WO2022056719A1 - 注塑模具及注塑方法 - Google Patents

注塑模具及注塑方法 Download PDF

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Publication number
WO2022056719A1
WO2022056719A1 PCT/CN2020/115561 CN2020115561W WO2022056719A1 WO 2022056719 A1 WO2022056719 A1 WO 2022056719A1 CN 2020115561 W CN2020115561 W CN 2020115561W WO 2022056719 A1 WO2022056719 A1 WO 2022056719A1
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WO
WIPO (PCT)
Prior art keywords
cover plate
cavity
power module
holes
injection mold
Prior art date
Application number
PCT/CN2020/115561
Other languages
English (en)
French (fr)
Inventor
吴凡坤
吕镇
侯召政
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20953578.0A priority Critical patent/EP4205942A4/en
Priority to PCT/CN2020/115561 priority patent/WO2022056719A1/zh
Priority to CN202080012415.4A priority patent/CN114514105B/zh
Publication of WO2022056719A1 publication Critical patent/WO2022056719A1/zh
Priority to US18/183,988 priority patent/US20230219269A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/36—Moulds having means for locating or centering cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2608—Mould seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B29C45/2675—Mounting of exchangeable mould inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/28—Closure devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present application relates to the field of packaging technology, and in particular, to an injection mold and an injection method.
  • Power modules are power electronic devices that are re-potted into a module according to a certain functional combination, and are widely used in servo motors, frequency converters, inverters and other fields.
  • the power module is provided with pins, which can facilitate the rapid crimping or welding of the system side.
  • the pins pass through the injection mold.
  • the entire injection mold needs to be replaced to adapt to different The pins of the new power module pass through, which is extremely unfriendly to design changes and the development of new power modules of the same series, and the injection mold development cycle is long and the cost is high.
  • the present application provides an injection mold and an injection method, which realizes that the same set of injection molds can be compatible with the same series of power modules with different pin positions, which facilitates design changes in the development process of power modules and development of new power modules in the same series.
  • the present application provides an injection mold, comprising a casing and a cover plate, wherein the casing is provided with a mold cavity, and the mold cavity is used for accommodating a power module; the cover plate is provided with a plurality of through holes, the A cover plate is detachably connected to the housing, the cover plate is located in the mold cavity and co-locates the power module with the housing, and the plurality of through holes are used for matching a plurality of pins of the power module .
  • a cover plate is provided, and the cover plate is provided with through holes for the pins to pass through.
  • the same set of injection molds can be compatible with the same series of power at different pin positions.
  • the module specifically, the housing includes a first shell and a second shell, the first shell is provided with a first cavity, and the second shell is provided with a second cavity (the first cavity and the second cavity form Mold cavity), the first shell and the second shell are fixed on the equipment or the mold frame, the power module is put into the second cavity, the cover plate is matched with the power module, so that the pins of the power module pass through the through holes, and then The first casing, the cover plate, the power module and the second casing are press-fitted to achieve injection sealing.
  • the positions of the through holes of different cover plates are arranged in different ways.
  • injecting power modules with pins with different arrangements it is only necessary to replace the cover plate with the corresponding through holes to realize the injection molding seal, instead of replacing the whole.
  • the injection mold improves the utilization rate of the first shell and the second shell, and solves the problems of long development cycle and high cost of the injection mold, and the production line can also greatly reduce the workload when switching the same series of power modules. Improve production line efficiency.
  • the present application provides an injection mold, comprising: a shell with a mold cavity inside, and the mold cavity is used for accommodating a power module; and at least two cover plates, each of which is provided with a plurality of through holes , and the arrangement of the through holes on different cover plates is different to match multiple pins of the power modules of different models; the casing is selectively connected to one of the plurality of cover plates or cooperate to co-locate the power module.
  • a set of injection molds of the present application may include a shell (ie, a first shell and a second shell) and at least two cover plates.
  • the at least two cover plates include a first cover plate and a second cover (the number of the first cover plate and the second cover plate can be multiple), the first cover plate is provided with a plurality of first through holes, the second cover plate is provided with a plurality of second through holes, the first The arrangement of the holes on the first cover plate is different from the arrangement of the second through holes on the second cover plate.
  • Both the first cover plate and the second cover plate can be detachably connected in the membrane cavity.
  • the through-hole and the plurality of second through-holes are used for pin passing of different types of power modules.
  • the injection mold further includes an elastic connection structure, and the elastic connection structure is connected to the cover plate, so as to realize the elastic connection between the cover plate and the housing.
  • the elastic connection structure is connected to the cover plate, and the other end of the elastic connection structure is detachably connected to the inside of the casing, the casing compresses the elastic connection structure, and the elastic connection structure applies elastic pressure to the cover plate, so that the cover plate and the power Module press fit.
  • the elastic connection structure includes a top post and an elastic piece, the top post and the cover plate are elastically connected by the elastic piece, and the top post is in contact with the inner surface of the housing.
  • the elastic member can be a spring or the like, which exerts pressure on the cover plate when being compressed, so that the cover plate and the plate body of the power module can be pressed tightly, so as to prevent the plate body of the power module from being broken by the injection pressure.
  • the cover plate includes a first surface and a second surface opposite to each other, the through hole penetrates the first surface and the second surface, and the top column includes a first column body and a second surface.
  • the second column body, the first column body is located on one side of the first surface of the cover plate, the second column body includes a limiting part and a connecting part, the cover plate is provided with a limiting hole, so The limiting portion is located in the limiting hole and cooperates with the limiting structure in the limiting hole to prevent the limiting portion from moving out of the cover plate from one side of the first surface.
  • the connecting portion protrudes out of the limiting hole and is fixedly connected with the first cylinder, and the elastic member is sleeved on the connecting portion and elastically abuts between the first surface and the first cylinder.
  • the top column is a retractable structure, and the top column drives the elastic member to compress, so that the cover plate and the board body of the power module are closely attached, and then the injection molding process is performed. .
  • the top column and the elastic part can be integrated with the cover plate under the condition of ensuring the machining accuracy. It can be understood that the top post and the elastic member form a retractable elastic connection structure.
  • the elastic connection structure is used to apply pressure to the cover plate to compress the power module.
  • the elastic connection structure is not limited to the way in which the top post and the elastic member cooperate. For other elastic connection structures.
  • the housing includes a first casing and a second casing, the first casing is provided with a first cavity, and the first cavity includes a first sub-cavity and a second sub-cavity A sub-cavity, a step surface is formed at the connection between the first sub-cavity and the second sub-cavity, the second shell includes the second cavity, and the first shell and the second sub-cavity form a step surface.
  • the two shells are fastened together so that the second cavity and the first cavity communicate with each other, the cover plate is located in the first sub-cavity, part of the power module is located in the second cavity, part of the The power module is located in the second sub-cavity and is in contact with the stepped surface.
  • the colloid is injected into the second sub-cavity and the second cavity, and some power modules are in contact with the stepped surface to prevent the colloid from overflowing into the first sub-cavity and bonding the pins extending into the first sub-cavity.
  • the size of the board body of the power module is larger than the size of the first sub-cavity.
  • the size and shape of the first cavity of the same set of injection molds need to be set according to the positions and sizes of pins of the same series of power modules.
  • the first sub-cavity is an overall hollowed-out structure, and the pins extend into the first sub-cavity through the through holes, which is convenient for cleaning when glue overflows. Specifically, when the glue overflows into the first sub-cavity and sticks to the On the inner wall of the first sub-cavity, the first shell and the second shell can be separated, and the first sub-cavity hollowed out as a whole can be cleaned separately.
  • the number of the through holes of each cover plate is greater than or equal to the number of the pins of the power module, and the arrangement of the through holes of each cover plate is at least A plurality of the pins of one of the power modules are matched.
  • the number of through holes of the cover plate is equal to the number of pins of the matching power module, that is, the through holes correspond to the pins one by one, it can prevent the glue from overflowing through too many through holes that are not inserted by the pins.
  • Such a cover The board corresponds to one type of power module, and another cover plate needs to be replaced when another power module with different pin positions appears.
  • the number of through holes of each cover plate can also be set to be greater than the number of pins of the power module, so that the same cover
  • the board can be compatible with at least two power modules with different pin positions, which solves the problems of long development cycle and high cost of injection molds, and the production line can greatly reduce the workload when switching the same series of power modules, improving the production line. effectiveness.
  • the through hole includes a first section and a second section, a limit surface is formed between the first section and the second section, and the pin includes a main body portion and a protruding portion.
  • the fixing part on the periphery of the main body part, the connection between the main body part and the fixing part forms a stepped surface, the first section is used for accommodating the main body part, and the second section is used for accommodating the fixing part , the step surface is in contact with the limiting surface, so as to realize the sealed connection between the cover plate and the pin.
  • the sealing connection between the cover plate and the pin can prevent the injection molding compound from overflowing into the first sub-cavity through the gap between the inner wall of the through hole and the pin during injection molding.
  • the specific structure of the pin includes but is not limited to cylindrical pin, regular polygon pin, When the specific structure of the pin, flat pin, irregular pin, and pin changes, the shape of the through hole also changes accordingly.
  • the cover plate includes a first surface and a second surface opposite to each other, the through hole penetrates the first surface and the second surface, and a sealing gasket is provided on the second surface , and the sealing gasket is arranged on the periphery of the through hole, and/or a sealing gasket is arranged on the limiting surface of the through hole.
  • the sealing gasket can realize tighter sealing between the pins and the cover plate, and prevent the injection molding colloid from overflowing into the first sub-cavity through the gap between the inner wall of the through hole and the pins during injection molding.
  • the cover plate includes a first surface and a second surface opposite to each other, the through hole penetrates through the first surface and the second surface, and the second surface of the cover plate A limit block is provided, the power module is provided with a limit hole, and the limit block is embedded in the limit hole to limit the positions of the cover plate assembly and the power module.
  • the cover plate and the power module are detachably connected by means of the limit block and the limit hole, and the functions of positioning and fixing are realized.
  • the power module is fixed on a bracket, and the bracket is overlapped with the edge of the housing to define the position of the power module in the mold cavity.
  • the positioning of the power module can also be achieved through other structures.
  • a positioning member is provided on the circuit board of the power module, and a positioning hole is formed on the casing, and the positioning hole is embedded in the positioning member to realize the positioning of the power module on the casing.
  • a plurality of installation areas can be arranged on the bracket at intervals (the installation area is the hollow area on the bracket, and the power module is fixed to the installation area), and the installation area on each bracket can be two, three, four, Five, etc., in other words, multiple power modules can be set at intervals on each bracket at the same time.
  • one injection mold corresponds to one power module, so that multiple power modules can be injected and sealed at the same time, which improves the packaging efficiency of the production line. .
  • the cover plate is one or more of titanium alloy, copper alloy, and stainless steel.
  • the cover plate usually has the characteristics of small thermal expansion coefficient, high temperature resistance and high strength.
  • the cover plate is one or more of titanium alloy, copper alloy, stainless steel, etc. Light weight, easy to install during mold closing and disassembly during demolding, and easy to replace the cover plate.
  • the number of the top pillars is multiple, and the plurality of the top pillars are symmetrically distributed on the first surface.
  • the number of top pillars can be multiple, and the multiple top pillars are symmetrically and evenly distributed on the cover plate, so as to ensure that the entire cover plate is subjected to uniform pressure during compression, so as to compress the power module and prevent uneven force on the cover plate.
  • the cover plate and the plate body of the power module cannot be partially compressed, so that the injection pressure partially breaks the plate body of the power module.
  • the present application provides an injection molding method, which provides an injection mold, the injection mold includes a shell and at least two cover plates, the shell is provided with a mold cavity, and each of the cover plates is provided with a plurality of through holes, And the arrangement of the through holes on different cover plates is different; according to the pin distribution of the power module to be injection molded, select one of the cover plates, and the arrangement of the through holes on the cover plate
  • the arrangement pattern matches the arrangement pattern of the pins of the power module; the power module to be injection-molded is placed in the mold cavity; the cover plate is mounted on the to-be-injected power module, The pins are made to pass through the through holes.
  • the first shell and the second shell are butted together to form a shell, the shell surrounds the cover plate and the power module, and the shell is provided with a glue injection port for the colloid (the colloid can be silica gel, Silicon gel, resin, etc.) are injected into the second sub-cavity and the second cavity, and the power module is completely injection-molded and sealed, so as to protect the power module from insulation and dust.
  • the glue injection port for the colloid the colloid can be silica gel, Silicon gel, resin, etc.
  • the power module is completely injection-molded and sealed, so as to protect the power module from insulation and dust.
  • the injection mold of the present application has a simple structure, and by replacing the cover plates with different through-hole arrangements, the same set of injection molds can be compatible with the same series of power modules with different pin positions, and the casing (the first shell and the second shell) can be improved. ) utilization rate, which solves the problems of long development cycle and high cost of injection molds, and the production line can greatly reduce the workload when switching the same series of power modules and improve the efficiency of the production line.
  • FIG. 1 is a schematic diagram of a power module packaged by an injection mold provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of an injection mold provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an injection mold provided in an embodiment of the present application before mold clamping
  • FIG. 4 is a schematic structural diagram of an injection mold provided in an embodiment of the present application after mold clamping
  • FIG. 5 is a schematic diagram of a cover plate and an elastic connection structure provided by an embodiment of the present application.
  • 6a is a schematic structural diagram of a through hole provided by an embodiment of the present application.
  • 6b is a schematic structural diagram of a through hole and a pin matching provided by an embodiment of the present application.
  • 6c is a schematic structural diagram of a through hole and a sealing gasket provided in an embodiment of the present application.
  • FIG. 7 is a top view of a cover plate and an elastic connection structure provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a silicone pad provided in an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a power module provided by an embodiment of the present application.
  • FIG. 10 is a flowchart of an injection molding method provided by an embodiment of the present application.
  • the present application provides an injection mold and an injection method.
  • Injection molds are mainly used in the packaging of power modules.
  • Power modules are power electronic devices that are re-potted into a module according to a certain combination of functions, with high current density, low saturation voltage, high voltage resistance, high input impedance, high switching frequency and low
  • the advantages of driving power, and the logic, control, detection and protection circuits are integrated inside the power module, which not only reduces the volume and development time of the system, but also greatly enhances the reliability of the system, which is convenient to use and adapts to today's power device modules. It is widely used in servo motors, frequency converters, inverters and other fields.
  • synthetic resin is usually used to encapsulate the power module to improve insulation and protection, so that the power module is not affected by the environment.
  • FIG. 1 is a schematic diagram of a power module packaged by an injection mold.
  • the injection mold 20 is fixed to the device 10 (the device 10 can be a plastic sealing machine).
  • the power module 30 is packaged into the injection mold 20 by operating the device 10 to realize the injection sealing of the power module 30 to achieve insulation. and protection.
  • the application provides an injection mold, and the specific structure of the injection mold is as follows:
  • Figure 2 is a schematic structural diagram of the injection mold
  • Figure 3 is a schematic structural diagram of the injection mold before clamping (with a power module placed)
  • Figure 4 is a schematic structural diagram of the injection mold after clamping .
  • the injection mold 20 includes a shell 21 and a cover plate 22.
  • the shell 21 includes a first shell 211 and a second shell 212.
  • the shell 21 is provided with a mold cavity 213.
  • the first shell 211 has a first cavity 2111 and a second shell.
  • the body 212 is provided with a second cavity 2121
  • the mold cavity 213 includes a first cavity 2111 and a second cavity 2121
  • the mold cavity 213 is used for accommodating the power module 30 .
  • the cover plate 22 is provided with a plurality of through holes 221 , the cover plate 22 is detachably connected to the casing 21 , the cover plate 22 is located in the mold cavity 213 and co-locates the power module 30 with the casing 21 , and the plurality of through holes 221 are used for matching the power module 30 of multiple pins 31.
  • a set of injection molds 20 may include a shell 21 (ie, a first shell 211 and a second shell 212 ) and at least two cover plates 22 .
  • the at least two cover plates 22 include a first shell 211 and a second shell 212 A cover plate and a second cover plate (the number of the first cover plate and the second cover plate can be multiple), the first cover plate is provided with a plurality of first through holes, and the second cover plate is provided with a plurality of first through holes Two through holes, the arrangement of the first through holes on the first cover plate is different from the arrangement of the second through holes on the second cover plate, both the first cover plate and the second cover plate can be detachably connected to the membrane In the cavity, a plurality of first through holes and a plurality of second through holes are used for the pins 31 of different types of power modules 30 to pass through.
  • the cover plate 22 is provided, and the cover plate 22 is provided with through holes 221 for the pins 31 to pass through.
  • a series of power modules 30 with different pin 31 positions specifically, the first housing 211 and the second housing 212 are fixed on the equipment or the mold frame, and the power module 30 is placed in the second cavity 2121 of the second housing 212 Inside, the cover plate 22 is matched with the power module 30 so that the pins 31 of the power module 30 pass through the through holes 221, and then the first casing 211, the cover plate 22, the power module 30 and the second casing 212 are press-fitted Achieve injection molding seal.
  • the positions of the through holes 221 of different cover plates 22 are different.
  • the plate 22 can achieve injection sealing without replacing the entire injection mold 20, which improves the utilization rate of the first shell 211 and the second shell 212, and solves the problems of long development cycle and high cost of the injection mold 20, and the production line.
  • the first casing 211 and the second casing 212 are fastened together to form the outer shell 21 of the injection mold 20 , so that the second cavity 2121 and the first cavity 2111 communicate with each other for packaging the power module 30 .
  • the first cavity 2111 inside the first housing 211 includes a first sub-cavity 2112 and a second sub-cavity 2113, and the second sub-cavity 2113 is butted with the second cavity 2121, so that the first cavity The body 2111 and the second cavity 2121 form a mold cavity 213 .
  • the size of the second sub-cavity 2113 is larger than that of the first sub-cavity 2112, the cover plate 22 is located in the first sub-cavity 2112, and the power module 30 is located in the second sub-cavity 2113 and the second sub-cavity 2121 (in other words, Part of the power module 30 is located in the second cavity 2121 , and part of the power module 30 is located in the second sub-cavity 2113 ), and the pins 31 of the power module 30 extend into the first sub-cavity 2112 .
  • the connection between the first sub-cavity 2112 and the second sub-cavity 2113 forms a stepped surface (in order to distinguish it from the stepped surface on the pin 31 , the stepped surface here is called the first stepped surface 43 ), and the power module
  • the plate body 32 of 30 is located in the second sub-cavity 2113 , and the plate body 32 is in contact with the first stepped surface 43 to prevent the colloid from overflowing into the first sub-cavity 2112 .
  • the colloid is injected into the second sub-cavity 2113 and the second cavity 2121, and the contact between the plate body 32 and the first stepped surface 43 can prevent the colloid from overflowing into the first sub-cavity 2112 and sticking into the first sub-cavity 2112.
  • the first shell 211 is crimped on the board body 32, that is, the board body 32 and the first step face 43 contacts.
  • the size of the second sub-cavity 2113 and the second cavity 2121 is larger than the size of the power module 30 to accommodate the power module 30.
  • the specific size and shape of the second sub-cavity 2113 and the second cavity 2121 need to be based on the power after packaging
  • the application environment of the module 30 is set.
  • the size and shape of the first cavity 2111 of the same set of injection molds 20 need to be set according to the position and size of the pins 31 of the same series of power modules.
  • the cover plate 22 is provided with an elastic connection structure 23 to realize the elastic connection between the cover plate 22 and the casing 21 .
  • the elastic connecting structure 23 includes a top post 231 and an elastic piece 232 , the top post 231 and the cover plate 22 are elastically connected by the elastic piece 232 , and the top post 231 is in contact with the inner surface of the housing 21 .
  • the cover plate 22 includes a first surface 222 and a second surface 223 opposite to each other, and the through hole 221 penetrates the first surface 222 and the second surface 223 .
  • the top column 231 includes a first column 2311 and a second column 2312 .
  • the first column 2311 is located on the side of the first surface 222 of the cover plate 22
  • the second column 2312 includes a limiting portion 2313 and a connecting portion 2314 .
  • the cover plate 22 is provided with a limit hole 224
  • the limit portion 2313 is located in the limit hole 224 and cooperates with the limit structure of the limit hole 224 to prevent the limit portion 2313 from moving out of the cover plate from one side of the first surface 222 22.
  • the connecting portion 2314 protrudes from the limiting hole 224 and is fixedly connected with the first cylinder 2311 .
  • the elastic member 232 is sleeved on the connecting portion 2314 and elastically abuts between the first surface 222 and the first cylinder 2311 .
  • the elastic connection structure 23 is connected to the cover plate 22, and the other end of the elastic connection structure 23 is detachably connected to the inside of the casing 21, the casing 21 compresses the elastic connection structure 23, and the elastic connection structure 23 exerts elastic pressure on the cover plate 22, so that The cover plate 22 is press-fitted with the power module 30, and the elastic member 232 may be a spring or the like.
  • the elastic connection structure 23 is not limited to the manner in which the top post 231 and the elastic member 232 cooperate, and may also be other elastic connection structures.
  • the arrangement of the through holes 221 on different cover plates 22 is different, and the positions of the through holes 221 are set corresponding to the pins 31 of the power module 30 .
  • the same set of injection molds 20 can be compatible with the same Series of power modules with different pin positions.
  • the number of through holes 221 of each cover plate 22 may be greater than or equal to the number of pins 31 of the power module 30 , and the arrangement of the through holes 221 of each cover plate 22 at least matches the plurality of pins of one power module 30 . feet 31.
  • the number of through holes 221 of the cover plate 22 is equal to the number of pins 31 of the matched power module 30 , that is, the through holes 221 correspond to the pins 31 one-to-one, it can prevent the gel from passing through too many pins that are not inserted by the pins 31 .
  • the through hole 221 overflows, such that one cover 22 corresponds to one type of power module 30, and another cover 22 needs to be replaced when another power module 30 with different pin positions appears.
  • the number of the through holes 221 of each cover plate 22 can also be set to be greater than that of each The number of pins 31 of the power module 30, so that the same cover 22 can be compatible with at least two power modules 30 with different pin positions, which solves the problems of long development cycle and high cost of the injection mold 20, and the production line is carrying out the same process.
  • the switching of series power modules can also greatly reduce the workload and improve the production line efficiency.
  • the through hole 221 includes a first section 2211 and a second section 2212, a limiting surface 2213 is formed between the first section 2211 and the second section 2212, the pin 31 includes a main body portion 311 and is protruded from the main body
  • the sealing connection between the cover plate 22 and the pins 31 can prevent the injection molding compound from overflowing into the first sub-cavity 2112 through the gap between the inner wall of the through hole 221 and the pins 31 during injection molding.
  • a sealing gasket 2214 can be provided on the second surface 223 of the cover plate 22, and the sealing gasket 2214 is arranged on the periphery of the through hole 221,
  • the sealing gasket 2214 may be fixed on the second surface 223 in an integrated structure, or the sealing gasket 2214 may be a separate structure, that is, a plurality of sealing gaskets 2214 spaced apart from each other are provided on the second surface 223 .
  • a sealing gasket 2214 may also be provided on the limiting surface 2213 of the through hole 221 .
  • the arrangement of the sealing gasket 2214 can ensure that the colloid can be prevented from overflowing through the gap between the through hole 221 and the pin 31 during the injection molding process.
  • the cover plate 22 generally has the characteristics of low thermal expansion coefficient, high temperature resistance and high strength.
  • the cover plate 22 can be one or more of titanium alloy, copper alloy, stainless steel, etc.
  • the cover plate 22 made of titanium alloy, copper alloy and stainless steel has a small thermal expansion coefficient and light weight, which is convenient for installation and demolding during mold clamping. During disassembly, the cover plate 22 can be easily replaced.
  • the side of the cover plate 22 (the side of the cover plate 22 refers to the surface of the cover plate 22 between the first surface 222 and the second surface 223 ) is attached to the inner wall of the first sub-cavity 2112 to prevent the gel from passing through the cover plate 22 .
  • the gap between the side surface and the inner wall of the first sub-cavity 2112 overflows to the first surface 222 .
  • FIG. 7 is a top view of the cover plate assembly.
  • the number of the top pillars 231 can be multiple, and the multiple top pillars 231 are symmetrically and evenly distributed on the cover plate 22, so as to ensure that the cover plate 22 as a whole is subjected to uniform pressure during compression, so as to compress the power module 30 and prevent the cover plate. 22 is not uniformly stressed, so that the cover plate 22 and the plate body 32 of the power module 30 cannot be partially compressed, so that the injection pressure partially breaks the plate body 32 of the power module 30 .
  • the first housing 211 contacts the top post 231 and applies pressure to the top post 231 , the top post 231 drives the elastic member 232 to compress (the top post 231 is a retractable structure), so that the cover plate 22 and the power The plate body 32 of the module 30 is closely attached, and then injection molding is performed.
  • the top post 231 and the elastic member 232 can be integrated with the cover plate 22 under the condition of ensuring the machining accuracy.
  • the arrangement of the elastic member 232 can make the cover plate 22 press the plate body 32 of the power module 30 tightly, so as to prevent the plate body 32 of the power module 30 from being broken by the injection pressure.
  • the positioning connection between the cover plate 22 and the power module 30 is achieved by means of limit blocks and limit holes.
  • the second surface 223 of the cover plate 22 is provided with a limit block 41
  • the power module 30 is provided with a limit hole 42 (in order to distinguish it from the limit hole 224 on the cover plate 22 , the limit hole on the power module 30 is called the first limit hole 42 ), and the limit block 41 is detachably inserted. in the first limiting hole 42 and realize the functions of positioning and fixing.
  • the cover plate 22 and the power module 30 are positioned and fixed through the detachable connection between the limiting block 41 and the first limiting hole 42 .
  • the power module 30 includes pins 31 , a board body 32 , a silicone pad 33 , a circuit board 34 , an electronic component 35 and a bracket 36 .
  • the electronic component 35 is located on the circuit board 34, one end of the pin 31 is fixed to the circuit board 34, and the other end of the pin 31 passes through the silicone pad 33 and the through hole on the board body 32 in turn (in order to communicate with the cover plate 22).
  • the holes 221 are distinguished, and the through holes on the silicone pad 33 and the plate body 32 are called first through holes 45).
  • the silicone pad 33 may also be an integral structure or a split structure, which is not limited in this application.
  • the pins 31 protrude into the first sub-cavity 2112 through the through holes 221.
  • the first sub-cavity 2112 is a hollowed-out structure as a whole, which is convenient for cleaning when glue overflows (specifically, when the glue overflows into the first sub-cavity)
  • glue overflows specifically, when the glue overflows into the first sub-cavity
  • the specific structures of the pins 31 include but are not limited to cylindrical pins, regular polygon pins, flat pins, and irregular pins, which are not limited in this application, and can be set according to specific application environments.
  • the number and position distribution of the pins 31 need to be set according to a specific application environment, which is not limited in this application.
  • the silica gel pad 33 may be a silica gel pad with low hardness, for example, a soft silica gel material, or other sealing materials such as rubber pads, which are not limited in this application.
  • the circuit board 34 includes, but is not limited to, an aluminum-based resin copper clad laminate, a copper-based resin copper clad laminate, or a double-sided copper clad ceramic laminate, and electronic components 35 with functions such as inverter, rectifier, braking, and buffering are welded on the circuit board 34 .
  • the bracket 36 is overlapped with the edge of the second casing 212 to define the position of the power module 30 in the second cavity 2121 .
  • the power module 30 can also be positioned by other structures.
  • the circuit board 34 of the power module 30 is provided with a positioning member
  • the second housing 22 is provided with positioning holes
  • the positioning holes are embedded in the positioning members to realize power Positioning of the module 30 on the second housing 212 .
  • a plurality of installation areas 361 may be provided at intervals on the bracket 36 (the installation area 361 is the hollow area on the bracket 36 , and the power module 30 is fixed to the installation area 361 ), and FIG. 9 only schematically shows two installation areas 361, the installation areas on each bracket 36 may also be three, four, five, etc., which are not limited in this application.
  • multiple power modules 30 can be disposed on each bracket 36 at intervals.
  • one injection mold 20 corresponds to one power module 30, so that multiple power modules 30 can be injected and sealed at the same time, which improves the packaging of the production line. effectiveness.
  • the present application provides an injection molding method. As shown in FIG. 10 , the injection molding method in one embodiment specifically includes the following steps:
  • the injection mold 20 includes a casing 21 and at least two cover plates 22 .
  • the housing 21 is provided with a mold cavity 213 , and each cover plate 22 is provided with a plurality of through holes 221 , and the arrangement of the through holes 221 on different cover plates 22 is different.
  • the arrangement of the through holes 221 on the cover plate 22 matches the arrangement of the pins 31 of the power module 30 .
  • T30. Install the cover plate 22 on the power module to be injection molded.
  • the power module to be injection molded is first placed in the mold cavity 213 , and the pins 31 pass through the through holes 221 when the cover plate 22 is mounted on the power module to be injection molded.
  • the first shell 211 and the second shell 212 are butted together to form the shell 21.
  • the shell 21 surrounds the cover plate 22 and the power module 30.
  • Silica gel, silicone gel, resin, etc. can be injected into the second sub-cavity 2113 and the second cavity 2121, so that the colloid overflows the inner space of the second sub-cavity 2113 and the second cavity 2121 and the colloid is cured
  • the power module 30 is completely injection-molded and sealed, so that the power module 30 can be insulated and protected from dust.
  • the first shell 211 and the second shell 212 are separated, the top post 231 and the elastic member 232 are restored to an uncompressed state, and the cover plate 22 and the plastic-encapsulated power module 30 can be taken out.
  • the present application designs a universal injection mold 20 that can be flexibly replaced.
  • the injection mold 20 includes a casing 21 and a replaceable cover plate 22. Only by replacing the cover plate 22, the same set of injection molds 20 can be compatible with the same series of different injection molds.
  • the power module at the position of foot 31 reduces the cost of replacing the injection mold 20 and improves the efficiency of the production line.
  • the injection mold 20 of the present application is suitable for power modules with the same external dimensions but different positions of the pins 31, avoiding the problems of high cost and long cycle time when a new injection mold 20 needs to be redeveloped when the same series of new power modules are developed. .
  • the injection mold has the advantages of simple structure, easy operation, high reliability and versatility.

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Abstract

本申请提供一种注塑模具和注塑方法。注塑模具包括外壳和盖板，外壳内设模腔，模腔内用于收容功率模块；盖板设有多个通孔，盖板可拆卸连接至外壳，盖板位于模腔内且与外壳共同定位所述功率模块，多个通孔用于匹配功率模块的多个引脚。本申请通过设置盖板，并在盖板上设有供引脚穿过的通孔，通过更换通孔排布方式不同的盖板，可以实现同一套注塑模具兼容同一系列不同引脚位置的功率模块。不同盖板的通孔的排布方式不同，针对具有不同的排布方式的引脚的功率模块注塑时，只需要更换设有相应通孔的盖板即可实现注塑密封，而不用更换整个注塑模具，解决了注塑模具开发周期长、成本高的问题。

Description

注塑模具及注塑方法 技术领域
本申请涉及封装技术领域，尤其涉及一种注塑模具及注塑方法。
背景技术
功率模块是功率电力电子器件按一定的功能组合再灌封成一个模块，广泛应用于伺服电机，变频器，逆变器等领域。
功率模块设有引脚，可方便系统端快速压接或者焊接，对功率模块进行封装的过程中，引脚穿过注塑模具，当引脚的位置改变时，需要更换整个注塑模具，以适应不同的功率模块的引脚穿过，对于设计更改及同系列新的功率模块开发极不友好，注塑模具开发周期长、成本高。
如何使得同一套注塑模具可以兼容同一系列不同引脚位置的功率模块应为业界的研发方向。
发明内容
本申请提供一种注塑模具及注塑方法，实现了同一套注塑模具可以兼容同一系列不同引脚位置的功率模块，方便功率模块开发过程中的设计更改及同系列新的功率模块的开发。
第一方面，本申请提供一种注塑模具，包括外壳和盖板，所述外壳内设模腔，所述模腔内用于收容功率模块；所述盖板设有多个通孔，所述盖板可拆卸连接至所述外壳，所述盖板位于所述模腔内且与所述外壳共同定位所述功率模块，所述多个通孔用于匹配所述功率模块的多个引脚。
本申请通过设置盖板，并在盖板上设有供引脚穿过的通孔，通过更换通孔排布方式不同的盖板，可以实现同一套注塑模具兼容同一系列不同引脚位置的功率模块，具体而言，外壳包括第一壳体和第二壳体，第一壳体设有第一腔体，第二壳体设有第二腔体(第一腔体和第二腔体形成模腔)，第一壳体和第二壳体固定在设备或者模架上，功率模块放入第二腔体内，盖板与功率模块配合，以使功率模块的引脚穿过通孔，然后将第一壳体、盖板、功率模块和第二壳体压紧配合实现注塑密封。不同盖板的通孔位置的排布方式不同，针对具有不同的排布方式的引脚的功率模块注塑时，只需要更换设有相应通孔的盖板即可实现注塑密封，而不用更换整个注塑模具，提高了第一壳体和第二壳体的使用率，解决了注塑模具开发周期长、成本高的问题，且产线在进行同一系列功率模块的切换时也可大大降低工作量，提高了产线效率。
第二方面，本申请提供一种注塑模具，包括：外壳，内设模腔，所述模腔内用于收容功率模块；至少两个盖板，各所述盖板上均设多个通孔，且不同的所述盖板上的所述通孔的排布方式不同，以匹配不同型号的所述功率模块的多个引脚；所述外壳选择性地与多个所述盖板之一者配合共同定位所述功率模块。
本申请的一套注塑模具可以包括一个外壳(即一个第一壳体和一个第二壳体)和至少两个盖板，可以理解地，至少两个盖板包括第一盖板和第二盖板(第一盖板和第二盖板的 数量都可以为多个)，第一盖板上设多个第一通孔，第二盖板上设有多个第二通孔，第一通孔在第一盖板上的排列方式不同于第二通孔在第二盖板上的排列方式，第一盖板和第二盖板均能够可拆卸地连接在膜腔内，多个第一通孔和多个第二通孔用于不同型号的功率模块的引脚穿过。
一种可能的实施方式中，所述注塑模具还包括弹性连接结构，所述弹性连接结构连接至所述盖板，以实现所述盖板和所述外壳之间的弹性连接。具体而言，弹性连接结构的一端连接至盖板，弹性连接结构的另一端可拆卸地连接至外壳的内部，外壳压缩弹性连接结构，弹性连接结构对盖板施加弹性压力，使得盖板与功率模块压紧配合。
一种可能的实施方式中，所述弹性连接结构包括顶柱和弹性件，所述顶柱与所述盖板通过所述弹性件弹性连接，所述顶柱与所述外壳的内表面接触。弹性件可以为弹簧等，在受到压缩时对盖板施加压力，可使得盖板与功率模块的板体压紧，避免注塑压力把功率模块的板体冲破。
一种可能的实施方式中，所述盖板包括相对的第一表面和第二表面，所述通孔贯穿所述第一表面和所述第二表面，所述顶柱包括第一柱体和第二柱体，所述第一柱体位于所述盖板的所述第一表面的一侧，所述第二柱体包括限位部和连接部，所述盖板设有限位孔，所述限位部位于所述限位孔内，且与所述限位孔内的限位结构配合，以防止所述限位部从所述第一表面的一侧移出所述盖板，所述连接部伸出所述限位孔且与所述第一柱体固定连接，所述弹性件套设在所述连接部上且弹性抵持在所述第一表面和第一柱体之间。合模时，第一壳体接触顶柱并对顶柱施加压力，顶柱为可伸缩的结构，顶柱带动弹性件压缩，使得盖板与功率模块的板体紧密贴合，然后进行注塑处理。顶柱和弹性件在保证加工精度的条件下可以与盖板为一体式结构。可以理解地，顶柱和弹性件组成了可以伸缩的弹性连接结构，弹性连接结构用于对盖板施加压力以压紧功率模块，弹性连接结构不限于顶柱和弹性件配合的方式，也可以为其他的弹性连接结构。
一种可能的实施方式中，所述外壳包括第一壳体和第二壳体，所述第一壳体设有第一腔体，所述第一腔体包括第一子腔体和第二子腔体，所述第一子腔体和所述第二子腔体的连接处形成台阶面，所述第二壳体包括所述第二腔体，所述第一壳体和所述第二壳体扣合，以使所述第二腔体和所述第一腔体连通，所述盖板位于所述第一子腔体，部分所述功率模块位于所述第二腔体，部分所述功率模块位于所述第二子腔体且与所述台阶面接触。注塑处理的过程中，胶体注入第二子腔体与第二腔体内，部分功率模块与台阶面接触可以防止胶体溢出到第一子腔体内粘接伸入第一子腔体内的引脚。具体地，功率模块的板体的尺寸大于第一子腔体的尺寸，合模的过程中，第一壳体压接在板体上，即板体与台阶面接触。
可以理解地，同一套注塑模具的第一腔体的尺寸、形状需要根据同一系列功率模块的引脚的位置和尺寸进行设置。第一子腔体为整体挖空的结构，引脚穿过通孔伸入第一子腔体内，出现溢胶时便于清理，具体而言，当胶体溢出到第一子腔体内且粘覆到第一子腔体的内壁上，可以把第一壳体与第二壳体分离，并单独清理整体挖空的第一子腔体。
一种可能的实施方式中，每个所述盖板的所述通孔的数量大于等于所述功率模块的所述引脚的数量，每个所述盖板的所述通孔的排列方式至少匹配一个所述功率模块的多个所述引脚。盖板的通孔的数量等于相匹配的功率模块的引脚的数量时，即通孔与引脚一一对 应，可以防止胶体通过过多的未被引脚插入的通孔溢出，这样一个盖板对应一种功率模块，当出现另一种引脚位置不同的功率模块时就要更换另一个盖板。当功率模块的板体与第一壳体的密封效果良好，胶体不会溢出到盖板时，也可以设置每个盖板的通孔的数量大于功率模块的引脚的数量，这样同一个盖板可以兼容至少两个引脚位置不同的功率模块，解决了注塑模具开发周期长、成本高的问题，且产线在进行同一系列功率模块的切换时也可大大降低工作量，提高了产线效率。
一种可能的实施方式中，所述通孔包括第一段和第二段，所述第一段和所述第二段之间形成限位面，所述引脚包括主体部和突出设置在所述主体部外围的固定部，所述主体部和所述固定部的连接处形成台阶面，所述第一段用于收容所述主体部，所述第二段用于收容所述固定部，所述台阶面与所述限位面接触，以实现所述盖板与所述引脚的密封连接。盖板与引脚密封连接可以防止注塑时，注塑胶体通过通孔内壁与引脚之间的间隙溢出到第一子腔体内，引脚的具体结构包括但不限于圆柱状引脚、正多边形引脚、扁状引脚、不规则状引脚，引脚的具体结构改变时，通孔的形状也相应改变。
一种可能的实施方式中，所述盖板包括相对的第一表面和第二表面，所述通孔贯穿所述第一表面和所述第二表面，所述第二表面上设有密封垫，且所述密封垫设于所述通孔的外围，和/或，所述通孔的所述限位面上设有密封垫。密封垫可以实现引脚与盖板更紧密的密封，防止注塑时，注塑胶体通过通孔内壁与引脚之间的间隙溢出到第一子腔体内。
一种可能的实施方式中，所述盖板包括相对的第一表面和第二表面，所述通孔贯穿所述第一表面和所述第二表面，所述盖板的所述第二表面设有限位块，所述功率模块设有限位孔，所述限位块嵌入所述限位孔，以限定所述盖板组件和所述功率模块的位置。换言之，盖板和功率模块通过限位块和限位孔的方式可拆卸连接且实现定位与固定的作用。
一种可能的实施方式中，所述功率模块固定至支架上，所述支架搭接至所述外壳的边缘，以限定所述功率模块在所述模腔内的位置。可以理解地，功率模块也可以通过其他的结构实现定位，比如，功率模块的电路板上设有定位件，外壳上上设有定位孔，定位件内嵌入定位孔实现功率模块在外壳上的定位。
可以理解地，支架上可以间隔设置多个安装区(安装区即为支架上中空的区域，功率模块固定至安装区)，每个支架上的安装区可以为两个、三个、四个、五个等，换言之，每个支架上可以同时间隔设置多个功率模块，合模的过程中，一个注塑模具对应一个功率模块，这样可以同时注塑密封多个功率模块，提高了产线的封装效率。
一种可能的实施方式中，所述盖板为钛合金、铜合金、不锈钢中的一种或多种。盖板通常具有热膨胀系数小、耐高温、高强度的特性，盖板为钛合金、铜合金、不锈钢等中的一种或多种，钛合金、铜合金、不锈钢材质的盖板热膨胀系数小、质量轻，便于合模时的安装及脱模过程中的拆卸，方便更换盖板。
一种可能的实施方式中，所述顶柱的数量为多个，多个所述顶柱对称分布于所述第一表面。顶柱的数量可以为多个，多个顶柱对称、均匀的分布于盖板上，这样可以保证压缩时盖板整体受到均匀的压力，以压紧功率模块，防止盖板受力不均匀，导致盖板与功率模块的板体局部不能压紧，使得注塑压力把功率模块的板体局部冲破。
第三方面，本申请提供一种注塑方法，提供注塑模具，所述注塑模具包括外壳和至少 两个盖板，所述外壳内设模腔，各所述盖板上均设多个通孔，且不同的所述盖板上的所述通孔的排布方式不同；根据待注塑的功率模块的引脚分布情况选择其中一个所述盖板，所述盖板上的所述通孔的排布方式与所述功率模块的所述引脚的排布方式相匹配；将所述待注塑的功率模块放置在所述模腔内；将所述盖板安装至所述待注塑功率模块上，使得所述引脚穿过所述通孔。
具体而言，安装盖板后，将第一壳体和第二壳体对接形成外壳，外壳将盖板和功率模块包围，外壳上设有注胶口，用于将胶体(胶体可以为硅胶、硅凝胶、树脂等)注入第二子腔体和第二腔体内，将功率模块完全注塑密封，对功率模块起到绝缘保护和防尘的作用。脱模的过程中，第一壳体和第二壳体分离，顶柱和弹性件恢复至未压缩的状态，将盖板和注塑完成的功率模块取出。
本申请的注塑模具结构简单，通过更换通孔排列方式不同的盖板，就可以实现同一套注塑模具兼容同一系列不同引脚位置的功率模块，提高了外壳(第一壳体和第二壳体)的使用率，解决了注塑模具开发周期长、成本高的问题，且产线在进行同一系列功率模块的切换时也可大大降低工作量，提高了产线效率。
附图说明
以下对本申请实施例用到的附图进行介绍。
图1是本申请实施例提供的一种注塑模具封装功率模块的示意图；
图2是本申请实施例提供的一种注塑模具的结构示意图；
图3是本申请实施例提供的一种注塑模具合模前的结构示意图；
图4是本申请实施例提供的一种注塑模具合模后的结构示意图；
图5是本申请实施例提供的一种盖板和弹性连接结构的示意图；
图6a是本申请实施例提供的一种通孔的结构示意图；
图6b是本申请实施例提供的一种通孔与引脚配合的结构示意图；
图6c是本申请实施例提供的一种通孔与密封垫配合的结构示意图；
图7是本申请实施例提供的一种盖板和弹性连接结构的俯视图；
图8是本申请实施例提供的一种硅胶垫的结构示意图；
图9是本申请实施例提供的一种功率模块的结构示意图；
图10是本申请实施例提供的一种注塑方法的流程图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
本申请提供一种注塑模具及注塑方法。注塑模具主要应用于功率模块的封装，功率模块是功率电力电子器件按一定的功能组合再灌封成一个模块，具有高电流密度、低饱和电压、耐高压、高输入阻抗、高开关频率和低驱动功率的优点，而且功率模块内部集成了逻辑、控制、检测和保护电路，不仅减小了系统的体积以及开发时间，也大大增强了系统的可靠性，使用起来方便，适应了当今功率器件模块化、复合化的发展方向，广泛应用于伺服电机，变频器，逆变器等领域。为了保持功率模块运作的稳定性，通常采用合成树脂将 功率模块包覆封装，以提高绝缘与保护，使得功率模块不受环境的影响。
如图1所示，图1是注塑模具封装功率模块的示意图。注塑模具20固定至设备10(设备10可以为塑封机)上，合模的过程中，通过运行设备10将功率模块30封装至注塑模具20中，实现功率模块30的注塑密封，以起到绝缘和保护的作用。
首先，本申请提供一种注塑模具，注塑模具的具体结构如下：
如图2、图3和图4所示，图2是注塑模具的结构示意图，图3是注塑模具合模前的结构示意图(放置有功率模块)，图4是注塑模具合模后的结构示意图。注塑模具20包括外壳21和盖板22，外壳21包括第一壳体211、第二壳体212，外壳21内设模腔213，第一壳体211设有第一腔体2111，第二壳体212设有第二腔体2121，模腔213包括第一腔体2111和第二腔体2121，模腔213用于容纳功率模块30。盖板22设有多个通孔221，盖板22可拆卸连接至外壳21，盖板22位于模腔213内且与外壳21共同定位功率模块30，多个通孔221用于匹配功率模块30的多个引脚31。
一种可能的实现方式中，盖板22的数量至少为两个，每个盖板22上均设有通孔221，且不同盖板22上的通孔221的排布方式不同，以匹配不同型号的功率模块30的多个引脚31，外壳21选择性地与多个盖板22中的一个盖板配合且共同定位功率模块30。具体而言，一套注塑模具20可以包括一个外壳21(即一个第一壳体211和一个第二壳体212)和至少两个盖板22，可以理解地，至少两个盖板22包括第一盖板和第二盖板(第一盖板和第二盖板的数量都可以为多个)，第一盖板上设多个第一通孔，第二盖板上设有多个第二通孔，第一通孔在第一盖板上的排列方式不同于第二通孔在第二盖板上的排列方式，第一盖板和第二盖板均能够可拆卸地连接在膜腔内，多个第一通孔和多个第二通孔用于不同型号的功率模块30的引脚31穿过。
本申请通过设置盖板22，并在盖板22上设有供引脚31穿过的通孔221，通过更换通孔221排布方式不同的盖板22，可以实现同一套注塑模具20兼容同一系列不同引脚31位置的功率模块30，具体而言，第一壳体211和第二壳体212固定在设备或者模架上，功率模块30放入第二壳体212的第二腔体2121内，盖板22与功率模块30配合，以使功率模块30的引脚31穿过通孔221，然后将第一壳体211、盖板22、功率模块30和第二壳体212压紧配合实现注塑密封。不同盖板22的通孔221位置不同，功率模块30在开发的过程中进行设计更改或进行同系列新功率模块的开发改变引脚31的设计时，只需要更换设有相应通孔221的盖板22即可实现注塑密封，而不用更换整个注塑模具20，提高了第一壳体211和第二壳体212的使用率，解决了注塑模具20开发周期长、成本高的问题，且产线在进行同一系列功率模块的切换时也可大大降低工作量，提高了产线效率。
第一壳体211和第二壳体212扣合且共同形成注塑模具20的外壳21，以使第二腔体2121和第一腔体2111相通，用于封装功率模块30。具体而言，第一壳体211内部的第一腔体2111包括第一子腔体2112和第二子腔体2113，第二子腔体2113与第二腔体2121对接，以使第一腔体2111和第二腔体2121形成模腔213。第二子腔体2113的尺寸大于第一子腔体2112的尺寸，盖板22位于第一子腔体2112内，功率模块30位于第二子腔体2113与第二腔体2121内(换言之，部分功率模块30位于第二腔体2121内，部分功率模块30位于第二子腔体2113内)，且功率模块30的引脚31伸入第一子腔体2112内。
参阅图4，第一子腔体2112和第二子腔体2113的连接处形成台阶面(为了与引脚31上的台阶面区分，这里的台阶面称为第一台阶面43)，功率模块30的板体32位于第二子腔体2113内，且板体32与第一台阶面43接触，以防止胶体溢出到第一子腔体2112内。注塑处理的过程中，胶体注入第二子腔体2113与第二腔体2121内，板体32与第一台阶面43接触可以防止胶体溢出到第一子腔体2112内粘接伸入第一子腔体2112内的引脚31。可以理解地，功率模块30的板体32的尺寸大于第一子腔体2112的尺寸，合模的过程中，第一壳体211压接在板体32上，即板体32与第一台阶面43接触。
第二子腔体2113与第二腔体2121的尺寸大于功率模块30的尺寸，以容纳功率模块30，第二子腔体2113与第二腔体2121的具体尺寸和形状需要根据封装之后的功率模块30的应用环境进行设置。
可以理解地，同一套注塑模具20的第一腔体2111的尺寸、形状需要根据同一系列功率模块的引脚31的位置和尺寸进行设置。
参阅图2和图5，盖板22上设有弹性连接结构23，以实现盖板22和外壳21之间的弹性连接。弹性连接结构23包括顶柱231和弹性件232，顶柱231与盖板22通过弹性件232弹性连接，顶柱231与外壳21的内表面接触。具体而言，盖板22包括相对的第一表面222和第二表面223，通孔221贯穿第一表面222和第二表面223。顶柱231包括第一柱体2311和第二柱体2312，第一柱体2311位于盖板22的第一表面222一侧，第二柱体2312包括限位部2313和连接部2314。盖板22上设有限位孔224，限位部2313位于限位孔224内，且与限位孔224的限位结构配合，以防止限位部2313从第一表面222的一侧移出盖板22，连接部2314伸出限位孔224且与第一柱体2311固定连接，弹性件232套设在连接部2314上且弹性抵持在第一表面222和第一柱体2311之间。
弹性连接结构23的一端连接至盖板22，弹性连接结构23的另一端可拆卸地连接至外壳21的内部，外壳21压缩弹性连接结构23，弹性连接结构23对盖板22施加弹性压力，使得盖板22与功率模块30压紧配合，弹性件232可以为弹簧等。弹性连接结构23不限于顶柱231和弹性件232配合的方式，也可以为其他的弹性连接结构。
不同盖板22上的通孔221的排列方式不同，通孔221的位置与功率模块30的引脚31对应设置。当功率模块30在开发的过程中进行设计更改或进行同系列新功率模块的开发改变引脚31的设计时，更换设有相应通孔221的盖板22即可实现同一套注塑模具20兼容同一系列不同引脚位置的功率模块。
可以理解地，每个盖板22的通孔221的数量可以大于等于功率模块30的引脚31的数量，每个盖板22的通孔221的排列方式至少匹配一个功率模块30的多个引脚31。盖板22的通孔221的数量等于相匹配的功率模块30的引脚31的数量时，即通孔221与引脚31一一对应，可以防止胶体通过过多的未被引脚31插入的通孔221溢出，这样一个盖板22对应一种功率模块30，当出现另一种引脚位置不同的功率模块30时就要更换另一个盖板22。当功率模块30的板体32与第一壳体21的密封效果良好，胶体不会溢出到盖板22的通孔221时，也可以设置每个盖板22的通孔221的数量大于每个功率模块30的引脚31的数量，这样同一个盖板22可以兼容至少两个引脚位置不同的功率模块30，解决了注塑模具20开发周期长、成本高的问题，且产线在进行同一系列功率模块的切换时也可大大降低工作量， 提高了产线效率。
参阅图6a和图6b，通孔221包括第一段2211和第二段2212，第一段2211和第二段2212之间形成限位面2213，引脚31包括主体部311和突出设置在主体部311外围的固定部312，主体部311和固定部312的连接处形成台阶面313，主体部311收容在第一段2211，固定部312收容在第二段2212，台阶面313与限位面2213接触，以实现盖板22与引脚31的密封连接。盖板22与引脚31密封连接可以防止注塑时，注塑胶体通过通孔221内壁与引脚31之间的间隙溢出到第一子腔体2112内。
可以理解地，参阅图6c，为了提高盖板22和引脚31的密封效果，可以在盖板22的第二表面223上设有密封垫2214，且密封垫2214设于通孔221的外围，密封垫2214可以为一体式的结构固定在第二表面223上，密封垫2214也可以为分体式结构，即第二表面223上设置多块彼此间隔的密封垫2214。
其它实施方式中，通孔221的限位面2213上也可以设有密封垫2214。
密封垫2214的设置可以保证在注塑过程中，防止胶体通过通孔221和引脚31之间的间隙溢出。
盖板22通常具有热膨胀系数小、耐高温、高强度的特性。盖板22可以为钛合金、铜合金、不锈钢等中的一种或多种，钛合金、铜合金、不锈钢材质的盖板22的热膨胀系数小、质量轻，便于合模时的安装及脱模过程中的拆卸，方便更换盖板22。盖板22的侧面(盖板22的侧面是指盖板22位于第一表面222和第二表面223之间的表面)与第一子腔体2112的内壁贴合，防止胶体通过盖板22的侧面与第一子腔体2112内壁之间的间隙溢出到第一表面222。
参阅图7，图7为盖板组件的俯视图。顶柱231的数量可以为多个，多个顶柱231对称、均匀的分布于盖板22上，这样可以保证压缩时盖板22整体受到均匀的压力，以压紧功率模块30，防止盖板22受力不均匀，导致盖板22与功率模块30的板体32局部不能压紧，使得注塑压力把功率模块30的板体32局部冲破。
参阅图4，合模时，第一壳体211接触顶柱231并对顶柱231施加压力，顶柱231带动弹性件232压缩(顶柱231为可伸缩的结构)，使得盖板22与功率模块30的板体32紧密贴合，然后进行注塑处理。顶柱231和弹性件232在保证加工精度的条件下可以与盖板22为一体式结构。弹性件232的设置可使得盖板22与功率模块30的板体32压紧，避免注塑压力把功率模块30的板体32冲破。
如图2和图9所示，盖板22与功率模块30之间通过限位块和限位孔的方式实现定位连接，具体而言，盖板22的第二表面223设有限位块41，功率模块30上设有限位孔42(为了与盖板22上的限位孔224区分，功率模块30上的限位孔称为第一限位孔42)，限位块41可拆卸地插接于第一限位孔42且实现定位与固定的作用。换言之，盖板22和功率模块30通过限位块41和第一限位孔42的可拆卸连接实现定位与固定。
参阅图4、图8和图9，功率模块30包括引脚31、板体32、硅胶垫33、电路板34、电子元件35和支架36。电子元件35位于电路板34上，引脚31的一端固定至电路板34上，引脚31的另一端依次穿过硅胶垫33、板体32上的通孔(为了与盖板22上的通孔221区分，硅胶垫33和板体32上的通孔称为第一通孔45)。安装完成后的引脚31、板体32、 硅胶垫33、电路板34、电子元件35固定至支架36的安装区361内。硅胶垫33也可以为一体式的结构，也可以为分体式结构，本申请不做限制。
引脚31穿过通孔221伸入第一子腔体2112内，第一子腔体2112为整体挖空的结构，出现溢胶时便于清理(具体而言，当胶体溢出到第一子腔体2112内时，粘附到第一子腔体2112的内壁上，可以把第一壳体211与第二壳体212分离，并单独清理整体挖空的第一子腔体2112)。引脚31的具体结构包括但不限于圆柱状引脚、正多边形引脚、扁状引脚、不规则状引脚，本申请不做限定，可以根据具体的应用环境设置。引脚31的数量及位置分布需要根据具体的应用环境设置，本申请不做限定。
合模的过程中，硅胶垫33被压变形，为盖板22提供支撑力，且与引脚31形成密封，提供良好的密封性，防止胶体通过引脚31与板体32上的第一通孔之间的间隙溢出到第一子腔体2112内。硅胶垫33可以为硬度较小的硅胶垫，比如可以采用软硅胶材质，也可以为橡胶垫等其他密封材料，本申请不做限定。
电路板34包括但不限于铝基树脂覆铜板、铜基树脂覆铜板或者双面覆铜陶瓷板，且电路板34上焊接了具有逆变、整流、制动、缓冲等功能的电子元件35。
支架36搭接至第二壳体212的边缘，以限定功率模块30在第二腔体2121内的位置。可以理解地，功率模块30也可以通过其他的结构实现定位，比如，功率模块30的电路板34上设有定位件，第二壳体22上设有定位孔，定位件内嵌入定位孔实现功率模块30在第二壳体212上的定位。
参阅图9，支架36上可以间隔设置多个安装区361(安装区361即为支架36上中空的区域，功率模块30固定至安装区361)，图9只是示意性的显示了两个安装区361，每个支架36上的安装区也可以为三个、四个、五个等，本申请不做限定。换言之，每个支架36上可以同时间隔设置多个功率模块30，合模的过程中，一个注塑模具20对应一个功率模块30，这样可以同时注塑密封多个功率模块30，提高了产线的封装效率。
其次，本申请提供一种注塑方法，如图10所示，一种实施方式中的注塑方法具体包括以下步骤：
T10、提供注塑模具20，注塑模具20包括外壳21和至少两个盖板22。
参阅图2和图5，外壳21内设模腔213，各盖板22上均设多个通孔221，且不同的盖板22上的通孔221的排布方式不同。
T20、根据待注塑的功率模块30的引脚31分布情况选择其中一个盖板22。
可以理解地，盖板22上的通孔221的排布方式与功率模块30的引脚31的排布方式相匹配。T30、将盖板22安装至待注塑功率模块上。
具体而言，首先将待注塑功率模块放置在模腔213内，盖板22安装至待注塑功率模块时，引脚31穿过通孔221。
安装盖板22后，将第一壳体211和第二壳体212对接形成外壳21，外壳21将盖板22和功率模块30包围，外壳21上设有注胶口，用于将胶体(胶体可以为硅胶、硅凝胶、树脂等)注入第二子腔体2113和第二腔体2121内，使得胶体溢满第二子腔体2113和第二腔体2121的内部空间并对胶体进行固化成型处理，将功率模块30完全注塑密封，对功率模块30起到绝缘保护和防尘的作用。脱模的过程中，第一壳体211和第二壳体212分离，顶 柱231和弹性件232恢复至未压缩的状态，可以将盖板22和塑封完成的功率模块30取出。
本申请设计了一种可以灵活更换的通用注塑模具20，该注塑模具20包括外壳21及可替换的盖板22，只需要更换盖板22，即可实现同一套注塑模具20兼容同一系列不同引脚31位置的功率模块，降低了注塑模具20更换的成本，提高了产线效率。本申请的注塑模具20适用于外形尺寸一致，只是引脚31位置不同的功率模块，避免了当有同一系列新功率模块开发时，需要重开发新的注塑模具20，成本高且周期长的问题。该注塑模具具有结构简单、易于操作、可靠性和通用性高的优点。
以上所述是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (11)

  1. 一种注塑模具，其特征在于，包括外壳和盖板，
    所述外壳内设模腔，所述模腔内用于收容功率模块；
    所述盖板设有多个通孔，所述盖板可拆卸连接至所述外壳，所述盖板位于所述模腔内且与所述外壳共同定位所述功率模块，所述多个通孔用于匹配所述功率模块的多个引脚。
  2. 一种注塑模具，其特征在于，包括：
    外壳，内设模腔，所述模腔内用于收容功率模块；
    至少两个盖板，各所述盖板上均设多个通孔，且不同的所述盖板上的所述通孔的排布方式不同，以匹配不同型号的所述功率模块的多个引脚；
    所述外壳选择性地与多个所述盖板之一者配合共同定位所述功率模块。
  3. 如权利要求1或2所述的注塑模具，其特征在于，所述注塑模具还包括弹性连接结构，所述弹性连接结构连接至所述盖板，以实现所述盖板和所述外壳之间的弹性连接。
  4. 如权利要求3所述的注塑模具，其特征在于，所述弹性连接结构包括顶柱和弹性件，所述顶柱与所述盖板通过所述弹性件弹性连接，所述顶柱与所述外壳的内表面接触。
  5. 如权利要求4所述的注塑模具，其特征在于，所述盖板包括相对的第一表面和第二表面，所述通孔贯穿所述第一表面和所述第二表面，所述顶柱包括第一柱体和第二柱体，所述第一柱体位于所述盖板的所述第一表面的一侧，所述第二柱体包括限位部和连接部，所述盖板设有限位孔，所述限位部位于所述限位孔内，且与所述限位孔内的限位结构配合，以防止所述限位部从所述第一表面的一侧移出所述盖板，所述连接部伸出所述限位孔且与所述第一柱体固定连接，所述弹性件套设在所述连接部上且弹性抵持在所述第一表面和所述第一柱体之间。
  6. 如权利要求1或2所述的注塑模具，其特征在于，所述外壳包括第一壳体和第二壳体，所述第一壳体设有第一腔体，所述第一腔体包括第一子腔体和第二子腔体，所述第一子腔体和所述第二子腔体的连接处形成台阶面，所述第二壳体包括所述第二腔体，所述第一壳体和所述第二壳体扣合，以使所述第二腔体和所述第一腔体连通，所述盖板位于所述第一子腔体，部分所述功率模块位于所述第二腔体，部分所述功率模块位于所述第二子腔体且与所述台阶面接触。
  7. 如权利要求1或2所述的注塑模具，其特征在于，每个所述盖板的所述通孔的数量大于等于所述功率模块的所述引脚的数量，每个所述盖板的所述通孔的排列方式至少匹配一个所述功率模块的多个所述引脚。
  8. 如权利要求1或2所述的注塑模具，其特征在于，所述通孔包括第一段和第二段，所述第一段和所述第二段之间形成限位面，所述引脚包括主体部和突出设置在所述主体部外围的固定部，所述主体部和所述固定部的连接处形成台阶面，所述第一段用于收容所述主体部，所述第二段用于收容所述固定部，所述台阶面与所述限位面接触，以实现所述盖板与所述引脚的密封连接。
  9. 如权利要求8所述的注塑模具，其特征在于，所述盖板包括相对的第一表面和第二表面，所述通孔贯穿所述第一表面和所述第二表面，所述第二表面上设有密封垫，且所述 密封垫设于所述通孔的外围，和/或，所述通孔的所述限位面上设有所述密封垫。
  10. 如权利要求1或2所述的注塑模具，其特征在于，所述盖板包括相对的第一表面和第二表面，所述通孔贯穿所述第一表面和所述第二表面，所述盖板的所述第二表面设有限位块，所述功率模块设有限位孔，所述限位块嵌入所述限位孔，以限定所述盖板和所述功率模块的位置。
  11. 一种注塑方法，其特征在于，包括：
    提供注塑模具，所述注塑模具包括外壳和至少两个盖板，所述外壳内设模腔，各所述盖板上均设多个通孔，且不同的所述盖板上的所述通孔的排布方式不同；
    根据待注塑的功率模块的引脚分布情况选择其中一个所述盖板，所述盖板上的所述通孔的排布方式与所述功率模块的所述引脚的排布方式相匹配；
    将所述待注塑的功率模块放置在所述模腔内；
    将所述盖板安装至所述待注塑功率模块上，使得所述引脚穿过所述通孔。
PCT/CN2020/115561 2020-09-16 2020-09-16 注塑模具及注塑方法 WO2022056719A1 (zh)

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