくは0.8μm以下である。
本発明においては、上記の熱硬化性樹脂組成物を、従来公知の方法で成形して得ることができる。成形方法としては、例えば、プレス成形、発泡成形、射出成形、押出成形、打ち抜き成形等が挙げられる。上記のようにして製造される成形体は、用途に応じて、様々な形状に加工することができる。成形体の形状は、限定されるものではないが、例えば、フィルム状、シート状、または板状である。特に、本発明の液晶ポリマー粒子を用いることで薄膜であっても成形体の表面粗さを低くすることができるため、フィルム状の成形体に好適である。
本発明の電子回路基板は、上記の熱硬化性樹脂組成物を用いて得ることができる。また、本発明の電子回路基板は、上記の成形体を含むものである。電子回路基板としては、薄膜のフィルム状に形成しても表面粗さを抑えながら、誘電正接を低下させることができるため、フレキシブル回路基板であることが好ましい。
なお、本発明の液晶ポリマー粒子は、成形品として、上記のフィルムや電子回路基板として用いられる他、ボンディングシート、プリプレグ、カバーレイ等にも用いることができる。また、成形品に限定されず、例えば、ペースト状組成物として用いられ、その場合は、接着剤、層間絶縁材、封止材などに用いることもできる。
(合成例1)
攪拌翼を有する重合容器に、6-ヒドロキシ-2-ナフトエ酸(HNA)60モル%、4,4-ジヒドロキシビフェニル(BP)20モル%、テレフタル酸(TPA)15.5モル%、2,6-ナフタレンジカルボン酸(NADA)4.5モル%を加え、触媒として酢酸カリウムおよび酢酸マグネシウムを仕込み、重合容器の減圧-窒素注入を3回行って窒素置換を行った後、無水酢酸(水酸基に対して1.08モル当量)を更に添加し、150℃まで昇温し、還流状態で2時間アセチル化反応を行った。
(実施例1)
液晶ポリマーAの粉末を、衝突板式音速気流粉砕機(内蔵分級機(アジャストリング:60mm、センターネーブル:センターネーブル:Φ60mm、ブロア設定:-45kPa)、日本ニューマチック工業株式会社製、型番:SPK-12+UFS10)を用いて、粉砕圧0.70MPa、10kg/hの条件で粉砕した。その結果、偏平状の液晶ポリマーA1を得た。
実施例1で得た偏平状の液晶ポリマーA1を、分級機(アジャストリング高さ30mm、ディスタンスリング高さ15mm、ガイドベーン隙間4mm、センターネーブル径Φ40mm、ルーバー開度1mm、日本ニューマチック工業株式会社製、型番:DXF2)を用いて、さらに分級し、偏平状の液晶ポリマー粒子A2を得た。
粉砕圧を0.75MPaとした以外は、実施例1と同様にして粉砕した結果、偏平状の液晶ポリマーA3を得た。
液晶ポリマーAの粉末を、特許第6697644号の実施例1に記載の方法で微粉化し、真球状の液晶ポリマーA4を得た。
(粒子の長短度および偏平度の測定)
撹拌装置を備えたガラス製容器中にポリアミック酸ワニスを準備し、上記で得られた液晶ポリマー粒子を分散媒に分散させたものを添加して攪拌し、懸濁液を得た。その際、液晶ポリマー粒子の濃度がポリアミック酸100質量部に対して10~20質量部になるように調整した。得られた懸濁液をガラス基板に塗布し、乾燥後、300℃で硬化させて、厚さ約25μmのフィルムを製造した。得られたフィルムを、クライオミクロトームを用いて断面方向に切削し、厚さ0.5~2.5μmの超薄切片を作成した。厚さの調整は、観察する粒子の数平均径によって、後述の倍率での顕微鏡視野において100個以上の粒子が重なり合うことなく観察できるように設定する。体積平均径が約5μmの粒子に対しては、0.5μm厚が適当であった。上述の<液晶ポリマー粒子の長径、短径、および厚みの測定方法>に従って、得られた超薄切片の断面を光学顕微鏡((株)キーエンス製、型番:VHX6000)を用いて観察し、短径/厚みの比を粒子の偏平度とした。なお、図1は、実施例1の液晶ポリマー粒子を用いて得られたフィルムの断面方向の超薄切片を光学顕微鏡で撮影した写真である。
上記で得られた各液晶ポリマー粒子の粒径分布をレーザー回折・散乱法粒径分布測定装置(ベックマン・コールター社製、LS 13 320乾式システム、トルネードドライパウダーモジュール装着)で測定した。粒径分布を示すパラメータであるD50およびD90は、測定データから演算結果として得た。結果を表1に示した。
上記で得られた各液晶ポリマーの融点を、日立ハイテクサイエンス(株)製の示差走査熱量計(DSC)により測定した。このとき、昇温速度10℃/分で室温から360~380℃まで昇温してポリマーを完全に融解させた後、速度10℃/分で30℃まで降温し、更に10℃/分の速度で380℃まで昇温するときに得られる吸熱ピークの頂点を融点(Tm2)とした。測定結果を表1に示した。
上記で得られた各液晶ポリマーを用いて、それぞれの融点~融点+30℃条件で加熱溶融し、30mm×30mm×0.4mm(厚み)の金型を用いて射出成形し、平板状試験片を作製した。続いて、該平板状試験片を用いて、キーサイト・テクノロジー社のネットワークアナライザーN5247Aを用いて、スプリットポスト誘電体共振器法(SPDR法)により、周波数10GHzの誘電正接を測定した。なお、各種類のサンプルをN=4ずつ測定し、4回の平均値を表1に示した。
(実施例4)
撹拌装置を備えたガラス製容器中にm-トルイジン(tol)60%、4,4’-ジアミノジフェニルエーテル(DDE)40%および所定の濃度になるようにN,N-ジメチルアセトアミドを入れ、窒素雰囲気下25℃で攪拌し、溶液を得た。この溶液にピロメリット酸二無水物(PMDA)100%を数回に分けて投入し、窒素雰囲気下25℃で攪拌し、ポリアミック酸ワニスを得た。得られたポリアミック酸ワニスに、ワニス中のポリアミック酸100質量部に対して30質量部の液晶ポリマー粒子A1を添加し、懸濁液を得る。得られた懸濁液をガラス基板に塗布し、乾燥後、300℃で硬化させて、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1の添加量を、ポリアミック酸100質量部に対して50質量部とした以外は、実施例4と同様にして、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1の代わりに液晶ポリマー粒子A2を、ポリアミック酸100質量部に対して30質量部添加した以外は、実施例4と同様にして、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1の代わりに液晶ポリマー粒子A2を、ポリアミック酸100質量部に対して50質量部添加した以外は、実施例4と同様にして、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1の代わりに液晶ポリマー粒子A3を、ポリアミック酸100質量部に対して30質量部添加した以外は、実施例4と同様にして、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1の代わりに液晶ポリマー粒子A3を、ポリアミック酸100質量部に対して50質量部添加した以外は、実施例4と同様にして、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1の代わりに液晶ポリマー粒子A4を、ポリアミック酸100質量部に対して50質量部添加した以外は、実施例3と同様にして、厚さ25μmのフィルムを製造した。
液晶ポリマー粒子A1を添加しなかった以外は、実施例4と同様にして、厚さ25μmのフィルムを製造した。
(配向性の測定)
上記で製造した各フィルムについて、クライオミクロトームを用いて断面方向に切削し、厚さ0.5μmの超薄切片を作成した。得られた超薄切片を、上述の<比(a/b)の測定方法>に従って光学顕微鏡((株)キーエンス製、型番:VHX6000)を用いて断面の観察およびポリマー粒子の長軸方向とその垂直方向のフェレー径の測定を行った。長軸方向のフェレー径の平均値aと垂直方向のフェレー径の平均値bの比(a/b)を算出し、その結果を表2に示した。
上記で製造した各フィルムについて、幅4mm程度に切削して、短冊状の測定用サンプルを得た。測定用サンプルを、熱機械分析装置((株)日立ハイテクサイエンス製、型番:TMA7000)を用いて引張モードにてサンプルの線膨張係数(CTE)を測定した。測定は測定間距離15mm、30℃から230℃までの温度範囲を10℃/minで昇温、降温させ、2サイクル測定した。2サイクル目の昇温の170℃~230℃のガラス転移点以上の温度領域でCTEを測定した。測定結果を表2に示した。
上記で製造した各フィルムを3mm×80mmの短冊状に切出してフィルムサンプルを得た。続いて、フィルムサンプルの表面粗さを、オリンパス社製OLS5000型レーザー顕微鏡を用いて測定した。測定結果を表2に示した。
上記で製造した各フィルムサンプルについて、10GHzでの誘電率および誘電正接を、株式会社エーイーティー製空洞共振器をアンリツ製スペクトルネットワークアナライザーMS46122B型に接続した測定装置で測定した。測定結果を表2に示した。
上記で製造した液晶ポリマー粒子A1~A3について、以下の方法により、ワニスに添加した際の粘度を測定した。宇部興産(株)製ワニスU-ワニスA(ポリアミック酸濃度18%)をN-メチル-2-ピロリドンで2/3に希釈した溶液に、ポリアミック酸ワニス中のポリアミック酸100質量部に対して30質量部の液晶ポリマー粒子を添加し、懸濁液を得た。得られた懸濁液について、B型粘度計(IKA株式会社、装置名:ROTAVISC lo-vi Complete)にSP-4型スピンドルを装着し、回転速度100rpm、温度25℃の条件で、粘度を測定した。また、液晶ポリマー粒子を添加していないポリアミック酸ワニスについても、同様に粘度を測定した。
2:偏平状の液晶ポリマー粒子
3:長径
4:短径
5:厚み
T:TD方向
M:MD方向
6:成形体
7:長軸方向(MD方向)のフェレー径
8:長軸方向に対する垂直方向(TD方向)のフェレー径
Claims (14)
- 全体の80質量%以上の粒子が偏平状である液晶ポリマー粒子であって、
偏平状の液晶ポリマー粒子が、下記で定義される長径、短径、および厚みが下記(A)および(B)の条件:
(A)長径と短径の比である長短度が1.2以上5.0以下であること、
(B)短径と厚みの比である偏平度が1.2以上であること、
を満たすことを特徴とする、液晶ポリマー粒子。 - 融点が270℃以上であり、
粒径分布における累積分布50%径D50が20μm以下であり、かつ、累積分布90%径D90がD50の2.5倍以下である、請求項1に記載の液晶ポリマー粒子。 - 前記液晶ポリマー粒子の誘電正接が0.001以下である、請求項1または2に記載の液晶ポリマー粒子。
- 前記液晶ポリマー粒子が、ヒドロキシカルボン酸に由来する構成単位(I)と、ジオール化合物に由来する構成単位(II)と、ジカルボン酸に由来する構成単位(III)と、を含む、請求項1~3のいずれか一項に記載の液晶ポリマー粒子。
- 前記ヒドロキシカルボン酸に由来する構成単位(I)が、6-ヒドロキシ-2-ナフトエ酸に由来する構成単位である、請求項4に記載の液晶ポリマー粒子。
- 前記構成単位(I)の組成比が、前記液晶ポリマー粒子全体の構成単位に対して、40モル%以上80モル%以下である、請求項4または5に記載の液晶ポリマー粒子。
- 請求項1~6のいずれか一項に記載の液晶ポリマー粒子と、
熱硬化性樹脂と、
を含む、熱硬化性樹脂組成物。 - 前記熱硬化性樹脂の粘度に対する前記熱硬化性樹脂組成物の粘度の比が30以下である、請求項7に記載の熱硬化性樹脂組成物。
- 前記液晶ポリマー粒子の含有量が、前記熱硬化性樹脂100質量部に対して、5質量部以上80質量部以下である、請求項7または8に記載の熱硬化性樹脂組成物。
- 前記熱硬化性樹脂が、エポキシ樹脂、フェノール樹脂、ポリイミド樹脂、およびビスマレイミドトリアジン樹脂からなる群より選択される少なくとも1種である、請求項7~9のいずれか一項に記載の熱硬化性樹脂組成物。
- 請求項8~10のいずれか一項に記載の熱硬化性樹脂組成物から形成される成形体であって、
前記成形体がフィルム状、シート状、または板状であり、
前記偏平状の液晶ポリマー粒子の、長軸方向のフェレー径の平均値aと、前記長軸方向に対する垂直方向のフェレー径の平均値bとの比(a/b)が1.2以上である、成形体。 - 前記比(a/b)が1.2以上10.0以下である、請求項11に記載の成形体。
- 前記成形体は、厚さが25μm以下の樹脂フィルムである、請求項11または12に記載の成形体。
- 前記樹脂フィルムの表面粗さRaが1.0μm以下である、請求項11~13のいずれか一項に記載の成形体。
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001131406A (ja) * | 1999-11-01 | 2001-05-15 | Toray Ind Inc | 気体および/または液体バリア成形品用樹脂組成物 |
JP2005501760A (ja) | 2001-08-30 | 2005-01-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 液晶ポリマーの粉砕 |
JP2007262334A (ja) * | 2006-03-29 | 2007-10-11 | Daicel Chem Ind Ltd | 異形状樹脂粒子を含む分散体の製造方法および異形状樹脂粒子 |
JP2015530460A (ja) * | 2012-09-27 | 2015-10-15 | ティコナ・エルエルシー | サーモトロピック液晶粉末 |
JP5904307B2 (ja) | 2013-05-22 | 2016-04-13 | 株式会社村田製作所 | フィブリル状液晶ポリマーパウダー、フィブリル化液晶ポリマーパウダーの製造方法、ペースト、樹脂多層基板、および、樹脂多層基板の製造方法 |
WO2017150336A1 (ja) * | 2016-02-29 | 2017-09-08 | ポリプラスチックス株式会社 | 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法 |
JP2019001866A (ja) | 2017-06-13 | 2019-01-10 | 住友化学株式会社 | 芳香族ポリエステル粒子および芳香族ポリエステル粒子の製造方法 |
JP6697644B1 (ja) | 2018-06-14 | 2020-05-20 | ポリプラスチックス株式会社 | 液晶性樹脂微粒子の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594307U (ja) | 1982-06-30 | 1984-01-12 | 三菱電機株式会社 | 車両用ク−リングユニツト装着装置 |
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Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001131406A (ja) * | 1999-11-01 | 2001-05-15 | Toray Ind Inc | 気体および/または液体バリア成形品用樹脂組成物 |
JP2005501760A (ja) | 2001-08-30 | 2005-01-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 液晶ポリマーの粉砕 |
JP2007262334A (ja) * | 2006-03-29 | 2007-10-11 | Daicel Chem Ind Ltd | 異形状樹脂粒子を含む分散体の製造方法および異形状樹脂粒子 |
JP2015530460A (ja) * | 2012-09-27 | 2015-10-15 | ティコナ・エルエルシー | サーモトロピック液晶粉末 |
JP5904307B2 (ja) | 2013-05-22 | 2016-04-13 | 株式会社村田製作所 | フィブリル状液晶ポリマーパウダー、フィブリル化液晶ポリマーパウダーの製造方法、ペースト、樹脂多層基板、および、樹脂多層基板の製造方法 |
WO2017150336A1 (ja) * | 2016-02-29 | 2017-09-08 | ポリプラスチックス株式会社 | 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法 |
JP6295013B2 (ja) | 2016-02-29 | 2018-03-14 | ポリプラスチックス株式会社 | 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法 |
JP2019001866A (ja) | 2017-06-13 | 2019-01-10 | 住友化学株式会社 | 芳香族ポリエステル粒子および芳香族ポリエステル粒子の製造方法 |
JP6697644B1 (ja) | 2018-06-14 | 2020-05-20 | ポリプラスチックス株式会社 | 液晶性樹脂微粒子の製造方法 |
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