CN114514105A - 注塑模具及注塑方法 - Google Patents

注塑模具及注塑方法 Download PDF

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Publication number
CN114514105A
CN114514105A CN202080012415.4A CN202080012415A CN114514105A CN 114514105 A CN114514105 A CN 114514105A CN 202080012415 A CN202080012415 A CN 202080012415A CN 114514105 A CN114514105 A CN 114514105A
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CN
China
Prior art keywords
cover plate
power module
cavity
injection mold
holes
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Granted
Application number
CN202080012415.4A
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English (en)
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CN114514105B (zh
Inventor
吴凡坤
吕镇
侯召政
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication of CN114514105A publication Critical patent/CN114514105A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/36—Moulds having means for locating or centering cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2608—Mould seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B29C45/2675—Mounting of exchangeable mould inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/28—Closure devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

本申请提供一种注塑模具和注塑方法。注塑模具包括外壳和盖板，外壳内设模腔，模腔内用于收容功率模块；盖板设有多个通孔，盖板可拆卸连接至外壳，盖板位于模腔内且与外壳共同定位所述功率模块，多个通孔用于匹配功率模块的多个引脚。本申请通过设置盖板，并在盖板上设有供引脚穿过的通孔，通过更换通孔排布方式不同的盖板，可以实现同一套注塑模具兼容同一系列不同引脚位置的功率模块。不同盖板的通孔的排布方式不同，针对具有不同的排布方式的引脚的功率模块注塑时，只需要更换设有相应通孔的盖板即可实现注塑密封，而不用更换整个注塑模具，解决了注塑模具开发周期长、成本高的问题。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN202080012415.4A 2020-09-16 2020-09-16 注塑模具及注塑方法 Active CN114514105B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/115561 WO2022056719A1 (zh) 2020-09-16 2020-09-16 注塑模具及注塑方法

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CN114514105A true CN114514105A (zh) 2022-05-17
CN114514105B CN114514105B (zh) 2023-08-22

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US (1) US20230219269A1 (zh)
EP (1) EP4205942A4 (zh)
CN (1) CN114514105B (zh)
WO (1) WO2022056719A1 (zh)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06134811A (ja) * 1992-10-23 1994-05-17 Mitsubishi Materials Corp 射出成形金型
JP2001018252A (ja) * 1999-07-06 2001-01-23 Matsushita Electric Ind Co Ltd リードフレームインサートの射出成形方法及びその金型
US20110169191A1 (en) * 2008-07-24 2011-07-14 Stephan Geise Sealing frame and method for covering a component
CN202473866U (zh) * 2012-03-12 2012-10-03 大连艺才精密模具有限公司 一种半导体封装模具
US20120287582A1 (en) * 2011-05-11 2012-11-15 Patrizio Vinciarelli Panel-Molded Electronic Assemblies
JP2014054009A (ja) * 2012-09-05 2014-03-20 Yazaki Corp 電線配索方法、該電線配索方法によって組み立てられた配線モジュール、該配線モジュールを有する電気接続箱
CN203739124U (zh) * 2013-12-26 2014-07-30 比亚迪股份有限公司 嵌铸件注塑用模具
CN104441486A (zh) * 2014-12-12 2015-03-25 重庆瑞霆塑胶有限公司 带嵌件的塑料注射模具
CN107116746A (zh) * 2017-04-18 2017-09-01 安徽振达刷业有限公司 一种一体式毛刷及其注塑模具
CN110965508A (zh) * 2019-12-06 2020-04-07 重庆文理学院 一种人工智能预警系统
CN210308719U (zh) * 2019-05-23 2020-04-14 湖北塑通科技有限公司 一种取出塑料制品嵌件的加热装置
DE102018219005A1 (de) * 2018-11-07 2020-05-07 Danfoss Silicon Power Gmbh Unteranordnung innerhalb eines formwerkzeugs für ein herzustellendes, einen oberseitigen stift aufweisendes gekapseltes halbleiter-leistungsmodul
CN210676749U (zh) * 2019-03-02 2020-06-05 东广精密电子(昆山)有限公司 一种pcb电路板剪脚工装
CN111527598A (zh) * 2018-01-29 2020-08-11 Zf腓德烈斯哈芬股份公司 用于制造针-翅型功率模块的方法和夹具
CN211428140U (zh) * 2020-02-19 2020-09-04 珠海格力电器股份有限公司 器件级封装模块以及电路板

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US3972663A (en) * 1973-01-22 1976-08-03 Toko Incorporated Method and apparatus for packaging electronic components with thermosetting material
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CN109940834A (zh) * 2019-04-28 2019-06-28 深圳市开薪科技有限公司 一种数据线端子注塑用治具及注塑模具

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06134811A (ja) * 1992-10-23 1994-05-17 Mitsubishi Materials Corp 射出成形金型
JP2001018252A (ja) * 1999-07-06 2001-01-23 Matsushita Electric Ind Co Ltd リードフレームインサートの射出成形方法及びその金型
US20110169191A1 (en) * 2008-07-24 2011-07-14 Stephan Geise Sealing frame and method for covering a component
US20120287582A1 (en) * 2011-05-11 2012-11-15 Patrizio Vinciarelli Panel-Molded Electronic Assemblies
CN202473866U (zh) * 2012-03-12 2012-10-03 大连艺才精密模具有限公司 一种半导体封装模具
JP2014054009A (ja) * 2012-09-05 2014-03-20 Yazaki Corp 電線配索方法、該電線配索方法によって組み立てられた配線モジュール、該配線モジュールを有する電気接続箱
CN203739124U (zh) * 2013-12-26 2014-07-30 比亚迪股份有限公司 嵌铸件注塑用模具
CN104441486A (zh) * 2014-12-12 2015-03-25 重庆瑞霆塑胶有限公司 带嵌件的塑料注射模具
CN107116746A (zh) * 2017-04-18 2017-09-01 安徽振达刷业有限公司 一种一体式毛刷及其注塑模具
CN111527598A (zh) * 2018-01-29 2020-08-11 Zf腓德烈斯哈芬股份公司 用于制造针-翅型功率模块的方法和夹具
DE102018219005A1 (de) * 2018-11-07 2020-05-07 Danfoss Silicon Power Gmbh Unteranordnung innerhalb eines formwerkzeugs für ein herzustellendes, einen oberseitigen stift aufweisendes gekapseltes halbleiter-leistungsmodul
CN210676749U (zh) * 2019-03-02 2020-06-05 东广精密电子(昆山)有限公司 一种pcb电路板剪脚工装
CN210308719U (zh) * 2019-05-23 2020-04-14 湖北塑通科技有限公司 一种取出塑料制品嵌件的加热装置
CN110965508A (zh) * 2019-12-06 2020-04-07 重庆文理学院 一种人工智能预警系统
CN211428140U (zh) * 2020-02-19 2020-09-04 珠海格力电器股份有限公司 器件级封装模块以及电路板

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US20230219269A1 (en) 2023-07-13
EP4205942A4 (en) 2023-10-25
CN114514105B (zh) 2023-08-22
WO2022056719A1 (zh) 2022-03-24
EP4205942A1 (en) 2023-07-05

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